1376178 _,---__ ' ， 1101年02月15日桉正替換頁 六、發明說明： [0001] 【發明所屬之技術領域】 本發明涉及電路板製作技術領域，尤其涉及一種電路板 及其製作方法。 [0002] 【先前技術】 隨著電子產品往小型化、高速化方向之發展，電路板也 從單面電路板、雙面電路板往多層電路板方向發展。多 層電路板疋&具有多層導電線路之電路板，其具有較多 • 之佈線面積、較高互連密度，因而得到廣泛之應用，參 見文獻Takahashi，A. O〇ki，n. Nagai，A 'Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880 ， IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992， 15(4): 418-425。 [0003] • 電路板製作工藝通常包括曝光、顳影、蝕刻、鑽孔、電 鍍等步驟。以多層電路板為例，其採用疊層法進行製作 ，具體地，包括以下步驟：第一步，以曝光、顯影、蝕 刻工藝於覆銅基板表面形成導電線路；第二步，於導電 線路之預定位置鑽貫通覆銅基板之通孔；第三步，以電 鍍工藝於通孔孔壁形成銅層，從而形成導通孔，制得内 層板；第四步，以另一覆銅基板為外層基板，採用純膠 將該外層基板壓合至内層板；第五步，於外層基板之預 疋位置形成盲孔或通孔；第六步，以電鐘工藝於盲孔或 通孔孔壁形成銅層；第七步，採用曝光、顯影、蝕刻工 09713307#單編號A0101 第3頁/共16頁 1013055706-0 [0004] 藝於外層基板表面形成導電緣路 X导电深路，制得兩層電路板，以 該兩層電路板為内層基板，重複第 制得多層電路板。 :見現有夕層電路板之製作工序中每層結構之製 、程匕括十刀複雜之導電線路製作，不斷重複進行之 h、曝光、顯影、餘刻等步驟，使得多層電路板製作 之勞動強度較大’製作效率較低。而且於上述之電路板 之製作方法中，需要採用覆鋼基板，使得電路板之厚度 欠到覆銅基板厚度之制約，線路_精度不易控制’而 採用上述之濕製程進行處理，採用化學藥水對環 境造成污染’殘_縣之目的。 [0005] 要提供—種電路板之製作方法，避免採用覆 銅基板作為原料，並能簡化電路板製作 板線路之精度。 抆同電路 【發明内容】 [0006] [0007] 以下將以實施例為例說明電路板及其製作方法。 ==多2括導電線路層和絕緣填充體，該導電 線路層1括彡條“線路，料電線⑽有彳目對 外表面和第二外表面，相鄰之兩導電 ，從而形成複數貫穿第—外表面和第〉 '部分分離 該絕緣填充體填充於相鄰導電線路之^表面之空隙， [0008] 四步至第七步，即可 •-種電路板之製作方法，其包括以下、隙内。 黏表面之支撐板；於支撐板表 .提供具有防 板形成有《電線路之表面形錢緣P線路；於支標 且使導電線路嵌 09713307^^^^ A〇101 第4頁/共16頁 1013055706-0 1376178 設於绝緣屏… 並從絕緣層暴露、出；將該支撐板與絕緣層 電線路分離’絕緣層和導電線路形成電路板。 _9] ^夕層電路板之製作方法其包括以下步驟：按照上 述電叫之製作方法製作單層電路板；於單層電路板 之導電缘路表面預定位置形成電導體；於單層電路板形 成有电導體之表面形成陽離層，使電導體嵌設於隔離層 ，於隔離層之表面形成外層導電線路。 圆與先雜術相比，本麟方案之電騎之製作方法不需 製作導通孔’因此，能有效克服先前技術中製作導通孔 帶來之電鍍導通孔孔壁困難之缺陷，並大大簡化電路板 製作工序，提高電路板製作良率。 【實施方式】 [0011]以下將結合附圖和實施例對本技術方案之電路板之製作 方法進行詳細說明。 [0012] 本技術方案第一實施例提供之電路板之製作方法包括以 下步驟： [0013] 第一步：提供支撐板11〇 » [〇〇14]請參閲圖1，支標板110具有表面111，表面ill具有防黏 性。本實施例中，支撐板110之表面11丨塗覆有鐵氟龍材 料，其為聚四氟乙烯為基體樹脂之氟塗料，其具有耐熱 性、化學惰性和優異之絕緣穩定性及低摩擦性，該鐵說 龍材料可為聚四氟乙烯（PTFE)、氟化乙烯丙稀共聚物 (FEP)、過氟烷基化物（PFA)、乙烯和四氟乙稀之共 聚物（ETFE)等。 09713307#單編號A0101 第5頁/共16頁 1013055706-0 1376178 _- 101年.02月15日核正替換寊 [0015] 第二步，於支撐板110之表面111形成導電線路層120。 [0016] 請參閱圖2，欲形成之導電線路層120於平行於表面111之 方向内延伸，即導電線路層120凸出於表面111，欲形成之 導電線路120凸出於表面111之高度可根據實際需要之電 路板之厚度進行控制。 [0017] 導電線路層120可採用印刷法形成於支撐板110之表面1376178 _,---__ ' , February 15, 1101 桉正换页页, invention description: [0001] [Technical Field] The present invention relates to the field of circuit board fabrication technology, and in particular to a circuit board and Production Method. [0002] [Prior Art] With the development of electronic products in the direction of miniaturization and high speed, circuit boards have also been developed from single-sided circuit boards and double-sided circuit boards to multilayer circuit boards. Multi-layer circuit boards & boards with multiple layers of conductive lines, which have more wiring area and higher interconnect density, are widely used, see the literature Takahashi, A. O〇ki, n. Nagai, A 'Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418 -425. [0003] • The board fabrication process typically includes steps such as exposure, shadowing, etching, drilling, and electroplating. Taking a multilayer circuit board as an example, it is fabricated by a lamination method, and specifically includes the following steps: first, forming a conductive line on the surface of the copper-clad substrate by exposure, development, and etching processes; and second, in the conductive line a predetermined position is drilled through the through hole of the copper-clad substrate; in the third step, a copper layer is formed on the wall of the through-hole by an electroplating process to form a via hole to form an inner layer; and in the fourth step, another copper-clad substrate is used as an outer substrate Pressing the outer substrate to the inner layer plate with pure glue; in the fifth step, forming a blind hole or a through hole at the pre-twisted position of the outer substrate; and in the sixth step, forming a copper by the electric clock process on the blind hole or the through hole hole wall The seventh step, using exposure, development, etching work 09713307# single number A0101 page 3 / a total of 16 pages 1013055706-0 [0004] Art on the surface of the outer substrate to form a conductive edge X conductive deep path, to make a two-layer circuit The board, with the two-layer circuit board as the inner substrate, repeats the multi-layer circuit board. : See the production process of each layer in the production process of the existing circuit board, and the process of making the conductive circuit of the ten-knife complex, repeating the steps of h, exposure, development, and residual, so that the labor intensity of the multilayer circuit board production is relatively high. Big 'production efficiency is low. Moreover, in the above method for manufacturing a circuit board, it is necessary to use a steel-clad substrate, so that the thickness of the circuit board is less than the thickness of the copper-clad substrate, and the line_accuracy is difficult to control', and the wet process is used for the treatment, using a chemical solution The environment causes pollution to the purpose of 'residual_ county. [0005] To provide a method for fabricating a circuit board, it is possible to avoid the use of a copper-clad substrate as a raw material and to simplify the precision of the circuit board production board. [Comparative Description of the Invention] [0006] [0007] Hereinafter, an embodiment will be described as an example of a circuit board and a method of fabricating the same. == 2 includes a conductive circuit layer and an insulating filling body. The conductive circuit layer 1 includes a "strip", the material wire (10) has an outer surface and a second outer surface, and the adjacent two are electrically conductive, thereby forming a plurality of through-the- The outer surface and the portion of the portion are separated from the gap of the surface of the adjacent conductive line, [0008] four steps to the seventh step, that is, a method for manufacturing the circuit board, which includes the following The support plate of the adhesive surface; on the support plate table. Provided with the anti-plate formed with the surface line of the electric line P-line; in the support and the conductive line embedded 97713307^^^^ A〇101 page 4 / A total of 16 pages 1013055706-0 1376178 is set on the insulation screen ... and exposed from the insulation layer; the support plate is separated from the insulation layer electrical circuit 'insulation layer and conductive circuit to form a circuit board. _9] ^ 层 layer circuit board production The method comprises the steps of: forming a single-layer circuit board according to the above-mentioned electric calling manufacturing method; forming an electrical conductor at a predetermined position on the surface of the conductive edge of the single-layer circuit board; forming a male separation layer on the surface of the single-layer circuit board forming the electrical conductor To embed the electrical conductor The isolation layer forms an outer conductive line on the surface of the isolation layer. Compared with the first hybrid technique, the manufacturing method of the electric riding method of the Benlin scheme does not need to make a via hole. Therefore, it can effectively overcome the manufacturing of the via hole in the prior art. The defects of the plating via hole wall are difficult, and the circuit board manufacturing process is greatly simplified, and the circuit board manufacturing yield is improved. [Embodiment] [0011] Hereinafter, the manufacturing method of the circuit board of the present technical solution will be described in detail with reference to the accompanying drawings and embodiments. [0012] The manufacturing method of the circuit board provided by the first embodiment of the present technical solution includes the following steps: [0013] First step: providing a support plate 11〇 [ [〇〇14], please refer to FIG. 1, the support plate 110 has a surface 111, and the surface ill has anti-adhesive property. In this embodiment, the surface 11 of the support plate 110 is coated with a Teflon material, which is a fluorine coating material of polytetrafluoroethylene as a matrix resin, which has heat resistance, Chemically inert and excellent insulation stability and low friction, the iron material can be polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP), perfluoroalkylate (PFA), ethylene and Tetrafluoro Ethylene copolymer (ETFE), etc. 09713307#单号A0101 Page 5/16 pages 1013055706-0 1376178 _- 101 years. February 15th nuclear replacement 寊[0015] The second step, on the support plate 110 The surface 111 forms a conductive circuit layer 120. [0016] Referring to FIG. 2, the conductive circuit layer 120 to be formed extends in a direction parallel to the surface 111, that is, the conductive circuit layer 120 protrudes from the surface 111, and the conductive line to be formed The height of the protrusion 120 from the surface 111 can be controlled according to the thickness of the circuit board which is actually required. [0017] The conductive wiring layer 120 can be formed on the surface of the support board 110 by a printing method.
111。具體地，印刷法按以下步驟進行：首先將範本如網 板或鋼板覆蓋於表面111，該範本具有導電線路圖形之通 孔；其次，將液態熱固性導電物質如銅膏、銀膏或碳膏 印刷至該線路圖形之通孔中；再次，烘烤或紫外光固化 該導電物質，使該導電物質固化成形為導電線路層120， 最後將範本與支撐板110分離，由此表面111上形成導電 線路層120。 [0018] 為提高製作精度，導電線路層120還可採用喷墨法制作。 具體地，可採用以下兩種方法製作。 [0019] 第一種，首先，提供喷射裝置和範本，該範麥設有與線 路圖形相對應之通扎，喷射裝置具有噴射頭，用於透過 範本之通孔向支撐板110之表面喷射液態熱固性導電物質 如銅漿、銀漿；其次，採用本領域常用固化工藝如軟烤 或硬烤固化液態導電物質，使液態導電物質固化；最後 ，施力於範本，使其與導電物質固化物分離，從而於支 撐板110之表面111形成導電線路層120。 [0020] 第二種，直接於支撐板110之表面形成導電線路，即採用 具有微機電系統之喷射頭並將通孔之位置資料資訊輸入 09713307#單编號 A〇101 第6頁/共16頁 1013055706-0 1376178 101年.02月15日修正替^頁 該喷射頭之微機電系統，然後於紫外光照射或加熱烘烤 之條件下利用該喷射頭直接將液態導電物質喷射至支撐 板110之表面111，以實現液態導電物質自喷射頭喷至支 撐板110之表面111之同時固化成形為導電線路。 [0021] 第二步^於支樓板110形成有該導電線路層120之表面 111形成絕缘層130且使導電線路層120嵌設於絕緣層130 ，並從絕緣層130中暴露出。 [0022] 請一併參閱圖2及圖3，首先以塗佈法或喷墨法將液態絕 • 緣材料填充於導電線路層120之空隙内。於液體表面張力 之影響下，液態絕緣材料將朝靠近導電線路層120之方向 擴散，直至浸潤導電線路層120。為避免液態絕緣材料溢 出，所填充之液態絕緣材料之厚度以不超過導電線路層 120之高度為宜，即絕緣層130之高度可小於導電線路層 120之高度，也可等於導電線路層120之高度。該喷墨法 之操作可參見步驟二。該液態絕緣材料之材質為本領域 常採用之樹脂，如酚醛樹脂、環氧樹脂、聚酯樹脂、聚 • 醯亞胺、鐵氟龍、聚硫胺、聚曱基丙烯酸曱酯、聚碳酸 酯、聚乙烯對苯二酸酯：聚醯亞胺-聚乙烯-對苯二曱酯 共聚物中之一種或幾種。 [0023] 待填充絕緣材料後，需採用本領域常規熱固化工藝如烘 烤或紫外光固化將液態絕緣材料固化成形，從而形成絕 緣層130，並暴露出導電線路層120，絕緣層130和導電 線路層120形成電路板140 [0024] 第四步，將單層電路板140與支撐板110分離。支撐板 第7頁/共16頁 09713307^單編號 A〇101 1013055706-0 1376178 _________ 1101年02月15日梭正替换$ 110之表面塗覆有防黏材料，待單層電路板140固化成型 後，即可容易地將單層電路板140與支撐板110分離。 [0025] 形成之電路板140包括導電線路層120和絕緣填充體，該 導電線路層120包括多條導電線路，該導電線路具有相對 之第一外表面121和第二外表面122,相鄰之兩導電線路 至少部分分離，從而形成複數貫穿第一外表面121和第二 外表面122之空隙’該絕緣填充體填充於相鄰導電線路之 間之空隙内。 [0026] 上述電路板之製作方法中，也可先於支撐板11〇之表面 隹I 111形成導電線路層’然後形成絕緣層圖形於導電線路層 之空隙之中，使得導電線路嵌設於絕緣層中，並由絕緣 層露出"111. Specifically, the printing method is carried out by first covering a template such as a stencil or a steel plate on the surface 111, the template having a through hole of a conductive line pattern; and secondly, printing a liquid thermosetting conductive substance such as a copper paste, a silver paste or a carbon paste. Up to the through hole of the circuit pattern; again, baking or ultraviolet curing the conductive material, curing the conductive material into the conductive circuit layer 120, and finally separating the template from the support plate 110, thereby forming a conductive line on the surface 111 Layer 120. [0018] In order to improve the fabrication precision, the conductive wiring layer 120 may also be fabricated by an inkjet method. Specifically, it can be produced by the following two methods. [0019] First, firstly, an injection device and a template are provided, the Fanmai is provided with a connection corresponding to a line pattern, and the injection device has a spray head for injecting a liquid into the surface of the support plate 110 through the through hole of the template. Thermosetting conductive materials such as copper paste and silver paste; secondly, solid conductive materials such as soft or hard baked liquid conductive materials are used to cure liquid conductive materials; finally, force is applied to the template to separate them from the conductive material cured product. Thereby, the conductive wiring layer 120 is formed on the surface 111 of the support board 110. [0020] Secondly, a conductive line is formed directly on the surface of the support plate 110, that is, a spray head having a MEMS system is used and the position information of the through hole is input into the 09713307# single number A 〇 101 page 6 / 16 Page 1013055706-0 1376178 101. On February 15th, the microelectromechanical system of the spray head is modified, and then the liquid conductive substance is directly sprayed to the support plate 110 by the spray head under the condition of ultraviolet light irradiation or heating baking. The surface 111 is formed to be solidified into a conductive line while the liquid conductive material is sprayed from the head to the surface 111 of the support plate 110. [0021] In the second step, the surface 111 of the conductive circuit layer 120 is formed on the support floor 110 to form the insulating layer 130, and the conductive circuit layer 120 is embedded in the insulating layer 130 and exposed from the insulating layer 130. [0022] Referring to FIG. 2 and FIG. 3 together, first, a liquid insulating material is filled in the gap of the conductive wiring layer 120 by a coating method or an inkjet method. Under the influence of the surface tension of the liquid, the liquid insulating material will diffuse toward the conductive circuit layer 120 until the conductive wiring layer 120 is wetted. In order to avoid overflow of the liquid insulating material, the thickness of the filled liquid insulating material is preferably not more than the height of the conductive circuit layer 120, that is, the height of the insulating layer 130 may be less than the height of the conductive circuit layer 120, and may be equal to the conductive circuit layer 120. height. The operation of the ink jet method can be seen in step two. The material of the liquid insulating material is a resin commonly used in the art, such as phenolic resin, epoxy resin, polyester resin, polyphthalamide, Teflon, polysulfide, polydecyl acrylate, polycarbonate Polyethylene terephthalate: one or more of a polyamidene-polyethylene-terephthalate copolymer. [0023] After the insulating material is to be filled, the liquid insulating material is cured and formed by a conventional thermal curing process such as baking or ultraviolet curing in the art, thereby forming the insulating layer 130, and exposing the conductive circuit layer 120, the insulating layer 130 and the conductive layer. The circuit layer 120 forms the circuit board 140. [0024] The fourth step separates the single layer circuit board 140 from the support board 110. Support plate Page 7 / Total 16 pages 09713307^ Single number A〇101 1013055706-0 1376178 _________ On February 15, 1101, the shuttle is replacing the surface of $110 with a release material, after the single-layer circuit board 140 is cured. The single layer circuit board 140 can be easily separated from the support board 110. [0025] The formed circuit board 140 includes a conductive circuit layer 120 and an insulating filler layer. The conductive circuit layer 120 includes a plurality of conductive lines having a first outer surface 121 and a second outer surface 122 opposite to each other. The two conductive traces are at least partially separated to form a plurality of voids extending through the first outer surface 121 and the second outer surface 122. The insulating filler fills the void between adjacent conductive traces. [0026] In the manufacturing method of the circuit board, the conductive circuit layer ' may be formed on the surface 隹I 111 of the support plate 11 然后 and then the insulating layer pattern is formed in the gap of the conductive circuit layer, so that the conductive circuit is embedded in the insulation. In the layer and exposed by the insulation layer "
II
[0027] 本技術方案第二實施例提供一種多層電路板之製作方法 ，其包括以下步驟：[0027] The second embodiment of the present technical solution provides a method for fabricating a multi-layer circuit board, which includes the following steps:
[0028] 第一步，按照上述第一實施例電路4之製作方法，製作 單層電路板140，單層電路板140具有相對之兩個表面 142。可分別於兩個上進行單層電路板14〇之増層。本實 施例中，以於其中一個表面進行增層為例進行說明。 [0029] 第二步，於導電線路120之表面之預定位置形成電導體 150 〇 [0030]電導體150之形成可採用塗佈法或喷墨法， 、Λ 具體可參照本 技術方案單層電路板之製作方法中之步驟二， "，不同之處 在於上述之範本設置之通孔和欲形成與導電線路相導 通之導通之位置和圖形相對應。 第8頁/共16頁 09713307#單編號 Α〇101 1013055706-0 1376178 • 101年.02月15日修正替換頁 [0031] 第三步，於單層電路板140形成有電導體150之表面形成 隔離層160且使電導體150嵌設於隔離層160，並從隔離 層160中暴露出。 [0032] 隔離層160用於隔離欲形成之外層導電線路與導電線路 120不需導通之地方相互隔離，其由絕緣材料製成，隔離 層160填充於相鄰之電導體150之間，隔離層160之形成 方法參照本技術方案第一實施例電路板之製作方法中之 步驟三。 Φ [0033] 第四步，於隔離層160表面形成與電導體150相連之外層 導電線路170，形成多層電路板180。 [0034] 於形成外層導電線路170之前，可對隔離層160之表面進 行預處理，如整平處理，以提高後續外層導電線路170與 隔離層160之間之介面結合力及確保外層導電線路170之 表面平整性，從而提高外層導電線路170之製作精度，或 除去以塗佈法形成隔離層160時可能黏附於電導體150表 • 面之絕緣材料，以暴露出相應之電導體150，便於後續外 層導電線路170通過電導體150實現與第一導電線路120 電導通。 .- [0035] 外層導電線路170之形成了採用噴墨法或塗佈法，具體參 見本技術方案第一實施例提供之電路板之製作方法之步 驟二。 [0036] 為了製作更多層之電路板，可重複本技術方案第一實施 例之電路板之製作方法之步驟三，形成第二絕緣層，然 後重複本實施例中之步驟二至步驟四即可製作更多層數 09713307产單编號 A〇101 第9頁/共16頁 1013055706-0 1376178 101年02月15日梭正替換友 之電路板。 0)037]纟技術方案之電路板製作方法中，不需使用覆銅基板# 為原料，避免原材料厚度對電路板厚度之制約。不需要 · 採用傳統之電路製作方法之姓刻等製程，電路板之線路 製作通過塗佈和喷墨之方式實現，簡化電路板製作工序 ’提高電路板線路之精度。 圆.综上所述’本發明確已符合發明專利之要件，遂依法提 出專利申請》惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 · 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0039]圖1係本技術方案第一實施例提供之電路板製作方法所採 用支撐板之示意圖。 ， [0040Γ圖2係於圖1所示支撐板表面形成導電線路之示意圖。 [0041] 圖3係於圖2所示支撐板表面形成絕緣層之示意圖。 參 [0042] 圖4係本技術方·案實施例製作之電路板示意圖。 剛®5係圖4所示單層電路板表面形成電導體之示意圖。 [0044] 圖6係圖5形成隔離層之示意圖。 [0045] 圖7係圖6形成外層導電線路之示意圖。 【主要元件符號說明】 [0_ 支標板：110 09713307#單编號A0101 第忉頁/共16頁 1013055706-0 1376178 « · 101年.02月15日修正替換頁 [0047]. 表面：111 ' [0048] 導電線路：120 ' [0049] 第一外表面：121 [0050] 第二外表面：122 [0051] 絕緣層：130 [0052] 單層電路板：140 [0053] 電導體：150 W [0054] 隔離層：160 [0055] 外層導電線路：170 [0056] 多層電路板：180 0刪07产單編號A0101 第11頁/共16頁 1013055706-0[0028] In the first step, a single-layer circuit board 140 is fabricated in accordance with the fabrication method of the circuit 4 of the first embodiment described above, and the single-layer circuit board 140 has two opposite surfaces 142. The layer of the single-layer circuit board 14 can be performed on two separate layers. In the present embodiment, an example in which one of the surfaces is layered is described. [0029] In the second step, the electrical conductor 150 is formed at a predetermined position on the surface of the conductive line 120. [0030] The electrical conductor 150 may be formed by a coating method or an inkjet method, and may be specifically referred to the single layer circuit of the present technical solution. Step 2 of the method for fabricating a panel, ", differs in that the through-holes of the above-described template are arranged to correspond to the positions and patterns of conduction with the conductive lines. Page 8 of 16 pages 09713307#单号Α〇101 1013055706-0 1376178 • 101. February 15 correction replacement page [0031] The third step is to form the surface of the electrical conductor 150 formed on the single-layer circuit board 140. The isolation layer 160 and the electrical conductor 150 are embedded in the isolation layer 160 and exposed from the isolation layer 160. [0032] The isolation layer 160 is used for isolating the outer layer conductive lines from which the conductive lines 120 are not required to be electrically insulated, and is made of an insulating material, and the isolation layer 160 is filled between the adjacent electrical conductors 150, the isolation layer. For the method of forming 160, refer to step 3 in the method for fabricating the circuit board of the first embodiment of the present technical solution. [0033] In the fourth step, an outer conductive line 170 is formed on the surface of the isolation layer 160 to be connected to the electrical conductor 150 to form a multilayer circuit board 180. [0034] Before the outer conductive line 170 is formed, the surface of the isolation layer 160 may be pretreated, such as leveling, to improve the interface bonding force between the subsequent outer conductive line 170 and the isolation layer 160 and to ensure the outer conductive line 170. The surface is flat, thereby improving the fabrication precision of the outer conductive line 170, or removing the insulating material that may adhere to the surface of the electrical conductor 150 when the isolation layer 160 is formed by coating to expose the corresponding electrical conductor 150 for subsequent The outer conductive line 170 is electrically connected to the first conductive line 120 through the electrical conductor 150. [0035] The outer conductive line 170 is formed by an inkjet method or a coating method, and specifically refers to step 2 of the method for fabricating the circuit board provided in the first embodiment of the present technical solution. [0036] In order to make a circuit board of more layers, step 3 of the manufacturing method of the circuit board of the first embodiment of the present technical solution may be repeated to form a second insulating layer, and then steps 2 to 4 in the embodiment are repeated. Can make more layers 09713307 Production order number A〇101 Page 9 / Total 16 pages 1013055706-0 1376178 On February 15th, 101, Shuttle is replacing the board of friends. 0) 037] In the circuit board manufacturing method of the technical solution, it is not necessary to use the copper-clad substrate # as a raw material, and the thickness of the raw material is not restricted to the thickness of the circuit board. No need to use the traditional circuit manufacturing method such as the name of the process, the circuit board production by coating and inkjet method to simplify the circuit board manufacturing process 'improve the accuracy of the circuit board circuit. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by those skilled in the art of the present invention in light of the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0039] FIG. 1 is a schematic view showing a support plate used in a method of manufacturing a circuit board according to a first embodiment of the present technical solution. [0040] FIG. 2 is a schematic view showing the formation of a conductive line on the surface of the support plate shown in FIG. 3 is a schematic view showing the formation of an insulating layer on the surface of the support plate shown in FIG. 2. [0042] FIG. 4 is a schematic diagram of a circuit board fabricated by the embodiment of the present technology. A schematic diagram of the electrical conductor formed on the surface of the single-layer circuit board shown in FIG. 6 is a schematic view showing the formation of an isolation layer in FIG. 5. [0045] FIG. 7 is a schematic diagram of FIG. 6 forming an outer conductive line. [Main component symbol description] [0_ Support plate: 110 09713307# Single number A0101 Page/16 pages 1013055706-0 1376178 « · 101 years. February 15th revised replacement page [0047]. Surface: 111 ' [0048] Conductive line: 120' [0049] first outer surface: 121 [0050] second outer surface: 122 [0051] insulating layer: 130 [0052] single layer circuit board: 140 [0053] electrical conductor: 150 W [0054] isolation layer: 160 [0055] outer conductive line: 170 [0056] multilayer circuit board: 180 0 delete 07 production order number A0101 page 11 / total 16 pages 1013055706-0