CN107046761A - Printed circuit board (PCB) - Google Patents
Printed circuit board (PCB) Download PDFInfo
- Publication number
- CN107046761A CN107046761A CN201710013795.3A CN201710013795A CN107046761A CN 107046761 A CN107046761 A CN 107046761A CN 201710013795 A CN201710013795 A CN 201710013795A CN 107046761 A CN107046761 A CN 107046761A
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- CN
- China
- Prior art keywords
- metal pattern
- layer
- flexible insulating
- insulating layer
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present invention discloses a kind of printed circuit board (PCB).Printed circuit board (PCB) according to an aspect of the present invention includes：Alternately laminated flexible insulating layer and rigid insulation layer；Multiple metal pattern layers, are formed on the flexible insulating layer and rigid insulation layer, wherein, in the multiple metal pattern layer, another layer of the rigidity positioned at most gabarit is more than positioned at the rigidity of a certain layer of most gabarit.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
In recent years, the importance that miniaturization, slimming and the profile of electronic product are related to increasingly increases.Met to realize
The electronic product of these requirements, the importance for being inserted into the printed circuit board (PCB) of the inside of electronic product is protruded.Right reply
The miniaturization and slimming of electronic product, hard-flexible printed circuit board is used as the substrate for being inserted into electronic product.
Firmly-flexible printed circuit board is divided into hard component and flexible portion, wherein, hard component is in order in narrower interval reality
Now effectively arrange and mount the part of sensor and part；Flexible portion is the part as bending section.
【Prior art literature】
【Patent document】
(patent document 0001) US publication the 2008-0014768th
The content of the invention
It is an object of the invention to provide the printed circuit board (PCB) that a kind of flatness is improved.
According to the present invention on the one hand there is provided a kind of printed circuit board (PCB), including：Alternately laminated flexible insulating layer and hardness
Insulating barrier；Multiple metal pattern layers, are formed on the flexible insulating layer and rigid insulation layer, wherein, the multiple
In metal pattern layer, another layer of the rigidity positioned at most gabarit is more than positioned at the rigidity of a certain layer of most gabarit.
According to the present invention on the other hand there is provided a kind of printed circuit board (PCB), including：First flexible insulating layer；First metal
Pattern, is formed at the upper and lower surface of first flexible insulating layer；First rigid insulation layer, with exposure first flexible insulation
The mode of a part for layer is laminated in the upper and lower surface of first flexible insulating layer；Second metal pattern, is formed at described
The bottom of one rigid insulation layer；3rd metal pattern, is formed at the top of the first rigid insulation layer, wherein, described second
The rigidity of metal pattern is more than the rigidity of the 3rd metal pattern.
Brief description of the drawings
Fig. 1 is the figure for showing the printed circuit board (PCB) according to one embodiment of the invention.
Fig. 2 is the figure for showing printed circuit board (PCB) according to another embodiment of the present invention.
Fig. 3 to Figure 11 is the figure for the manufacture method for showing the printed circuit board (PCB) according to one embodiment of the invention.
Symbol description
110：First flexible insulating layer 120：First metal pattern
130：First rigid insulation layer 140：Second metal pattern
150：3rd metal pattern 160：Second flexible insulating layer
170：4th metal pattern 180：Second rigid insulation layer
190：Coating SR：Solder resist
V1：First passage V2：Second channel
V3：Third channel V4：Fourth lane
V5：Five-channel
Embodiment
The embodiment with reference to the accompanying drawings to the printed circuit board (PCB) according to the present invention is described in detail herein, and
During being described with reference to the accompanying drawings, identical drawing reference numeral will be assigned for identical or corresponding key element, and omit weight
Multiple explanation.
In addition, the term of used such as " first ", " second " etc is only used for identical or corresponding composition
The identification label of key element difference, and identical or corresponding inscape can't be limited by the term such as " first ", " second ".
In addition, in contact relation between each inscape, so-called " with reference to " is not only represented between each key element
Direct physical contact situation, will also be also to tap tactile situation with other constituting portion respectively including each inscape
Concept and used.
Printed circuit board (PCB)
Fig. 1 is the figure for showing the printed circuit board (PCB) according to one embodiment of the invention.
Reference picture 1, according to the printed circuit board (PCB) of one embodiment of the invention as a kind of hard-flexible base board, can be answered
For camara module etc..
Flexible insulating layer, rigid insulation layer, Duo Gejin can be included according to the printed circuit board (PCB) of one embodiment of the invention
Metal patterns layer.
Specifically, it can be included according to the printed circuit board (PCB) of one embodiment of the invention：First flexible insulating layer 110,
First metal pattern 120, the 130, second metal pattern 140 of the first rigid insulation layer, the 3rd metal pattern 150, and can enter
One step is included：Second flexible insulating layer 160, the 4th metal pattern 170, the second rigid insulation layer 180.
In multiple metal pattern layers, the rigidity positioned at some layer of most gabarit can be than another layer positioned at most gabarit
Rigidity it is big.
Flexible insulating layer is the layer formed by the megohmite insulant that can be bent with flexible, for example, can be by polyamides
Imines (Polyimide：PI) constitute.
Flexible insulating layer could be formed with multiple.For example, flexible insulating layer can include the first flexible insulating layer 110 and the
Two flexible insulating layers 160.
Rigid insulation layer is by lacking flexibility compared to flexible insulating layer, so as to which the megohmite insulant that can not be bent is constituted
Layer, it can be made up of epoxy resin.Especially, the fiber of such as glass fibre etc can be impregnated with these epoxy resin
Supporting material, and it can be preimpregnation material (prepreg) to be impregnated with the epoxy resin of glass fibre.
For example, epoxy resin can be naphthalene system epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic aldehyde
Novolac epoxy resins, cresol novolac epoxy, rubber deformation type epoxy resin, aliphatic epoxy resin, organosilicon ring
Oxygen tree fat, nitrogen-containing epoxy thermoset, phosphorous epoxy resin etc., but be not limited to that this.
Rigid insulation layer can include the material with cementability, so that rigid insulation layer is able to carry out the adhesive portion of interlayer
The function of part.
Rigid insulation layer can be formed as multiple.For example, rigid insulation layer can include the first rigid insulation layer 130 and the
Two rigid insulations layer 180.
Flexible insulating layer and rigid insulation layer can be with alternately laminated.
For example, the first rigid insulation layer 130 is could be formed with the two sides of the first flexible insulating layer 110, and second
The two sides of flexible insulating layer 160 could be formed with the second rigid insulation layer 180, and be intervened with the first rigid insulation layer 130
The first flexible insulating layer 110 and the second flexible insulating layer 160 are formed with to middle mode with being laminated.
In the case, three layers of rigid insulation layer is equipped with, and flexibility is intervened absolutely between each two rigid insulation layer
Edge layer, so as to provide the printed circuit board (PCB) for being configured to five layers.
In addition, the thickness of flexible insulating layer can be less than the thickness of rigid insulation layer, but be not limited to that this, both
Thickness can be with identical, or the thickness of rigid insulation layer can be with relatively smaller.
Firmly-soft printed circuit board (PCB) can be divided into stiffened area R and flexible region F.Only included in flexible region F
Flexible insulating barrier, and stiffened area R can by flexible insulating layer and rigid insulation layer all include.Rigid insulation layer can be with
It is laminated in the way of the part for exposing flexible insulating layer on flexible insulating layer.
That is, it is soft that the first rigid insulation layer 130 is formed at first in the way of a part for the first flexible insulating layer 110 of exposure
Property insulating barrier 110 on, and the second rigid insulation layer 180 by exposure the second flexible insulating layer 160 a part in the way of formed
In on the second flexible insulating layer 160.
A part for the exposure of a part for the exposure of first flexible insulating layer 110 and the second flexible insulating layer 160 is each other
Correspondence, and the part of the exposure is flexible region F.
In the angle of manufacturing process, it can be understood as hole (cavity) can be correspondingly formed with flexible region F in
First flexible insulating layer 130 and the second flexible insulating layer 180.
As shown in figure 1, according to the printed circuit board (PCB) of one embodiment of the invention can be divided into two stiffened area R and
Intervene a flexible region F in the middle of two stiffened area R.
In flexible region F, rigid insulation layer is not present to outer exposed in flexible insulating layer.Flexible region F can be by
Multiple flexible insulating layers are constituted, and multiple flexible insulating layers can be isolated from each other.
In addition, even if printed circuit board (PCB) includes two layers of flexible insulating layer, the flexible insulating layer from flexible region F exposures can
Think one.That is, according to the demand of those skilled in the art, another flexible insulating layer can be removed.
For example, in Fig. 1, flexible region F can be made only to remain the first flexible insulating layer 110, the second flexible insulating layer 160
It can then be removed.
Stiffened area R can include multiple flexible insulating layers and rigid insulation layer, it is possible to flexible insulating layer and firmly
The structure that property insulating barrier is alternately laminated.Because stiffened area R is almost without bendability, exist even in stiffened area R flexible
Insulating barrier, stiffened area R bendability is relatively low.
It is exhausted in flexible insulating layer and hardness for flexible region F and stiffened area R in the angle of manufacturing process
After edge layer is alternately laminated, in flexible region F, only rigid insulation layer-selective is removed, so as to be divided into
Flexible region F and stiffened area R.
In addition, metal pattern layer is the layer being made up of metal pattern, its metal pattern layer may be constructed multiple.Metal figure
Pattern layer be formed on flexible insulating layer and rigid insulation layer on.
Multiple metal pattern layers can include the first metal pattern 120, the second metal pattern 140, the 3rd metal pattern 150
And the 4th metal pattern 170.
First metal pattern 120 is formed at the one side of the first flexible insulating layer 110 or the metal pattern of top and bottom.
Second metal pattern 140 is formed at the bottom of the first rigid insulation layer 130, is especially formed in the first flexible insulation
The bottom of the first rigid insulation layer 130 of the lower surface formation of layer 110, specifically, can be formed at the second rigid insulation layer
180 lower surface.In addition, the second metal pattern 140 can be the metal pattern for the most gabarit being located on printed circuit board (PCB).
3rd metal pattern 150 can be located at the top of the first rigid insulation layer 130, it is particularly possible to be formed at soft first
Property insulating barrier 110 upper surface formed the first rigid insulation layer 130 upper surface.3rd metal pattern 150 can be in printing
It is located at outermost exterior feature on circuit board, and the opposing face of the second metal pattern 140 can be located at.
The 3rd metal pattern layer being made up of the 3rd metal pattern 150 can be utilized as ground plane.
4th metal pattern 170 can be formed at the one side of the second flexible insulating layer 160, it is particularly possible to be formed at following table
Face.In addition, the 4th metal pattern 170 can be formed at the two sides (that is, top and bottom) of the second flexible insulating layer 160.
The external substrates such as the second metal pattern 140 and mainboard are connected, and the part such as chip can be mounted on the 3rd gold medal
Metal patterns 150.
This metal pattern can be by the copper (Cu) of good electric performance, palladium (Pd), aluminium (Al), nickel (Ni), titanium (Ti), gold
(Au), the metal of platinum (Pt) etc is constituted.
In multiple metal patterns, the rigidity positioned at a certain layer of most gabarit can be more than positioned at another layer of most gabarit
Rigidity.In addition, in multiple metal patterns, can be more than positioned at the rigidity of a certain layer of most gabarit and be not on each of most gabarit
The rigidity of individual metal pattern layer.
For example, the rigidity of the second metal pattern 140 can be more than the rigidity of the 3rd metal pattern 150.In addition, the second metal
The rigidity of pattern 140 can be more than the rigidity of remaining metal pattern, i.e. more than the first metal pattern 120, the second metal pattern
140 and the 3rd metal pattern 150 rigidity.
In the case, the second metal pattern 140 can be made up of the metal comprising iron, and the first metal pattern 120
It can be made up of to the 3rd metal pattern 150 metal comprising copper.Especially, the second metal pattern 140 can be stainless steel
(Stainless Steel；steel usestainless：SUS).In addition, the metal pattern of the first metal pattern 120 to the 3rd
150 can be made up of fine copper or copper alloy.
Using the relatively large metal of rigidity as the second metal pattern 140 in the case of use, printed circuit board (PCB)
Flatness can be improved, it is possible to the problems such as reducing bending (warpage), tilt (tilt).
In addition, in multiple metal patterns, the thermal conductivity positioned at a certain layer of most gabarit can be more than the heat of remaining layer
Conductance.For example, the thermal conductivity of the second metal pattern 140 can be more than the thermal conductivity of remaining metal pattern.
The first metal pattern 120, still, the second metal pattern are could be formed with flexible region F and stiffened area R
140th, the 3rd metal pattern 150, the 4th metal pattern 170 but can only be formed at stiffened area R.
Each metal pattern can pass through additive (additive), abatement (subtractive), half additive (semi
Additive), protuberance (tenting), modified half additive treating (Modified Semi Additive Process：MSAP)
Formed Deng Process, but be not limited to that above-mentioned method.
Multiple passages can further be included according to the printed circuit board (PCB) of one embodiment of the invention.
Passage can make at least two metal patterns in multiple metal patterns realize that interlayer is connected.In multiple passages extremely
Few one can be with a certain layer positioned at most gabarit in the multiple metal pattern layers of insertion.
Multiple passages can include first passage V1, second channel V2, third channel V3, fourth lane V4, Five-channel
V5。
First passage V1 is the first flexible insulating layer of insertion 110 and will be formed in the two sides of the first flexible insulating layer 110
120 passage between first metal pattern 120.First passage V1 can be the passage for being padded (fill) plating.
Second channel V2 is the passage that simultaneously insertion rigid insulation layer is connected with the second metal pattern 140.Here, second channel
V2 can be with the rigid insulation of insertion second layer 180.In addition, second channel V2 can be located at the most gabarit on printed circuit board (PCB) with insertion
Metal pattern layer.That is, second channel V2 can be with the second metal pattern of insertion 140.Second channel V2 can be padded plating or
The form that only access opening madial wall is plated.
Third channel V3 is to be connected with the 3rd metal pattern 150 and insertion rigid insulation layer (especially, the first rigid insulation layer
130) passage.Third channel V3 can be padded plating or form that only passage madial wall is plated.
Third channel V3 can be constituted with first passage V1 and be stacked (stack) structure.
Fourth lane V4 is through channel formed by the multiple insulating barriers of insertion.Fourth lane V4 can include following lead to
Road：By the first flexible insulating layer 110, the second flexible insulating layer 160, the whole insertions of the first rigid insulation layer 130, so that by first
Metal pattern 120, the 3rd metal pattern 150 and the 4th metal pattern 170 are electrically connected.In addition, fourth lane V4 can include
Following passage：By the first flexible insulating layer 110, the second flexible insulating layer 160, the hardness of the first rigid insulation layer 130, second absolutely
The whole insertions of edge layer 180, so that by the first metal pattern 120, the second metal pattern 140, the 3rd metal pattern 150 and the 4th
Metal pattern 170 is electrically connected.
Fourth lane V4 through hole cross section is configured to tend to be constant with the above-below direction for tending to printed circuit board (PCB).This
Outside, fourth lane V4 can be padded plating and form through hole or the form of plating is only carried out in madial wall.
Five-channel V5 is that the first metal pattern 120 and the 4th metal pattern 170 can be connected to the hardness of ground insertion first absolutely
The passage of edge layer 130.
Coating 190 can also be included according to the printed circuit board (PCB) of one embodiment of the invention.
The part metals pattern of metal pattern layer is could be formed with the exposed region of flexible insulating layer, and flexible exhausted
The region of edge layer could be formed with the coating for covering the part metals pattern.
For example, a part of of the first metal pattern 120 (that is, can be located in the exposed region of the first flexible insulating layer 110
The flexible region F part of the first flexible insulating layer 110) formed.
In the case, flexible region F the first flexible insulating layer 110 and stiffened area R the first flexible insulating layer 110
Compared to showing as to outer exposed.Therefore, the part of the first metal pattern 120 can also be to outer exposed.In this feelings
Under condition, it may be necessary to the described a part of burn into damage of the first metal pattern 120 of coating 190 to prevent exposure etc..
Coating 190 can be made up of the megohmite insulant with the identical material of the first flexible insulating layer 110, for example, can be with
It is made up of polyimides.Only, adhesive substance can also be contained in coating 190.
In addition, coating can also be formed on the second flexible insulating layer, but not figure 1 illustrates.
The side of coating 190 can be with stiffened area R printed circuit board (PCB).This coating 190 is also known as covering
Film (coverlay).
Coating 190 can be formed at the two sides of the first flexible insulating layer 110.
Solder resist SR can also be included according to the printed circuit board (PCB) of one embodiment of the invention.
Solder resist SR is as a kind of photonasty solder resist, in the metal pattern layer of the most gabarit on printed circuit board (PCB)
Formed, so as to protect the metal pattern of the metal pattern layer.Solder resist SR can cover the second metal pattern 140 and the 3rd metal
Pattern 150.Only, can be in solder resist SR in order that a part for the second metal pattern 140 and the 3rd metal pattern 150
Form opening.
Fig. 2 is the figure for showing printed circuit board (PCB) according to another embodiment of the present invention.With reference picture 1 according to the present invention
The printed circuit board (PCB) of an embodiment compare, and the description of emphasis is only carried out to discrepancy.
Reference picture 2, printed circuit board (PCB) according to another embodiment of the present invention includes the first flexible insulating layer 110 and a pair of
First rigid insulation layer 130, and unlike the above-mentioned printed circuit board (PCB) according to one embodiment of the invention, not comprising second
The rigid insulation of flexible insulating layer 160 and second layer 180.
The rigid insulation of a pair of first layer 130 is formed at the two sides of the first flexible insulating layer 110.In the present embodiment, print
The insulating barrier of circuit board and the first flexible insulating layer 110 are symmetrical.In flexible region F, one layer of flexible insulating layer is only existed
110。
In the case, to be formed at first formed below the first flexible insulating layer 110 hard for the second metal pattern 140
The lower surface of property insulating barrier 130.
The rigidity of second metal pattern 140 can be more than the first metal pattern 120 and/or the 3rd metal pattern 150
Rigidity.In addition, the thermal conductivity of the second metal pattern 140 can be more than the first metal pattern 120 and/or the 3rd metal figure
The thermal conductivity of case 150.
In addition, printed circuit board (PCB) according to another embodiment of the present invention can include multiple passages, and multiple passages
It can include：Between first passage V1, the first metal pattern 120 of connection；Second channel V2, connects the He of the first metal pattern 120
Second metal pattern 140；Third channel V3, the first metal pattern 120 of connection and the 3rd metal pattern 150；Fourth lane V4, with
All layers of the mode insertion printed circuit board (PCB) of multiple metal patterns are connected simultaneously.
In addition, printed circuit board (PCB) according to another embodiment of the present invention can also include above-mentioned coating 190 and resistance
Solder flux SR.
The manufacture method of printed circuit overtime work
Fig. 3 to Figure 11 is the figure for the manufacture method for showing the printed circuit board (PCB) according to one embodiment of the invention.
Reference picture 3 can include as follows to Figure 11 according to the manufacture method of the printed circuit board (PCB) of one embodiment of the invention
The step of：In the first flexible insulating layer 110 the first metal pattern of formation；Form coating 190；Form the first rigid insulation layer
130；Form the second flexible insulating layer 160, the 3rd metal pattern layer, the 4th metal pattern layer；Pattern the 3rd metal pattern layer；
Form the second rigid insulation 140 layers of the 180, second metal pattern of layer；The second rigid insulation layer is correspondingly formed with flexible region F
180 and pattern 140 layers of the second metal pattern；Form solder resist SR.
Reference picture 3, the first metal pattern 120 is formed with the first flexible insulating layer 110.In the first flexible insulating layer 110
Prepare to be pasted with the flexibility coat copper plate (Flexible of the first metal pattern layer with the two sides of first flexible insulating layer 110
Copper Clad Laminate：FCCL after), the first metal pattern can be formed by patterned first metal patterned layer
120。
In addition, in this step, first passage V1 can also be formed simultaneously.It can be led to by such a way formation first
Road V1：First, with forming the part of through hole accordingly, the part of the first metal pattern layer is removed by the mode such as etching, from
And the first flexible insulating layer 110 is exposed, and using laser such as CO2, YAG to the first flexible insulating layer 110 formation through hole, and
Plating is carried out to associated through-holes inside.
In the case of using this laser formation through hole, the cross-sectional area of through hole can add with tending to non-from machined surface
Work face and be gradually reduced.
Reference picture 4, coating 190 is formed at the first flexible insulating layer 110.Coating 190 covers the first metal pattern 120
A part, and flexible region F can be located in final product.
Reference picture 5, while stacking on the two sides with the first flexible insulating layer 110 as the first rigid insulation layer 130,
First rigid insulation layer 130 is used as adhering part, so that by the second flexible insulating layer 160 and the 3rd metal pattern
Layer is laminated respectively.That is, it is laminated with the on the first rigid insulation layer 130 for being formed at the upper surface of the first flexible insulating layer 110
Three metal pattern layers, and be laminated with the first rigid insulation layer 130 for being formed at the lower surface of the first flexible insulating layer 110
Second flexible insulating layer 160.Here, being laminated with the 4th metal pattern layer on the second flexible insulating layer 160.
In short, a FCCL being made up of the first flexible insulating layer 110 and the first metal pattern layer and flexible by second
Another FCCL that insulating barrier 160 and the 4th metal pattern layer are constituted using the first rigid insulation layer 130 as adhering part and that
This stacking.
In addition, the 3rd metal pattern layer also using the first rigid insulation layer 130 as adhering part in the first flexible insulation
It is laminated on layer 110.
State of 3rd metal pattern layer with the 4th metal pattern layer still before patterning, and in stiffened area R
Occupy certain region with flexible region F.
Reference picture 6, the 3rd metal level is patterned and forms the 3rd metal pattern 150.The pattern of 3rd metal pattern 150
It is not defined, but only in the R of stiffened area, and be not present in flexible region F.That is, the in flexible region F the 3rd
Metal pattern layer is removed.
In correlation step, it will form multiple passages.Connect the first metal pattern 120 and the 3rd metal pattern 150
Passage, third channel V3 can be formed in the following way：3rd metal level a part of impregnated and the hardness of exposure first are absolutely
Edge layer 130, processes through hole, and carry out plating to through hole inside to the first rigid insulation layer 130 afterwards.Here, through hole can lead to
Laser processing is crossed to be formed.
Fourth lane V4 is the passage for all insulating barrier insertions that will be laminated in current step, and it can be by such as
Under type is formed：Formed the first flexible insulating layer 110, the second flexible insulating layer 160, the first rigid insulation layer 130 all
After the through hole of insertion, by plating inside through hole.Here, through hole can be by machine drilling processing methods such as drill points (bit)
Formed, and compared to Laser Processing, the constant cross-sectional area of its through hole.
Five-channel V5 is the passage by the first metal pattern 120 and the connection of the 4th metal pattern layer, by the following method
Formed：A part for 4th metal pattern layer is removed by impregnating method and the second flexible insulating layer 160 is exposed, is then formed
The through hole of insertion the second flexible insulating layer 160 and the first rigid insulation layer 130, and plating will be carried out inside through hole.
Five-channel V5 can be compared with first passage V1 or third channel V3 and with reciprocal shape.That is,
Five-channel V5 cross section can be trapezoidal, on the contrary, first passage V1 and third channel V3 cross section can be inverted trapezoidal.This
Species diversity is caused by the difference of the machined surface laser machined.
Reference picture 7, stacking forms 140 layers of the second rigid insulation layer 180 and the second metal pattern.In the case, second
Second rigid insulation layer 180 is laminated by 140 layers of metal pattern as adhering part.
In above-mentioned steps, 140 layers of the 180, second metal pattern of the second rigid insulation layer crosses over stiffened area R and flex region
Both domains and preferentially form.
Reference picture 8, the second 140 layers of metal pattern is patterned and forms the second metal pattern 140.Second metal pattern
140 exist only in stiffened area R, are but not present in flexible region F.
The patterning of second 140 layers of metal pattern can be realized by impregnating method, in the case, and dipping is only the
Two metal patterns 140 are realized, and the second rigid insulation layer 180 can perform the function of placing restrictions on key element (stopper).
In addition, in this step, the another of all insulating barrier insertions for will being laminated in the step of so far can be formed
One fourth lane V4.
Reference picture 9, patterns and forms the second rigid insulation layer 180.By removing the second hardness in flexible region F absolutely
Edge layer 180, so that the second rigid insulation layer 180 exists only in stiffened area R.Second rigid insulation layer 180 can pass through laser
Processing or machine drilling are processed and are removed, and in the case, the 4th metal pattern layer, which can be played, places restrictions on key element (stopper)
Effect.
Reference picture 10, patterns and forms the 4th metal pattern layer.Here, the 4th metal pattern in flexible region F
Layer will be removed, and the 4th metal pattern 170 of formation in the R of stiffened area.4th metal pattern layer can pass through dipping
And be removed, in the case, the second flexible insulating layer 160 can perform the function of placing restrictions on key element.
The result of correlation step is performed, the flexible region for being only left to include coating 190 in flexible region F, and hard
Property region R in insulating barrier and rigid insulation layer can all exist.
Flexible region F flexible insulating layer has bendability, therefore, and printed circuit board (PCB) may be on the basis of flexible insulating layer
And be bent.
Reference picture 11, forms solder resist SR.Solder resist SR covers the second metal pattern 140 and the 3rd metal pattern 150, and
And according to demand, the opening of the part exposure of the second metal pattern 140 and the 3rd metal pattern 150 is formed at welding resistance
Agent SR.
In the case where solder resist SR is photonasty solder resist, opening can pass through photoetching (photolithography) work
Skill is formed.
More than, one embodiment of the invention is illustrated, but there is the people of ABC in the technical field
Can do not depart from be recorded in the range of the thought of the invention of claims by the additional of inscape, change,
Delete or addition etc. and corrected in various mode and change the present invention.And this also will be contained in the interest field of the present invention
It is interior.
Claims (16)
1. a kind of printed circuit board (PCB), including：
Alternately laminated flexible insulating layer and rigid insulation layer；
Multiple metal pattern layers, are formed on the flexible insulating layer and rigid insulation layer,
Wherein, in the multiple metal pattern layer, the rigidity positioned at a certain layer of most gabarit is more than positioned at the another of most gabarit
The rigidity of layer.
2. printed circuit board (PCB) as claimed in claim 1, wherein,
In the multiple metal pattern layer, a certain layer positioned at most gabarit is made up of the metal comprising iron, and remaining layer is by wrapping
The metal of cupric is constituted.
3. printed circuit board (PCB) as claimed in claim 1, in addition to：
At least one passage, realizes the interlayer connection of two metal patterns in multiple metal pattern layers.
4. printed circuit board (PCB) as claimed in claim 3, wherein,
The passage is formed as multiple, is located at most at least one the multiple metal pattern layer of passage insertion in multiple passages
The a certain layer of gabarit.
5. printed circuit board (PCB) as claimed in claim 1, wherein,
In the multiple metal pattern layer, the thermal conductivity of remainder layer is more than positioned at the thermal conductivity of a certain layer of most gabarit.
6. printed circuit board (PCB) as claimed in claim 1, wherein,
The rigid insulation layer is laminated on the flexible insulating layer in the way of a part for the exposure flexible insulating layer.
7. printed circuit board (PCB) as claimed in claim 6, wherein,
A part for the metal pattern of the metal pattern layer is formed with the exposed region of the flexible insulating layer,
A part of coating for covering the metal pattern is formed with the exposed region of the flexible insulating layer.
8. printed circuit board (PCB) as claimed in claim 7, wherein,
The flexible insulating layer and the coating are made up of identical material.
9. printed circuit board (PCB) as claimed in claim 1, wherein,
In the multiple metal pattern layer, solder resist is formed with the layer of most gabarit.
10. printed circuit board (PCB) as claimed in claim 1, wherein,
The flexible insulating layer and the rigid insulation layer be respectively structured as it is multiple,
Each described flexible insulating layer is respectively arranged between rigid insulation layer.
11. printed circuit board (PCB) as claimed in claim 1, wherein,
In the multiple metal pattern layer, each gold for being not on most gabarit is more than positioned at the rigidity of a certain layer of most gabarit
The rigidity of metal patterns layer.
12. a kind of printed circuit board (PCB), including：
First flexible insulating layer；
First metal pattern, is formed at the upper and lower surface of first flexible insulating layer；
First rigid insulation layer, is laminated in described first flexible exhausted in the way of a part for exposure first flexible insulating layer
The upper and lower surface of edge layer；
Second metal pattern, is formed at the bottom of the first rigid insulation layer；And
3rd metal pattern, is formed at the top of the first rigid insulation layer,
Wherein, the rigidity of second metal pattern is more than the rigidity of the 3rd metal pattern.
13. printed circuit board (PCB) as claimed in claim 12, in addition to：
Second flexible insulating layer, is laminated in the lower surface of the first rigid insulation layer；
4th metal pattern, is formed at the lower surface of second flexible insulating layer；And
Second rigid insulation layer, is laminated in the following table of second flexible insulating layer in the way of covering the 4th metal pattern
Face, and a part for second flexible insulating layer is exposed,
Wherein, second metal pattern is formed at the lower surface of the second rigid insulation layer.
14. printed circuit board (PCB) as claimed in claim 13, wherein,
The rigidity of second metal pattern is more than the rigidity of first metal pattern and the 4th metal pattern.
15. printed circuit board (PCB) as claimed in claim 13, in addition to：
Passage, connects second metal pattern and the 4th metal pattern,
Wherein, the second metal pattern described in the passage insertion.
16. printed circuit board (PCB) as claimed in claim 12, wherein,
A part for first metal pattern is formed at the exposed region of first flexible insulating layer,
Described the described a part of of first metal pattern of covering is formed with the exposed region of first flexible insulating layer to cover
Cap rock.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0003194 | 2016-01-11 | ||
| KR1020160003194A KR102494343B1 (en) | 2016-01-11 | 2016-01-11 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107046761A true CN107046761A (en) | 2017-08-15 |
| CN107046761B CN107046761B (en) | 2022-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710013795.3A Active CN107046761B (en) | 2016-01-11 | 2017-01-09 | Printed circuit board |
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| Country | Link |
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| KR (1) | KR102494343B1 (en) |
| CN (1) | CN107046761B (en) |
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| KR102550170B1 (en) * | 2018-01-04 | 2023-07-03 | 삼성전기주식회사 | Printed circuit board and camera module having the same |
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| CN1929123A (en) * | 2005-09-07 | 2007-03-14 | 新光电气工业株式会社 | Multilayered wiring substrate and method of manufacturing the same |
| JP2013030724A (en) * | 2011-06-22 | 2013-02-07 | Sumitomo Chemical Co Ltd | Laminated body and manufacturing method of the same |
| CN104735899A (en) * | 2013-12-19 | 2015-06-24 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN104869753A (en) * | 2014-02-21 | 2015-08-26 | 三星电机株式会社 | Printed Circuit Board And Method Of Manufacturing The Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4843979B2 (en) * | 2004-03-30 | 2011-12-21 | 住友ベークライト株式会社 | Circuit board |
| KR100754080B1 (en) | 2006-07-13 | 2007-08-31 | 삼성전기주식회사 | Rigid-flexible printed circuit board and manufacturing method therefor |
| JP2011091312A (en) * | 2009-10-26 | 2011-05-06 | Sumitomo Bakelite Co Ltd | Rigid flex circuit board, method of manufacturing the same, and electronic device |
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2016
- 2016-01-11 KR KR1020160003194A patent/KR102494343B1/en active IP Right Grant
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929123A (en) * | 2005-09-07 | 2007-03-14 | 新光电气工业株式会社 | Multilayered wiring substrate and method of manufacturing the same |
| JP2013030724A (en) * | 2011-06-22 | 2013-02-07 | Sumitomo Chemical Co Ltd | Laminated body and manufacturing method of the same |
| CN104735899A (en) * | 2013-12-19 | 2015-06-24 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN104869753A (en) * | 2014-02-21 | 2015-08-26 | 三星电机株式会社 | Printed Circuit Board And Method Of Manufacturing The Same |
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| Publication number | Publication date |
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| KR102494343B1 (en) | 2023-02-01 |
| KR20170083833A (en) | 2017-07-19 |
| CN107046761B (en) | 2022-03-01 |
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