CN105830542B - The production method of ladder copper post in a kind of PCB - Google Patents
The production method of ladder copper post in a kind of PCB Download PDFInfo
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- CN105830542B CN105830542B CN201480002422.0A CN201480002422A CN105830542B CN 105830542 B CN105830542 B CN 105830542B CN 201480002422 A CN201480002422 A CN 201480002422A CN 105830542 B CN105830542 B CN 105830542B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The production method of ladder copper post (40) in a kind of PCB, resist ink layer (20) is first made on the laminate including copper foil layer (11), resist ink layer makes the first photopolymer layer (30) and the first copper plate (41) on it again after certain temperature and time baking, make the second photopolymer layer (50) and the second copper plate (42) on it again, make optionally to remove the first photopolymer layer and the second photopolymer layer in rear process, and resist ink layer remains intact, continue after laminate powers on tin coating (60), unwanted copper foil layer is removed by etching, the PCB with ladder copper post is made.
Description
Technical field
The present invention relates to a kind of production methods of ladder copper post in PCB manufacture technology fields more particularly to PCB.
Background technology
PCB is the supporter of electronic component, and the carrier of electrical connection is one of important component of electronics industry, application
It is small to electronic watch, calculator in almost each electronic equipment, greatly to computer, communication electronic device, military issue weapons system
Deng.With the continuous development of electronic equipment, the multifunction of electronic equipment also requires the design of PCB more diversified.It is existing
PCB is typically designed with internal layer circuit, outer-layer circuit, the plated-through hole of sandwich circuit or blind hole and step groove inside and outside connection
Deng.And surface has the PCB of ladder copper post, due to complex manufacturing technology, seldom even without using such in electronic product
PCB, strong influence have the development of the PCB of ladder copper post, limit the design and its diversification of PCB.
Invention content
The problem of complex manufacturing technology difficulty of ladder copper post is realized during the present invention makes for existing PCB provides a kind of logical
The method that patch dry film makes ladder copper post with repeatedly plating on PCB is crossed repeatedly, this method is simple and practicable.
To achieve the above object, the present invention is using following technical scheme, the production method of ladder copper post in a kind of PCB, packet
Include following steps：
S1, resist ink layer is made on laminate and the position for making ladder copper post is being needed to open a window, then by layer
Pressing plate is placed in baking sheet 23-27min at 116-124 DEG C；The laminate includes substrate layer and the copper pressed together with substrate layer
Layers of foil.
Preferably, the thickness of the resist ink layer is 20-26 μm.
Preferably, after carrying out baking sheet to laminate, roughening treatment is carried out to anti-plate ink layer.
S2, the first photopolymer layer is made on laminate and the position for making ladder copper post is being needed to open a window, described first is dry
The windowing of film layer is consistent with the windowing shape size of resist ink layer；Then the electro-coppering at windowing forms the first copper plate.
Preferably, the first copper plate is electroplated with the current density of 22ASF, until the first copper plate is flushed with the first photopolymer layer.
A concentration of 55-65g/L, a concentration of 125-135mL/L of sulfuric acid of copper ion in cylinder is electroplated.
S3, the second photopolymer layer is made on laminate and the position for making ladder copper post is being needed to open a window, described second is dry
The windowing of film layer is less than the windowing of the first photopolymer layer；Then the electro-coppering at windowing forms the second copper plate；First copper facing
Layer and the second copper plate form ladder copper post.
Preferably, the second copper plate is electroplated with the current density of 20ASF, until the second copper plate is flushed with the second photopolymer layer.
A concentration of 55-65g/L, a concentration of 125-135mL/L of sulfuric acid of copper ion in cylinder is electroplated.
S4, the first photopolymer layer and the second photopolymer layer are removed, then powers on tin coating in ladder copper post.
S5, resist ink layer is removed, then etching removes the copper foil layer except ladder copper post, then removes tin layers.
In above-described PCB in the production method of ladder copper post, it can be made before step S4 by repeating step S3
Make the ladder copper post with more ladder numbers of plies.Specifically, other photopolymer layers are made on laminate in the method for step S3, so
Other copper plates are electroplated at windowing afterwards, first copper plate, the second copper plate and other copper plates form ladder copper post.So
Afterwards in the method for step S4, the first photopolymer layer, the second photopolymer layer and the other photopolymer layers on laminate are all removed, then existed
Ladder copper post powers on tin coating.And continue step S5.
In above-described PCB in the production method of ladder copper post, the laminate is for a core plate or equipped with interior
The multi-layer board that the core plate of sandwich circuit is pressed together with outer copper foil by prepreg.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention on laminate by first making anti-plate oil
Then layer of ink gradually makes photopolymer layer and plating copper plate, so as to gradually form ladder copper post again.In making, resist ink
Layer makes photopolymer layer on it again after certain temperature and time baking, makes optionally to remove photopolymer layer in rear process, and
Resist ink layer remains intact, and continues to remove unwanted copper foil layer by etching after tin layers are electroplated on multilayer boards
It goes, the PCB with ladder copper post is made.Roughening treatment is first carried out before making photopolymer layer on resist ink layer, dry film can be made
Layer is preferably attached on resist ink layer, can avoid wrinkling due to adhesive force deficiency between resist ink layer and photopolymer layer
Or blistering；Cooperation is electroplated using high current density, shortens electroplating time, makes resist ink layer with photopolymer layer for a long time
Plating conditions under remain to keep good attachment, phenomena such as interlayer does not occur bubble or is detached from, the generation of plating can be avoided.
Make resist ink layer and during each photopolymer layer, using same exposure aligning point, and by exposure aligning precision be located at 20 μm with
It is interior, it is ensured that each stair coaxial of made ladder copper post, and the side vertical smoothness of ladder copper post.
Description of the drawings
Fig. 1 is to make the structure diagram after resist ink layer and the first photopolymer layer in embodiment on PCB；
Fig. 2 is that the structure diagram after the first copper plate is electroplated on PCB in embodiment；
Fig. 3 is that the structure diagram after the second photopolymer layer is made on PCB in embodiment；
Fig. 4 is that the structure diagram after the second copper plate is electroplated on PCB in embodiment；
Fig. 5 is the structure diagram after the first photopolymer layer and the second photopolymer layer removed in embodiment on PCB；
Fig. 6 is the structure diagram after PCB powers on tin coating in embodiment；
Fig. 7 is the structure diagram after the resist ink layer removed in embodiment on PCB；
Fig. 8 is that the PCB in embodiment removes the structure diagram after the copper foil layer other than ladder copper post；
Fig. 9 is the structure diagram made ladder copper post in embodiment and move back the PCB after tin layers.
Specific embodiment
In order to more fully understand the technology contents of the present invention, technical scheme of the present invention is made with reference to specific embodiment
It is further described and illustrates.
Embodiment
With reference to Fig. 1-9, the present embodiment provides a kind of production method of ladder copper post in PCB, using made by this method
The parameter of PCB is as follows：
Core plate：The 0.71mm H/H numbers of plies：2L
Plate Tg：170 ° of base copper：1OZ
The ladder copper post number of plies：2L
Specific make step is as follows：
(1) periphery holes are bored on the technique edges of core plate 10 and make exposure aligning point, anti-electricity is then made on core plate 10
Plating ink layer 20 is simultaneously needing the position for making ladder copper post to open a window, then baking sheet and roughening treatment.It is specific as follows：
(a) sawing sheet：Core plate 10 is outputed by jigsaw size, 10 thickness of core plate is 0.71mm H/H.
(b) periphery holes and exposure aligning point：Using borehole data periphery holes are bored on the technique edges of core plate 10.And in core
Make an exposure aligning point on the technique edges of plate 10, made exposure aligning point for subsequently make resist ink layer 20,
It is used in conjunction with when the first photopolymer layer 30 and the second photopolymer layer 50.
(c) silk-screen resist ink：Silk-screen printing or coating resist ink, are made resist ink layer on core plate 10
20, and by the thickness control of resist ink layer 20 at 20-26 μm.
(d) it is exposed and developed：Contraposition exposure is carried out with 6-7 lattice exposure energy (21 lattice exposure guide rule) and exposure aligning point, and
Exposure aligning precision is located in 20 μm, is then developed, is made except the position for needing to make ladder copper post 40 on core plate 10
Region is covered completely by resist ink layer 20, and the position that need to make ladder copper post 40 then exposes completely, that is, is needing to make
Make to set windowing at the position of ladder copper post 40.
(e) it toasts：Core plate 10 is placed in baking sheet 23-27min at 116-124 DEG C.Resist ink layer 20, can through overbaking
Ensure it is follow-up move back photopolymer layer when, optionally decorporate photopolymer layer and to retain resist ink layer 20 intact.
(f) it is roughened：Roughening treatment is carried out to 20 surface of anti-plate ink layer using sandblasting, to increase follow-up photopolymer layer anti-
The adhesive force on ink layer 20 is electroplated.
(2) the first photopolymer layer 30 is made on core plate 10 and the position for making ladder copper post 40 is being needed to open a window, Ran Hou
Electro-coppering at windowing forms the first copper plate 41.As shown in Figs. 1-2.It is specific as follows：
(a) the first dry film is pasted：The dry film that thickness is 50 μm, press mold temperature are pasted on core plate 10：112-118 DEG C, pressure：
5.0-5.5Kgf/cm2, speed：1.4-1.5m/min enter plate plate temperature：50-60 DEG C, ejecting plate plate temperature：70-85℃.
(b) it is exposed and developed：Contraposition exposure is carried out with 7-8 lattice exposure energy (21 lattice exposure guide rule) and exposure aligning point, and
Exposure aligning precision is located in 20 μm, development is then carried out and forms the first photopolymer layer 30, makes to need to make ladder copper on core plate 10
Region except the position of column 40 is covered completely by the first photopolymer layer 30, and the position that need to make ladder copper post 40 is then completely exposed
Out, i.e., set windowing at the position that need to make ladder copper post 40, the form and dimension of the windowing on resist ink layer 20
Windowing it is completely the same.
(c) microetch：Surface micro etching processing is carried out to core plate 10, and microetch amount is controlled at 1.0-2.0 μm, ensures core plate 10
The cleanliness factor and roughness on 11 surface of copper foil layer at uplifting window make the first copper plate 41 for being subsequently electroplated can be attached well
It on copper foil layer 11.
(d) the first copper plate 41 is electroplated：Core plate 10 is placed in electro-coppering cylinder and is electroplated, copper ion in electro-coppering cylinder
A concentration of 55-65g/L, a concentration of 125-135mL/L of sulfuric acid, is electroplated with the current density of 22ASF, and electroplating time is about
165min, obtains the first copper plate 41, and the surface of the first copper plate 41 is flushed with the surface of the first photopolymer layer 30.It is close using high current
Degree carries out electro-coppering, can shorten electroplating time, reduces the first photopolymer layer 30 or the risk being detached from occurs in resist ink layer 20.The
The surface of one copper plate 41 is flushed with the surface of the first photopolymer layer 30, and the plate face that can make core plate 10 is smooth, the dry film subsequently sticked
It can be attached to well on the first photopolymer layer 30.
(e) it cleans and dry：Comprehensive surface clean is carried out to core plate 10, and low temperature drying is carried out under subnormal ambient
(vacuum degree：- 400mmHg to -500mmHg, temperature：55-65 DEG C, the time：45min), to remove the first photopolymer layer 30 and first
Remaining aqueous vapor between copper plate 41 prevents from subsequently pasting photopolymer layer and wrinkling or blister due to the influence of aqueous vapor.
(3) the second photopolymer layer 50 is made on core plate 10 and the position for making ladder copper post 40 is being needed to open a window, Ran Hou
Electro-coppering at windowing forms the second copper plate 42；First copper plate, 41 and second copper plate 42 forms ladder copper post 40.Such as
Shown in Fig. 3-4.It is specific as follows：
(a) second time dry film 51 is pasted：The dry film that thickness is 50 μm, press mold temperature are pasted on core plate 10：112-118 DEG C, pressure
Power：5.0-5.5Kgf/cm2, speed：1.6-1.7m/min enter plate plate temperature：50-60 DEG C, ejecting plate plate temperature：65-80℃.
Dry film 52 in patch second：Continue to paste the dry film that thickness is 50 μm, press mold temperature on core plate 10：112-118 DEG C, pressure
Power：5.0-5.5Kgf/cm2, speed：1.6-1.7m/min enter plate plate temperature：50-60 DEG C, ejecting plate plate temperature：65-80℃.
(b) it is exposed and developed：Contraposition exposure is carried out with 8-9 lattice exposure energy (21 lattice exposure guide rule) and exposure aligning point, and
Exposure aligning precision is located in 20 μm, is then developed, it is dry to form second by dry film 52 on second time dry film 51 and second
Film layer 50 makes the region for needing to make on core plate 10 except the position of ladder copper post 40 be covered completely by the second photopolymer layer 50, and needs
The position for making ladder copper post 40 then exposes completely, i.e., windowing is set at the position that need to make ladder copper post 40, the windowing
Less than the windowing of the first photopolymer layer 30, i.e. the top surface area of the first copper plate of size ratio 41 of the windowing is small, each side of the windowing
Each side in upper surface compared to the first copper plate 41 inside contracts 0.25mm.
(c) microetch：Surface micro etching processing is carried out to core plate 10, and microetch amount is controlled at 1.0-2.0 μm, ensures the first plating
The cleanliness factor and roughness of 41 upper surface of layers of copper make the second copper plate 42 for being subsequently electroplated that can be attached to the first plating well
In layers of copper 41.
(d) the second copper plate 42 is electroplated：Core plate 10 is placed in electro-coppering cylinder and is electroplated, copper ion in electro-coppering cylinder
A concentration of 55-65g/L, a concentration of 125-135mL/L of sulfuric acid, is electroplated with the current density of 20ASF, and electroplating time is about
235min, obtains the second copper plate 42, and the surface of the second copper plate 42 is flushed with the surface of the second photopolymer layer 50.It is close using high current
Degree carries out electro-coppering, can shorten electroplating time, reduces the first photopolymer layer 30, the second photopolymer layer 50 or resist ink layer 20 and occurs
The risk of disengaging.The surface of second copper plate 42 is flushed with the surface of the second photopolymer layer 50, and the plate face that can make core plate 10 is smooth.
Ladder copper post 40 with two layers of ladder is formed by the first copper plate 41 and the second copper plate 42.
(4) it decorporates the first photopolymer layer 30 and the second photopolymer layer 50, then powers on tin coating 60 in ladder copper post 40.As Fig. 5-
Shown in 6.
(a) dry film is moved back：Core plate 10 is carried out to move back film process with film liquid is moved back, all dry films on core plate 10 is made to remove completely,
And the then intact reservation of resist ink layer 20.Temperature：45-51 DEG C, spray pressure：1.2-1.8kgf/cm2, the time：2.5-
3.0min。
(b) it is tin plating：Tin coating 60 is powered in ladder copper post 40, forms resist layer, the thickness of tin layers 60 is 5-8 μm.
(5) resist ink layer 20 is removed, then etching removes the copper foil layer 11 except ladder copper post 40, then removes tin
Layer 60.As Figure 7-9.
After resist ink layer 20 is decorporated, it will not removed by alkali etching by the copper foil layer 11 that tin layers 60 cover.It connects
It and tin layers 60 is decorporated.
(6) after being surface-treated to the above-mentioned core plate 10 for having made ladder copper post 40, then gong shape, electrical measurement are carried out successively
Examination and final inspection, qualified product can shipment.
In other embodiments, also outer-layer circuit can be made on the surface of core plate, removing obtained PCB has ladder
Outside copper, also with outer-layer circuit.
In other embodiments, can also the core plate in above-described embodiment be changed into multi-layer board equipped with internal layer circuit, it should
Multi-layer board is pressed together by prepreg with outer copper foil by the core plate for being equipped with internal layer circuit and is formed.
In addition, it can also be made before (4) by repeating step (3) with more ladder numbers of plies above-described embodiment the step of
Ladder copper post.I.e.：Third photopolymer layer is made on core plate in the method for step (3), third copper facing is then electroplated at windowing
Layer, first copper plate, the second copper plate and third copper plate form ladder copper post.Then in the method for step S4, by layer
The first photopolymer layer, the second photopolymer layer and third photopolymer layer on pressing plate all remove, and then power on tin coating in ladder copper post.And
Continue step (5) and the flow of (6).So as to which the ladder copper post with three layers of ladder be made.
If the ladder copper post with four layers of ladder need to be made, step is repeated before step (4) according to above-mentioned method
(3) it is primary.If the ladder copper post of more layers need to be made, and so on.
Comparative example 1
The method of the production method that this comparative example provides ladder copper post in a kind of PCB, this method and above-described embodiment is basic
It is identical, the difference lies in：Baking processing (omitting the e operations in step 1) is not carried out in step (1) to core plate, i.e., in core plate
After upper making resist ink layer, facedown plating ink layer carries out roughening treatment.
In step (4), with move back film liquid decorporate the first photopolymer layer and the second photopolymer layer when, resist ink layer can be by together
It removes so that the operation of tin plating and step (5) can not be continued.
Comparative example 2
The method of the production method that this comparative example provides ladder copper post in a kind of PCB, this method and above-described embodiment is basic
It is identical, the difference lies in：In step (1), after making resist ink layer on core plate, core plate is placed at 106-114 DEG C
Baking sheet 18-22min.
In step (4), with move back film liquid decorporate the first photopolymer layer and the second photopolymer layer when, part resist ink layer can quilt
It removes together so that resist ink layer cannot keep complete.When continuing tin plating, it is removed the copper of resist ink layer
Also tin layers can be plated on face, the final copper foil layer (copper foil layer except ladder copper post) for remove does not etch totally, influences
The quality of product.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (9)
1. the production method of ladder copper post in a kind of PCB, which is characterized in that include the following steps：
S1, resist ink layer is made on laminate and the position for making ladder copper post is being needed to open a window, then by laminate
It is placed in baking sheet 23-27min at 116-124 DEG C；The laminate includes substrate layer and the copper foil layer pressed together with substrate layer；
S2, the first photopolymer layer is made on laminate and the position for making ladder copper post is being needed to open a window, first photopolymer layer
Windowing it is consistent with the windowing shape size of resist ink layer；Then the electro-coppering at windowing forms the first copper plate；
S3, the second photopolymer layer is made on laminate and the position for making ladder copper post is being needed to open a window, second photopolymer layer
Windowing less than the first photopolymer layer windowing；Then the electro-coppering at windowing forms the second copper plate；First copper plate and
Second copper plate forms ladder copper post；
S4, the first photopolymer layer and the second photopolymer layer are removed, then powers on tin coating in ladder copper post；
S5, resist ink layer is removed, then etching removes the copper foil layer except ladder copper post, then removes tin layers.
2. according to claim 1 in a kind of PCB ladder copper post production method, which is characterized in that in step S1, to lamination
After plate carries out baking sheet, roughening treatment is carried out to anti-plate ink layer.
3. according to claim 2 in a kind of PCB ladder copper post production method, which is characterized in that in step S2, with
The first copper plate is electroplated in the current density of 22ASF, until the first copper plate is flushed with the first photopolymer layer.
4. according to claim 3 in a kind of PCB ladder copper post production method, which is characterized in that in step S3, with
The second copper plate is electroplated in the current density of 20ASF, until the second copper plate is flushed with the second photopolymer layer.
5. according to claim 4 in a kind of PCB ladder copper post production method, which is characterized in that in step S2 and S3, electricity
When plating the first copper plate and the second copper plate, a concentration of 55-65g/L, a concentration of 125- of sulfuric acid of copper ion in cylinder is electroplated
135mL/L。
6. according to claim 5 in a kind of PCB ladder copper post production method, which is characterized in that before step S4 repeat
Step S3 makes other photopolymer layers in the method for step S3 on laminate, and other copper plates are then electroplated at windowing, described
First copper plate, the second copper plate and other copper plates form ladder copper post；It then will be on laminate in the method for step S4
First photopolymer layer, the second photopolymer layer and other photopolymer layers all remove and power on tin coating in ladder copper post.
7. according to claim 6 in a kind of PCB ladder copper post production method, which is characterized in that the resist ink
The thickness of layer is 20-26 μm.
8. according to the production method of ladder copper post in a kind of any one of claim 1-7 PCB, which is characterized in that the layer
Pressing plate is a core plate.
9. according to the production method of ladder copper post in a kind of any one of claim 1-7 PCB, which is characterized in that the layer
The multi-layer board that pressing plate is pressed together for the core plate equipped with internal layer circuit with outer copper foil by prepreg.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/092351 WO2016082146A1 (en) | 2014-11-27 | 2014-11-27 | Method for manufacturing stepped copper column in pcb |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105830542A CN105830542A (en) | 2016-08-03 |
| CN105830542B true CN105830542B (en) | 2018-07-06 |
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| CN201480002422.0A Active CN105830542B (en) | 2014-11-27 | 2014-11-27 | The production method of ladder copper post in a kind of PCB |
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| Country | Link |
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| CN (1) | CN105830542B (en) |
| WO (1) | WO2016082146A1 (en) |
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| CN108995322B (en) * | 2018-08-06 | 2021-07-09 | 重庆科技学院 | Halogen-free plating-resistant copper plate |
| CN109348629B (en) * | 2018-10-25 | 2021-05-04 | 东莞康源电子有限公司 | Processing method for manufacturing boss PCB |
| CN113316327B (en) * | 2020-02-27 | 2022-05-10 | 北大方正集团有限公司 | Method for manufacturing golden finger of circuit board and circuit board with golden finger |
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| CN103731997A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
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| Publication number | Publication date |
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| CN105830542A (en) | 2016-08-03 |
| WO2016082146A1 (en) | 2016-06-02 |
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