CN102291934A - Plated through hole, printed circuit board (PCB) and method for manufacturing plated through hole - Google Patents
Plated through hole, printed circuit board (PCB) and method for manufacturing plated through hole Download PDFInfo
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- CN102291934A CN102291934A CN201110223786XA CN201110223786A CN102291934A CN 102291934 A CN102291934 A CN 102291934A CN 201110223786X A CN201110223786X A CN 201110223786XA CN 201110223786 A CN201110223786 A CN 201110223786A CN 102291934 A CN102291934 A CN 102291934A
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- China
- Prior art keywords
- throughhole portions
- hole
- aperture
- electroplating ventilating
- step part
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The invention discloses a plated through hole, a printed circuit board (PCB) and a method for manufacturing the plated through hole. The plated through hole is defined by hole walls and comprises at least two through hole parts and at least a step part, wherein the walls of the at least two through hole parts are provided with metal conducting layers; each step part is arranged between the two adjacent through hole parts in all the through hole parts and is connected with the two adjacent through hole parts; and the step parts are provided with insulating hole walls. The plated through hole, the PCB and the method for manufacturing the plated through hole, which are disclosed by the embodiment of the invention, have the following beneficial effects: the outgoing line density can be improved and the two-sided opposite compression of the connector is realized by designing the plated through hole to be provided with at least two conductive through hole parts which are insulated from each other, thus increasing the transmission capacity of signals; and by reducing the thickness-to-diameter ratios of the through holes, the manufacturing difficulty of the PCB can be reduced, the reliability of the product can be improved and the production cost can be lowered.
Description
Technical field
The present invention relates to art of printed circuit boards, particularly the method for the electroplating ventilating hole in the art of printed circuit boards, printed circuit board (PCB) and manufacturing electroplating ventilating hole.
Background technology
Along with the high speed development of networking products, backboard (Backplane) channel capacity is extension trend.At present, adopt common via process, make printed circuit board (PCB) (Printed Circuit Board, abbreviate " PCB " as) the design number of plies and thickness of slab more and more higher, size design is increasing, thereby brought great challenge for the manufacturing process of printed circuit board (PCB), this is mainly reflected in the capacity limit that the number of plies, size, the thickness of slab of printed circuit board (PCB), the throwing power of through hole etc. have all reached producer's equipment.Thereby make that the room for promotion of signal transmission capacity of system is very limited.
Signal transmission capacity for further elevator system satisfies the jumbo demand in market, can adopt two-sided mechanical blind hole technology, forms mechanical blind hole respectively in top surface of printed circuit board and bottom surface, is used to transmit the signal of telecommunication between the different aspects.Yet, this complex process, manufacture difficulty is big, the production cost height, and, cause reliability of products relatively poor owing to factors such as easily long-pending Tibetan medicine water in the blind hole, yields is low.
Therefore, need the signal transmission capacity that a kind of scheme can elevator system, and can reduce the difficulty of manufacturing, and improve reliability of products.
Summary of the invention
The method that the embodiment of the invention provides a kind of electroplating ventilating hole, printed circuit board (PCB) and made electroplating ventilating hole can be lifted out line density, increases the transmission capacity of signal, and can reduce manufacture difficulty, and improve reliability of products.
On the one hand, the embodiment of the invention provides a kind of electroplating ventilating hole, this electroplating ventilating hole is enclosed by hole wall and forms, this electroplating ventilating hole comprises: the axial direction along this electroplating ventilating hole is divided at least two throughhole portions that form, these at least two throughhole portions are enclosed by hole wall and form, and the hole wall of these at least two throughhole portions has metal conducting layer; And at least one step part of dividing formation along this axial direction, this at least one step part is enclosed by the hole wall that insulate and forms, each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least.
On the other hand, the embodiment of the invention provides a kind of printed circuit board (PCB), and this printed circuit board (PCB) comprises: have two-layer at least substrate; And at least one electroplating ventilating hole that runs through this substrate, this electroplating ventilating hole is enclosed by hole wall and forms, this electroplating ventilating hole comprises: the axial direction along this electroplating ventilating hole is divided at least two throughhole portions that form, these at least two throughhole portions are enclosed by hole wall and form, and the hole wall of these at least two throughhole portions has metal conducting layer; And at least one step part of dividing formation along this axial direction, this at least one step part is enclosed by the hole wall that insulate and forms, each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least.
Again on the one hand, the embodiment of the invention provides a kind of method of making electroplating ventilating hole, this method comprises: the electroplating ventilating hole blank that has on the two-layer at least substrate is carried out first electroplating processes, this electroplating ventilating hole blank is enclosed by hole wall and forms, this electroplating ventilating hole blank comprises along the axial direction of this electroplating ventilating hole blank divides at least two throughhole portions and at least one step part that forms, to form metal conducting layer on the surface of these at least two throughhole portions and this at least one step part; Pass through mechanical process, remove lip-deep this metal conducting layer of this at least one step part, form this electroplating ventilating hole, wherein, these at least two throughhole portions are enclosed by hole wall and form, the aperture difference of any two adjacent throughhole portions in these at least two throughhole portions, and axial direction along this electroplating ventilating hole, the throughhole portions that from these two throughhole portions, has the minimum-value aperture at least, until be positioned at the throughhole portions of the top or the bottom of this electroplating ventilating hole, respectively the aperture of this throughhole portions increases successively; This at least one step part is enclosed and is formed by the hole wall of insulation, and each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least.
Based on technique scheme, the electroplating ventilating hole of the embodiment of the invention, printed circuit board (PCB) and the method for making electroplating ventilating hole, the throughhole portions of at least two conductions by electroplating ventilating hole being designed to have mutually insulated, can be lifted out line density, realize the two-sided of connector, thereby increase the transmission capacity of signal pressure, and by reducing the radius-thickness ratio of through hole, can reduce the manufacture difficulty of printed circuit board (PCB), improve reliability of products, and reduce production costs.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention, to do to introduce simply to the accompanying drawing of required use in the embodiment of the invention below, apparently, below described accompanying drawing only be some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic diagram according to the electroplating ventilating hole of the embodiment of the invention;
Fig. 2 is the schematic diagram of electroplating ventilating hole according to another embodiment of the present invention;
Fig. 3 is the schematic diagram of electroplating ventilating hole according to yet another embodiment of the invention;
Fig. 4 is the schematic diagram that has the electroplating ventilating hole of deviation according to the axis of the throughhole portions of the embodiment of the invention;
Fig. 5 is the schematic diagram according to the electroplating ventilating hole that comprises two throughhole portions of the embodiment of the invention;
Fig. 6 is the schematic diagram according to the electroplating ventilating hole that comprises three throughhole portions of the embodiment of the invention
Fig. 7 is the schematic diagram according to the printed circuit board (PCB) of the embodiment of the invention;
Fig. 8 is the indicative flowchart according to the method for the manufacturing electroplating ventilating hole of the embodiment of the invention;
Fig. 9 is the schematic diagram according to the method for the manufacturing electroplating ventilating hole of the embodiment of the invention;
Figure 10 is an indicative flowchart of making the method for electroplating ventilating hole according to another embodiment of the present invention;
Figure 11 is a schematic diagram of making the method for electroplating ventilating hole according to another embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, the every other embodiment that those of ordinary skills are obtained under the prerequisite of not making creative work should belong to the scope of protection of the invention.
Fig. 1 shows the schematic diagram according to the electroplating ventilating hole of the embodiment of the invention.Enclose by hole wall according to the electroplating ventilating hole of the embodiment of the invention and to form, this electroplating ventilating hole comprises along the axial direction of this electroplating ventilating hole divides at least two throughhole portions that form, and at least one step part, these at least two throughhole portions are enclosed by hole wall and form, the hole wall of these at least two throughhole portions has metal conducting layer, this at least one step part is enclosed by the hole wall that insulate and forms, each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least.
Particularly, for example, as shown in Figure 1, this electroplating ventilating hole 100 comprises along the axial direction of this electroplating ventilating hole divides five throughhole portions 111 that form, 112,113,114,115, and four step parts 121,122,123,124, these five throughhole portions 111,112,113,114,115 are enclosed by hole wall respectively and form, and the hole wall of this throughhole portions all has metal conducting layer, these four step parts 121,122,123,124 are enclosed and are formed by the hole wall of insulation respectively, thereby make that the throughhole portions of two conductions adjacent with step part is insulated from each other, wherein, each step part in these four step parts lays respectively between adjacent two throughhole portions, and links to each other with these two adjacent throughhole portions.Particularly, step part 121 and links to each other with 112 with throughhole portions 111 between throughhole portions 111 and 112; Step part 122 and links to each other with 113 with throughhole portions 112 between throughhole portions 112 and 113; Step part 123 and links to each other with 114 with throughhole portions 113 between throughhole portions 113 and 114; Step part 124 and links to each other with 115 with throughhole portions 114 between throughhole portions 114 and 115.
Should be understood that the embodiment of the invention is that example describes with electroplating ventilating hole shown in Figure 1 100 only, but this electroplating ventilating hole 100 should not constitute any qualification to the present invention.Will also be understood that, in embodiments of the present invention, electroplating ventilating hole, throughhole portions and step part all are to be enclosed by hole wall to form, and throughhole portions and step part are in axial direction electroplating ventilating hole to be divided and formed, and the hole wall that promptly forms throughhole portions or step part is a part that forms the hole wall of electroplating ventilating hole.
Therefore, the electroplating ventilating hole of the embodiment of the invention, the throughhole portions of at least two conductions by electroplating ventilating hole being designed to have mutually insulated, can be lifted out line density, realize the two-sided of connector, thereby increase the transmission capacity of signal pressure, and by reducing the radius-thickness ratio of through hole, can reduce the manufacture difficulty of printed circuit board (PCB), improve reliability of products, and reduce production costs.
In the electroplating ventilating hole of the embodiment of the invention, the aperture of adjacent two throughhole portions can be identical, also can be different, and the aperture of throughhole portions can according to actual needs and freely be adjusted.For example, can design the aperture of throughhole portions according to borehole accuracy, also can be according to the aperture of the size design throughhole portions of the connector that links to each other with throughhole portions.
Alternatively, in electroplating ventilating hole according to the embodiment of the invention, the aperture difference of any two adjacent throughhole portions in these at least two throughhole portions, and axial direction along this electroplating ventilating hole, the throughhole portions that from these two throughhole portions, has the minimum-value aperture at least, until be positioned at the throughhole portions of the top or the bottom of this electroplating ventilating hole, respectively the aperture of this throughhole portions increases successively.
Promptly, in embodiments of the present invention, the aperture difference of any two adjacent throughhole portions, and the throughhole portions with minimum-value aperture is positioned at the middle part of electroplating ventilating hole, has the throughhole portions of minimum-value aperture from this, along the axial direction of this electroplating ventilating hole, until any end of this electroplating ventilating hole, the aperture of each throughhole portions increases successively; Perhaps, the throughhole portions with minimum-value aperture is positioned at the top and the bottom of electroplating ventilating hole, has the throughhole portions of minimum-value aperture from this, and along the axial direction of this electroplating ventilating hole, until the other end of this electroplating ventilating hole, the aperture of each throughhole portions increases successively.Below in conjunction with electroplating ventilating hole illustrated in figures 1 and 2, above-mentioned two kinds of situations are described respectively.Should be understood that the middle part that throughhole portions is positioned at electroplating ventilating hole refers to that this throughhole portions is not positioned at the top or the bottom of electroplating ventilating hole, and do not limit the center that this throughhole portions is positioned at electroplating ventilating hole.
Be positioned at the situation at the middle part of electroplating ventilating hole for throughhole portions with minimum-value aperture, for example as shown in Figure 1, the aperture difference of any two the adjacent throughhole portions in the electroplating ventilating hole 100, be that adjacent throughhole portions 111 is different with 112 aperture, adjacent throughhole portions 112 is different with 113 aperture, adjacent throughhole portions 113 is different with 114 aperture, and adjacent throughhole portions 114 is different with 115 aperture.And from the throughhole portions 113 with minimum-value aperture, along the axial method of this electroplating ventilating hole, for always for each throughhole portions 113,112,111 at electroplating ventilating hole top, the aperture of these three throughhole portions increases successively; For always for each throughhole portions 113,114,115 of electroplating ventilating hole bottom, the aperture of these three throughhole portions also increases successively.
Need to prove, in electroplating ventilating hole shown in Figure 1 100, the aperture difference of any two adjacent throughhole portions, but not do not limit the pore size relation of any two throughhole portions of the throughhole portions both sides that lay respectively at the minimum-value aperture.For example, in electroplating ventilating hole shown in Figure 1 100, throughhole portions 112 can be identical with the aperture of throughhole portions 114 or 115, also can be different, particularly, the aperture of throughhole portions 112 can also can be less than or equal to the aperture of this throughhole portions 114 or 115 greater than the aperture of throughhole portions 114 or 115.
Be positioned at the situation of the top or the bottom of electroplating ventilating hole for throughhole portions with minimum-value aperture, for example as shown in Figure 2, the throughhole portions 211 that has the minimum-value aperture in the electroplating ventilating hole 200 is positioned at the top of this electroplating ventilating hole 200, the aperture difference of any two the adjacent throughhole portions in this electroplating ventilating hole 200, be that adjacent throughhole portions 211 is different with 212 aperture, adjacent throughhole portions 212 is different with 213 aperture.And from the throughhole portions 211 with minimum-value aperture, along the axial method of this electroplating ventilating hole, for always for each throughhole portions 211,212,213 of electroplating ventilating hole bottom, the aperture of these three throughhole portions increases successively.
In the electroplating ventilating hole of the embodiment of the invention, from having the throughhole portions of minimum-value aperture, until be positioned at the throughhole portions of the top or the bottom of this electroplating ventilating hole, respectively the aperture of this throughhole portions increases successively, can be convenient to the processing of each throughhole portions thus, thereby can simplified processing process, improve product reliability and precision, and reduce production costs.
But should be understood that the embodiment of the invention is not limited to this, for example, in the electroplating ventilating hole according to the embodiment of the invention, the aperture of any two adjacent throughhole portions also can be only different in these at least two throughhole portions.For example, as shown in Figure 3, electroplating ventilating hole 300 comprises first throughhole portions 311, second throughhole portions 312, third through-hole part 313, fourth hole part 314 and first step part 321, second step part 322 and the 3rd step part 323.Each throughhole portions 311,312,313 and 314 hole wall all have metal conducting layer, and each step part 321,322 and 323 has the hole wall of insulation.In each throughhole portions, the aperture difference of adjacent two throughhole portions.Particularly, the maximum diameter of hole throughhole portions 312 of this electroplating ventilating hole 300 is positioned at the middle part of this electroplating ventilating hole, and top or bottom from this second throughhole portions 312 toward this electroplating ventilating hole, and the aperture of each throughhole portions reduces successively.
In embodiments of the present invention, each throughhole portions can be coaxial in the electroplating ventilating hole, but because mismachining tolerance or according to actual needs, also can have certain axial deviation according to each adjacent throughhole portions of the electroplating ventilating hole of the embodiment of the invention.Alternatively, axial deviation of any two adjacent throughhole portions is less than half of the aperture difference of these two adjacent throughhole portions at least two throughhole portions of this of electroplating ventilating hole, and promptly this axial deviation is less than the radius difference of these two adjacent throughhole portions.
For example, as shown in Figure 4, can have axial deviation d1 between the adjacent through-holes part 411 and 412 of electroplating ventilating hole 400, also can have axial deviation d2 between the throughhole portions 412 and 413, this axial deviation d1 should be less than half of the aperture difference between throughhole portions 411 and 412, and this axial deviation d2 should be less than half of the aperture difference between throughhole portions 412 and 413.
In embodiments of the present invention, electroplating ventilating hole comprises at least two throughhole portions and at least one step part, but quantity and quantitative relation to throughhole portions and step part are unqualified, as long as comprise the throughhole portions of two conductions and the step part of an insulation between these two throughhole portions at least in this electroplating ventilating hole.The quantity that is the throughhole portions that comprises of electroplating ventilating hole can be 2,3,4,5 or more, and the quantity of the step part that electroplating ventilating hole comprises can be 1,2,3,4 or more.
And, each step part at least one step part of electroplating ventilating hole is in these at least two throughhole portions between two adjacent throughhole portions, but do not limit in the electroplating ventilating hole and have a step part between any two the adjacent throughhole portions in these at least two throughhole portions, be that adjacent throughhole portions can directly link to each other, their aperture can be identical, also can be different.Thereby the quantity of throughhole portions can be than the quantity of step part more than 1.Alternatively, has a step part between any two the adjacent throughhole portions in these at least two throughhole portions in the electroplating ventilating hole.
Below in conjunction with Fig. 5 and Fig. 6,, describe electroplating ventilating hole in detail according to the embodiment of the invention in axial direction electroplating ventilating hole is divided into two throughhole portions and three throughhole portions are example.
Fig. 5 shows the schematic diagram according to the electroplating ventilating hole that comprises two throughhole portions 500 of the embodiment of the invention.As shown in Figure 5, these at least two throughhole portions of comprising of this electroplating ventilating hole 500 comprise:
Axial direction along this electroplating ventilating hole is divided first throughhole portions 511 that forms, and this first throughhole portions 511 is enclosed by hole wall and forms, and the hole wall of this first throughhole portions 511 has metal conducting layer; And
Divide second throughhole portions 512 that forms along this axial direction, this second throughhole portions 512 is enclosed by hole wall and forms, and the hole wall of this second throughhole portions 512 has metal conducting layer;
This at least one step part that this electroplating ventilating hole 500 comprises comprises:
Divide the first step part 521 that forms along this axial direction, this first step part 521 is enclosed by the hole wall that insulate and forms, this first step part 521 is between this first throughhole portions 511 and this second throughhole portions 512, and link to each other with this second throughhole portions 512 with this first throughhole portions 511
Wherein, this first throughhole portions 511 is different with the aperture of this second throughhole portions 512, and the axial deviation of this first throughhole portions 511 and this second throughhole portions 512 is less than half of the aperture difference of this first throughhole portions and this second throughhole portions.
For example, the aperture of first throughhole portions 511 can be greater than the aperture of second throughhole portions 512, also can be less than the aperture of second throughhole portions 512.The axial deviation of first throughhole portions 511 and second throughhole portions 512 can be less than 511 and 512 radius difference, and this axial deviation also can be zero, and promptly first throughhole portions 511 is coaxial with second throughhole portions 512.
Alternatively, as shown in Figure 6, these at least two throughhole portions also comprise:
Divide the third through-hole part 513 that forms along this axial direction, this third through-hole part 513 is enclosed by hole wall and forms, this third through-hole part 513 is positioned at a side of this second throughhole portions 512 and away from this first throughhole portions 511, the hole wall of this third through-hole part 513 has metal conducting layer;
This at least one step part also comprises:
Divide the second step part 522 that forms along this axial direction, this second step part 522 is enclosed by the hole wall that insulate and forms, this second step part 522 is between this second throughhole portions 512 and this third through-hole part 513, and link to each other with this third through-hole part 513 with this second throughhole portions 512
Wherein, this second throughhole portions 512 is different with the aperture of this third through-hole part 513, and the axial deviation of this second throughhole portions 512 and this third through-hole part 513 is less than half of the aperture difference of this second throughhole portions 512 and this third through-hole part 513.
Alternatively, the aperture of this first throughhole portions 511 is greater than the aperture of this second throughhole portions 512, and the aperture of this second throughhole portions 512 is greater than the aperture of this third through-hole part 513.Alternatively, the aperture of this first throughhole portions 511 is greater than the aperture of this second throughhole portions 512, and the aperture of this second throughhole portions 512 is less than the aperture of this third through-hole part 513.At this moment, the aperture of first throughhole portions 511 can be greater than the aperture of third through-hole part 513, also can be less than the aperture of this third through-hole part 513, and certainly, the aperture of first throughhole portions 511 also can equate with the aperture of third through-hole part 513.Alternatively, the aperture of this first throughhole portions 511 is less than the aperture of this second throughhole portions 512, and the aperture of this second throughhole portions 512 is less than the aperture of this third through-hole part 513.
Therefore, the electroplating ventilating hole of the embodiment of the invention, the throughhole portions of at least two conductions by electroplating ventilating hole being designed to have mutually insulated, can be lifted out line density, realize the two-sided of connector, thereby increase the transmission capacity of signal pressure, and by reducing the radius-thickness ratio of through hole, can reduce the manufacture difficulty of printed circuit board (PCB), improve reliability of products, and reduce production costs.
Should understand, in embodiments of the present invention, the cross section of throughhole portions and step part is except can being semicircle, ellipse, rectangle, polygon or other shape for the circle, the embodiment of the invention only is that example describes with the circle, but the present invention is not limited to this.
Should also be understood that in embodiments of the present invention the number of throughhole portions and step part, the hole depth of throughhole portions and pore size etc. can determine that the embodiment of the invention is not done any qualification to this according to actual needs.For example, according to actual conditions, the aperture difference of two throughhole portions that each is adjacent can be greater than 0.254mm, the hole depth of the throughhole portions of electroplating ventilating hole inside can be greater than 0.5mm, and for example at the radius-thickness ratio of the electroplating ventilating hole of needs greater than 20 o'clock, can adopt electroplating ventilating hole according to the embodiment of the invention etc.For example, the electroplating ventilating hole of formation can be about its center symmetry, also can be asymmetric; The quantity that is positioned at the throughhole portions of the throughhole portions both sides with minimum-value aperture can equate, also can be unequal.
Should also be understood that the metal conducting layer that the throughhole portions in the embodiment of the invention has can be a copper coating, also can be gold plate, silvering or other coat of metal.And it is that example is described that the embodiment of the invention is applied to printed circuit board (PCB) with electroplating ventilating hole, but the present invention is not limited to this.
The embodiment of the invention also provides a kind of printed circuit board (PCB).As shown in Figure 7, this printed circuit board (PCB) 700 comprises:
Has two-layer at least substrate 710; And
At least one electroplating ventilating hole 721,722,723,724 that runs through this substrate 710,
Wherein any one this electroplating ventilating hole is enclosed by hole wall and forms, and this electroplating ventilating hole can comprise: the axial direction along this electroplating ventilating hole is divided at least two throughhole portions that form, these at least two throughhole portions are enclosed by hole wall and form, and the hole wall of these at least two throughhole portions has metal conducting layer; And at least one step part of dividing formation along this axial direction, this at least one step part is enclosed by the hole wall that insulate and forms, each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least.
Should be understood that at least one electroplating ventilating hole 721,722,723,724 that the printed circuit board (PCB) 700 according to the embodiment of the invention comprises can for simplicity, not repeat them here corresponding to the electroplating ventilating hole in the embodiment of the invention 100,200,300,400 or 500.Should also be understood that the embodiment of the invention only is that example describes with Fig. 7, for example comprise that with printed circuit board (PCB) shown in Figure 7 700 four electroplating ventilating holes are example, but the present invention is not limited to this, printed circuit board (PCB) can comprise the electroplating ventilating hole of other quantity.
The printed circuit board (PCB) of the embodiment of the invention, the throughhole portions of at least two conductions by electroplating ventilating hole being designed to have mutually insulated, can be lifted out line density, realize the two-sided of connector to pressing, thereby increase the transmission capacity of signal, and, can reduce the manufacture difficulty of printed circuit board (PCB) by reducing the radius-thickness ratio of through hole, improve reliability of products, and reduce production costs.
Above, describe electroplating ventilating hole and printed circuit board (PCB) in detail,, describe method in detail according to the manufacturing electroplating ventilating hole of the embodiment of the invention below in conjunction with Fig. 8 to Figure 11 according to the embodiment of the invention in conjunction with Fig. 1 to Fig. 7.
Fig. 8 shows the indicative flowchart according to the method 800 of the manufacturing electroplating ventilating hole of the embodiment of the invention.As shown in Figure 8, this method 800 comprises:
S810, the electroplating ventilating hole blank that has on the two-layer at least substrate is carried out first electroplating processes, this electroplating ventilating hole blank is enclosed by hole wall and forms, this electroplating ventilating hole blank comprises along the axial direction of this electroplating ventilating hole blank divides at least two throughhole portions and at least one step part that forms, to form metal conducting layer on the surface of these at least two throughhole portions and this at least one step part;
S820 by mechanical process, removes lip-deep this metal conducting layer of this at least one step part, forms the insulation hole wall of this at least one step part,
Wherein, these at least two throughhole portions are enclosed by hole wall and form, the aperture difference of any two adjacent throughhole portions in these at least two throughhole portions, and axial direction along this electroplating ventilating hole, the throughhole portions that from these two throughhole portions, has the minimum-value aperture at least, until be positioned at the throughhole portions of the top or the bottom of this electroplating ventilating hole, respectively the aperture of this throughhole portions increases successively; This at least one step part is enclosed and is formed by the hole wall of insulation, and each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least.
The method of the manufacturing electroplating ventilating hole of the embodiment of the invention, the throughhole portions of at least two conductions by electroplating ventilating hole being designed to have mutually insulated, can be lifted out line density, realize the two-sided of connector to pressing, thereby increase the transmission capacity of signal, and, can reduce the manufacture difficulty of printed circuit board (PCB) by reducing the radius-thickness ratio of through hole, improve reliability of products, and reduce production costs.
Below in conjunction with Fig. 9, be example with the electroplating ventilating hole of making as shown in Figure 6, the method 800 of the manufacturing electroplating ventilating hole of the embodiment of the invention is described, but the embodiment of the invention is not limited to this.
As shown in Figure 9, for example, on substrate, can get out the through hole of smaller aperture due earlier, respectively on this substrate two sides, form the larger aperture through hole coaxial with this smaller aperture due through hole by boring procedure then, this smaller aperture due through hole and this two larger aperture through holes are throughhole portions, intersection between the two through hole part forms step part, thereby forms the electroplating ventilating hole blank shown in (a) among Fig. 9.
Certainly, also can form the blind hole of coaxial larger aperture earlier in the substrate both sides, and then this two blind hole be drilled, thereby form this electroplating ventilating hole blank with drill bit than minor diameter.Should be understood that and similarly, can form throughhole portions with different apertures by bore process if the electroplating ventilating hole blank comprises the throughhole portions of greater number.Should also be understood that dark and this electroplating ventilating hole blank position on substrate, pore size, the footpath of the throughhole portions of this electroplating ventilating hole blank and transition portion etc. can determine according to actual needs.
By the electroplating ventilating hole blank that has on the two-layer at least substrate is carried out first electroplating processes, can form shown in (b) among Fig. 9, throughhole portions and step part all have the electroplating ventilating hole blank of metal conducting layer.Alternatively, this first electroplating processes is a copper plating treatment, and promptly this metal conducting layer is a copper plate.Certainly, also can carry out the electroplating processes of other metal, for example gold-plated processing or silver-plated processing etc.
Shown in (c) among Fig. 9, pass through mechanical process again, can remove the lip-deep metal conducting layer of all step parts on the electroplating ventilating hole blank, form the insulation hole wall of this at least one step part shown in (d) among Fig. 9, thereby form this electroplating ventilating hole.Each throughhole portions has metal conducting layer in this electroplating ventilating hole, and does not have metal conducting layer on each step part surface, and each step part has the inwall of insulation, thereby makes two adjacent throughhole portions insulation.Alternatively, this mechanical process can be handled for laser processing, also can be for controlling deep drilling boring processing etc.
Alternatively, the method according to the manufacturing electroplating ventilating hole of the embodiment of the invention can also comprise: this electroplating ventilating hole blank with this metal conducting layer is carried out second electroplating processes, form this electroplating ventilating hole blank with protective layer; Lip-deep this metal conducting layer that this removes this at least one step part comprises: by mechanical process, remove lip-deep this protective layer and this metal conducting layer of this at least one step part.
Alternatively; method according to the manufacturing electroplating ventilating hole of the embodiment of the invention can also comprise: after this removes lip-deep this protective layer and this metal conducting layer of this at least one step part; this electroplating ventilating hole blank is carried out etch processes, to remove lip-deep this metal conducting layer of this at least one step part fully.
For example, as shown in figure 10, the method 900 of making electroplating ventilating hole according to another embodiment of the present invention comprises:
S910, the electroplating ventilating hole blank that has on the two-layer at least substrate is carried out first electroplating processes, this electroplating ventilating hole blank is enclosed by hole wall and forms, this electroplating ventilating hole blank comprises along the axial direction of this electroplating ventilating hole blank divides at least two throughhole portions and at least one step part that forms, on the surface of these at least two throughhole portions and this at least one step part, to form metal conducting layer, wherein, these at least two throughhole portions are enclosed by hole wall and form, the aperture difference of any two adjacent throughhole portions in these at least two throughhole portions, and axial direction along this electroplating ventilating hole, the throughhole portions that from these two throughhole portions, has the minimum-value aperture at least, until be positioned at the throughhole portions of the top or the bottom of this electroplating ventilating hole, respectively the aperture of this throughhole portions increases successively; This at least one step part is enclosed and is formed by the hole wall of insulation, and each step part in this at least one step part and with this two adjacent throughhole portions links to each other in these two throughhole portions between two adjacent throughhole portions at least;
S920 carries out second electroplating processes to this electroplating ventilating hole blank with this metal conducting layer, forms this electroplating ventilating hole blank with protective layer,
S930 by mechanical process, removes lip-deep this protective layer and this metal conducting layer of this at least one step part;
S940; after this removes lip-deep this protective layer and this metal conducting layer of this at least one step part; this electroplating ventilating hole blank is carried out etch processes,, form this electroplating ventilating hole to remove lip-deep this metal conducting layer of this at least one step part fully.
Alternatively, this mechanical process comprises laser ablation process or control deep drilling boring processing.Alternatively, this metal conducting layer is a copper coating, and this protective layer is tin coating, gold plate or silvering.
Below in conjunction with Figure 11, be example with the electroplating ventilating hole of making as shown in Figure 5, the method 900 of the manufacturing electroplating ventilating hole of the embodiment of the invention is described, but the embodiment of the invention is not limited to this.
As shown in figure 11, form among Figure 11 (a) and (b) shown in the method for electroplating ventilating hole blank and (a) among Fig. 9 and (b) shown in method similar, for simplicity, do not repeat them here.By the electroplating ventilating hole blank with metal conducting layer is carried out second electroplating processes, form and shown in (c) among Figure 11, have the electroplating ventilating hole blank of protective layer at the metallic conduction laminar surface.Shown in (d) among Figure 11, again by mechanical process, can remove the lip-deep metal conducting layer and the protective layer of all step parts on the electroplating ventilating hole blank, form the insulation hole wall of step part.Shown in (e) among Figure 11; after passing through mechanical process; step part on the electroplating ventilating hole blank is also during the residual metal conductive layer; or when removing the lip-deep metal conducting layer of each step part more up hill and dale; can carry out etch processes to this electroplating ventilating hole blank; thereby form the electroplating ventilating hole shown in (f) among Figure 11; metal conducting layer and/or protective layer on all step parts in this electroplating ventilating hole are thoroughly removed; insulation fully between two adjacent conductive through hole parts can be guaranteed thus, thereby reliability of products can be further improved.Wherein, this mechanical process comprises that laser ablation process or control deep drilling boring handles etc., and this metal conducting layer can be for copper coating etc., and this protective layer can be tin coating, gold plate or silvering etc.
The method of the manufacturing electroplating ventilating hole of the embodiment of the invention, the throughhole portions of at least two conductions by electroplating ventilating hole being designed to have mutually insulated, can be lifted out line density, realize the two-sided of connector to pressing, thereby increase the transmission capacity of signal, and, can reduce the manufacture difficulty of printed circuit board (PCB) by reducing the radius-thickness ratio of through hole, improve reliability of products, and reduce production costs.
Those of ordinary skills can recognize, the unit and the algorithm steps of each example of describing in conjunction with embodiment disclosed herein, can realize with electronic hardware, computer software or the combination of the two, for the interchangeability of hardware and software clearly is described, the composition and the step of each example described prevailingly according to function in the above description.These functions still are that software mode is carried out with hardware actually, depend on the application-specific and the design constraint of technical scheme.The professional and technical personnel can use distinct methods to realize described function to each specific should being used for, but this realization should not thought and exceeds scope of the present invention.
The those skilled in the art can be well understood to, and for the convenience described and succinct, the concrete course of work of the system of foregoing description, device and unit can not repeat them here with reference to the corresponding process among the preceding method embodiment.
In several embodiment that the application provided, should be understood that disclosed system, apparatus and method can realize by other mode.For example, device embodiment described above only is schematic, for example, the division of described unit, only be that a kind of logic function is divided, during actual the realization other dividing mode can be arranged, for example a plurality of unit or assembly can in conjunction with or can be integrated into another system, or some features can ignore, or do not carry out.In addition, the shown or coupling each other discussed or directly be coupled or communicate to connect and can be the indirect coupling by some interfaces, device or unit or communicate to connect also can be electric, machinery or other form connect.
Described unit as separating component explanation can or can not be physically to separate also, and the parts that show as the unit can be or can not be physical locations also, promptly can be positioned at a place, perhaps also can be distributed on a plurality of network element.Can select wherein some or all of unit to realize the purpose of embodiment of the invention scheme according to the actual needs.
In addition, each functional unit in each embodiment of the present invention can be integrated in the processing unit, also can be that the independent physics in each unit exists, and also can be that two or more unit are integrated in the unit.Above-mentioned integrated unit both can adopt the form of hardware to realize, also can adopt the form of SFU software functional unit to realize.
If described integrated unit is realized with the form of SFU software functional unit and during as independently production marketing or use, can be stored in the computer read/write memory medium.Based on such understanding, the part that technical scheme of the present invention contributes to prior art in essence in other words, perhaps all or part of of this technical scheme can embody with the form of software product, this computer software product is stored in the storage medium, comprise that some instructions are with so that a computer equipment (can be a personal computer, server, the perhaps network equipment etc.) carry out all or part of step of the described method of each embodiment of the present invention.And aforesaid storage medium comprises: various media that can be program code stored such as USB flash disk, portable hard drive, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD.
The above; it only is the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; can expect the modification or the replacement of various equivalences easily, these modifications or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (12)
1. an electroplating ventilating hole is characterized in that, described electroplating ventilating hole is enclosed by hole wall and forms, and described electroplating ventilating hole comprises:
Axial direction along described electroplating ventilating hole is divided at least two throughhole portions that form, and described at least two throughhole portions are enclosed by hole wall and form, and the hole wall of described at least two throughhole portions has metal conducting layer; And
Divide at least one step part that forms along described axial direction, described at least one step part is enclosed by the hole wall that insulate and forms, each step part in described at least one step part and with described two adjacent throughhole portions links to each other in described two throughhole portions between two adjacent throughhole portions at least.
2. electroplating ventilating hole according to claim 1, it is characterized in that, the aperture difference of any two adjacent throughhole portions in described at least two throughhole portions, and axial direction along described electroplating ventilating hole, the throughhole portions that from described two throughhole portions, has the minimum-value aperture at least, until be positioned at the throughhole portions of the top or the bottom of described electroplating ventilating hole, the aperture of each described throughhole portions increases successively.
3. electroplating ventilating hole according to claim 1 is characterized in that, the axial deviation of any two adjacent throughhole portions is less than half of the aperture difference of described two adjacent throughhole portions in described at least two throughhole portions.
4. according to each described electroplating ventilating hole in the claim 1 to 3, it is characterized in that described at least two throughhole portions comprise:
Divide first throughhole portions that forms along described axial direction, described first throughhole portions is enclosed by hole wall and forms, and the hole wall of described first throughhole portions has metal conducting layer; And
Divide second throughhole portions that forms along described axial direction, described second throughhole portions is enclosed by hole wall and forms, and the hole wall of described second throughhole portions has metal conducting layer;
Described at least one step part comprises:
Divide the first step part that forms along described axial direction, described first step part is enclosed by the hole wall that insulate and forms, described first step part and links to each other with described second throughhole portions with described first throughhole portions between described first throughhole portions and described second throughhole portions
Wherein, described first throughhole portions is different with the aperture of described second throughhole portions, and the axial deviation of described first throughhole portions and described second throughhole portions is less than half of the aperture difference of described first throughhole portions and described second throughhole portions.
5. electroplating ventilating hole according to claim 4 is characterized in that, described at least two throughhole portions also comprise:
Divide the third through-hole part that forms along described axial direction, described third through-hole part is enclosed by hole wall and forms, described third through-hole partly is positioned at a side of described second throughhole portions and away from described first throughhole portions, the hole wall of described third through-hole part has metal conducting layer;
Described at least one step part also comprises:
Divide the second step part that forms along described axial direction, described second step part is enclosed by the hole wall that insulate and forms, described second step part and partly links to each other with described third through-hole with described second throughhole portions between described second throughhole portions and described third through-hole part
Wherein, described second throughhole portions is different with the aperture of described third through-hole part, and the axial deviation of described second throughhole portions and described third through-hole part is less than half of described second throughhole portions and described third through-hole aperture difference partly.
6. electroplating ventilating hole according to claim 5 is characterized in that, the aperture of described first throughhole portions is greater than the aperture of described second throughhole portions, and the aperture of described second throughhole portions is greater than the aperture of described third through-hole part; Or
The aperture of described first throughhole portions is greater than the aperture of described second throughhole portions, and the aperture of described second throughhole portions is less than the aperture of described third through-hole part; Or
The aperture of described first throughhole portions is less than the aperture of described second throughhole portions, and the aperture of described second throughhole portions is less than the aperture of described third through-hole part.
7. a printed circuit board (PCB) is characterized in that, described printed circuit board (PCB) comprises:
Has two-layer at least substrate; And
At least one that runs through described substrate is according to each described electroplating ventilating hole in the claim 1 to 6.
8. a method of making electroplating ventilating hole is characterized in that, described method comprises:
The electroplating ventilating hole blank that has on the two-layer at least substrate is carried out first electroplating processes, described electroplating ventilating hole blank is enclosed by hole wall and forms, described electroplating ventilating hole blank comprises along the axial direction of described electroplating ventilating hole blank divides at least two throughhole portions and at least one step part that forms, to form metal conducting layer on the surface of described at least two throughhole portions and described at least one step part;
By mechanical process, remove the lip-deep described metal conducting layer of described at least one step part, form the insulation hole wall of described at least one step part,
Wherein, described at least two throughhole portions are enclosed by hole wall and form, the aperture difference of any two adjacent throughhole portions in described at least two throughhole portions, and axial direction along described electroplating ventilating hole, the throughhole portions that from described two throughhole portions, has the minimum-value aperture at least, until be positioned at the throughhole portions of the top or the bottom of described electroplating ventilating hole, the aperture of each described throughhole portions increases successively; Described at least one step part is enclosed and is formed by the hole wall of insulation, and each step part in described at least one step part and with described two adjacent throughhole portions links to each other in described two throughhole portions between two adjacent throughhole portions at least.
9. method according to claim 8 is characterized in that, described method also comprises:
Described electroplating ventilating hole blank with described metal conducting layer is carried out second electroplating processes, forms described electroplating ventilating hole blank with protective layer,
The lip-deep described metal conducting layer of described at least one step part of described removal comprises:
By mechanical process, remove the lip-deep described protective layer and the described metal conducting layer of described at least one step part.
10. method according to claim 9 is characterized in that, described method also comprises:
After the lip-deep described protective layer and described metal conducting layer of described at least one step part of described removal; described electroplating ventilating hole blank is carried out etch processes, to remove the lip-deep described metal conducting layer of described at least one step part fully.
11. each described method in 10 is characterized in that according to Claim 8, described mechanical process comprises that laser ablation process or control deep drilling boring handles.
12. each described method in 10 is characterized in that described metal conducting layer is a copper coating according to Claim 8, described protective layer is tin coating, gold plate or silvering.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110223786XA CN102291934A (en) | 2011-08-05 | 2011-08-05 | Plated through hole, printed circuit board (PCB) and method for manufacturing plated through hole |
| PCT/CN2012/072795 WO2012103833A1 (en) | 2011-08-05 | 2012-03-22 | Plated through hole, printed circuit board (pcb) and method for manufacturing plated through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110223786XA CN102291934A (en) | 2011-08-05 | 2011-08-05 | Plated through hole, printed circuit board (PCB) and method for manufacturing plated through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102291934A true CN102291934A (en) | 2011-12-21 |
Family
ID=45337958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110223786XA Pending CN102291934A (en) | 2011-08-05 | 2011-08-05 | Plated through hole, printed circuit board (PCB) and method for manufacturing plated through hole |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102291934A (en) |
| WO (1) | WO2012103833A1 (en) |
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| WO2012103833A1 (en) * | 2011-08-05 | 2012-08-09 | 华为技术有限公司 | Plated through hole, printed circuit board (pcb) and method for manufacturing plated through hole |
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Application publication date: 20111221 |