CN101657074B - Circuit board and manufacturing method of circuit board - Google Patents
Circuit board and manufacturing method of circuit board Download PDFInfo
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- CN101657074B CN101657074B CN2008103040471A CN200810304047A CN101657074B CN 101657074 B CN101657074 B CN 101657074B CN 2008103040471 A CN2008103040471 A CN 2008103040471A CN 200810304047 A CN200810304047 A CN 200810304047A CN 101657074 B CN101657074 B CN 101657074B
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- circuit board
- conducting wire
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- supporting bracket
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Abstract
The invention relates to a circuit board, comprising a conductive line layer and an insulating padding body, wherein the conductive line layer comprises a plurality of conductive lines which have opposite first outer surfaces and second outer surfaces; two adjacent conductive lines are at least separated partially to form a plurality of interspaces which penetrate through the first outer surfaces and the second outer surfaces; and the insulating padding body is padded in the interspaces between adjacent conductive lines. The invention also relates to a manufacturing method of the circuit board and a manufacturing method of a multi-layer circuit board.
Description
Technical field
The present invention relates to the circuit board making technical field, relate in particular to a kind of circuit board and preparation method thereof.
Background technology
Along with the development of electronic product toward miniaturization, high speed direction, circuit board also develops toward the multilayer circuit board direction from single face circuit board, double-sided PCB.Multilayer circuit board is meant the circuit board with multilayer conductive circuit, it has more wiring area, higher interconnect density, thereby be widely used, referring to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans.on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
Process for manufacturing circuit board generally includes steps such as exposure, development, etching, boring, plating.With the multilayer circuit board is example, and it adopts lay-up method to make, and particularly, may further comprise the steps: the first step forms the conducting wire with exposure, development, etch process in the copper-clad base plate surface; In second step, bore the through hole that connects copper-clad base plate in the precalculated position of conducting wire; The 3rd step formed the copper layer with electroplating technology in the through hole hole wall, thereby formed via, made inner plating; The 4th step was an outermost layer substrate with another copper-clad base plate, adopted pure glue that this outermost layer substrate is pressure bonded to inner plating; In the 5th step, form blind hole or through hole in the precalculated position of outermost layer substrate; In the 6th step, form the copper layer in blind hole or through hole hole wall with electroplating technology; The 7th step, adopt exposure, development, etch process to form the conducting wire in the outermost layer substrate surface, make the two-tier circuit plate, be internal substrate with this two-tier circuit plate, repeated for the 4th step to the 7th step, can make multilayer circuit board.
This shows, the manufacturing process of every layer of structure comprises that very complicated conducting wire makes in the production process of existing multilayer circuit board, steps such as the pressing that constantly repeats, exposure, development, etching, the labour intensity that makes multilayer circuit board make is bigger, and make efficiency is lower.And in the manufacture method of above-mentioned circuit board, need to adopt copper-clad base plate, make the thickness of circuit board be subjected to the restriction of copper-clad base plate thickness, the circuit etching precision is wayward, and, adopt above-mentioned wet process to handle, adopt chemical medicinal liquid, environment is polluted, can not reach the purpose of environmental protection.
Therefore, be necessary to provide a kind of manufacture method of circuit board, avoid adopting copper-clad base plate as raw material, and can simplify the circuit board making operation, improve the precision of circuit board line.
Summary of the invention
Below will be the manufacture method of example explanation circuit board with embodiment.
A kind of circuit board, it comprises conducting wire layer and insulation filling body, described conducting wire layer comprises many conducting wires, described conducting wire has the first relative outer surface and second outer surface, adjacent two conducting wires to small part is separated, thereby form a plurality of spaces of running through first outer surface and second outer surface, described insulation filling body is filled in the space between the adjacent conductive circuit.
A kind of manufacture method of circuit board, it may further comprise the steps: the supporting bracket with adherent surfaces is provided; Form the conducting wire layer in the supporting bracket surface; Form insulating barrier in supporting bracket surface, and described insulating barrier is formed in the space of described conducting wire layer, makes described conducting wire layer be embedded at described insulating barrier, and go out from described insulating layer exposing; Described supporting bracket is separated with the conducting wire layer with insulating barrier, and insulating barrier and conducting wire layer form circuit board.
A kind of manufacture method of multilayer circuit board, it may further comprise the steps: the manufacture method according to above-mentioned circuit board is made single layer board; Precalculated position, surface, conducting wire in single layer board forms electric conductor; The surface that is formed with electric conductor in single layer board forms separator, makes electric conductor be embedded at separator; Surface in separator forms external conducting wire.
Compared with prior art, the manufacture method of the circuit board of the technical program need not made via, therefore, can effectively overcome the defective of the plating via hole wall difficulty that the making via brings in the prior art, and simplify the circuit board making operation greatly, improve the circuit board making yield.
Description of drawings
Fig. 1 is the schematic diagram of the supporting bracket that circuit board manufacturing method adopts that provides of the technical program first embodiment.
Fig. 2 is the schematic diagram that forms the conducting wire in supporting bracket shown in Figure 1 surface.
Fig. 3 is the schematic diagram that forms insulating barrier in supporting bracket shown in Figure 2 surface.
Fig. 4 is the circuit board schematic diagram that the technical program embodiment makes.
Fig. 5 is the schematic diagram that single layer board shown in Figure 4 surface forms electric conductor.
Fig. 6 is the schematic diagram that Fig. 5 forms separator.
Fig. 7 is the schematic diagram that Fig. 6 forms external conducting wire.
Embodiment
Be elaborated below with reference to the manufacture method of drawings and Examples to the circuit board of the technical program.
The manufacture method of the circuit board that the technical program first embodiment provides may further comprise the steps:
The first step: provide support plate 110.
See also Fig. 1, supporting bracket 110 has surface 111, and surface 111 has antistick characteristic.In the present embodiment, the surface 111 of supporting bracket 110 is coated with the Teflon material, it is the fluorine coating of matrix resin for polytetrafluoroethylene alkene, it has thermal endurance, chemical inertness and excellent insulation stability and low frictional properties, and described Teflon material can be for polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP), cross the copolymer (ETFE) of fluoroalkylation thing (PFA), ethene and tetrafluoroethene etc.
In second step, form conducting wire layer 120 in the surface 111 of supporting bracket 110.
See also Fig. 2, the conducting wire layer 120 that desire forms extends in the direction that is parallel to surface 111, be that conducting wire layer 120 protrudes from surface 111, the conducting wire 120 that desire forms protrudes from the thickness of the circuit board that the height on surface 111 can be according to actual needs and controls.
Conducting wire layer 120 can adopt print process to be formed at the surface 111 of supporting bracket 110.Particularly, print process is carried out according to the following steps: at first template such as web plate or steel plate are covered in surface 111, described template has the through hole of conductive circuit pattern; Secondly, with the liquid thermosetting conductive materials as copper cream, silver paste or carbon paste printing to as described in the through hole of line pattern; Once more, baking or the described conductive materials of ultraviolet light polymerization, making this conductive materials solidified forming is conducting wire layer 120, at last template is separated with supporting bracket 110, forms conducting wire layer 120 on the surface 11 thus.
Make precision for improving, conducting wire layer 120 also can adopt ink-jet method to make.Particularly, can adopt following two kinds of methods to make.
First kind, at first, provide injection apparatus and template, described template is provided with and the corresponding through hole of line pattern, and injection apparatus has injector head, and the through hole that is used for seeing through template is to the jet surface liquid thermosetting conductive materials of supporting bracket 10 such as copper slurry, silver slurry; Secondly, adopt this area curing process commonly used such as the soft roasting or hard roasting liquid conductive materials that solidifies, liquid conductive materials is solidified; At last, force in template, it is separated with the conductive materials solidfied material, thereby form conducting wire layer 120 on the surface 111 of supporting bracket 110.
Second step, directly form the conducting wire in the surface of supporting bracket 110, promptly adopt the MEMS (micro electro mechanical system) that has the injector head of MEMS (micro electro mechanical system) and the position data of through hole is imported this injector head, utilize this injector head directly liquid conductive materials to be injected into the surface 111 of supporting bracket 110 then under the condition of UV-irradiation or heated baking, solidified forming is the conducting wire when realizing that liquid conductive materials self-injection head is sprayed onto the surface 111 of supporting bracket 110.
The 3rd step, supporting bracket 110 be formed with described conducting wire layer 120 surface 111 form insulating barriers 130 and make conducting wire layer 120 be embedded at insulating barrier 130, and from insulating barrier 130, expose.
See also Fig. 2 and Fig. 3, at first liquid insulating material is filled in the space of conducting wire layer 120 with rubbing method or ink-jet method.Under the influence of surface tension of liquid, liquid insulating material will be towards the direction diffusion near conducting wire layer 120, until soaking into conducting wire layer 120.For avoiding liquid insulating material to overflow, the thickness of the liquid insulating material of being filled is advisable with the height that is no more than conducting wire layer 120, and promptly the height of insulating barrier 130 can also can equal the height of conducting wire layer 120 less than the height of conducting wire layer 120.The operation of described ink-jet method can be referring to step 2.The material of described liquid insulating material is the normal resin that adopts in this area, as in phenolic resins, epoxy resin, mylar, polyimides, Teflon, poly-thiamines, polymethyl methacrylate, Merlon, polyethylene terephthalate, the polyimides-polyethylene-terephthaldehyde's ester copolymer one or more.
Behind the insulating material to be filled, need to adopt the conventional heat curing process in this area as baking or ultraviolet light polymerization with the liquid insulating material solidified forming, thereby form insulating barrier 130, and expose conducting wire layer 120, insulating barrier 130 and conducting wire layer 120 form circuit board 140.
In the 4th step, single layer board 140 is separated with supporting bracket 110.The surface-coated of supporting bracket 110 has adhesive, treat single layer board 140 curing moldings after, can easily single layer board 140 be separated with supporting bracket 110.
The circuit board 140 that forms comprises conducting wire layer 120 and insulation filling body, described conducting wire layer 120 comprises many conducting wires, described conducting wire has the first relative outer surface 121 and second outer surface 122, adjacent two conducting wires to small part is separated, thereby form a plurality of spaces of running through first outer surface 121 and second outer surface 122, described insulation filling body is filled in the space between the adjacent conductive circuit.
In the manufacture method of foregoing circuit plate, also can form the conducting wire layer, form the insulating barrier figure then among the space of conducting wire layer, make the conducting wire be embedded in the insulating barrier, and expose by insulating barrier prior to the surface 111 of supporting bracket 110.
The technical program second embodiment provides a kind of manufacture method of multilayer circuit board, and it may further comprise the steps:
The first step according to the manufacture method of the above-mentioned first embodiment circuit board, is made single layer board 140, and single layer board 140 has two relative surfaces 142.Can on two, carry out the layer that increases of single layer board 140 respectively.In the present embodiment, increasing layer with surface therein is that example describes.
In second step, the precalculated position on 120 surface forms electric conductor 150 in the conducting wire.
The formation of electric conductor 150 can be adopted rubbing method or ink-jet method, specifically can be with reference to the step 2 in the manufacture method of the technical program single layer board, difference is that the through hole of above-mentioned template setting is corresponding with position and figure that desire forms the conducting that is conducted with conducting wire 120.
In the 3rd step, the surface that is formed with electric conductor 150 in single layer board 140 forms separator 160 and makes electric conductor 150 be embedded at separator 160, and exposes from separator 160.
The 4th step formed the external conducting wire 170 that links to each other with electric conductor 150 on separator 160 surfaces, formed multilayer circuit board 180.
Before forming external conducting wire 170, can carry out preliminary treatment to the surface of separator 160, as flatten processing, to improve the interface binding power between follow-up external conducting wire 170 and the separator 160 and to guarantee the profile pattern of external conducting wire 170, thereby improve the making precision of external conducting wire 170, or remove the insulating material that may adhere to electric conductor 150 surfaces when forming separator 160 with rubbing method, to expose corresponding electric conductor 150, be convenient to follow-up external conducting wire 170 and realize conducting with first conducting wire 120 by electric conductor 150.
The formation of external conducting wire 170 employing ink-jet method or rubbing method, the concrete step 2 of the manufacture method of the circuit board that provides referring to the technical program first embodiment.
In order to make more multi-layered circuit board, can repeat the step 3 of manufacture method of the circuit board of the technical program first embodiment, form second insulating barrier, repeat step 2 in the present embodiment can be made more multi-layered number to step 4 circuit board then.
In the circuit board manufacturing method of the technical program, need not use copper-clad base plate, avoid of the restriction of raw material thickness circuit board thickness as raw material.Do not need to adopt the processing procedures such as etching of traditional circuit production method, the mode that the circuit of circuit board is made by coating and ink-jet realizes, simplifies the circuit board making operation, improves the precision of circuit board line.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (12)
1. circuit board, it comprises conducting wire layer and insulation filling body, described conducting wire layer comprises many conducting wires, described conducting wire has the first relative outer surface and second outer surface, adjacent two conducting wires to small part is separated, thereby form a plurality of spaces of running through first outer surface and second outer surface, described insulation filling body is filled in the space between the adjacent conductive circuit.
2. circuit board as claimed in claim 1 is characterized in that the height of described insulation filling body is less than the height of conducting wire layer.
3. as the circuit board under the claim 1, it is characterized in that the height of described insulation filling body equals the height of conducting wire layer.
4. the manufacture method of a circuit board, it may further comprise the steps:
Supporting bracket with adherent surfaces is provided;
Form the conducting wire layer in the supporting bracket surface;
Form insulating barrier in supporting bracket surface, and described insulating barrier is formed in the space of described conducting wire layer, makes described conducting wire layer be embedded at described insulating barrier, and go out from described insulating layer exposing;
Described supporting bracket is separated with the conducting wire layer with insulating barrier.
5. the manufacture method of circuit board as claimed in claim 4 is characterized in that, described conducting wire layer puts on described supporting bracket surface with print process or ink-jet method with the liquid thermosetting conductive materials and forms.
6. the manufacture method of circuit board as claimed in claim 4 is characterized in that, described insulating barrier is filled in the zone that the conducting wire layer is removed on the supporting bracket surface with rubbing method or ink-jet method with liquid insulating material.
7. the manufacture method of circuit board as claimed in claim 4 is characterized in that, described manufacture method also is included in the step that forms the preceding curing conductive line layer of insulating barrier.
8. the manufacture method of circuit board as claimed in claim 4 is characterized in that, the surface-coated of described supporting bracket has the Teflon material.
9. the manufacture method of a multilayer circuit board, it may further comprise the steps:
Manufacture method according to each described circuit board of claim 4 to 8 is made single layer board; Precalculated position, surface, conducting wire in single layer board forms electric conductor;
The surface that is formed with electric conductor in single layer board forms separator, makes electric conductor be embedded at separator; Surface in separator forms external conducting wire.
10. the manufacture method of multilayer circuit board as claimed in claim 9 is characterized in that, described external conducting wire is the liquid thermosetting conductive materials, and it is formed at described precalculated position with print process or ink-jet method.
11. the manufacture method of multilayer circuit board as claimed in claim 9 is characterized in that, the formation of described separator comprises that with rubbing method or ink-jet method liquid insulating material being filled in the supporting bracket surface removes the step in the zone of electric conductor.
12. the manufacture method of multilayer circuit board as claimed in claim 9 is characterized in that, described manufacture method also is included in and forms the step of solidifying electric conductor before the separator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103040471A CN101657074B (en) | 2008-08-19 | 2008-08-19 | Circuit board and manufacturing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103040471A CN101657074B (en) | 2008-08-19 | 2008-08-19 | Circuit board and manufacturing method of circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN101657074A CN101657074A (en) | 2010-02-24 |
| CN101657074B true CN101657074B (en) | 2011-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008103040471A Active CN101657074B (en) | 2008-08-19 | 2008-08-19 | Circuit board and manufacturing method of circuit board |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI496258B (en) * | 2010-10-26 | 2015-08-11 | Unimicron Technology Corp | Fabrication method of package substrate |
| TWI419278B (en) * | 2010-10-26 | 2013-12-11 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5604018A (en) * | 1993-06-25 | 1997-02-18 | Shinko Electric Industries, Co., Ltd. | Ceramic oxide circuit board |
| CN1273762A (en) * | 1998-05-06 | 2000-11-15 | 日本碍子株式会社 | Printed circit board material and method of manufacturing board material and intermediate block body for board material |
| CN101184360A (en) * | 2006-11-14 | 2008-05-21 | 三星电子株式会社 | Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film |
-
2008
- 2008-08-19 CN CN2008103040471A patent/CN101657074B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5604018A (en) * | 1993-06-25 | 1997-02-18 | Shinko Electric Industries, Co., Ltd. | Ceramic oxide circuit board |
| CN1273762A (en) * | 1998-05-06 | 2000-11-15 | 日本碍子株式会社 | Printed circit board material and method of manufacturing board material and intermediate block body for board material |
| CN101184360A (en) * | 2006-11-14 | 2008-05-21 | 三星电子株式会社 | Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film |
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| CN101657074A (en) | 2010-02-24 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Effective date of registration: 20170303 Address after: 518103 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |