CN103687306A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN103687306A CN103687306A CN201210325574.7A CN201210325574A CN103687306A CN 103687306 A CN103687306 A CN 103687306A CN 201210325574 A CN201210325574 A CN 201210325574A CN 103687306 A CN103687306 A CN 103687306A
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Abstract
The invention provides a manufacturing method of a printed circuit board. The method comprises the following steps: obtaining a mother board by laminating a plurality of insulated laminated daughter boards; fabricating a through hole in the mother board; enlarging the through hole at the part of outer daughter boards; the connection part of the enlarged part of the through hole and the original part of the through hole is contained in a single insulating layer; plating the mother board; removing metal at the connection part. The invention further provides the printed circuit board manufactured by the method. According to the invention, the manufacturing quality of the printed circuit board is improved.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB) field, in particular to a kind of printed circuit board (PCB) and preparation method thereof.
Background technology
Current PCB design adopts back drill and the design of blind buried via hole, can reduce the loss of signal and crosstalk, and can increase the number of plies and the density of wiring, insert hole also developed into up-to-date two-sided insert hole by former one side insert hole simultaneously, the integrated quantity of its chip improves 1 times than original one side plug-in unit, thereby reduces the PCB layout number of plies and reach the object that reduces PCB manufacturing cost.
The two-sided insert hole processing technology of existing PCB following (to only have a kind of buried via hole and single crimping hole depth PCB to be processed as example):
As shown in Figure 1, lamination obtains three daughter boards 1,2,3 respectively, and daughter board 1,2,3 is the pcb board of multilayer;
Then, as shown in Figure 2, on three daughter boards 1,2,3, process respectively through hole 11,21,31;
Then, as shown in Figure 3, by 11,21,31 contrapositions of the through hole on three daughter boards 1,2,3 consistent rear (the center line of three through holes is on same axis), utilizes prepreg that three daughter boards 1,2,3 are carried out to lamination and be bonded together, form PCB motherboard;
Known by above-mentioned description; because the existing two-sided insert hole pcb board processing technology with buried-hole structure has at least twice lamination; technological process is long; in the lamination process of Fig. 3; three daughter boards 1,2,3 often there will be dislocation; make the through hole 11,21,31 can not co-axially align, thereby affect product quality.
Summary of the invention
The present invention aims to provide a kind of PCB and preparation method thereof, to solve the above problems.
In an embodiment of the present invention, provide the manufacture method of a kind of PCB, having comprised: by obtain motherboard after the stacked a plurality of daughter board laminations of insulating barrier; On motherboard, make through hole; Expand through hole in the aperture of outside daughter board part, the reaming of through hole part and do not expand connecting portion between part on an insulating barrier; To this motherboard plating; Remove the metal on connecting portion.
In an embodiment of the present invention, provide the PCB that adopts above-mentioned manufacture method to be made.
PCB of the above embodiment of the present invention and preparation method thereof, because adopt the method for reaming to make insert hole, has avoided the operation of alignment daughter board, so overcome the defect that daughter board alignment error causes, has improved the making quality of PCB.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, forms the application's a part, and schematic description and description of the present invention is used for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the schematic diagram of each daughter board that prior art provides;
Fig. 2 shows the schematic diagram of processing through hole on each daughter board that prior art provides;
Fig. 3 show that prior art provides by each daughter board schematic diagram laminated together;
Fig. 4 shows the schematic diagram of the motherboard that the embodiment of the present invention provides;
Fig. 5 shows the schematic diagram that forms through hole on the motherboard that the embodiment of the present invention provides;
Fig. 6 shows the schematic diagram that carries out outside reaming along the through hole center line in Fig. 5;
Fig. 7 shows the schematic diagram that is processed to form shoulder hole and buried via hole along the ladder hole center line in Fig. 6;
Fig. 8 shows the schematic diagram of the PCB of the two-sided insert hole with the different buried via hole degree of depth that the embodiment of the present invention finally makes;
Fig. 9 shows according to the flow chart of the manufacture method of the PCB of the embodiment of the present invention.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
Fig. 9 shows according to the flow chart of the manufacture method of the PCB of the embodiment of the present invention, comprising:
Step S10, by obtain motherboard after the stacked a plurality of daughter board laminations of insulating barrier;
Step S20 makes through hole on motherboard;
Step S30, expands through hole in the aperture of outside daughter board part, the reaming of through hole part and do not expand connecting portion between part on an insulating barrier;
Step S40, to this motherboard plating;
Step S50, removes the metal on connecting portion.
Prior art adopts the mode of daughter board alignment to make insert hole, when for making the through hole of insert hole can not co-axially align time, will affect the quality of PCB.And in the present embodiment, adopt the mode of reaming to make insert hole, and do not need the through hole of making each daughter board of insert hole to carry out co-axially align, thus the defect of having avoided daughter board dislocation to bring, and then improved the product quality of PCB.
Fig. 4 is the schematic diagram of a motherboard providing of the embodiment of the present invention, and a plurality of daughter boards are set, and utilizes prepreg (insulating barrier a kind of, under take prepreg as example) pressing that each daughter board is fitted tightly together, forms a motherboard.
Fig. 5 shows the schematic diagram that forms through hole on the motherboard that the embodiment of the present invention provides.On motherboard 5, boring forms through hole 51.
Fig. 6 shows the schematic diagram that carries out outside reaming along the through hole center line in Fig. 5.On the center line of through hole, by adopting the brill larger than the aperture of through hole to chew, control deep drilling, to expand through hole in the aperture of outside daughter board part.Preferably, consider offset error, adopt and chew and control deep drilling than the brill of the large 0.30mm-0.42mm in aperture of through hole.As shown in Figure 6, on through hole 51 center lines, two sides control deep drilling, processes through hole 52, and described through hole 52 is shoulder hole, and the brill of shoulder hole part is chewed diameter than the large 0.30mm-0.42mm of through hole 51 diameter.
Fig. 7 shows the schematic diagram that is processed to form shoulder hole and buried via hole along the ladder hole center line in Fig. 6.On the center line of through hole, larger than the aperture of not expanding part of through hole by adopting, than the less brill in aperture of reaming part, chew, carry out back drill, to remove the metal on connecting portion.Preferably, the thickness of plating is 25～35um.Motherboard can be electroplated, make through hole 52 hole walls electroplate upper metal copper layer, the thickness of metal copper layer is 25～35um.Preferably, adopt than the large 0.12mm～0.18mm in aperture of the not expansion part of through hole, than the brill of the little 0.18mm～0.22mm in aperture of reaming part, chew, carry out back drill.As shown in Figure 7, along two sides back drill on the center line of ladder hole 52, depth requirements is for boring the metallic copper of through hole 51 and ladder hole 52 ladder connecting portions, process shoulder hole 53 and buried via hole 54, described back drill bores and chews diameter requirement than the large 0.15mm of through hole 51 diameter, than the little 0.2mm of ladder hole 52 diameter, by back drill is bored to chew, compare known with ladder hole 52 sizes, the diameter that back drill brill is chewed is than the little 0.2mm of the diameter of ladder hole 52, and the metal copper layer thickness that ladder hole inwall is electroplated is 25～35um, so can not be damaged to the hole wall metallic copper of ladder hole 52 in the back drill course of processing, thereby the copper place to go of ladder hole 52 ladder connecting portions can be fallen, make the inwall insulation of ladder hole 52, ladder hole 52 originally has just formed shoulder hole 53, through hole 51 originally has just formed buried via hole 54, when the degree of depth of control deep drilling and back drill is different, just can make shoulder hole 53 and the buried via hole 54 of different depth, so just can make the PCB of the two-sided insert hole with buried-hole structure.
Preferably, expand through hole in the aperture of two relative outside daughter board parts, the final through hole forming is two-sided insert hole.Fig. 8 shows the schematic diagram of the PCB of the two-sided insert hole with the different buried via hole degree of depth that the embodiment of the present invention finally makes.Certainly, also can only to a side of through hole, carry out reaming as required, be processed into one side insert hole.
Because the two-sided insert hole of the pcb board finally obtaining is blind hole, there is blind hole Tibetan medicine water, oxidizable problem in prior art, and in follow-up plating and process of surface treatment, also exist blind hole hole wall not plate the quality defect of metal in follow-up etch process.And in the embodiment of the present invention, be first plating, and then chew with boring the metal of removing connecting wall, so blind hole Tibetan medicine water, the oxidizable problem of having avoided the etch process of prior art to cause have also overcome the quality defect that blind hole hole wall does not plate metal.
Another embodiment that makes two-sided insert hole is, first with larger-diameter brill, chew co-axially align deep drilling is controlled in two outsides of motherboard, make the buried via hole in two outsides, then carry out plating, then with the brill of minor diameter, chew the coupling part between the buried via hole that drills two outsides.Yet, when chewing the coupling part between the buried via hole that drills two outsides with the brill of minor diameter, easily producing break flour, break flour is along with thickness of slab and brill are chewed the increase of diameter and increased the more difficult discharge of break flour.And the embodiment of Fig. 4-Fig. 9 of the present invention can avoid the problem of this respect.
The PCB with the two-sided insert hole of different depth buried via hole that the above embodiment of the present invention is made in use, is inserted in crimping PIN in the going up or down stairway hole of PCB, due to the inwall insulation of shoulder hole, thereby there will not be breaking phenomena in chip crimping process.Compare from the existing two-sided plug-in unit pcb board with the different buried via hole degree of depth, the embodiment of the present invention only needs lamination one time, greatly shortened technological process, avoided existing several daughter boards upper and lower blind hole when lamination to occur dislocation, in addition, the two-sided insert hole processing due to the embodiment of the present invention is still through hole, solved the two-sided insert hole of prior art or one side insert hole and be blind hole cause Tibetan medicine water, oxidizable, do not electroplate the problems such as metal, improved the crudy of blind hole.This kind of blind hole that mode is processed, hole wall is smooth and burr is few, and pass is vertical, and middle buried via hole is PTH hole, can signal transmission.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. a manufacture method for printed circuit board (PCB), is characterized in that, comprising:
By to obtain motherboard after the stacked a plurality of daughter board laminations that insulate;
On described motherboard, make through hole;
Expand described through hole in the aperture of outside daughter board part, the reaming of described through hole part and do not expand connecting portion between part on a described insulating barrier;
To described motherboard plating;
Remove the metal on described connecting portion.
2. method according to claim 1, is characterized in that, on the center line of described through hole, by adopting the brill larger than the aperture of described through hole to chew, controls deep drilling, to expand described through hole in the aperture of outside daughter board part.
3. method according to claim 2, is characterized in that, adopts and chews and control deep drilling than the brill of the large 0.30mm-0.42mm in aperture of described through hole.
4. method according to claim 1, is characterized in that, on the center line of described through hole, larger than the aperture of not expanding part of described through hole by adopting, the less brill in aperture than described reaming part is chewed, and carries out back drill, to remove the metal on described connecting portion.
5. method according to claim 4, is characterized in that, adopts than the large 0.12mm～0.18mm in aperture of the not expansion part of described through hole, than the brill of the little 0.18mm～0.22mm in aperture of described reaming part, chews, and carries out back drill.
6. method according to claim 5, is characterized in that, the thickness of plating is 25～35um.
7. according to the method described in claim 1-6 any one, it is characterized in that, expand described through hole in the aperture of two relative outside daughter board parts, the final through hole forming is two-sided insert hole.
8. a printed circuit board (PCB), is characterized in that, adopts the method described in claim 1-7 any one to be made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210325574.7A CN103687306A (en) | 2012-09-05 | 2012-09-05 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210325574.7A CN103687306A (en) | 2012-09-05 | 2012-09-05 | Printed circuit board and manufacturing method thereof |
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| CN103687306A true CN103687306A (en) | 2014-03-26 |
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| CN201210325574.7A Pending CN103687306A (en) | 2012-09-05 | 2012-09-05 | Printed circuit board and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470222A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Back drilling and diskless vie hole forming process for PCB |
| CN104797080A (en) * | 2015-04-20 | 2015-07-22 | 深圳崇达多层线路板有限公司 | Circuit board and through-hole manufacturing method thereof |
| CN105228376A (en) * | 2015-08-28 | 2016-01-06 | 北大方正集团有限公司 | A kind of method and pcb board offering back drill hole on pcb board |
| CN106793509A (en) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of back drilling method for improving plug-hole |
| CN109874229A (en) * | 2017-12-04 | 2019-06-11 | 北大方正集团有限公司 | The manufacturing method and pcb board of pcb board stepped hole |
| CN113334493A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN113692141A (en) * | 2021-08-25 | 2021-11-23 | 电子科技大学 | Printed circuit hole interconnection structure and manufacturing method thereof |
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| US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
| US20040118605A1 (en) * | 2002-12-20 | 2004-06-24 | Van Der Laan Ruud | Circuit board having a multi-functional hole |
| TWI267332B (en) * | 2003-07-29 | 2006-11-21 | Matsushita Electric Ind Co Ltd | Multi-layer circuit board and the manufacturing method of the multi-layer circuit board |
| CN101257770A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN102291934A (en) * | 2011-08-05 | 2011-12-21 | 华为技术有限公司 | Plated through hole, printed circuit board (PCB) and method for manufacturing plated through hole |
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Patent Citations (6)
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| US6534723B1 (en) * | 1999-11-26 | 2003-03-18 | Ibiden Co., Ltd. | Multilayer printed-circuit board and semiconductor device |
| US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
| US20040118605A1 (en) * | 2002-12-20 | 2004-06-24 | Van Der Laan Ruud | Circuit board having a multi-functional hole |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470222A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Back drilling and diskless vie hole forming process for PCB |
| CN104797080A (en) * | 2015-04-20 | 2015-07-22 | 深圳崇达多层线路板有限公司 | Circuit board and through-hole manufacturing method thereof |
| CN105228376A (en) * | 2015-08-28 | 2016-01-06 | 北大方正集团有限公司 | A kind of method and pcb board offering back drill hole on pcb board |
| CN106793509A (en) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of back drilling method for improving plug-hole |
| CN109874229A (en) * | 2017-12-04 | 2019-06-11 | 北大方正集团有限公司 | The manufacturing method and pcb board of pcb board stepped hole |
| CN109874229B (en) * | 2017-12-04 | 2021-04-09 | 北大方正集团有限公司 | Manufacturing method of PCB stepped hole and PCB |
| CN113334493A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN113334493B (en) * | 2021-05-31 | 2023-02-28 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN113692141A (en) * | 2021-08-25 | 2021-11-23 | 电子科技大学 | Printed circuit hole interconnection structure and manufacturing method thereof |
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Application publication date: 20140326 |