CN113950191A - Circuit board and hole plugging method thereof - Google Patents
Circuit board and hole plugging method thereof Download PDFInfo
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- CN113950191A CN113950191A CN202010694732.0A CN202010694732A CN113950191A CN 113950191 A CN113950191 A CN 113950191A CN 202010694732 A CN202010694732 A CN 202010694732A CN 113950191 A CN113950191 A CN 113950191A
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- circuit board
- hole
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- plugged
- plugging
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 28
- 238000007650 screen-printing Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 230000008602 contraction Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000011347 resin Substances 0.000 description 45
- 229920005989 resin Polymers 0.000 description 45
- 239000007789 gas Substances 0.000 description 22
- 239000004809 Teflon Substances 0.000 description 7
- 229920006362 Teflon® Polymers 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a circuit board and a hole plugging method thereof, wherein the hole plugging method comprises the following steps: obtaining a circuit board to be processed; the circuit board is provided with holes to be plugged; carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged; and (4) carrying out hole plugging treatment on the baked uncooled circuit board so as to adhere the inner wall of the hole to be plugged with the filler. The invention provides a circuit board and a hole plugging method thereof, wherein the hole plugging method of the circuit board is characterized in that a circuit board to be processed provided with holes to be plugged is obtained; carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged; the plug hole treatment is carried out on the circuit board which is not cooled after being baked, so that the phenomenon that gas is hidden in the hole to be plugged due to thermal expansion and cold contraction is avoided, a plug can be filled in the hole to be plugged, and the phenomenon that the hole is broken and sunken is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the filler can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the capacity are saved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board and a hole plugging method of the circuit board.
Background
With the trend of printed circuit boards toward high density and multi-functionalization, the reliability requirements of the printed circuit boards are increasing. The circuit board uses the demand of resin consent technology to promote by a wide margin, but resin consent technology is not enough to the back drilling consent processingcapacity of special material, because contain the air in the back drilling hole of circuit board in the consent process, leads to the resin of consent to appear brokenly the sunken phenomenon of hole in the postcure in-process for the defective rate of circuit board increases, and machining efficiency is slow, and has all caused serious waste to cost and productivity.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board and a manufacturing method thereof, and solves the problem that a hole is easy to break at a solder resist plug hole of the circuit board in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: a hole plugging method of a circuit board is provided, and the method comprises the following steps: obtaining a circuit board to be processed; the circuit board is provided with holes to be plugged; carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged; and (4) carrying out hole plugging treatment on the baked uncooled circuit board so as to adhere the inner wall of the hole to be plugged with the filler.
The step of conducting hole plugging treatment on the baked uncooled circuit board to enable the inner wall of the hole to be plugged to be adhered to the filler specifically comprises the following steps: and carrying out vacuum screen printing hole plugging treatment on the circuit board which is not cooled after being baked so as to remove gas in holes to be plugged.
Wherein, to toasting uncooled circuit board and carry out vacuum silk screen printing consent to handle to the step of getting rid of the gas in treating the consent specifically includes: carrying out constant-temperature cooling treatment on the baked circuit board; and (5) after the circuit board is cooled to 80-100 ℃ at constant temperature, carrying out vacuum screen printing hole plugging treatment on the holes to be plugged on the circuit board.
Wherein, the step of plugging the baked uncooled circuit board to make the inner wall of the hole to be plugged adhere to the filler further comprises the following steps: and carrying out secondary baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the filling material.
Wherein, the step of carrying out the second baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the filling material specifically comprises the following steps: horizontally placing the circuit board subjected to the hole plugging treatment and carrying out secondary baking treatment; the concave surface of the filler in the plug hole of the circuit board faces downwards, and the convex surface faces upwards, so that the filler protruding out of the surface of the circuit board flows into the plug hole vertically in the curing process.
The step of horizontally placing the circuit board subjected to the hole plugging treatment and performing secondary baking treatment specifically comprises the following steps: and carrying out segmented curing baking on the circuit board subjected to the hole plugging treatment from low to high according to the baking temperature, wherein the number of the segments of segmented curing ranges from 3 to 5, the baking temperature ranges from 80 to 150 ℃, and the total time of all the segmented baking is 140 minutes.
When the number of the sections of the segmented curing is 5, the step of baking the circuit board subjected to the hole plugging treatment by the segmented curing from low to high according to the baking temperature comprises the following steps: baking the circuit board subjected to the hole plugging treatment at a temperature of 80 ℃ for a first period of time, wherein the baking time for the first period of time is 35 minutes; carrying out second-stage baking on the circuit board subjected to the first-stage baking at the temperature of 90 ℃, wherein the second-stage baking time is 35 minutes; carrying out third-stage baking on the circuit board subjected to the second-stage baking at the temperature of 110 ℃, wherein the third-stage baking time is 28 minutes; carrying out fourth-stage baking on the circuit board subjected to the third-stage baking at the temperature of 140 ℃, wherein the fourth-stage baking time is 7 minutes; and (4) baking the circuit board baked in the fourth section at the temperature of 150 ℃ for a fifth section, wherein the baking time in the fifth section is 35 minutes.
The step of obtaining the circuit board to be processed specifically comprises the following steps: obtaining a substrate; wherein, the base plate is provided with holes to be plugged; and cleaning the substrate to obtain the circuit board to be processed.
The method comprises the following steps of firstly baking the circuit board to discharge foreign matters in holes to be plugged, wherein the step of baking the circuit board for the first time to discharge the foreign matters in the holes to be plugged specifically comprises the following steps: and carrying out primary baking treatment on the circuit board at the temperature of 170 ℃, wherein the time of the primary baking treatment is 60-90 minutes, so as to remove gas and water in holes to be plugged on the circuit board.
In order to solve the above technical problems, the second technical solution adopted by the present invention is: the circuit board is provided, and holes to be plugged of the circuit board are plugged by the plugging method of the circuit board.
The invention has the beneficial effects that: different from the situation of the prior art, the circuit board and the hole plugging method thereof are provided, wherein the hole plugging method of the circuit board is realized by obtaining a circuit board to be processed, which is provided with holes to be plugged; carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged; the plug hole treatment is carried out on the circuit board which is not cooled after being baked, so that the phenomenon that gas is hidden in the hole to be plugged due to thermal expansion and cold contraction is avoided, a plug can be filled in the hole to be plugged, and the phenomenon that the hole is broken and sunken is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the filler can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the capacity are saved.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of a circuit board plugging method provided by the present invention;
FIG. 2 is a schematic flow chart of a second embodiment of the hole plugging method for circuit boards according to the present invention;
FIG. 3 is a schematic structural diagram of a circuit board corresponding to the step of the circuit board plugging method provided in FIG. 2;
fig. 4 is a schematic structural diagram of an embodiment of a circuit board provided in the present invention.
Detailed Description
The following describes in detail the embodiments of the present application with reference to the drawings attached hereto.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic flow chart of a first embodiment of a circuit board plugging method provided by the present invention. In this embodiment, the method for plugging the circuit board specifically includes the following steps.
S11: obtaining a circuit board to be processed; the circuit board is provided with holes to be plugged.
Specifically, a substrate is obtained; wherein, the base plate is provided with holes to be plugged; and cleaning the substrate to obtain the circuit board to be processed.
S12: and carrying out primary baking treatment on the circuit board to exhaust gas in the hole to be plugged.
Specifically, the first baking treatment is carried out on the circuit board at the temperature of 170 ℃, wherein the time of the first baking treatment is 60-90 minutes, so that gas and moisture in holes to be plugged on the circuit board are removed.
S13: and (4) carrying out hole plugging treatment on the baked uncooled circuit board so as to adhere the inner wall of the hole to be plugged with the filler.
Specifically, the baked uncooled circuit board is subjected to vacuum silk-screen hole plugging treatment to remove gas in holes to be plugged. Carrying out constant-temperature cooling treatment on the baked circuit board; and (5) after the circuit board is cooled to 80-100 ℃ at constant temperature, carrying out vacuum screen printing hole plugging treatment on the holes to be plugged on the circuit board. And then, carrying out secondary baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the filling material. In an optional embodiment, the circuit board after the hole plugging treatment is horizontally placed and subjected to secondary baking treatment; the concave surface of the filling material in the hole to be plugged of the circuit board faces downwards, and the convex surface faces upwards, so that the filling material protruding out of the surface of the circuit board flows into the hole to be plugged vertically in the curing process. And carrying out segmented curing baking on the circuit board subjected to the hole plugging treatment from low to high according to the baking temperature, wherein the number of the segments of segmented curing ranges from 3 to 5, the baking temperature ranges from 80 to 150 ℃, and the total time of all the segmented baking is 140 minutes.
In a specific embodiment, when the number of the sections for segmented curing is 5, the step of performing segmented curing baking on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high comprises the following steps: baking the circuit board subjected to the hole plugging treatment at a temperature of 80 ℃ for a first period of time, wherein the baking time for the first period of time is 35 minutes; continuing to perform second-stage baking on the circuit board subjected to the first-stage baking at the temperature of 90 ℃, wherein the second-stage baking time is 35 minutes; continuing to bake the circuit board baked in the second section at a temperature of 110 ℃ for a third section, wherein the baking time in the third section is 28 minutes; continuing to bake the circuit board baked in the third section at the temperature of 140 ℃, wherein the baking time in the fourth section is 7 minutes; and continuously baking the circuit board baked in the fourth section at the temperature of 150 ℃, wherein the baking time in the fifth section is 35 minutes.
According to the hole plugging method of the circuit board, the circuit board to be processed provided with the holes to be plugged is obtained; carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged; the plug hole treatment is carried out on the circuit board which is not cooled after being baked, so that the phenomenon that gas is hidden in the hole to be plugged due to thermal expansion and cold contraction is avoided, a plug can be filled in the hole to be plugged, and the phenomenon that the hole is broken and sunken is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the filler can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the capacity are saved.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic flow chart of a second embodiment of a circuit board plugging method according to the present invention; fig. 3 is a schematic structural diagram of a circuit board corresponding to the step of the circuit board plugging method provided in fig. 2. In this embodiment, the method for plugging the circuit board specifically includes the following steps.
S21: obtaining a substrate; wherein, the base plate is provided with a hole to be plugged.
Specifically, a substrate 301 is obtained, the substrate 301 including a core board and a metal plate provided on a surface of the core board. The core board is made of insulating medium material. The metal plate can be loaded on both the upper surface and the lower surface of the core plate, or the metal plate can be loaded on one surface of the core plate. The substrate 301 may also be a copper clad laminate. In an alternative embodiment, the substrate 301 is made of teflon. The polytetrafluoroethylene substrate 301 is provided with a hole 302 to be plugged, and the hole 302 to be plugged is a through hole. Wherein the inner wall of the hole 302 to be plugged may also be plated with a copper layer (not shown).
S22: and cleaning the substrate to obtain the circuit board to be processed.
Specifically, the metal plate on the surface of the substrate 301 is ground by a grinding machine to remove oxides, oil stains and impurities on the surface of the metal plate on the substrate 301, and the roughened metal plate can enhance the adhesion between the subsequent solder resist ink and the surface of the substrate 301, and clean the impurities in the holes to be plugged 302 to obtain the circuit board to be processed. In another alternative embodiment, the diluted sulfuric acid solution with a mass concentration of 1% ± 0.5% is sprayed and enters a polisher, and the metal plate on the surface of the roughened substrate 301 is brushed by a nylon brush. In an alternative embodiment, the surface of the substrate 301 is cleaned with dilute sulfuric acid having a mass concentration of 1% ± 0.5% to remove oil stains, impurities, and the like on the surface of the substrate 301. In an alternative embodiment, the surface of the substrate 301 may be cleaned by blowing air or ultrasonic vibration to remove the dirt attached to the surface of the substrate 301.
S23: and carrying out primary baking treatment on the circuit board to exhaust gas in the hole to be plugged.
Specifically, the cleaned circuit board to be processed is dried by hot air, wherein the temperature of the hot air is 170 ℃, the hot air is dried for 60 to 90 minutes, when the hot air is dried for 90 minutes, the board drying effect is better, residual moisture on the circuit board to be processed can be removed by performing primary baking treatment on the circuit board, and meanwhile, water vapor and other gases in the hole 302 to be plugged on the circuit board to be processed are reduced as much as possible by the principle of expansion with heat and contraction with cold. In an alternative embodiment, the substrate 301 is a teflon plate, and the activity of the substrate in the holes 302 to be plugged on the teflon plate is greatly improved under high temperature conditions, which is beneficial for the subsequent combination with the filled resin 303. In an optional embodiment, the circuit board to be processed after cleaning is dried to prevent moisture on the circuit board from affecting the bonding strength between the resin 303 for plugging the hole and the inner wall of the hole to be plugged 302, and simultaneously, the wetting effect of the solder resist ink on the circuit board can be prevented from being affected when the solder resist ink is coated on the circuit board subsequently.
S24: and (4) carrying out vacuum silk-screen hole plugging treatment on the baked uncooled circuit board to remove gas in the holes to be plugged 302.
Specifically, the circuit board subjected to the 170-degree-centigrade hot-air baking treatment is placed in a thermostat with the temperature of 90 degrees centigrade, the temperature of the circuit board is cooled to 90 degrees centigrade, the circuit board with the temperature of 90 degrees centigrade is taken out, the circuit board is horizontally placed on a vacuum screen printing hole plugging machine to directly perform vacuum screen printing hole plugging operation on the circuit board, and resin 303 is filled into the hole to be plugged 302 from the upper end face of the hole to be plugged 302 on the circuit board. In the vacuum screen printing hole plugging process, the circuit board and the hole to be plugged 302 on the circuit board are in a vacuum state, and the amount of gas hidden in the hole to be plugged 302 cannot be increased, so that the resin 303 can be more densely filled into the hole to be plugged 302 and is tightly attached to the inner wall of the hole to be plugged 302. At 90 ℃, the moisture contained in the hole to be plugged 302 on the circuit board can be evaporated into water vapor, so that the moisture contained in the hole to be plugged 302 can be removed, and at the same time, due to the expansion caused by heat and the contraction caused by cold of the gas, the gas contained in the hole to be plugged 302 on the circuit board is relatively reduced at 90 ℃, so that more resin 303 can be filled into the hole to be plugged 302, and the phenomenon that more bubbles appear in the resin 303 due to the gas contained in the hole to be plugged 302 in the filling process is avoided. Meanwhile, the resin 303 is filled into the hole to be plugged 302 of the circuit board at 90 ℃, so that the resin 303 and the circuit board can be bonded more firmly at high temperature, and the bonding strength between the resin 303 and the inner wall of the hole to be plugged 302 is improved. In an optional embodiment, the substrate 301 is made of a teflon material, vacuum screen printing hole plugging processing is performed on the circuit board at 90 ℃, the teflon plate has relatively high substrate activity, and the teflon on the inner wall of the hole to be plugged 302 can be relatively well combined with the filled resin 303, so that the bonding force between the teflon on the inner wall of the hole to be plugged 302 and the resin 303 is enhanced. Resin 303 is filled in treating consent 302 during high temperature, treat that the volatile matter of solvent can effectively volatilize in downthehole resin 303, the resin 303 that has reduced later stage solidification and has leaded to the consent contains the bubble and explodes the hole phenomenon, treat simultaneously that consent 302 inner wall edge can realize fast curing at the consent in-process, reached resin 303 pre-curing's effect, reduced later stage circuit board harmomegathus and gas release, greatly promoted the stability and the reliability of later stage resin 303 complete cure.
S25: and carrying out secondary baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the filling material.
Specifically, the circuit board subjected to the hole plugging treatment by the resin 303 is horizontally placed, the upper end surface during the vacuum screen printing hole plugging treatment is used as the bottom surface of the second baking treatment, and the lower end surface during the vacuum screen printing hole plugging treatment is used as the top surface of the second baking treatment. In another alternative embodiment, the circuit board subjected to the hole plugging process is horizontally placed, wherein the concave surface at the position where the resin 303 on the circuit board is plugged is used as the bottom surface of the second baking process, and the convex surface at the position where the resin 303 on the circuit board is plugged is used as the top surface. Because the circuit board is horizontally placed in the vacuum screen printing hole plugging process, the resin 303 is plugged in the hole to be plugged 302 vertically arranged on the circuit board, the resin 303 can generate a vertical flow phenomenon under the action of gravity, so that the resin 303 at the position of the hole to be plugged 302 of the circuit board can generate a concave phenomenon and a convex phenomenon at one side of the resin 303 at the position of the hole to be plugged, in the second baking process, in order to enable the resin 303 at the convex part of the hole to be plugged 302 of the circuit board to flow back to the hole to be plugged 302, the concave part at the position of the hole to be plugged 302 of the circuit board can be filled with the resin 303, the hole to be plugged is turned over, one side of the circuit board, which protrudes the resin 303, faces upwards, and the concave side of the resin 303 faces downwards, so that the resin 303 at the convex part can flow back to the hole to be plugged 302 of the circuit board due to the action of self gravity in the heating and curing process, and simultaneously, the resin 303 in the hole to be plugged 302 fills the concave part due to the action of the gravity, the surface of the resin 303 at the position of the hole 302 to be plugged of the circuit board can be flush with the surface of the substrate 301.
After the circuit board subjected to the hole plugging treatment by the resin 303 is horizontally placed, the circuit board subjected to the hole plugging by the resin 303 is heated and cured. Specifically, the circuit board after the hole plugging treatment is cured and baked in a segmented manner from high to low according to the baking temperature. In an optional embodiment, 3 sections of curing baking are performed on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high, the baking temperature range is 80-150 ℃, and the total baking time is 140 minutes. In another optional embodiment, the circuit board subjected to the hole plugging treatment is cured and baked for 4 sections from low to high according to the baking temperature, the baking temperature range is 80-150 ℃, and the total baking time is 140 minutes. In another optional embodiment, 5-section curing baking is performed on the circuit board subjected to the hole plugging treatment according to the baking temperature from low to high, the baking temperature range is 80-150 ℃, and the total baking time is 140 minutes. In a specific embodiment, 5 sections of curing and baking are carried out on the circuit board subjected to the hole plugging treatment, and the circuit board subjected to the hole plugging treatment is baked at the temperature of 80 ℃ for 35 minutes to finish the first section of baking; baking the circuit board subjected to the first-stage baking treatment at the temperature of 90 ℃ for 35 minutes to finish second-stage baking; baking the circuit board subjected to the second-stage baking treatment at the temperature of 110 ℃ for 28 minutes to finish third-stage baking; baking the circuit board subjected to the third-stage baking treatment at the temperature of 140 ℃ for 7 minutes to finish the fourth-stage baking; and baking the circuit board subjected to the fourth-stage baking treatment at the temperature of 150 ℃ for 35 minutes to finish the fifth-stage baking to obtain the finished product circuit board 30 with the cured resin 303.
According to the hole plugging method of the circuit board, the circuit board to be processed provided with the holes to be plugged is obtained; carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged; the baked uncooled circuit board is subjected to hole plugging treatment, so that gas is prevented from being hidden in holes to be plugged due to thermal expansion and cold contraction, hole plugging resin can be filled in the holes to be plugged, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged and the hole plugging resin can be enhanced, so that the reject ratio of the circuit board is reduced, and the cost and the capacity are saved. And the resin in the hole to be plugged can flow back to the hole to be plugged through self gravity in the heating and curing process by taking the concave surface of the resin plugged in the circuit board as the bottom surface and the convex surface as the top surface in the second curing process, so that the resin surface at the resin plug hole of the circuit board is flush with the surface of the circuit board, and the problem of the phenomenon that the resin plugged in the circuit board flows perpendicularly is solved.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a circuit board provided in the present invention. In this embodiment, a circuit board 40 includes a substrate 401, a hole to be plugged 402 is disposed on the substrate 401, and the hole to be plugged 402 on the circuit board 40 is plugged by the circuit board plugging method provided in any of the above embodiments. The circuit board 40 performs hole plugging treatment on the baked uncooled hole to be plugged 402 to avoid that gas is hidden in the hole to be plugged 402 due to thermal expansion and cold contraction, so that the hole plugging resin 403 can fill the hole to be plugged 402, and the phenomenon of hole breaking and sinking is avoided; meanwhile, the adhesive force between the inner wall of the hole to be plugged 402 and the plugging resin 403 can be enhanced, so that the reject ratio of the circuit board 40 is reduced, and the cost and the productivity are saved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A hole plugging method of a circuit board is characterized by comprising the following steps:
obtaining a circuit board to be processed; the circuit board is provided with holes to be plugged;
carrying out primary baking treatment on the circuit board to discharge gas in the hole to be plugged;
and carrying out hole plugging treatment on the baked uncooled circuit board so as to enable the inner wall of the hole to be plugged to be adhered to the filler.
2. The method for plugging a wiring board according to claim 1, wherein said step of performing a plugging process on said baked uncooled wiring board to bond an inner wall of said hole to be plugged with a filler comprises:
and carrying out vacuum screen printing hole plugging treatment on the circuit board which is not cooled after baking so as to remove gas in the holes to be plugged.
3. The hole plugging method for the circuit board according to claim 2, wherein the step of performing vacuum screen printing hole plugging treatment on the baked uncooled circuit board to remove the gas in the hole to be plugged specifically comprises:
carrying out constant-temperature cooling treatment on the baked circuit board;
and after the circuit board is cooled to 80-100 ℃ at constant temperature, carrying out vacuum screen printing hole plugging treatment on the holes to be plugged on the circuit board.
4. The method for plugging a wiring board according to claim 1, wherein said step of plugging said baked uncooled wiring board so that the inner wall of said hole to be plugged is bonded to the filler further comprises:
and carrying out secondary baking treatment on the circuit board subjected to the hole plugging treatment so as to cure the filling material.
5. The method for plugging a wiring board according to claim 4, wherein said step of performing a second baking process on the wiring board subjected to the plugging process to cure the plugging material comprises:
horizontally placing the circuit board subjected to the hole plugging treatment and carrying out secondary baking treatment; the concave surface of the filler in the plug hole of the circuit board faces downwards, and the convex surface faces upwards, so that the filler protruding out of the surface of the circuit board flows into the plug hole vertically in the curing process.
6. The method for plugging a circuit board according to claim 5, wherein the step of horizontally placing the circuit board after the plugging process and performing the second baking process specifically comprises:
and carrying out segmented curing baking on the circuit board subjected to the hole plugging treatment from low to high according to the baking temperature, wherein the number of segments of segmented curing ranges from 3 to 5, the baking temperature ranges from 80 to 150 ℃, and the total time of all segmented baking is 140 minutes.
7. The method for plugging a circuit board according to claim 6, wherein when the number of the stage of the step curing is 5, the step of performing the step of curing and baking the plugged circuit board in a stage manner from a low baking temperature to a high baking temperature comprises the following steps:
baking the circuit board subjected to the hole plugging treatment at a temperature of 80 ℃ for a first period of time, wherein the baking time for the first period of time is 35 minutes;
carrying out second-stage baking on the circuit board subjected to the first-stage baking at the temperature of 90 ℃, wherein the second-stage baking time is 35 minutes;
carrying out third-stage baking on the circuit board subjected to the second-stage baking at the temperature of 110 ℃, wherein the third-stage baking time is 28 minutes;
baking the circuit board baked in the third section at the temperature of 140 ℃ for a fourth section, wherein the baking time in the fourth section is 7 minutes;
and (4) baking the circuit board baked in the fourth section at the temperature of 150 ℃ for a fifth section, wherein the baking time in the fifth section is 35 minutes.
8. The method for plugging a circuit board according to claim 1, wherein the step of obtaining the circuit board to be processed specifically comprises:
obtaining a substrate; wherein, the base plate is provided with a hole to be plugged;
and cleaning the substrate to obtain the circuit board to be processed.
9. The method for plugging a circuit board according to claim 1, wherein said step of performing a first baking process on said circuit board to discharge foreign matters in said holes to be plugged specifically comprises:
and carrying out primary baking treatment on the circuit board at the temperature of 170 ℃, wherein the time of the primary baking treatment is 60-90 minutes, so as to remove gas and moisture in the holes to be plugged on the circuit board.
10. A wiring board characterized in that the holes to be plugged in the wiring board are plugged by the plugging method for the wiring board according to any one of claims 1 to 9.
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