TWI267332B - Multi-layer circuit board and the manufacturing method of the multi-layer circuit board - Google Patents

Multi-layer circuit board and the manufacturing method of the multi-layer circuit board

Info

Publication number
TWI267332B
TWI267332B TW94102665A TW94102665A TWI267332B TW I267332 B TWI267332 B TW I267332B TW 94102665 A TW94102665 A TW 94102665A TW 94102665 A TW94102665 A TW 94102665A TW I267332 B TWI267332 B TW I267332B
Authority
TW
Taiwan
Prior art keywords
circuit board
immersed
going
layer circuit
manufacturing
Prior art date
Application number
TW94102665A
Other languages
Chinese (zh)
Other versions
TW200628040A (en
Inventor
Yoji Ueda
Susumu Matsuoka
Rikiya Okimoto
Shozo Ochi
Satoru Tomekawa
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200628040A publication Critical patent/TW200628040A/en
Application granted granted Critical
Publication of TWI267332B publication Critical patent/TWI267332B/en

Links

Abstract

The manufacturing method of a traditional multi-layer circuit board may introduce the mismatch of characteristic impedances. The manufacturing method of the multi-layer circuit board of this invention comprises a circuit board with two surfaces and at least one of the surfaces of the circuit board is manufactured with the patterns of a ground connection and signal connections. The preset thickness of the deposited layers that are going to be immersed is formed in order to perform the procedures used to manufacture deposited layers. The deposited layers then are heated and pressured. At the interface between the two-face circuit board and the object that is going to be immersed, the signal connection is buried in the object that is going to be immersed in order to finish the construction procedures of the layered structure. Moreover, by using the preset thickness of the plate object that is going to be immersed, the thickness of the main body of the two-face circuit board is smaller than the distance between the electrode wire buried in the plate object that is going to be immersed and the lateral surface of the two-face circuit board, which is not faced to the plate object that is going to be immersed in the layered structure that is previously finished.
TW94102665A 2003-07-29 2005-01-28 Multi-layer circuit board and the manufacturing method of the multi-layer circuit board TWI267332B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003282095A JP2005051075A (en) 2003-07-29 2003-07-29 Multilayer circuit board and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200628040A TW200628040A (en) 2006-08-01
TWI267332B true TWI267332B (en) 2006-11-21

Family

ID=34267411

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94102665A TWI267332B (en) 2003-07-29 2005-01-28 Multi-layer circuit board and the manufacturing method of the multi-layer circuit board

Country Status (2)

Country Link
JP (1) JP2005051075A (en)
TW (1) TWI267332B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517584A (en) * 2012-06-27 2014-01-15 富葵精密组件(深圳)有限公司 Manufacturing method of multilayer circuit board
CN103582320A (en) * 2012-07-19 2014-02-12 富葵精密组件(深圳)有限公司 Multilayer circuit board and manufacturing method thereof
CN103687306A (en) * 2012-09-05 2014-03-26 北大方正集团有限公司 Printed circuit board and manufacturing method thereof
TWI498067B (en) * 2012-04-27 2015-08-21 Zhen Ding Technology Co Ltd Multilayer circuit board and method for manufacturing same
US9265146B2 (en) 2012-06-27 2016-02-16 Zhen Ding Technology Co., Ltd. Method for manufacturing a multi-layer circuit board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101120623B (en) * 2005-01-27 2010-07-28 松下电器产业株式会社 Manufacturing method of multi-layer circuit board and multi-layer circuit board
TWI666749B (en) * 2014-02-19 2019-07-21 矽品精密工業股份有限公司 Package substrate and package structure
JP2015226034A (en) * 2014-05-30 2015-12-14 京セラサーキットソリューションズ株式会社 Wiring board
JP6991014B2 (en) * 2017-08-29 2022-01-12 キオクシア株式会社 Semiconductor device
CN113395817B (en) * 2020-03-13 2023-03-24 重庆达方电子有限公司 Thin film circuit board

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Publication number Priority date Publication date Assignee Title
JPH02277286A (en) * 1989-04-19 1990-11-13 Hitachi Ltd Multilayer printed board
JPH0485991A (en) * 1990-07-27 1992-03-18 Fujitsu Ltd Controlling method for lamination of multilayer printed circuit board
JPH06177548A (en) * 1992-12-07 1994-06-24 Hitachi Ltd Printed wiring board
JPH1168314A (en) * 1997-08-21 1999-03-09 Matsushita Electric Ind Co Ltd Mobile object communication equipment
JPH11163539A (en) * 1997-11-25 1999-06-18 Kyocera Corp Multilayer wiring board
KR19990073126A (en) * 1999-05-26 1999-10-05 이형도 Printed circuit board for rambus
JP2001044636A (en) * 1999-07-28 2001-02-16 Toshiba Corp Printed wiring board and electronic equipment incorporating the board therein
JP2001144452A (en) * 1999-11-15 2001-05-25 Nec Corp Multilayered printed board
JP2002076644A (en) * 2000-08-28 2002-03-15 Matsushita Electric Works Ltd Multilayer printed wiring board
JP2002141675A (en) * 2000-11-01 2002-05-17 Pfu Ltd Printed wiring board
JP2003086950A (en) * 2001-07-06 2003-03-20 Matsushita Electric Works Ltd Printed wiring board
JP2003152336A (en) * 2001-11-15 2003-05-23 Nec Toppan Circuit Solutions Toyama Inc Method of manufacturing multilayer printed wiring board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498067B (en) * 2012-04-27 2015-08-21 Zhen Ding Technology Co Ltd Multilayer circuit board and method for manufacturing same
CN103517584A (en) * 2012-06-27 2014-01-15 富葵精密组件(深圳)有限公司 Manufacturing method of multilayer circuit board
US9265146B2 (en) 2012-06-27 2016-02-16 Zhen Ding Technology Co., Ltd. Method for manufacturing a multi-layer circuit board
CN103582320A (en) * 2012-07-19 2014-02-12 富葵精密组件(深圳)有限公司 Multilayer circuit board and manufacturing method thereof
CN103582320B (en) * 2012-07-19 2017-05-10 富葵精密组件(深圳)有限公司 Multilayer circuit board and manufacturing method thereof
CN103687306A (en) * 2012-09-05 2014-03-26 北大方正集团有限公司 Printed circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
TW200628040A (en) 2006-08-01
JP2005051075A (en) 2005-02-24

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