CN107046761B - A printed circuit board - Google Patents
A printed circuit board Download PDFInfo
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- CN107046761B CN107046761B CN201710013795.3A CN201710013795A CN107046761B CN 107046761 B CN107046761 B CN 107046761B CN 201710013795 A CN201710013795 A CN 201710013795A CN 107046761 B CN107046761 B CN 107046761B
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- insulating layer
- metal pattern
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- flexible insulating
- layer
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 208
- 239000002184 metal Substances 0.000 claims abstract description 208
- 239000010410 layer Substances 0.000 claims description 346
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 238000000059 patterning Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明公开一种印刷电路板。根据本发明的一方面的印刷电路板包括：交替层叠的柔性绝缘层和硬性绝缘层；多个金属图案层，形成于所述柔性绝缘层和所述硬性绝缘层上，其中，在所述多个金属图案层中，位于最外廓的某一层的刚度大于位于最外廓的另一层的刚度。
The invention discloses a printed circuit board. A printed circuit board according to an aspect of the present invention includes: alternately laminated flexible insulating layers and rigid insulating layers; a plurality of metal pattern layers formed on the flexible insulating layers and the rigid insulating layers, wherein, among the multiple insulating layers Among the metal pattern layers, the rigidity of a certain layer located at the outermost outline is greater than that of another layer located at the outermost outline.
Description
Technical Field
The present invention relates to a printed circuit board.
Background
In recent years, the importance of miniaturization, thinning, and shape design of electronic products has been increasing. In order to realize electronic products satisfying these requirements, the importance of a printed circuit board inserted into the interior of the electronic products is highlighted. In order to cope with miniaturization and thinning of electronic products, a rigid-flexible printed circuit board is used as a substrate to be inserted into the electronic products. The hard-flexible printed circuit board is divided into a hard part and a flexible part, wherein the hard part is used for mounting sensors and components for realizing effective arrangement in a narrower interval; the flexible portion is a portion that serves as a flexure.
[ Prior art documents ]
[ patent document ]
(patent document 0001) U.S. published patent No. 2008-0014768
Disclosure of Invention
An object of the present invention is to provide a printed circuit board with improved flatness.
According to an aspect of the present invention, there is provided a printed circuit board including: flexible insulating layers and hard insulating layers which are alternately laminated; and a plurality of metal pattern layers formed on the flexible insulating layer and the hard insulating layer, wherein, in the plurality of metal pattern layers, a certain layer positioned at the outermost contour has a rigidity greater than that of another layer positioned at the outermost contour.
According to another aspect of the present invention, there is provided a printed circuit board including: a first flexible insulating layer; a first metal pattern formed on upper and lower surfaces of the first flexible insulating layer; a first hard insulating layer laminated on upper and lower surfaces of the first flexible insulating layer in a manner of exposing a portion of the first flexible insulating layer; a second metal pattern formed on a lower portion of the first hard insulating layer; and a third metal pattern formed on an upper portion of the first hard insulating layer, wherein the second metal pattern has a rigidity greater than that of the third metal pattern.
Drawings
Fig. 1 is a diagram illustrating a printed circuit board according to an embodiment of the present invention.
Fig. 2 is a diagram illustrating a printed circuit board according to another embodiment of the present invention.
Fig. 3 to 11 are diagrams illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
Description of the symbols
110: first flexible insulating layer 120: a first metal pattern
130: first hard insulating layer 140: second metal pattern
150: third metal pattern 160: second flexible insulating layer
170: fourth metal pattern 180: a second hard insulating layer
190: the covering layer SR: solder resist
V1: first passage V2: the second channel
V3: third passage V4: the fourth channel
V5: the fifth channel
Detailed Description
Embodiments of the printed circuit board according to the present invention will be described herein in detail with reference to the accompanying drawings, and in the course of description with reference to the drawings, the same reference numerals will be given to the same or corresponding elements, and overlapping description will be omitted.
In addition, terms such as "first", "second", and the like are used only as identification numbers for distinguishing the same or corresponding constituent elements, and the same or corresponding constituent elements are not limited by the terms "first", "second", and the like.
In the contact relationship between the respective components, the term "joined" is used to mean not only a case where the respective components are in direct physical contact but also a case where the respective components are in contact with other components.
Printed circuit board
Fig. 1 is a diagram illustrating a printed circuit board according to an embodiment of the present invention.
Referring to fig. 1, a printed circuit board according to an embodiment of the present invention, as a hard-flexible substrate, may be applied to a camera module or the like.
The printed circuit board according to an embodiment of the invention may include a flexible insulating layer, a rigid insulating layer, and a plurality of metal pattern layers.
Specifically, the printed circuit board according to an embodiment of the present invention may include: the first flexible insulating layer 110, the first metal pattern 120, the first hard insulating layer 130, the second metal pattern 140, and the third metal pattern 150, and may further include: a second flexible insulating layer 160, a fourth metal pattern 170, and a second hard insulating layer 180.
Among the plurality of metal pattern layers, one layer positioned at the outermost profile may have a greater rigidity than another layer positioned at the outermost profile.
The flexible insulating layer is a layer made of an insulating material that is flexible and can be bent, and may be made of, for example, Polyimide (PI).
The flexible insulating layer may be formed in plurality. For example, the flexible insulating layer may include the first flexible insulating layer 110 and the second flexible insulating layer 160.
The hard insulating layer is a layer made of an insulating substance which is less flexible than the flexible insulating layer and thus cannot be bent, and may be made of epoxy resin. In particular, these epoxy resins may be impregnated with a fiber reinforcement material such as glass fibers, and the epoxy resin impregnated with glass fibers may be a prepreg (preprg).
For example, the epoxy resin may be a naphthalene-based epoxy resin, a bisphenol a-type epoxy resin, a bisphenol F-type epoxy resin, a novolac epoxy resin, a cresol novolac epoxy resin, a rubber deformation-type epoxy resin, an aliphatic epoxy resin, a silicone epoxy resin, a nitrogen-containing epoxy resin, a phosphorus-containing epoxy resin, or the like, but is not limited thereto.
The hard insulating layer may contain a substance having adhesiveness so that the hard insulating layer can perform a function of an adhesive member between layers.
The hard insulating layer may be formed in plurality. For example, the hard insulating layer may include a first hard insulating layer 130 and a second hard insulating layer 180.
The flexible insulating layers and the hard insulating layers may be alternately laminated.
For example, the first hard insulating layer 130 may be formed on both surfaces of the first flexible insulating layer 110, the second hard insulating layer 180 may be formed on both surfaces of the second flexible insulating layer 160, and the first flexible insulating layer 110 and the second flexible insulating layer 160 may be stacked with one first hard insulating layer 130 interposed therebetween.
In this case, three layers of hard insulating layers are provided, and a flexible insulating layer is interposed between each two hard insulating layers, thereby providing a printed circuit board constructed of five layers.
In addition, the thickness of the flexible insulating layer may be smaller than that of the hard insulating layer, but is not limited thereto, and the thicknesses of both may be the same, or the thickness of the hard insulating layer may be relatively smaller.
The hard-soft printed circuit board may be divided into a hard region R and a flexible region F. The flexible region F includes only the flexible insulating layer, and the hard region R may include both the flexible insulating layer and the hard insulating layer. The hard insulating layer may be laminated on the flexible insulating layer in such a manner that a portion of the flexible insulating layer is exposed.
That is, the first hard insulating layer 130 is formed on the first flexible insulating layer 110 in a manner of exposing a portion of the first flexible insulating layer 110, and the second hard insulating layer 180 is formed on the second flexible insulating layer 160 in a manner of exposing a portion of the second flexible insulating layer 160.
The exposed portion of the first flexible insulating layer 110 and the exposed portion of the second flexible insulating layer 160 correspond to each other, and the exposed portions are flexible regions F.
From the viewpoint of the manufacturing process, it can be understood that a cavity (cavity) may be formed in the first flexible insulating layer 130 and the second flexible insulating layer 180 corresponding to the flexible region F.
As shown in fig. 1, a printed circuit board according to an embodiment of the present invention may be divided into two rigid regions R and one flexible region F interposed between the two rigid regions R.
In the flexible region F, the flexible insulating layer is exposed to the outside, and the hard insulating layer is not present. The flexible region F may be composed of a plurality of flexible insulating layers, and the plurality of flexible insulating layers may be isolated from each other.
In addition, even if the printed circuit board includes two layers of the flexible insulating layer, the flexible insulating layer exposed from the flexible domain F may be one. That is, another flexible insulating layer may be removed according to the needs of those skilled in the art.
For example, in fig. 1, the flexible region F may be left with only the first flexible insulating layer 110, and the second flexible insulating layer 160 may be removed.
The hard region R may include a plurality of flexible insulating layers and hard insulating layers, and may have a structure in which the flexible insulating layers and the hard insulating layers are alternately stacked. Since the hard region R has almost no flexibility, the flexibility of the hard region R is relatively low even if the flexible insulating layer is present in the hard region R.
In terms of the manufacturing process, for the flexible region F and the hard region R, after the flexible insulating layers and the hard insulating layers are alternately laminated, only the hard insulating layer is selectively removed in the flexible region F, thereby being capable of being divided into the flexible region F and the hard region R.
The metal pattern layer is a layer formed of a metal pattern, and a plurality of metal pattern layers may be formed. The metal pattern layer is formed on the flexible insulating layer and the hard insulating layer.
The plurality of metal pattern layers may include a first metal pattern 120, a second metal pattern 140, a third metal pattern 150, and a fourth metal pattern 170.
The first metal pattern 120 is a metal pattern formed on one surface or on upper and lower surfaces of the first flexible insulating layer 110.
The second metal pattern 140 is formed on a lower portion of the first hard insulating layer 130, particularly, on a lower portion of the first hard insulating layer 130 formed on a lower surface of the first flexible insulating layer 110, and more particularly, may be formed on a lower surface of the second hard insulating layer 180. In addition, the second metal pattern 140 may be a metal pattern located at the most outer contour on the printed circuit board.
The third metal pattern 150 may be located on an upper portion of the first hard insulating layer 130, and particularly, may be formed on an upper surface of the first hard insulating layer 130 formed on an upper surface of the first flexible insulating layer 110. The third metal pattern 150 may be positioned at the most outer contour on the printed circuit board, and may be positioned at the opposite side of the second metal pattern 140.
The third metal pattern layer formed of the third metal pattern 150 may be utilized as a ground layer.
The fourth metal pattern 170 may be formed on one surface of the second flexible insulating layer 160, and particularly, may be formed on the lower surface. In addition, the fourth metal pattern 170 may be formed on both sides (i.e., upper and lower sides) of the second flexible insulating layer 160.
The second metal pattern 140 is connected to an external substrate such as a main board, and a component such as a chip may be attached to the third metal pattern 150.
Such a metal pattern may be made of a metal having excellent electrical characteristics, such as copper (Cu), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), or platinum (Pt).
In the plurality of metal patterns, a certain layer located at the outermost profile may have a rigidity greater than that of another layer located at the outermost profile. Further, in the plurality of metal patterns, a certain layer located at the outermost contour may have a rigidity greater than that of each metal pattern layer not located at the outermost contour.
For example, the second metal pattern 140 may have a rigidity greater than that of the third metal pattern 150. In addition, the second metal pattern 140 may have a rigidity greater than that of the remaining metal patterns, i.e., greater than that of the first, second, and third metal patterns 120, 140, and 150.
In this case, the second metal pattern 140 may be composed of a metal including iron, and the first to third metal patterns 120 to 150 may be composed of a metal including copper. In particular, the second metal pattern 140 may be Stainless Steel (SUS). In addition, the first to third metal patterns 120 to 150 may be composed of pure copper or a copper alloy.
In the case of using a metal having a relatively large rigidity as the second metal pattern 140, the flatness of the printed circuit board may be improved and problems of bending (warp), tilting (tilt), and the like may be reduced.
In addition, in the plurality of metal patterns, a certain layer located at the outermost profile may have a thermal conductivity greater than that of the remaining layers. For example, the second metal pattern 140 may have a thermal conductivity greater than that of the remaining metal patterns.
The first metal pattern 120 may be formed in both the flexible region F and the hard region R, but the second metal pattern 140, the third metal pattern 150, and the fourth metal pattern 170 may be formed only in the hard region R.
Each metal pattern may be formed by a Process such as Additive (Additive), subtractive (subtractive), Semi-Additive (protrusion), Modified Semi-Additive Process (MSAP), etc., but is not limited to the above Process.
The printed circuit board according to an embodiment of the present invention may further include a plurality of vias.
The via may enable interlayer connection of at least two metal patterns of the plurality of metal patterns. At least one of the plurality of vias may pass through a certain one of the plurality of metal-pattern layers that is located at the outermost profile.
The plurality of channels may include a first channel V1, a second channel V2, a third channel V3, a fourth channel V4, and a fifth channel V5.
The first via V1 is a via that penetrates the first flexible insulating layer 110 and is to be formed between the first metal patterns 120 on both sides of the first flexible insulating layer 110. The first channel V1 may be a fill (fill) plated channel.
The second via V2 is a via connected to the second metal pattern 140 and penetrating the hard insulating layer. Here, the second channel V2 may penetrate the second hard insulating layer 180. In addition, the second channel V2 may pass through the metal pattern layer of the outermost profile on the printed circuit board. That is, the second channel V2 may penetrate the second metal pattern 140. The second channel V2 may be filled with plating or only the inner side wall of the channel hole may be plated.
The third via V3 is a via connected to the third metal pattern 150 and penetrating the hard insulating layer (particularly, the first hard insulating layer 130). The third channel V3 may be pad plated or only the inner side wall of the channel may be plated.
The third channel V3 may constitute a stacked (stack) structure with the first channel V1.
The fourth channel V4 is a through channel formed through the plurality of insulating layers. The fourth channel V4 may include the following channels: the first flexible insulating layer 110, the second flexible insulating layer 160, and the first hard insulating layer 130 are all penetrated, so that the first metal pattern 120, the third metal pattern 150, and the fourth metal pattern 170 are electrically connected. Further, the fourth passage V4 may include the following passages: the first flexible insulating layer 110, the second flexible insulating layer 160, the first hard insulating layer 130, and the second hard insulating layer 180 are all penetrated, so that the first metal pattern 120, the second metal pattern 140, the third metal pattern 150, and the fourth metal pattern 170 are electrically connected.
The through-hole cross section of the fourth passage V4 is configured to be constant as going toward the up-down direction of the printed circuit board. The fourth duct V4 may be formed by filling-in plating to form a through hole, or may be plated only on the inner wall.
The fifth via V5 is a via that may connect the first metal pattern 120 and the fourth metal pattern 170 to penetrate the first hard insulating layer 130.
The printed circuit board according to an embodiment of the present invention may further include a coverlay 190.
A portion of the metal pattern layer may be formed on the exposed region of the flexible insulating layer, and a cover layer covering the portion of the metal pattern may be formed on the region of the flexible insulating layer.
For example, a portion of the first metal pattern 120 may be formed at an exposed region of the first flexible insulating layer 110 (i.e., a portion of the first flexible insulating layer 110 located at the flexible region F).
In this case, the first flexible insulating layer 110 of the flexible region F appears to be exposed to the outside as compared to the first flexible insulating layer 110 of the hard region R. Accordingly, the portion of the first metal pattern 120 may also be exposed to the outside. In this case, the capping layer 190 may be required to prevent corrosion, damage, etc. of the portion of the exposed first metal pattern 120.
The cover layer 190 may be made of an insulating material of the same material as the first flexible insulating layer 110, and may be made of polyimide, for example. However, the cover layer 190 may contain an adhesive substance.
In addition, a cover layer may also be formed on the second flexible insulating layer, but is not shown in fig. 1.
The side of the cover layer 190 may be connected to the printed circuit board of the hard region R. Such a cover layer 190 is also referred to as a cover film (cover).
Cover layers 190 may be formed on both sides of the first flexible insulating layer 110.
The printed circuit board according to an embodiment of the present invention may further include a solder resist SR.
The solder resist SR is formed as a photosensitive solder resist on the metal pattern layer located at the outermost periphery on the printed circuit board, thereby protecting the metal pattern of the metal pattern layer. The solder resist SR may cover the second and third metal patterns 140 and 150. However, in order to form a part of the second metal pattern 140 and the third metal pattern 150, an opening may be formed in the solder resist SR.
Fig. 2 is a diagram illustrating a printed circuit board according to another embodiment of the present invention. Compared with the printed circuit board according to an embodiment of the present invention with reference to fig. 1, only the point of difference will be described with emphasis.
Referring to fig. 2, a printed circuit board according to another embodiment of the present invention includes a first flexible insulating layer 110 and a dual first hard insulating layer 130, and unlike the printed circuit board according to the above-described embodiment of the present invention, does not include a second flexible insulating layer 160 and a second hard insulating layer 180.
A pair of first hard insulating layers 130 is formed on both sides of the first flexible insulating layer 110. In the present embodiment, the insulating layer of the printed circuit board is symmetrical to the first flexible insulating layer 110. In the flexible zone F, there is only one layer of the flexible insulating layer 110.
In this case, the second metal pattern 140 is formed on the lower surface of the first hard insulating layer 130 formed under the first flexible insulating layer 110.
The second metal pattern 140 may have a rigidity greater than that of the first metal pattern 120 and/or the third metal pattern 150. In addition, the second metal pattern 140 may have a thermal conductivity greater than that of the first metal pattern 120 and/or the third metal pattern 150.
In addition, the printed circuit board according to another embodiment of the present invention may include a plurality of channels, and the plurality of channels may include: a first via V1 connecting between the first metal patterns 120; a second via V2 connecting the first metal pattern 120 and the second metal pattern 140; a third via V3 connecting the first metal pattern 120 and the third metal pattern 150; the fourth via V4 penetrates all layers of the printed circuit board in such a manner as to connect a plurality of metal patterns at the same time.
In addition, the printed circuit board according to another embodiment of the present invention may further include the above-described coverlay 190 and the solder resist SR.
Method for manufacturing printed circuit overtime
Fig. 3 to 11 are diagrams illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
Referring to fig. 3 to 11, a method of manufacturing a printed circuit board according to an embodiment of the present invention may include the steps of: forming a first metal pattern on the first flexible insulating layer 110; forming a capping layer 190; forming a first hard insulating layer 130; forming a second flexible insulating layer 160, a third metal pattern layer, and a fourth metal pattern layer; patterning the third metal pattern layer; forming a second hard insulating layer 180 and a second metal pattern 140 layer; forming a second hard insulating layer 180 corresponding to the flexible region F and patterning the second metal pattern 140 layer; the solder resist SR is formed.
Referring to fig. 3, a first metal pattern 120 is formed on the first flexible insulating layer 110. After preparing a Flexible Copper Clad Laminate (FCCL) to which a first metal pattern layer is attached on both sides of the first Flexible insulating layer 110 and the first Flexible insulating layer 110, the first metal pattern 120 may be formed by patterning the first metal pattern layer.
Further, in this step, the first passage V1 may also be formed simultaneously. The first passage V1 may be formed by: first, a part of the first metal pattern layer is removed by etching or the like corresponding to a portion where a via hole is formed, thereby exposing the first flexible insulating layer 110, and a via hole is formed in the first flexible insulating layer 110 by a laser such as CO2 or YAG, and the inside of the relevant via hole is plated.
In the case of forming a through-hole using such a laser, the cross-sectional area of the through-hole may gradually decrease from the machined surface toward the non-machined surface.
Referring to fig. 4, a capping layer 190 is formed on the first flexible insulating layer 110. The cover layer 190 covers a portion of the first metal pattern 120 and may be located at the flexible region F in the final product.
Referring to fig. 5, the second flexible insulating layer 160 and the third metal pattern layer are stacked on both surfaces of the first flexible insulating layer 110 as the first hard insulating layer 130, and the first hard insulating layer 130 is used as an adhesive member. That is, the third metal pattern layer is stacked on the first hard insulating layer 130 formed on the upper surface of the first flexible insulating layer 110, and the second flexible insulating layer 160 is stacked on the first hard insulating layer 130 formed on the lower surface of the first flexible insulating layer 110. Here, a fourth metal pattern layer is stacked on the second flexible insulating layer 160.
In short, one FCCL composed of the first flexible insulating layer 110 and the first metal pattern layer and the other FCCL composed of the second flexible insulating layer 160 and the fourth metal pattern layer are laminated with the first hard insulating layer 130 as an adhesive member.
The third metal pattern layer is also laminated on the first flexible insulating layer 110 with the first hard insulating layer 130 as an adhesive member.
The third metal pattern layer and the fourth metal pattern layer are in a state before patterning, and occupy certain areas in both the hard area R and the flexible area F.
Referring to fig. 6, the third metal layer is patterned to form a third metal pattern 150. The pattern of the third metal pattern 150 is not limited, but is only within the hard region R and is not present within the flexible region F. That is, the third metal pattern layer in the flexible domain F is removed.
In a related step, a plurality of channels will be formed. A via connecting the first metal pattern 120 and the third metal pattern 150, the third via V3 may be formed by: a portion of the third metal layer is dipped to expose the first hard insulating layer 130, and then a through hole is processed in the first hard insulating layer 130 and plating is performed on the inside of the through hole. Here, the through-hole may be formed by a laser processing method.
The fourth channel V4 is a channel that penetrates all the insulating layers laminated in the present step, and may be formed by: after forming a through hole penetrating all of the first flexible insulating layer 110, the second flexible insulating layer 160, and the first hard insulating layer 130, the inside of the through hole is plated. Here, the through-hole may be formed by a mechanical drilling processing method such as a drill point (bit), and the cross-sectional area of the through-hole is constant as compared with laser processing.
The fifth via V5 is a via connecting the first metal pattern 120 and the fourth metal pattern layer, and is formed by: a portion of the fourth metal pattern layer is removed by dipping or the like to expose the second flexible insulating layer 160, and then a through hole penetrating the second flexible insulating layer 160 and the first hard insulating layer 130 is formed and the inside of the through hole is plated.
The fifth passages V5 may have opposite shapes to each other compared to the first passage V1 or the third passage V3. That is, the cross-section of the fifth passage V5 may be trapezoidal, and conversely, the cross-sections of the first and third passages V1 and V3 may be inverted trapezoidal. This difference is caused by the difference in the processing surface of the laser processing.
Referring to fig. 7, a second hard insulating layer 180 and a second metal pattern 140 layer are stacked. In this case, the second metal pattern 140 layer is laminated with the second hard insulating layer 180 as an adhesive member.
In the above steps, the second hard insulating layer 180 and the second metal pattern 140 layer are preferentially formed across both the hard region R and the flexible region.
Referring to fig. 8, the second metal pattern 140 layer is patterned to form a second metal pattern 140. The second metal pattern 140 exists only in the hard region R, but does not exist in the flexible region F.
The patterning of the second metal pattern 140 layer may be achieved by a dipping method, etc., in which case the dipping is performed only in the second metal pattern 140 and the second hard insulating layer 180 may perform the function of a stopper element (stopper).
In addition, in this step, another fourth channel V4 may be formed that penetrates all the insulating layers laminated in the steps so far.
Referring to fig. 9, a second hard insulating layer 180 is formed by patterning. The second hard insulating layer 180 is only present in the hard region R by removing the second hard insulating layer 180 in the flexible region F. The second hard insulating layer 180 may be removed by laser processing or mechanical drilling processing, and in this case, the fourth metal pattern layer may function as a stopper element (stopper).
Referring to fig. 10, a fourth metal pattern layer is formed by patterning. Here, the fourth metal pattern layer in the flexible region F is removed, and a fourth metal pattern 170 is formed in the hard region R. The fourth metal pattern layer may be removed by dipping, in which case the second flexible insulating layer 160 may perform the function of a limiting element.
As a result of performing the relevant steps, only the flexible region including the cover layer 190 remains in the flexible region F, and the insulating layer and the hard insulating layer are present in the hard region R.
The flexible insulating layer of the flexible domain F has flexibility, and thus, the printed circuit board may be bent with the flexible insulating layer as a reference.
Referring to fig. 11, solder resist SR is formed. The solder resist SR covers the second and third metal patterns 140 and 150, and an opening exposing a portion of the second and third metal patterns 140 and 150 may be formed in the solder resist SR as needed.
In the case where the solder resist SR is a photosensitive solder resist, the opening can be formed by a photolithography (photolithography) process.
Although the embodiment of the present invention has been described above, a person having basic knowledge in the art can variously correct and change the present invention by adding, changing, deleting, or adding components without departing from the scope of the idea of the present invention described in the claims. And this is intended to be included within the scope of the present invention.
Claims (15)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160003194A KR102494343B1 (en) | 2016-01-11 | 2016-01-11 | Printed circuit board |
| KR10-2016-0003194 | 2016-01-11 |
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| Publication Number | Publication Date |
|---|---|
| CN107046761A CN107046761A (en) | 2017-08-15 |
| CN107046761B true CN107046761B (en) | 2022-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710013795.3A Expired - Fee Related CN107046761B (en) | 2016-01-11 | 2017-01-09 | A printed circuit board |
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| KR (1) | KR102494343B1 (en) |
| CN (1) | CN107046761B (en) |
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| KR102550170B1 (en) * | 2018-01-04 | 2023-07-03 | 삼성전기주식회사 | Printed circuit board and camera module having the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929123A (en) * | 2005-09-07 | 2007-03-14 | 新光电气工业株式会社 | Multilayered wiring substrate and method of manufacturing the same |
| JP2013030724A (en) * | 2011-06-22 | 2013-02-07 | Sumitomo Chemical Co Ltd | Laminated body and manufacturing method of the same |
| CN104735899A (en) * | 2013-12-19 | 2015-06-24 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN104869753A (en) * | 2014-02-21 | 2015-08-26 | 三星电机株式会社 | Printed Circuit Board And Method Of Manufacturing The Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4843979B2 (en) * | 2004-03-30 | 2011-12-21 | 住友ベークライト株式会社 | Circuit board |
| KR100754080B1 (en) | 2006-07-13 | 2007-08-31 | 삼성전기주식회사 | Rigid-flexible printed circuit boards and manufacturing method thereof |
| JP2011091312A (en) * | 2009-10-26 | 2011-05-06 | Sumitomo Bakelite Co Ltd | Rigid flex circuit board, method of manufacturing the same, and electronic device |
-
2016
- 2016-01-11 KR KR1020160003194A patent/KR102494343B1/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929123A (en) * | 2005-09-07 | 2007-03-14 | 新光电气工业株式会社 | Multilayered wiring substrate and method of manufacturing the same |
| JP2013030724A (en) * | 2011-06-22 | 2013-02-07 | Sumitomo Chemical Co Ltd | Laminated body and manufacturing method of the same |
| CN104735899A (en) * | 2013-12-19 | 2015-06-24 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN104869753A (en) * | 2014-02-21 | 2015-08-26 | 三星电机株式会社 | Printed Circuit Board And Method Of Manufacturing The Same |
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| Publication number | Publication date |
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| CN107046761A (en) | 2017-08-15 |
| KR20170083833A (en) | 2017-07-19 |
| KR102494343B1 (en) | 2023-02-01 |
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