KR100733814B1 - Manufacturing method of pcb - Google Patents

Abstract

A method for manufacturing a printed circuit board is provided to reduce a process lead time and to improve productivity by manufacturing a multilayer printed circuit board through a bump forming process for connecting between layers, and an inkjet process. A method for manufacturing a printed circuit board includes the steps of: connecting a paste bump to a supporting plate(110); protruding the paste bump toward a surface of an insulation layer so that the paste pump penetrates the insulation layer by stacking the insulation layer on the supporting plate(120); stacking and compressing a pushing plate on the insulation layer(130); forming a core substrate by removing the supporting plate and the pushing plate(140); and printing a circuit pattern on a surface of the core substrate by an inkjet process(150). Wherein the paste bump connection step includes the steps of: stacking a film layer on the supporting plate; and connecting the paste pump to the film layer.

Description

Manufacturing method of printed circuit board {Manufacturing method of PCB}

1 is a flow chart showing a printed circuit board manufacturing method according to an embodiment of the present invention.

2 is a flow chart showing a multi-layer printed circuit board manufacturing process according to an embodiment of the present invention.

3 is a flowchart illustrating a method of manufacturing a multilayer printed circuit board according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: support plate 12, 32: film layer

20: paste bump 22: insulating layer

30: pressing plate 40: circuit pattern

The present invention relates to a printed circuit board manufacturing method.

In the conventional multilayer printed circuit board, an inner layer circuit is formed by applying an additive method or a subtractive method to the surface of a core substrate such as a copper clad laminate (CCL), and an insulating layer and a metal layer are sequentially stacked. It is manufactured by forming the outer layer circuit in the same way as the inner layer circuit while building (up).

Due to the development of electronic components, there is a demand for a technology capable of improving performance of high density interconnection (HDI) substrates to which electrical patterns of circuit patterns and fine circuit wiring are applied for increasing the density of printed circuit boards. That is, in order to improve the performance of the HDI substrate, a technique for securing the electrical conduction technology and the degree of freedom of design between circuit patterns is required. In addition, the demand for continuous cost reduction and process simplification is increasing rapidly. In the case of printed circuit boards, new method development is urgently needed to keep pace with the trend of lighter and smaller production.

Conventionally, a circuit pattern is formed on a printed circuit board by applying a drilling process to a core board to implement electrical connection between circuit layers, stacking photosensitive materials, and performing exposure and development processes using a circuit mask. The circuit pattern was formed through the plating method.

That is, in the manufacturing process of a multilayer printed circuit board according to the prior art, first, a dry film is laminated on a core substrate such as CCL, in which copper foil layers are laminated on both sides, in order to form windows, and the exposure, development, After etching, the remaining dry film is peeled off to form an open portion. Next, a via hole is formed by a laser drill, a fill plating process is performed on the inside of the via hole and the surface of the core substrate, and then half etching is applied to prepare a metal layer for forming a circuit pattern. Next, in order to form a circuit pattern, a dry film is laminated, exposed, developed, and etched, and the remaining dry film is peeled off to form a circuit pattern.

However, such a conventional printed circuit board manufacturing process satisfies a request for low cost due to a drop in the price of an applied product such as a mobile phone, a request for a short lead time to increase mass production, and the like. There is a problem such as cost increase, environmental infringement due to the drilling process and plating process.

The present invention provides a method for manufacturing a printed circuit board using only the inkjet technology and the bump forming technology without the plating process and the drilling process.

According to one aspect of the invention, (a) bonding the paste bumps to the support plate, (b) laminating an insulating layer on the support plate so that the paste bumps penetrate the insulating layer over the surface of the insulating layer, (c A method of manufacturing a printed circuit board is provided, the method comprising: stacking and pressing a pressing plate on an insulating layer, and (d) removing the supporting plate and the pressing plate to form a core substrate.

Step (a) may be performed by laminating a film layer on a support plate and bonding paste bumps onto the film layer.

The support plate and the pressing plate may be made of a stainless steel plate, and the pressing plate may be formed by laminating a film layer on the stainless steel plate like the supporting plate. In this case, it is preferable to laminate the pressure plate so that the film layer contacts the insulating layer in step (c).

After step (d), it is preferable to print the circuit pattern on the surface of the core substrate by an inkjet method.

According to another aspect of the present invention, a method for manufacturing a multilayer printed circuit board in which a plurality of insulating layers and circuit patterns are stacked alternately, (f) a paste bump penetrating the insulating layer at a position requiring an electrical connection between the layers of the circuit pattern Manufacturing a first core substrate and a second core substrate including (g) forming a first circuit pattern on a surface of the first core substrate, and (h) laminating a second core substrate on the first circuit pattern. And (i) forming a second circuit pattern on the surface of the second core substrate.

The first core board and the second core board may be manufactured according to the method of manufacturing a printed circuit board according to the above-described aspect of the present invention.

As described above, the first circuit pattern and / or the second circuit pattern may be formed by printing an inkjet method on the surface of the core substrate.

Hereinafter, a preferred embodiment of a method for manufacturing a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components will be denoted by the same reference numerals regardless of the reference numerals and redundant description thereof will be omitted.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention, and FIG. 2 is a flowchart illustrating a process of manufacturing a multilayer printed circuit board according to an exemplary embodiment of the present invention. Referring to FIG. 2, the support plate 10, the film layers 12 and 32, the paste bumps 20, the insulating layer 22, the press plate 30, and the circuit pattern 40 are illustrated.

The present embodiment implements the electrical connection between circuit layers, which is difficult to solve in the conventional circuit pattern forming process using inkjet, by using the paste bump 20. The bump pattern forming process for the interlayer connection and the circuit pattern printing by the inkjet method are performed. After manufacturing the core substrate through a process, it is characterized in that the multilayer printed circuit board is manufactured using a lamination process. According to the present embodiment, the plating process and the drilling process, which have been conventionally considered in the manufacturing process of the multilayer printed circuit board, can be omitted.

To this end, first, the paste bump 20 is bonded to the support plate 10. Since the support plate 10 serves to support the paste bump 20 in the pressing process described later, a thick film, a metal plate, or the like, which is heat resistant and structurally rigid, may be used. In addition, a stainless steel plate (hereinafter, referred to as an SUS plate) used for batch lamination in a conventional multilayer printed circuit board manufacturing process may be used. In the case of using the SUS plate as the support plate 10, it is possible to use the equipment used in the existing batch lamination process as it is possible to reduce the cost.

Since the support plate 10 is detached after the crimping process, as will be described later, the film layer 12 is formed on the support plate 10 as shown in FIG. 2A, rather than directly attaching the paste bump 20 to the support plate 10. ) And the paste bump 20 is printed on the film layer 12 as shown in FIG. 2 (a) (110). Figure 2 (a) shows an example of using a carrier plate (10) by laminating a release paper on a SUS plate.

The film layer 12 allows the paste bump 20 to adhere well, and prevents a portion of the paste bump 20 from remaining in the state attached to the support plate 10 in the process of detaching the support plate 10 after pressing. In order to use the polymer film, the polymer film having excellent adhesion and heat resistance can be used. In addition, the release paper used in the general lamination process of a conventional multilayer printed circuit board can also be used.

By interposing a film layer 12 such as a release paper before attaching the paste bumps 20 to the support plate 10, the process of removing the support plate 10 after the core substrate is manufactured by compression is facilitated, and the film layer (12) Since the peeling is also easy, the reliability of the core substrate manufacturing process by pressing is improved.

After the release paper is laminated on the support plate 10 and the paste bumps 20 are bonded onto the release paper, the paste bump 20 is laminated by laminating an insulating layer 22 such as PPG on the support plate 10 as shown in FIG. Pass through the insulating layer 22 to protrude above the surface of the insulating layer 22 (120).

Silver (Ag) paste may be used as the material of the paste bump 20, and thus, since the strength of the cured paste bump 20 is greater than that of the insulating layer 22, the support plate 10 to which the paste bump 20 is bonded may be used. When the insulating layer 22 is stacked on the paste bump 20, the paste bump 20 penetrates the insulating layer 22 and a part of the insulating layer 22 protrudes over the surface of the insulating layer 22.

As a method of penetrating the insulating layer after printing the paste bump 20 on the film layer 12, such as a release paper, there exist a method using a penetrator and the method of applying a lamination process.

The method of using a penetrator is a simple and easy lamination process by printing a paste on a substrate to form a bump and penetrating an insulating material through the bump in order to simplify the process and to quickly manufacture a printed circuit board by batch lamination. The so-called 'B2it' (Buried bump interconnection technology) technology is applied, and the insulating layer 22 can be penetrated through the paste bump 20 by using a penetrator, which is a dedicated equipment used for applying the technology.

However, it is not necessary to use the above-described penetrator as a method of penetrating the insulating layer 22 through the paste bump 20, and of course, a build-up process on a multilayer printed circuit board manufacturing process may be applied. .

As such, the paste bump 20 penetrating the insulating layer 22 in a 'pillar' shape plays a role of implementing electrical conduction between circuit layers in the core substrate as in the conventional via hole, thereby securing reliability of electrical connection. In order to prevent the end of the paste bump 20 from penetrating through the insulating layer 22, the press plate 30 serves as a connection bump 20.

Therefore, the paste bump 20 may be coupled to a position requiring electrical connection between layers of the circuit pattern, and the paste bump 20 coupled to the support plate 10 corresponding to the thickness of the insulating layer 22 corresponding to the thickness of the core substrate ( 20) it is good to determine the height.

Next, as shown in (d) of FIG. 2, the pressing plate 30 is laminated on the insulating layer 22, and pressurized as shown in FIG. 2 (e) so that the surface of the paste bump surface and the insulating layer 22 coincide. Molding (130). Figure 2 (d) shows an example of laminating the pressing plate 30, the release paper is laminated on the SUS plate. The pressing plate 30 is a component for forming a core substrate by pressing the insulating layer 22 interposed between the supporting plate 10 and the paste bump 20 penetrating through the insulating layer 22 to form a core substrate. ), A thick film, a metal plate, or the like, which is a heat resistant and structurally rigid material, may be used. In addition, a SUS plate can be used similarly to the support plate 10. When the SUS plate is used as the pressing plate 30, the equipment used in the existing batch lamination process can be used as it is, as in the support plate 10, it is efficient.

Meanwhile, in order to prevent a part of the paste bump 20 from remaining in a state of being attached to the pressing plate 30 in the process of detaching the pressing plate 30 after pressing, the film is formed on the pressing plate 30 as in the supporting plate 10. It is preferable to use the layer 32 by lamination. The film layer 32 may be a polymer-based film having excellent adhesiveness and heat resistance, and release film used in a batch lamination process of a conventional multilayer printed circuit board may be used.

By pressing the film layer 32 such as a release paper on the press plate 30, the process of removing the press plate 30 after the core board is manufactured is smooth, and the film layer 32 itself is also easily peeled off. This improves the reliability of the core substrate manufacturing process. In this case, the press plate 30 may be laminated so that the film layer 32 laminated on the step press plate 30 faces the insulating layer 22.

After the pressing process is completed, the core plate is formed by removing the support plate 10 and the pressing plate 30 as shown in FIG. The core substrate has a shape in which the paste bump 20 penetrates at a position requiring electrical connection between the circuit layers in the insulating layer 22. As described above, the core substrate has a thickness of the insulating layer 22 and a height of the paste bump 20. By adjusting, the thickness of the core substrate can be easily adjusted.

The circuit pattern 40 is printed on both surfaces of the core substrate thus formed through inkjet printing as shown in FIG. 2G (150). Inkjet printing technology has been mainly used in office automation (OA) field and has been mainly used in fields such as packaging material marking and garment printing. However, the development of functional ink containing nano metal particles such as silver and nickel In addition, the application possibilities are gradually expanded, and are currently being applied to the formation of circuit patterns of printed circuit boards using functional inks including nano metal particles.

3 is a flowchart illustrating a method of manufacturing a multilayer printed circuit board according to another exemplary embodiment of the present invention.

In the above-described embodiment, a method of manufacturing a printed circuit board having two layers of circuit patterns by printing circuit patterns on both surfaces of the core board has been described. Hereinafter, the method of manufacturing a multilayer printed circuit board by laminating the above-described core board will be described.

The multilayer printed circuit board is formed by stacking a plurality of insulating layers and circuit patterns alternately. The multilayer printed circuit board may be manufactured by applying a conventional build-up method to the core board described above. It is also possible to manufacture a multilayer printed circuit board by laminating. The aforementioned core substrate is not necessarily used to manufacture a multilayer printed circuit board, and of course, it can be used as a printed circuit board by itself.

Hereinafter, a method of manufacturing a multilayer printed circuit board by collectively laminating a plurality of core boards will be described. First, a plurality of core substrates are manufactured according to the above-described embodiment (200). As described above, the paste bump 20 included in the core substrate is coupled to penetrate the insulating layer 22 at a position requiring interlayer electrical connection of the circuit pattern.

A circuit pattern is formed on the surface of the core substrate by inkjet printing (210), another core substrate is laminated on the circuit pattern (220), and then the circuit pattern is formed on the surface of the stacked core substrate by inkjet printing again. (230). By repeating this process, a multilayer printed circuit board can be manufactured as many as desired layers. However, the multilayer printed circuit board manufacturing method according to the present embodiment does not necessarily have to sequentially perform the above-described steps.

That is, it is also possible to form a multi-layer printed circuit board by forming a circuit pattern by inkjet printing on the surface of each of the plurality of core boards without laminating the core boards while stacking the core boards. In this case, the circuit pattern may be printed on only one of the core boards in the overlapped portions by lamination.

Although the technical spirit of the present invention has been described in detail according to the above-described embodiments, the above-described embodiments are for the purpose of description and not of limitation, and a person of ordinary skill in the art will appreciate It will be understood that various embodiments are possible within the scope.

As described above, according to the method of manufacturing a printed circuit board according to the preferred embodiment of the present invention, it is possible to eliminate the drilling process and the plating process, which are basic in forming the printed circuit board, and to use only the inkjet technology and the bump forming technology for the interlayer connection. Multilayer printed circuit boards can be fabricated, reducing process lead times and improving productivity.

In addition, there is an advantage that the thickness of the core substrate can be freely adjusted in the process of manufacturing the core substrate, all processes can be a dry process (dry process) can be an environmentally friendly method.

Claims (10)

(a) bonding the paste bumps to the support plate; (b) stacking an insulating layer on the support plate such that the paste bumps penetrate the insulating layer and protrude above the surface of the insulating layer; (c) stacking and pressing the pressing plate on the insulating layer; (d) removing the support plate and the pressing plate to form a core substrate; And (e) printing a circuit pattern on the surface of the core board by an inkjet method. The method of claim 1, Step (a) is, (a1) laminating a film layer on the support plate; And (a2) A method of manufacturing a printed circuit board comprising the step of bonding the paste bumps on the film layer. The method of claim 1, The support plate is a printed circuit board manufacturing method comprising a stainless steel plate. The method of claim 1, The pressing plate is a printed circuit board manufacturing method, characterized in that formed by laminating a film layer on a stainless steel plate. The method of claim 4, wherein The step (c) comprises the step of laminating the pressing plate such that the film layer in contact with the insulating layer. delete As a method of manufacturing a multilayer printed circuit board in which a plurality of insulating layers and circuit patterns are laminated alternately, (f) manufacturing a first core substrate and a second core substrate including a paste bump penetrating the insulating layer at a position where an interlayer electrical connection of the circuit pattern is required; (g) printing a first circuit pattern on the surface of the first core substrate by an inkjet method; (h) stacking the second core substrate on the first circuit pattern; And (i) printing a second circuit pattern on the surface of the second core substrate by an inkjet method, The first core substrate and the second core substrate, (f1) bonding the paste bumps to the support plate; (f2) stacking an insulating layer on the support plate such that the paste bump penetrates the insulating layer and protrudes above the surface of the insulating layer; (f3) stacking and pressing the pressing plate on the insulating layer; And (f4) A method of manufacturing a multilayer printed circuit board, which is manufactured by removing the support plate and the pressing plate. delete delete delete

Images