CN109068491B - Aluminum substrate machining process - Google Patents
Aluminum substrate machining process Download PDFInfo
- Publication number
- CN109068491B CN109068491B CN201811158574.6A CN201811158574A CN109068491B CN 109068491 B CN109068491 B CN 109068491B CN 201811158574 A CN201811158574 A CN 201811158574A CN 109068491 B CN109068491 B CN 109068491B
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- Prior art keywords
- double
- board
- aluminum substrate
- sided board
- drilling
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
Abstract
The invention provides an aluminum substrate processing technology, which comprises the following steps: the method comprises the following steps of material preparation, pressing, abrasive belt grinding, dispensing, pressing plate warping, dry film, etching, third trimming, welding prevention, character and gold melting, drilling, dragging, depth setting blind drilling, V-CUT, electrical measurement and visual inspection.
Description
Technical Field
The invention relates to the technical field of substrate production, and particularly discloses an aluminum substrate processing technology.
Background
The substrate is one of the important parts in the electronic industry, and is cut to a certain size by using an insulating plate as a base material, and at least one conductive pattern is attached thereon. It can be divided into single-sided board, double-sided board and multi-layer board according to the circuit layer number. A substrate in which wires are present on only one side is called a single panel; the double-sided board is characterized in that copper-clad wires are arranged on both sides of the double-sided board, and a circuit between the two layers can be conducted through a via hole to form a required network; a multilayer board refers to a substrate having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and conductive patterns therebetween interconnected as required.
When the multilayer board is manufactured, the multilayer boards are pressed together to form the composite board, blind holes need to be manufactured in the board layers, and then the blind holes are electroplated to realize the communication of circuits between different board layers. When the existing aluminum substrate is used for electroplating blind holes, the laminated composite board is subjected to whole-board electroplating, and after the whole-board electroplating, the gum surface on the composite board undergoes redox reaction to form chemical copper. The chemical copper can be used after being brushed off, so that the manufacturing difficulty is increased, and the product quality is difficult to ensure.
Disclosure of Invention
Therefore, it is necessary to provide a processing technology of an aluminum substrate to solve the problems in the prior art, so that the difficulty in manufacturing the aluminum substrate is reduced and the product quality is improved by changing the processing flow.
In order to solve the problems in the prior art, the invention discloses an aluminum substrate processing technology, which comprises the following steps:
a. preparing a plate material: preparing a double-sided board and an aluminum board which are subjected to pretreatment;
b. and (3) laminating: pressing the double-sided board and the aluminum board to form a composite board;
c. dispensing: dispensing glue on the bottom surface of the aluminum plate;
d. pressing and warping: tilting and flattening the edge of the composite plate;
e. dry film: carrying out dry film pasting treatment on the surface of the composite board to manufacture an outer layer circuit;
f. etching: etching off the non-circuit part on the surface of the composite board;
g. and (3) repairing: inspecting the etched circuit and repairing the short circuit part of the circuit;
h. solder mask: covering a layer of uniform solder mask ink on the top surface of the composite board to cover the circuit, thereby preventing short circuit caused by welding;
i. and (3) writing: printing character marks on the top surface of the composite board;
j. gold melting: forming gold at the bonding pad;
k. drilling: performing preliminary blind hole drilling on the composite board;
l, fishing: fishing the shape of the composite board according to the shape requirement of the aluminum substrate;
m, fixed-depth blind drill: drilling deeply according to the depth requirement of the blind hole;
n, V-CUT: performing V-CUT slotting on the top surface of the composite board according to the size requirement of the aluminum substrate;
o, electrical measurement: carrying out electrical test on the aluminum substrate;
p, visual inspection: visual inspection was performed on the surface of the aluminum substrate to confirm whether foreign matter was attached to the surface of the substrate.
Preferably, the pre-treatment of the double-sided board comprises the following steps:
q, drilling a double-sided board: drilling holes on the double-sided board according to the blind hole requirement;
r, primary electroplating of the double-sided board: carrying out primary electroplating on the wall of the via hole of the double-sided board;
s, resin hole plugging: filling the via holes with epoxy resin;
t, grinding the ceramic: grinding the two end faces of the resin plug hole by using a ceramic grinding wheel so as to grind the part protruding out of the plate surface flat;
u, double-panel secondary electroplating: carrying out secondary electroplating on the surface of the resin plug hole;
v, double-sided plate dry film: carrying out dry film pasting treatment on the surface of the composite board to manufacture an inner layer circuit;
w, double-panel etching: etching off the non-circuit part on the surface of the double-sided board;
x, three-dimensional repair of the double-sided board: the etched line is inspected and a repair operation is performed on the short-circuited portion of the line.
Preferably, the pre-treatment of the aluminium sheet comprises belt grinding of the aluminium sheet: and (4) grinding the surface of the aluminum plate by using a sand belt.
Preferably, the drilling coefficient of the double-sided board drilling in the step q is 100.18%.
Preferably, the sanding belt is a 150 mesh sanding belt.
The invention has the beneficial effects that: the invention discloses an aluminum substrate processing technology, which is characterized in that through optimizing processing steps, the whole aluminum substrate is not subjected to electroplating treatment, the formation of back gelatinized copper caused by the whole aluminum substrate electroplating is avoided, and the purposes of simplifying the technology and improving the product quality are achieved. And after the double-sided board is subjected to primary electroplating, resin hole plugging and ceramic grinding are carried out to obtain a flat double-sided board surface, the via hole is free from expansion and contraction, electroplating of the via hole is realized, and electroplating treatment on the whole board is not required.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments in order to further understand the features and technical means of the invention and achieve specific objects and functions.
The embodiment of the invention discloses an aluminum substrate processing technology, which comprises the following steps:
a. preparing a plate material: preparing a double-sided board and an aluminum board which are subjected to pretreatment;
b. and (3) laminating: pressing the double-sided board and the aluminum board to form a composite board;
c. dispensing: dispensing glue on the bottom surface of the aluminum plate;
d. pressing and warping: tilting and flattening the edge of the composite plate;
e. dry film: carrying out dry film pasting treatment on the surface of the composite board to manufacture an outer layer circuit;
f. etching: etching off the non-circuit part on the surface of the composite board;
g. and (3) repairing: inspecting the etched circuit and repairing the short circuit part of the circuit;
h. solder mask: covering a layer of uniform solder mask ink on the top surface of the composite board to cover the circuit, thereby preventing short circuit caused by welding;
i. and (3) writing: printing character marks on the top surface of the composite board;
j. gold melting: forming gold at the bonding pad;
k. drilling: performing preliminary blind hole drilling on the composite board;
l, fishing: fishing the shape of the composite board according to the shape requirement of the aluminum substrate;
m, fixed-depth blind drill: drilling deeply according to the depth requirement of the blind hole;
n, V-CUT: performing V-CUT slotting on the top surface of the composite board according to the size requirement of the aluminum substrate;
o, electrical measurement: carrying out electrical test on the aluminum substrate;
p, visual inspection: visual inspection was performed on the surface of the aluminum substrate to confirm whether foreign matter was attached to the surface of the substrate.
The specific principle is that the whole plate is not electroplated by optimizing the processing steps, so that the formation of back gelled copper caused by electroplating of the whole plate is avoided, and the purposes of simplifying the process and improving the product quality are achieved.
Based on the above embodiment, the pre-processing of the double-sided board includes the following steps:
q, drilling a double-sided board: drilling holes on the double-sided board according to the blind hole requirement;
r, primary electroplating of the double-sided board: carrying out primary electroplating on the wall of the via hole of the double-sided board;
s, resin hole plugging: filling the via holes with epoxy resin;
t, grinding the ceramic: grinding the two end faces of the resin plug hole by using a ceramic grinding wheel so as to grind the part protruding out of the plate surface flat;
u, double-panel secondary electroplating: carrying out secondary electroplating on the surface of the resin plug hole;
v, double-sided plate dry film: carrying out dry film pasting treatment on the surface of the composite board to manufacture an inner layer circuit;
w, double-panel etching: etching off the non-circuit part on the surface of the double-sided board;
x, three-dimensional repair of the double-sided board: the etched line is inspected and a repair operation is performed on the short-circuited portion of the line.
Resin hole plugging and ceramic grinding are carried out after the double-sided board is electroplated once, a flat double-sided board surface is obtained, via holes are free of expansion and shrinkage, electroplating of the via holes is achieved, electroplating treatment on the whole board is not needed, and the formation of back gelled copper caused by electroplating of the whole board is avoided.
In order to obtain a flat and bright aluminium sheet surface, based on the above example, the pre-treatment of the aluminium sheet comprises an aluminium sheet belt grinding: and (4) grinding the surface of the aluminum plate by using a sand belt.
In order to avoid via hole shrinkage, the drilling factor of the double-sided board drilling in step q is 100.18% based on the above embodiment.
In order to improve the grinding brightness of the aluminum plate, the abrasive belt is a 150-mesh abrasive belt based on the above embodiment.
The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (4)
1. The aluminum substrate processing technology is characterized by comprising the following steps:
a. preparing a plate material: preparing a double-sided board and an aluminum board which are subjected to pretreatment; the pretreatment comprises the following steps:
q, drilling a double-sided board: drilling holes on the double-sided board according to the blind hole requirement;
r, primary electroplating of the double-sided board: carrying out primary electroplating on the wall of the via hole of the double-sided board;
s, plugging holes with resin: filling the via holes with epoxy resin;
t, grinding the ceramic: grinding the two end faces of the resin plug hole by using a ceramic grinding wheel so as to grind the part protruding out of the plate surface flat;
u, secondary electroplating of the double-sided board: carrying out secondary electroplating on the surface of the resin plug hole;
v, double-sided board dry film: carrying out dry film pasting treatment on the surface of the composite board to manufacture an inner layer circuit;
w, double-panel etching: etching off the non-circuit part on the surface of the double-sided board;
x, three-dimensional repair of the double-sided board: inspecting the etched circuit and repairing the short circuit part of the circuit;
b. and (3) laminating: pressing the double-sided board and the aluminum board to form a composite board;
c. dispensing: dispensing glue on the bottom surface of the aluminum plate;
d. pressing and warping: tilting and flattening the edge of the composite plate;
e. dry film: carrying out dry film pasting treatment on the surface of the composite board to manufacture an outer layer circuit;
f. etching: etching off the non-circuit part on the surface of the composite board;
g. and (3) repairing: inspecting the etched circuit and repairing the short circuit part of the circuit;
h. solder mask: covering a layer of uniform solder mask ink on the top surface of the composite board to cover the circuit, thereby preventing short circuit caused by welding;
i. and (3) writing: printing character marks on the top surface of the composite board;
j. gold melting: forming gold at the bonding pad;
k. drilling: performing preliminary blind hole drilling on the composite board;
l, fishing: fishing the shape of the composite board according to the shape requirement of the aluminum substrate;
m, fixed-depth blind drill: drilling deeply according to the depth requirement of the blind hole;
n, V-CUT: performing V-CUT slotting on the top surface of the composite board according to the size requirement of the aluminum substrate;
o, electrical measurement: carrying out electrical test on the aluminum substrate;
p, visual inspection: visual inspection was performed on the surface of the aluminum substrate to confirm whether foreign matter was attached to the surface of the substrate.
2. The aluminum substrate processing process according to claim 1, wherein the pretreatment of the aluminum plate comprises aluminum plate belt grinding: and (4) grinding the surface of the aluminum plate by using a sand belt.
3. The process for processing an aluminum substrate according to claim 1, wherein the drilling coefficient of the double-sided board in the step Q is 100.18%.
4. The process for processing the aluminum substrate according to claim 2, wherein the abrasive belt is a 150-mesh abrasive belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811158574.6A CN109068491B (en) | 2018-09-30 | 2018-09-30 | Aluminum substrate machining process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811158574.6A CN109068491B (en) | 2018-09-30 | 2018-09-30 | Aluminum substrate machining process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109068491A CN109068491A (en) | 2018-12-21 |
| CN109068491B true CN109068491B (en) | 2021-02-23 |
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| CN201811158574.6A Active CN109068491B (en) | 2018-09-30 | 2018-09-30 | Aluminum substrate machining process |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708895B (en) * | 2019-10-18 | 2024-03-12 | 深圳市鑫荣进绝缘材料有限公司 | Aluminum substrate processing technology |
| CN112105170B (en) * | 2020-09-28 | 2021-11-23 | 捷卡（厦门）工业科技有限公司 | Method for gluing small circuit hard board and small circuit hard board |
| CN112687781A (en) * | 2020-12-22 | 2021-04-20 | 珠海市沃德科技有限公司 | Processing method of LED mirror lamp panel for COB packaging |
| CN114885516A (en) * | 2022-05-27 | 2022-08-09 | 东莞联桥电子有限公司 | Double-sided single-layer aluminum substrate manufacturing process |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN102256441A (en) * | 2011-05-23 | 2011-11-23 | 中山大学 | Metal substrate of heat conducting aluminium-based core and preparation method thereof |
| TWI490115B (en) * | 2014-03-07 | 2015-07-01 | Azotek Co Ltd | Metal substrate and fabricating method thereof |
| CN103987211B (en) * | 2014-05-23 | 2017-12-01 | 景旺电子科技(龙川)有限公司 | A kind of high-efficiency heat-radiating aluminum plate based on increase aluminium base face and preparation method thereof |
| CN104703397B (en) * | 2015-03-27 | 2018-03-09 | 大族激光科技产业集团股份有限公司 | A kind of method of flexible circuitry board blind hole processing |
| CN106304691A (en) * | 2015-05-29 | 2017-01-04 | 深圳华祥荣正电子有限公司 | HDI plate and manufacture method thereof |
| CN107645828A (en) * | 2017-11-02 | 2018-01-30 | 江门市君业达电子有限公司 | A kind of composite circuit board for the high heat conduction that insulate and preparation method thereof |
| CN107734857A (en) * | 2017-11-15 | 2018-02-23 | 江苏苏杭电子有限公司 | High precision double-sided multi-layer one side aluminium base board machining process |
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| CN109068491A (en) | 2018-12-21 |
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