TWI267332B - Multi-layer circuit board and the manufacturing method of the multi-layer circuit board - Google Patents
Multi-layer circuit board and the manufacturing method of the multi-layer circuit boardInfo
- Publication number
- TWI267332B TWI267332B TW94102665A TW94102665A TWI267332B TW I267332 B TWI267332 B TW I267332B TW 94102665 A TW94102665 A TW 94102665A TW 94102665 A TW94102665 A TW 94102665A TW I267332 B TWI267332 B TW I267332B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- immersed
- going
- layer circuit
- manufacturing
- Prior art date
Links
Abstract
The manufacturing method of a traditional multi-layer circuit board may introduce the mismatch of characteristic impedances. The manufacturing method of the multi-layer circuit board of this invention comprises a circuit board with two surfaces and at least one of the surfaces of the circuit board is manufactured with the patterns of a ground connection and signal connections. The preset thickness of the deposited layers that are going to be immersed is formed in order to perform the procedures used to manufacture deposited layers. The deposited layers then are heated and pressured. At the interface between the two-face circuit board and the object that is going to be immersed, the signal connection is buried in the object that is going to be immersed in order to finish the construction procedures of the layered structure. Moreover, by using the preset thickness of the plate object that is going to be immersed, the thickness of the main body of the two-face circuit board is smaller than the distance between the electrode wire buried in the plate object that is going to be immersed and the lateral surface of the two-face circuit board, which is not faced to the plate object that is going to be immersed in the layered structure that is previously finished.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003282095A JP2005051075A (en) | 2003-07-29 | 2003-07-29 | Multilayer circuit board and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200628040A TW200628040A (en) | 2006-08-01 |
TWI267332B true TWI267332B (en) | 2006-11-21 |
Family
ID=34267411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94102665A TWI267332B (en) | 2003-07-29 | 2005-01-28 | Multi-layer circuit board and the manufacturing method of the multi-layer circuit board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2005051075A (en) |
TW (1) | TWI267332B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103517584A (en) * | 2012-06-27 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multilayer circuit board |
CN103582320A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
CN103687306A (en) * | 2012-09-05 | 2014-03-26 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
TWI498067B (en) * | 2012-04-27 | 2015-08-21 | Zhen Ding Technology Co Ltd | Multilayer circuit board and method for manufacturing same |
US9265146B2 (en) | 2012-06-27 | 2016-02-16 | Zhen Ding Technology Co., Ltd. | Method for manufacturing a multi-layer circuit board |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101120623B (en) * | 2005-01-27 | 2010-07-28 | 松下电器产业株式会社 | Manufacturing method of multi-layer circuit board and multi-layer circuit board |
TWI666749B (en) * | 2014-02-19 | 2019-07-21 | 矽品精密工業股份有限公司 | Package substrate and package structure |
JP2015226034A (en) * | 2014-05-30 | 2015-12-14 | 京セラサーキットソリューションズ株式会社 | Wiring board |
JP6991014B2 (en) * | 2017-08-29 | 2022-01-12 | キオクシア株式会社 | Semiconductor device |
CN113395817B (en) * | 2020-03-13 | 2023-03-24 | 重庆达方电子有限公司 | Thin film circuit board |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02277286A (en) * | 1989-04-19 | 1990-11-13 | Hitachi Ltd | Multilayer printed board |
JPH0485991A (en) * | 1990-07-27 | 1992-03-18 | Fujitsu Ltd | Controlling method for lamination of multilayer printed circuit board |
JPH06177548A (en) * | 1992-12-07 | 1994-06-24 | Hitachi Ltd | Printed wiring board |
JPH1168314A (en) * | 1997-08-21 | 1999-03-09 | Matsushita Electric Ind Co Ltd | Mobile object communication equipment |
JPH11163539A (en) * | 1997-11-25 | 1999-06-18 | Kyocera Corp | Multilayer wiring board |
KR19990073126A (en) * | 1999-05-26 | 1999-10-05 | 이형도 | Printed circuit board for rambus |
JP2001044636A (en) * | 1999-07-28 | 2001-02-16 | Toshiba Corp | Printed wiring board and electronic equipment incorporating the board therein |
JP2001144452A (en) * | 1999-11-15 | 2001-05-25 | Nec Corp | Multilayered printed board |
JP2002076644A (en) * | 2000-08-28 | 2002-03-15 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
JP2002141675A (en) * | 2000-11-01 | 2002-05-17 | Pfu Ltd | Printed wiring board |
JP2003086950A (en) * | 2001-07-06 | 2003-03-20 | Matsushita Electric Works Ltd | Printed wiring board |
JP2003152336A (en) * | 2001-11-15 | 2003-05-23 | Nec Toppan Circuit Solutions Toyama Inc | Method of manufacturing multilayer printed wiring board |
-
2003
- 2003-07-29 JP JP2003282095A patent/JP2005051075A/en active Pending
-
2005
- 2005-01-28 TW TW94102665A patent/TWI267332B/en active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI498067B (en) * | 2012-04-27 | 2015-08-21 | Zhen Ding Technology Co Ltd | Multilayer circuit board and method for manufacturing same |
CN103517584A (en) * | 2012-06-27 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multilayer circuit board |
US9265146B2 (en) | 2012-06-27 | 2016-02-16 | Zhen Ding Technology Co., Ltd. | Method for manufacturing a multi-layer circuit board |
CN103582320A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
CN103582320B (en) * | 2012-07-19 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
CN103687306A (en) * | 2012-09-05 | 2014-03-26 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW200628040A (en) | 2006-08-01 |
JP2005051075A (en) | 2005-02-24 |
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