CN106455366A - Method for electroplating copper taphole in PCB - Google Patents
Method for electroplating copper taphole in PCB Download PDFInfo
- Publication number
- CN106455366A CN106455366A CN201611012627.4A CN201611012627A CN106455366A CN 106455366 A CN106455366 A CN 106455366A CN 201611012627 A CN201611012627 A CN 201611012627A CN 106455366 A CN106455366 A CN 106455366A
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- Prior art keywords
- copper
- hole
- metalized
- blind hole
- pcb
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention relates to the technical field of circuit board production, in particular to a method for an electroplating copper taphole in a PCB. The method comprises the steps of forming a first metalized blind hole from a first surface of a multi-layer working panel, forming a second metalized bind hole from a second surface, making the bottom of the first metalized blind hole connect with the bottom of the second metalized blind hole in a butt-joint mode so that an existing porefilling electroplating production line can be used to conduct via-filling-plating on the first metalized blind hole and the second metalized bind hole and finally forming the copper taphole tamped by electroplating copper. The advantages that roasting is not needed by the electroplating copper taphole and a stuffing material coincides with a hole wall metal are used to solve the problem that a porthole sunken depth is larger than 3 micrometers caused by roasting in the prior art; meanwhile, due to the fact that copper is used as the stuffing material and expansion coefficient of the stuffing material coincides with that of a hole wall copper layer can sharply lower risks of stratified plate blasting in a welding process. The number of plate grinding times in a production process can be lowered by using the electroplating copper to tamp metalized through holes, thus expansion-shrinkage degree of the multi-layer working panel can be lowered; meanwhile, the method is beneficial to improvement of the quality of the product.
Description
Technical field
The present invention relates to board production technical field, the method for electroplating copper plughole in more particularly, to a kind of PCB.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate.PCB's
Produce and include two links of circuit design and manufacture, the manufacture of PCB is designed as foundation with the circuit of early stage, and manufacturing process is typically such as
Under：In sawing sheet operation, core material is cut into the pad pasting of required size → on core material → use internal layer by design requirement
Film aligning exposure → development removes and is not covered with forming non-envelope on inner figure → etching core material by the film of photocuring
Layers of copper stack by necessarily putting in order and pass through high-temperature laminating for one to form internal layer circuit → take off film → by each core material
Body formation multi-layer sheet → make hole metallization → electric plating of whole board make in the hole layers of copper thickness reach according to borehole data boring → electroless copper plating
Design requirement → on multilayer boards makes with the silk-screen solder mask of the outer-layer circuit of internal layer conducting → on multilayer boards and passes through luxuriant and rich with fragrance
Woods contraposition exposed and developed making solder mask → rear operation such as surface treatment → shaping, detection.The making of wherein outer-layer circuit can
Carried out using negative film technique or positive blade technolgy according to actual needs.It is outer that positive blade technolgy includes pad pasting → use on multilayer boards successively
Layer film aligning exposure → development removes and is not formed outer graphics → plating copper and tin → take off film → outer layer by the film of photocuring and etch
→ take off tin；Negative film technique then include successively on multilayer boards pad pasting → using outer layer film aligning exposure → development remove not by light
The film of solidification forms outer graphics → outer layer and etches → take off film.In order that the interlayer line conduction of PCB and meet certain electric
Performance and index request, not only need to make metallization hole slot on PCB, such as metallization circular hole, metallization slotted eye, metallization
Hole and/or other metallization irregularly-shaped hole etc., the metallization slotted eye in part PCB also needs to clog using other materials, forms consent.
High frequency communications product generally requires to the camber in consent aperture on PCB extremely sternly, typically to require consent aperture to be recessed≤3 μm, so
And existing filling perforation plating line can only carry out electroplating filling perforation to metalized blind vias, cannot be electroplated using filling perforation for plated-through hole
Line carries out electroplating consent, and prior art is typically by the way of filling holes with resin, copper slurry consent or silver paste consent, but resin, copper
Need baking-curing after the material consent such as slurry and silver paste (copper slurry, silver paste are all the mixtures of corresponding metal dust and resin), dry
Roasting solidification easily causes aperture depression and is recessed typically larger than 3 μm, and therefore existing filling holes with resin, copper slurry consent and silver paste consent are no
Method meets the requirement of≤3 μm of consent aperture depression.In addition, the coefficient of expansion of the material such as resin, silver paste, copper slurry differs pole with copper
Greatly, in welding process, there is the risk of layering plate bursting in poor heat resistance.Additionally, needing after filling holes with resin, copper slurry consent and silver paste consent
Abrasive belt grinding to be used, this can cause product harmomegathus, is also unfavorable for improving the quality of product.
Content of the invention
The present invention is difficult to depression asking less than or equal to 3 μm in its aperture after through hole filling for existing consent technology
Topic, the method that electroplating copper plughole in a kind of PCB is provided, the method reaches through hole consent metapore mouth by way of electro-coppering filling perforation
The depression at place is less than or equal to 3 μm.
For achieving the above object, the present invention employs the following technical solutions.
In a kind of PCB, the method for electroplating copper plughole, comprises the following steps：
S1 multilayer produces plate：Prepreg is passed through according to prior art core material is integrated shape with outer copper foil pressing
Multilayer is become to produce plate, described multilayer produces plate and includes first surface and second surface, and described first surface is provided with for making
First consent position of copper consent；On described second surface, the position vertically superposed with the first consent position is the second consent position.
S2 first metalized blind vias：Produce in multilayer and at the first consent position of plate first surface, bore the first blind hole, Ran Houtong
Cross heavy copper and electric plating of whole board makes the first blind hole metallization, form the first metalized blind vias.
Preferably, using CO2The mode of laser drill bores the first blind hole.
It is furthermore preferred that the hole depth of described first blind hole produces the 1/3 to 1/2 of plate thickness of slab for multilayer.
Preferably, first the first blind hole is carried out before heavy copper process with plasma removing glue Slag treatment.
Preferably, copper layer thickness >=15 μm to the first metalized blind vias for the electric plating of whole board.
S3 second metalized blind vias：Produce in multilayer and bore the second blind hole at the second consent position of plate second surface, with first
The bottom of metalized blind vias is as the bottom of the second blind hole；Then the second blind hole metallization, shape are made by heavy copper and electric plating of whole board
Become the second metalized blind vias.
Preferably, using CO2The mode of laser drill bores the second blind hole.
Preferably, first the second blind hole is carried out before heavy copper process with plasma removing glue Slag treatment.
Preferably, copper layer thickness >=15 μm to the second metalized blind vias for the electric plating of whole board.
S4 electroplates filling perforation：By existing filling perforation electroplating assembly line, the first metalized blind vias and the second metalized blind vias are entered
Row electro-coppering filling perforation, forms copper consent.
Operation after S5：According to prior art multilayer produce make successively on plate outer-layer circuit, make solder mask, at surface
Reason, shaping and test.
When also needing to make other plated through-hole outside copper removal consent on PCB, in the rear operation of step S5, making outer layer line
Also include outer layer drilling operating before road, and heavy copper and electric plating of whole board operation make hole metallization.
Compared with prior art, the invention has the beneficial effects as follows：The present invention passes through cleverly to produce from multilayer the first of plate
Surface makes the first metalized blind vias, makes the second metalized blind vias from second surface, make the bottom of the first metalized blind vias with
The bottom docking of the second metalized blind vias, thus can be utilized existing filling perforation electroplating assembly line that the first blind hole and the second blind hole are entered
Row plating filling perforation, ultimately forms the copper consent of electro-coppering filling, need not be toasted and be clogged material and hole wall using electroplating copper plughole
The advantage that metal is consistent overcomes prior art and leads to aperture depression more than 3 μm of problem because of baking, and clogs material
For copper, the coefficient of expansion clogging material is consistent with hole wall layers of copper, greatly reduces the wind that welding process occurs being layered plate bursting
Danger.Additionally, the inventive method fills out, with electro-coppering, the number of times that plated-through hole can reduce nog plate in production process, thus reduce multilayer
Produce the expansion-contraction degree of plate, be conducive to improving the quality of product.
Specific embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrate.
Embodiment 1
The present embodiment provides a kind of preparation method of PCB, need to make on the pcb to clog to metallize in electro-coppering mode and lead to
The copper consent in hole.And in order to the technology contents of the present invention are described, design the PCB of this embodiment hole thereon and be copper consent,
Other plated through-holes and the plated through-hole of other material filling need not be made.
The specifications parameter of prepared PCB is as follows：
Comprise the following steps that：
(1) multilayer produces plate
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → boring → sink copper → entirely
Plate is electroplated, and core material and outer copper foil is fabricated to multilayer and produces plate, that is, by core material, prepreg and outer copper foil pressure
The production plate being integrated.Specific as follows：
A, sawing sheet：Output central layer, core thickness 1.1mm H/H by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：LDI dry film, stands 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, and development after etching goes out line pattern, and internal layer live width measures as 3mil.
C, internal layer AOI：Check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective scraps process, no
The product of defect goes out to downstream.
D, pressing：Brown speed is selected according to thickness of slab.After lamination, pressed from suitable lamination according to plate Tg
Close, after pressing, thickness is 1.4mm.
Pressing forms multilayer after being integrated and produces plate, and this multilayer produces plate and includes first surface and second surface, the first table
Face is provided with the first consent position for making copper consent；On second surface, the position vertically superposed with the first consent position is second
Consent position (i.e. the first consent position is overlapped with the second consent position in the projection producing plate direction perpendicular to multilayer).
(2) first metalized blind vias
Using CO2The mode of laser drill produces in multilayer and bores the first blind hole at the first consent position of plate first surface, leads to
Cross control CO2The hole depth of energy hole first blind hole of laser is 1/3rd of thickness of slab.Then removed using existing plasma
The method of glue residue carries out removing glue Slag treatment to the first blind hole, removes in the hole carbide resin, glue residue, and is roughened in the hole wall, for heavy copper
Prepare.Then pass through heavy copper and electric plating of whole board makes the first blind hole metallization, and control the layers of copper in the first metalized blind vias thick
>=15 μm of degree, forms the first metalized blind vias.Specific as follows：
A, x-ray bore wad cutter：X-ray brill target drone carries out layer to pressing PCB and partially checks, bores target position hole, as boring simultaneously
Location hole.
B, laser drill：Control CO2Laser energy, drilling depth only reaches 1/3rd that multilayer produces plate thickness of slab.
C, plasma treatment：Remove in the hole carbide resin, glue residue, be roughened in the hole wall, prepare for heavy copper.
D, heavy copper：Make hole metallization by way of electroless copper plating, backlight tests 9.5 grades.
E, electric plating of whole board：In the first blind hole, copper facing to be to thicken hole wall layers of copper, and ensures copper thickness >=15um.
(3) second metalized blind vias
Using CO2The mode of laser drill produces in multilayer and bores the second blind hole at the second consent position of plate second surface, with
The bottom of the first metalized blind vias as the second blind hole bottom (due to CO2During laser drill, CO used2Laser cannot penetrate
The metallic copper bottom of the first metalized blind vias, makes the bottom of the first metalized blind vias be the bottom of the second blind hole, the first metal
Change blind hole and the second blind hole common base).Then removing glue is carried out to the second blind hole using the method for existing plasma de-smear
Slag treatment, removes in the hole carbide resin, glue residue, and is roughened in the hole wall, prepares for heavy copper.Then pass through heavy copper and electric plating of whole board
Make the second blind hole metallization, and control copper layer thickness >=15 μm in the second metalized blind vias, form the second metalized blind vias.Tool
Body is as follows：
A, laser drill：Using CO2The second surface that laser produces plate in multilayer carries out to brill, will be complete for remaining resin bed
Portion removes, and makes the bottom as the second blind hole for the bottom of the first metalized blind vias.
B, plasma treatment：Remove in the hole carbide resin, glue residue, and be roughened in the hole wall, prepare for heavy copper.
C, heavy copper：Make hole metallization by way of electroless copper plating, backlight tests 9.5 grades.
D, electric plating of whole board：In the second blind hole, copper facing to be to thicken hole wall layers of copper, and ensures copper thickness >=15um.
(4) electroplate filling perforation
Carry out electro-coppering by existing filling perforation electroplating assembly line to the first metalized blind vias and the second metalized blind vias to fill out
Hole, fills and leads up the first metalized blind vias and the second metalized blind vias, to the aperture of the first metalized blind vias and the second metalized blind vias
Place is no recessed.The first metalized blind vias after electro-coppering filling and the second metalized blind vias constitute copper consent and (are equivalent to plating
Copper is loaded with plated-through hole).
(5) operation afterwards
According to prior art, sequentially pass through outer-layer circuit → outer layer AOI → silk-screen welding resistance, character → heavy nickel gold → electrical testing
→ shaping → FQA → packaging, the PCB finished product of the thick gold of prepared one side parcel plating.Specific as follows：
A, outer-layer circuit：Using negative film technique, sequentially pass through pad pasting, exposure, development, copper facing, tin plating, take off film, etching and
Take off the operation of tin, the first surface and second surface of multilayer production plate form outer-layer circuit.
B, outer layer AOI：Check the live width of circuit, spacing, circuit pin hole and whether have circuit breach, and check product and product
Whether mutually product require relevant item on an equal basis.
Consent before c, welding resistance：Ink need to be filled in for 0.25mm hole, by the 0.30mm aperture on aluminium flake, ink plug be arrived
In the aperture of 0.25mm, and press special jack Ink parameters baking sheet.
D, silk-screen welding resistance, character：Using white wire mark brush TOP face solder mask, TOP face character adds UL mark.
The blue glue of e, print：Thick carat (measure of the purity of gold) (or golden finger position) prints the blue glue of last layer 0.7-1.2mm, protection thickness layer gold, simultaneously plus
Heat cure indigo plant glue.
F, lead-free tin spray：The spray uniform tin of last layer is thick, controls 1-20 μm；Tear blue glue simultaneously.
G, shaping：Gong external form, external form tolerance +/- 0.05mm.
H, electrical measurement：The electric property of test-based examination production board.
I, eventually inspection：Check that the aesthetic appearance of production board is bad.
j、FQA：Take a sample test outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. again.
K, packaging：By customer requirement, PCB is packed, and place drier and humidity card within a package.
Embodiment 2
The present embodiment provides a kind of preparation method of PCB, need to make on the pcb to clog to metallize in electro-coppering mode and lead to
The copper consent in hole.Also need outside copper removal consent on the PCB of the present embodiment to make other plated through-holes (as plated-through hole and metallization
Blind hole etc.).
The specifications parameter of prepared PCB is as follows：
Comprise the following steps that：
(1) multilayer produces plate
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → boring → sink copper → entirely
Plate is electroplated, and core material and outer copper foil is fabricated to multilayer and produces plate, that is, by core material, prepreg and outer copper foil pressure
The production plate being integrated.Specific as follows：
A, sawing sheet：Output central layer, core thickness 1.1mm H/H by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：LDI dry film, stands 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, and development after etching goes out line pattern, and internal layer live width measures as 3mil.
C, internal layer AOI：Check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective scraps process, no
The product of defect goes out to downstream.
D, pressing：Brown speed is selected according to thickness of slab.After lamination, pressed from suitable lamination according to plate Tg
Close, after pressing, thickness is 1.4mm.
Pressing forms multilayer after being integrated and produces plate, and this multilayer produces plate and includes first surface and second surface, the first table
Face is provided with the first consent position for making copper consent；On second surface, the position vertically superposed with the first consent position is second
Consent position (projection that i.e. the first consent position produces plate direction perpendicular to multilayer is overlapped with the second consent position).
(2) first metalized blind vias
Using CO2The mode of laser drill produces in multilayer and bores the first blind hole at the first consent position of plate first surface, leads to
Cross control CO2The hole depth of energy hole first blind hole of laser produces 1/2nd of plate thickness of slab for multilayer.Then adopt existing
The method of plasma de-smear the first blind hole is carried out with removing glue Slag treatment, remove in the hole carbide resin, glue residue, and be roughened in the hole
Wall, prepares for heavy copper.Then pass through heavy copper and electric plating of whole board makes the first blind hole metallization, and control in the first metalized blind vias
Copper layer thickness >=15 μm, formed the first metalized blind vias.Specific as follows：
A, x-ray bore wad cutter：X-ray brill target drone carries out layer to pressing PCB and partially checks, bores target position hole, as boring simultaneously
Location hole.
B, laser drill：Control CO2Laser energy, drilling depth only reaches 1/2nd that multilayer produces plate thickness of slab.
C, plasma treatment：Remove in the hole carbide resin, glue residue, be roughened in the hole wall, prepare for heavy copper.
D, heavy copper：Make hole metallization by way of electroless copper plating, backlight tests 9.5 grades.
E, electric plating of whole board：In the first blind hole, copper facing to be to thicken hole wall layers of copper, and ensures copper thickness >=15um.
(3) second metalized blind vias
Using CO2The mode of laser drill produces in multilayer and bores the second blind hole at the second consent position of plate second surface, with
The bottom of the first metalized blind vias as the second blind hole bottom (due to CO2CO during laser drill2Laser cannot penetrate the first gold medal
The metallic copper bottom of genusization blind hole, makes the bottom of the first metalized blind vias be the bottom of the second blind hole, the first metalized blind vias
With the second blind hole common base).Then removing glue Slag treatment is carried out to the second blind hole using the method for existing plasma de-smear,
Remove in the hole carbide resin, glue residue, and be roughened in the hole wall, prepare for heavy copper.Then pass through heavy copper and electric plating of whole board makes second
Blind hole metallizes, and controls copper layer thickness >=15 μm in the second metalized blind vias, forms the second metalized blind vias.Specifically such as
Under：
A, laser drill：Using CO2The second surface that laser produces plate in multilayer carries out to brill, will be complete for remaining resin bed
Portion removes, and makes the bottom as the second blind hole for the bottom of the first metalized blind vias.
B, plasma treatment：Remove in the hole carbide resin, glue residue, and be roughened in the hole wall, prepare for heavy copper.
C, heavy copper：Make hole metallization by way of electroless copper plating, backlight tests 9.5 grades.
D, electric plating of whole board：In the second blind hole, copper facing to be to thicken hole wall layers of copper, and ensures copper thickness >=15um.
(4) electroplate filling perforation
Carry out electro-coppering by existing filling perforation electroplating assembly line to the first metalized blind vias and the second metalized blind vias to fill out
Hole, fills and leads up the first metalized blind vias and the second metalized blind vias, to the aperture of the first metalized blind vias and the second metalized blind vias
Place is no recessed.The first metalized blind vias after electro-coppering filling and the second metalized blind vias constitute copper consent and (are equivalent to plating
Copper is loaded with plated-through hole).
(5) operation afterwards
According to prior art, sequentially pass through outer layer and hole → sink copper → electric plating of whole board → outer-layer circuit → outer layer AOI → silk
Print welding resistance, character → heavy nickel gold → electrical testing → shaping → FQA → packaging, the PCB finished product of the thick gold of prepared one side parcel plating.Tool
Body is as follows：
A, outer layer boring：Carry out Drilling operation (including through hole and blind hole) using borehole data.
B, heavy copper：Make the hole metallization on production plate, backlight tests 10 grades.
C, electric plating of whole board：Disposably electroplate the copper of production board desired thickness on multilayer boards, that is, control multiple-plate upper table
The copper that the copper layer thickness of face and lower surface is equal to the outer-layer circuit of required making is thick.Specifically, with the current density electricity of 18ASF
Plating 90min, makes hole wall copper 21 μm of the Min of thickness of multi-layer sheet mesopore.
D, outer-layer circuit：Using negative film technique, sequentially pass through pad pasting, exposure, development, copper facing, tin plating, take off film, etching and
Take off the operation of tin, the first surface and second surface of multilayer production plate form outer-layer circuit.
E, outer layer AOI：Check the live width of circuit, spacing, circuit pin hole and whether have circuit breach, and check product and product
Whether mutually product require relevant item on an equal basis.
Consent before f, welding resistance：Ink need to be filled in for 0.25mm hole, by the 0.30mm aperture on aluminium flake, ink plug be arrived
In the aperture of 0.25mm, and press special jack Ink parameters baking sheet.
G, silk-screen welding resistance, character：Using white wire mark brush TOP face solder mask, TOP face character adds UL mark.
The blue glue of h, print：Thick carat (measure of the purity of gold) (or golden finger position) prints the blue glue of last layer 0.7-1.2mm, protection thickness layer gold, simultaneously plus
Heat cure indigo plant glue.
I, lead-free tin spray：The spray uniform tin of last layer is thick, controls 1-20 μm；Tear blue glue simultaneously.
J, shaping：Gong external form, external form tolerance +/- 0.05mm.
K, electrical measurement：The electric property of test-based examination production board.
L, eventually inspection：Check that the aesthetic appearance of production board is bad.
m、FQA：Take a sample test outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. again.
N, packaging：By customer requirement, PCB is packed, and place drier and humidity card within a package.
The above only to further illustrate the technology contents of the present invention with embodiment, is easier to understand in order to reader,
But do not represent embodiments of the present invention and be only limitted to this, any technology done according to the present invention extends or recreates, all by this
Bright protection.
Claims (9)
1. in a kind of PCB the method for electroplating copper plughole it is characterised in that comprising the following steps：
S1 multilayer produces plate：By prepreg, core material and outer copper foil pressing are formed as one many according to prior art
Layer produces plate, and described multilayer produces plate and includes first surface and second surface, and described first surface is provided with for making copper plug
The first consent position in hole；On described second surface, the position vertically superposed with the first consent position is the second consent position；
S2 first metalized blind vias：Produce in multilayer and at the first consent position of plate first surface, bore the first blind hole, it is heavy then to pass through
Copper and electric plating of whole board make the first blind hole metallization, form the first metalized blind vias；
S3 second metalized blind vias：Produce in multilayer and bore the second blind hole at the second consent position of plate second surface, with the first metal
Change the bottom as the second blind hole for the bottom of blind hole；Then the second blind hole metallization is made by heavy copper and electric plating of whole board, form the
Two metalized blind vias；
S4 electroplates filling perforation：Electricity is carried out to the first metalized blind vias and the second metalized blind vias by existing filling perforation electroplating assembly line
Copper facing filling perforation, forms copper consent；
Operation after S5：According to prior art multilayer produce plate on make successively outer-layer circuit, make solder mask, surface treatment,
Shaping and test.
2. according to claim 1 in a kind of PCB the method for electroplating copper plughole it is characterised in that in the rear operation of step S5,
Also include outer layer drilling operating before making outer-layer circuit, and heavy copper and electric plating of whole board operation make hole metallization.
3. according to claim 1 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S2, described first
The hole depth of blind hole produces the 1/3 to 1/2 of plate thickness of slab for multilayer.
4. according to claim 3 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S2, electric plating of whole board
Copper layer thickness >=15 μm to the first metalized blind vias.
5. according to claim 4 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S2, using CO2Swash
The mode of light boring bores the first blind hole.
6. according to claim 5 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S2, in heavy coppersmith
First the first blind hole is carried out before sequence with plasma removing glue Slag treatment.
7. according to claim 1 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S3, electric plating of whole board
Copper layer thickness >=15 μm to the second metalized blind vias.
8. according to claim 7 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S3, using CO2Swash
The mode of light boring bores the second blind hole.
9. according to claim 8 in a kind of PCB the method for electroplating copper plughole it is characterised in that in step S3, in heavy coppersmith
First the second blind hole is carried out before sequence with plasma removing glue Slag treatment.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611012627.4A CN106455366A (en) | 2016-11-17 | 2016-11-17 | Method for electroplating copper taphole in PCB |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611012627.4A CN106455366A (en) | 2016-11-17 | 2016-11-17 | Method for electroplating copper taphole in PCB |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708323A (en) * | 2017-10-30 | 2018-02-16 | 惠州市和信达线路板有限公司 | Thick copper printed circuit board welding resistance consent solidify afterwards baking sheet technique and its apparatus for baking |
| CN108449873A (en) * | 2018-03-14 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of the full copper plating of novel via hole |
| CN109068490A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of HDI substrate processing technology |
| CN110602900A (en) * | 2019-09-17 | 2019-12-20 | 深圳明阳电路科技股份有限公司 | Multilayer and multistage HDI plate manufacturing method and device |
| CN113026066A (en) * | 2021-03-04 | 2021-06-25 | 江西博泉化学有限公司 | Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof |
| CN113950191A (en) * | 2020-07-17 | 2022-01-18 | 深南电路股份有限公司 | Circuit board and hole plugging method thereof |
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| US20130153274A1 (en) * | 2011-12-14 | 2013-06-20 | Wistron Corporation | Circuit board capable of preventing contact of a gold finger and solder |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708323A (en) * | 2017-10-30 | 2018-02-16 | 惠州市和信达线路板有限公司 | Thick copper printed circuit board welding resistance consent solidify afterwards baking sheet technique and its apparatus for baking |
| CN108449873A (en) * | 2018-03-14 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of the full copper plating of novel via hole |
| CN109068490A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of HDI substrate processing technology |
| CN109068490B (en) * | 2018-09-30 | 2020-11-10 | 东莞联桥电子有限公司 | HDI substrate processing technology |
| CN110602900A (en) * | 2019-09-17 | 2019-12-20 | 深圳明阳电路科技股份有限公司 | Multilayer and multistage HDI plate manufacturing method and device |
| CN113950191A (en) * | 2020-07-17 | 2022-01-18 | 深南电路股份有限公司 | Circuit board and hole plugging method thereof |
| CN113950191B (en) * | 2020-07-17 | 2024-03-22 | 深南电路股份有限公司 | Circuit board and hole plugging method thereof |
| CN113026066A (en) * | 2021-03-04 | 2021-06-25 | 江西博泉化学有限公司 | Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof |
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Application publication date: 20170222 |