JPH0590740A - Sheet for transferring conductor circuit, its manufacture, printed wiring body utilizing it, and its manufacture - Google Patents

Abstract

PURPOSE:To provide a printed wiring body in which an adhesive layer between a conductive circuit and resin board has a high heat-resistance, which has an excellent soldering property, and is not limited to a flat shape. CONSTITUTION:A sheet for transfer with an adhesive layer is previously set into a mold from a coating layer of 0.1-5.0g(dry)/m<2> according to epoxy resin or phenol resin, injected molding of a base resin is performed for performing transfer of a conductive circuit and formation of the base resin simultaneously and then an epoxy resin or a phenol resin forming an adhesive layer between the conductive circuit and the injected molding body are completely cured by heating treatment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive circuit transfer sheet used for obtaining a printed wiring body used for electronic parts, a method for producing the transfer sheet, and a print using the transfer sheet. The present invention relates to a wiring body and a manufacturing method thereof.

[0002]

2. Description of the Related Art A conventional printed wiring body has a process of impregnating a paper or glass cloth with a thermosetting resin such as unsaturated polyester resin, epoxy resin or polyimide resin to obtain a prepreg in a semi-cured state. A step of forming a copper-clad laminate by press-forming a laminated body of the prepreg and a copper foil, and a step of subjecting the copper foil in the copper-clad laminate to a treatment such as etching to form a conductive circuit Manufactured in and. Therefore, the shape of the obtained printed wiring body is limited to the flat plate shape.

On the other hand, in recent years, various electronic devices have been miniaturized, and a non-planar three-dimensional printed wiring body is required from the viewpoint of space saving and cost reduction. Such a three-dimensional shape printed wiring body,
For example, (1) a conductive circuit is formed on a thermoplastic resin injection molded body by using electroless plating, (2) a conductive circuit composed of a metal vapor deposition layer in a mold for injection molding. A transfer sheet having a sheet (Japanese Patent Laid-Open No. 63-274194)
Or (3) a transfer sheet having a laminated circuit composed of a laminated printed layer made of a conductive paste and an insulating paste (Japanese Patent Laid-Open No. 6-58242).
No. 3-219189), and then a thermoplastic resin is injection-molded.

However, the method for forming a conductive circuit utilizing the electroless plating described in the above item (1) has a low plating deposition rate and requires complicated steps. Sufficient facilities are required for pollution control.

Further, the method for producing a printed wiring body using the transfer sheet described in the items (2) and (3) is for transferring a conductive circuit by metal vapor deposition or a conductive paste. , It is easy to make a molded product into a circuit, but in the case of a conductive circuit by a metal vapor deposition layer, it is difficult to obtain a conductor thickness required for a printed wiring body,
In addition, there is a problem in that the cost becomes high economically, and in the case of the circuit using the conductive paste, the conductor resistance is higher than that of the circuit using the metal foil, and there is a problem in the reliability of the circuit.

For this reason, (4) a copper foil is attached to a plastic sheet and then a transfer sheet which is subjected to an etching process to form a circuit is set in a mold for injection molding and injection molding of a base resin is carried out. A method of manufacturing a printed wiring body by carrying out the method (JP-A-3-25996) has been proposed.

[0007]

However, the conductive circuit transfer sheet used in the manufacture of each of the above-mentioned printed wiring bodies has been designed to ensure the adhesion between the conductive circuit and the base resin. The heat resistance of the adhesive layer used is low, and the adhesive layer melts when the printed wiring body is soldered. For this reason, it has been found that there is a restriction that the IC chip cannot be mounted.

That is, regarding the base resin, in recent years, high heat resistance such as polyether ether ketone (PEEK), polyether imide (PEI), polyether sulfone (PES), polyphenylene sulfide (PPS), or liquid crystal polymer has been used. Super engineering plastics have been developed, especially polyphenylene sulfide (PPS)
Has sufficient solder heat resistance because its heat distortion temperature is 260 ° C, and the cost of the resin itself is relatively low, and it can be sufficiently used as a base resin for injection molding having solder heat resistance. It is in.

On the other hand, the adhesive layer for ensuring the adhesion between the conductive circuit and the base resin is formed on the circuit in the conductive circuit transfer sheet by overprinting, and the adhesive layer is formed. For the agent layer, a hot-melt type thermoplastic resin that melts by heating with a molten resin during injection molding of a base resin and exhibits adhesive properties by heating within an extremely short time is used. Therefore, the heat resistance is low, and as described above, the solder melts during soldering, which causes a problem of circuit peeling.

Further, in order to obtain a sufficient adhesive strength between the base resin and the injection-molded article, it is necessary to uniformly form an adhesive layer having a coating amount of 20 g / m ² or more. If the adhesive layer is formed on the entire surface of the conductive circuit side, the carrier film on the transfer sheet cannot be peeled off or removed. Therefore, it is necessary to form a highly accurate adhesive layer by a method of overprinting on the conductive circuit, and there is a problem that the adhesive layer forming process is complicated.

In view of the present situation, the present invention is a case where the adhesive layer is provided over the entire surface of the conductive circuit side without taking the step of forming the adhesive layer for overprinting on the conductive circuit. Even if the carrier film on the transfer sheet can be appropriately peeled and removed, and an adhesive layer having solderability is formed between the carrier film and the injection-molded body serving as the base resin. A circuit transfer sheet and a method for manufacturing the same are provided.

Further, according to the present invention, in particular, by using a polyphenylene sulfide resin as a base resin for injection molding, both of the injection molded article and the adhesive layer between the injection molded article and the injection molded article have sufficient solderability. Provided is a printed wiring body having heat resistance and adaptable to mounting of an IC chip or the like, and a manufacturing method thereof.

[0013]

According to the first aspect of the present invention, as an adhesive layer in a conductive circuit transfer sheet, an epoxy resin or a phenol resin formed on the entire surface on the conductive circuit side is used. By using a coating layer of up to 5.0 g (dry) / m ² , the above-mentioned various problems are solved. A plastic carrier film and a release agent layer for the carrier film are used. From a conductive circuit transfer sheet comprising a conductive circuit formed by a metal foil laminated via an adhesive layer, and an adhesive layer formed on the entire surface of the circuit side so as to cover the conductive circuit. Become.

According to the second aspect of the present invention, the adhesive layer in the conductive circuit transfer sheet is made of an epoxy resin or a phenol resin formed so as to cover only the metal foil forming the conductive circuit. 1 ~ 5.0g (dry)
The above-mentioned various problems are solved by utilizing a coating layer of / m ² and a plastic carrier film and a metal foil laminated on the carrier film via a release agent layer. And an adhesive layer formed so as to cover only the metal foil forming the conductive circuit, and the conductive circuit transfer sheet.

The method for producing a conductive circuit transfer sheet according to the third aspect of the present invention comprises a step of heating and pressure-bonding a metal foil on a plastic carrier film via a release agent layer, and a conductive circuit by etching. And a step of forming the conductive circuit so that the entire surface of the conductive circuit side is covered with an epoxy resin or a phenol resin in an amount of 0.1 to 0.1%.
By the process of forming an adhesive layer of 5.0 g (dry) / m ² ,
It consists of obtaining the target conductive circuit transfer sheet.

According to the fourth aspect of the present invention, a conductive circuit transfer sheet is manufactured by heating and pressing a metal foil on a plastic carrier film via a release agent layer, and then applying epoxy to the entire surface of the metal foil. With a resin or phenolic resin.
By forming an adhesive layer of 1 to 5.0 g (dry) / m ² or by coating with an adhesive layer of 0.1 to 5.0 g (dry) / m ² of epoxy resin or phenol resin By heating and pressing the metal foil on the plastic carrier film via the release agent layer, a laminate comprising the plastic carrier film / release agent layer / metal foil / adhesive layer is obtained. By the steps and the subsequent step of forming a conductive circuit by etching, a target conductive circuit transfer sheet is obtained.

The printed wiring body of the fifth invention is a polyphenylene sulfide resin injection-molded article having a conductive circuit formed by the transfer layer in the conductive circuit transfer sheet of the first or second invention. Consists of
The peel strength (JIS-K 6481) between the injection molded body of polyphenylene sulfide resin and the metal foil forming the conductive circuit is set to 1.0 Kgf / 25 mm or more.

A sixth aspect of the present invention is to provide the conductive circuit transfer sheet according to the first or second aspect of the invention in a cavity of a mold for injection molding, and a plastic carrier film for the transfer sheet. A polyphenylene sulfide resin injection-molded body in which a conductive circuit transfer sheet is laminated is obtained by the step of setting so that the surface contacts the surface of the cavity and the step of injection-molding the polyphenylene sulfide resin. After that, the plastic carrier film and the release agent layer in the conductive circuit transfer sheet are peeled and removed from the injection molded body, and further, the conductive circuit and injection are performed by post-heating treatment at a temperature of 100 ° C. or higher. Completely cure the epoxy resin or phenol resin that forms the adhesive layer between the molded body and obtain the desired printed wiring body. Ranaru.

The carrier film in the conductive circuit transfer sheets of the first and second inventions having the above-mentioned construction includes, for example, polyester, polyimide, polyamide,
A plastic film made of a fluorine-based resin, a cellulose-based resin, or the like, and a plastic sheet obtained by processing fibers made of these resins into a sheet are used.

The release agent layer formed on the carrier film has adhesion to the conductive circuit formed by the metal foil formed on the release agent layer, and can be easily formed together with the carrier film. A property capable of peeling, that is, a property having both thermocompression bonding property and re-peeling property, for example,
It is formed of a mixture of an adhesive such as polyvinyl formal and silicone, or a mixture of an epoxy resin and silicone. The release agent layer can be easily formed by coating the release agent composition on the carrier film with a roll coater or the like and drying.

The conductive circuit made of a metal foil is a metal foil laminated on the release agent layer, which is made into a circuit by etching, and for example, a metal foil made of copper, nickel, aluminum or the like is used. ..

The adhesive layer in the conductive circuit transfer sheet is an adhesive obtained by diluting a resin component made of an epoxy resin or a phenol resin and a curing agent with a solvent such as acetone, methyl ethyl ketone, toluene, cellosolve to about 1 to 5% by weight. The agent composition is applied by a roll coating method or a spray coating method, dried, and the like.

In the adhesive layer made of epoxy resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, cycloaliphatic epoxy is used as an epoxy resin component. Resins, glycidyl ester type epoxy resins and their bromides are also used as curing agents, for example, aliphatic diamines such as ethylenediamine and hexamethylenediamine, aromatic amines such as diphenyldiaminomethane, amines such as dicyandiamide and polyaminoamide. -Based curing agents, acid anhydride-based curing agents such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, and the like, and 2-ethyl-4-
Methylimidazole is utilized. The ratio of the epoxy resin and the curing agent in the adhesive composition may be the same as in a normal adhesive composition using an epoxy resin. Further, in the adhesive layer, if necessary, for example, a solvent, a drier, a wetting agent, a thickener, a gelling agent, a thixotropy imparting agent, and the like,
It may be added within a range that does not impair the heat resistance and adhesive strength of the adhesive layer.

Resol type phenolic resin and novolac type phenolic resin are used for the adhesive layer made of phenolic resin, and the ratio of novolac type phenolic resin to hexamethyltetramine, which is a curing agent for the resin, is the same as that of phenolic resin. It may be the same as the adhesive composition.
Further, if necessary, a solvent, a drier, a wetting agent, a thickener, a gelling agent, a thixotropy imparting agent, etc. may be added within a range that does not impair the heat resistance and adhesive strength of the adhesive layer, This is similar to the case of the adhesive layer made of epoxy resin.

When the coating amount of the adhesive layer made of epoxy resin or phenol resin is less than 0.1 g (dry) / m ² ,
The resulting adhesive strength between the metal foil forming the conductive circuit of the printed wiring body and the injection molded body forming the resin substrate becomes insufficient. Further, when the coating amount of the adhesive layer exceeds 5.0 g (dry) / m ² , in the case of the conductive circuit transfer sheet of the first aspect of the invention, the peeling / removing performance of the carrier film is not sufficient. In the case of the conductive circuit transfer sheet of the second invention, etching spots are likely to occur in the etching step when the conductive circuit transfer sheet is manufactured by the method of the fourth invention. ..

In the step of forming a conductive circuit by etching in the third aspect of the present invention, electrolytic copper foil for printed wiring material, rolled copper foil, aluminum foil for shielding, other metal foil, etc. are placed on the release agent layer. After crimping to the metal foil surface,
A circuit pattern made of an etching resist is formed by screen printing or the like, and further, an etching solution such as ferric chloride is sprayed to remove the metal foil except for the conductive circuit pattern, and then the etching resist is peeled off. Consists of steps.

The step of forming a conductive circuit by etching in the fourth aspect of the present invention is performed by using an adhesive layer made of a coating layer of 0.1 to 5.0 g (dry) / m ² made of an epoxy resin or a phenol resin. Form a circuit pattern with etching resist on the top by screen printing etc.,
By spraying an etchant such as ferric chloride, the metal foil of the portion other than the conductive circuit pattern and 0.1 to 5.0 g of the epoxy resin or phenol resin formed on the metal foil of the portion (dry) / m ² adhesive layer is removed, and then the etching resist is peeled off.

In the fourth aspect of the invention, the application of the etching solution in the etching step etches the metal foil in the portion not covered with the etching resist, and at the same time peels and removes the adhesive layer in the portion. However, this is because the adhesive layer consists of a very small coating layer of 0.1 to 5.0 g (dry) / m ² made of epoxy resin or phenol resin, and it has good permeability of etching solution. It depends.

The printed wiring body of the fifth aspect of the present invention is specifically a printed wiring body obtained by the production method of the sixth aspect of the present invention. Polyphenylene sulfide is used alone or as a base resin for injection molding. A material in which a filler such as glass fiber is mixed is used.

In the sixth aspect of the present invention, after the carrier film and the release agent layer are peeled and removed from the injection molded body on which the conductive circuit transfer sheet is laminated, the injection molded body is further subjected to 10 minutes to 10 hours. The post heat treatment is to completely cure the epoxy resin or phenol resin that forms the adhesive layer between the conductive circuit and the injection molded body. Properties and adhesive strength are then imparted by heat treatment. When the post heat treatment is performed at a heating temperature of less than 100 ° C., the effect is not remarkable, and usually the post heat treatment of 120 to 160 ° C. for several tens of minutes is preferable.

[0031]

In the conductive circuit transfer sheet according to the first or second aspect of the invention, the adhesive layer in the transfer sheet is formed of a coating layer of epoxy resin or phenol resin, and is cured by heating. As a result, a three-dimensional cross-linked structure is obtained, so that post-heat treatment provides both excellent heat resistance and adhesive strength.

In the conductive circuit transfer sheet according to the first aspect of the present invention, the adhesive layer is formed on the entire surface of the conductive circuit side including the portion where the metal foil does not exist, but the carrier is formed. The film and the release agent layer are provided with easy peelability, but this is because the adhesive layer is extremely thin.
This is because good adhesion between the base resin and the release agent layer is hindered.

In the method for manufacturing a conductive circuit transfer sheet according to the third and fourth aspects of the present invention, it is not necessary to accurately apply the adhesive layer onto the metal foil forming the conductive circuit by overprinting. Since the adhesive layer is formed on the entire surface to be coated, it can be formed by a simple coating method such as a roller coating method or a spray coating method, so that the manufacturing process is simple and A homogeneous conductive circuit transfer sheet is obtained.

In the case of the conventional adhesive layer formed by overprinting, defective peeling of the carrier film occurs due to deterioration of accuracy, and the adhesive layer is formed in an arc shape having a rounded top surface. Therefore, the thickness of the adhesive layer becomes uneven between the side end portion and the central portion of the conductive circuit, and it is difficult to obtain a uniform conductive circuit transfer sheet. Further, the conductive circuit transfer sheet obtained by the method of the fourth aspect of the present invention has a uniform adhesive layer thickness and has no peeling defect of the carrier film, and has high quality characteristics.

The printed wiring body of the fifth invention is
An injection-molded body made of polyphenylene sulfide resin is provided on the surface thereof, and a conductive circuit is formed by the transfer layer of the conductive circuit transfer sheet according to the first invention or the second invention. The printed wiring body has an arbitrary contour shape including the three-dimensional shape of the injection molded body. Furthermore, both the injection molded body of the polyphenylene sulfide resin as the base resin and the adhesive layer of the metal foil forming the conductive circuit have extremely good heat resistance.

The method for manufacturing a printed wiring body according to the sixth aspect of the present invention uses the conductive circuit transfer sheet according to the first or second aspect of the present invention and a resin for injection molding of polyphenylene sulfide resin. After obtaining an injection-molded product of polyphenylene sulfide resin having a conductive circuit transfer sheet laminated on its surface, the plastic carrier film and the release agent layer in the conductive circuit transfer sheet are peeled from the injection-molded product. , And is further subjected to a post heat treatment at a temperature of 100 ° C. or higher. In this post heat treatment step, the epoxy resin or the phenol resin forming the adhesive layer is completely cured. Therefore, the heat resistance and the adhesive strength of the adhesive layer are remarkably improved, and the printed wiring body of the fifth invention can be easily and surely manufactured.

[0037]

EXAMPLES The concrete constitution of each invention will be described below based on examples.

Example 1 A carrier film made of a polyimide film having a thickness of 50 μ was coated on one surface with a mixture of an epoxy resin, polyvinyl formal, an amine-based curing agent and silicone by a roll coater, and dried to 20 g / m ² . After forming the release agent layer, an electrolytic copper foil having a thickness of 35 μm is pressed against the surface of the release agent layer with a heat press roll so that the roughened surface of the copper foil faces the front side, to form a laminated sheet. Manufactured.

Next, after degreasing the surface of the copper foil of the laminated sheet with isopropyl alcohol, a 3 wt% acetone solution of a mixture having the composition [A] shown below was applied to the entire surface with a roll coater. 1.0g (dry) /
The adhesive layer was formed by coating at a ratio of m ² and drying.

Composition [A] Bisphenol A type epoxy resin [Shell Co., Ltd .: Epicoat 1001] ... 88.00 parts by weight Novolak type epoxy resin [Shell Co., Ltd .: A-154] ...・ ・ ・ ・ ・ ・ ・ ・ ・ 10.00 parts by weight Dicyandiamide ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 1. 75 parts by weight 2-ethyl-4-methylimidazole ・ ・ ・ ・ ・ ・ ・ ・ 0.25 parts by weight

Subsequently, a circuit pattern made of an etching resist is screen-printed on the adhesive layer, and spray etching is performed with a ferric chloride solution. Thereafter, the etching resist is peeled off by a conventional method. Thus, a conductive circuit transfer sheet (1) having a conductive circuit made of copper foil was obtained.

In the obtained conductive circuit transfer sheet (1), no etching residual copper due to the adhesive layer of epoxy resin was observed.

Example 2 The conductive circuit transfer sheet (1) obtained in Example 1 was placed in a mold for injection molding with a movable die and a fixed die, and the carrier film in the transfer sheet (1) was used. Set so that the surface is in contact with the surface of the cavity, clamp the mold, and then subject the polyphenylene sulfide resin [Toray Industries, Inc .: Torelina A504] to injection molding,
Sheet for conductive circuit transfer at the same time as molding of polyphenylene sulfide resin that forms the substrate of the printed wiring body
The conductive circuit in (1) was transferred.

Further, the injection molded body is taken out from the mold,
After peeling the carrier film and the release agent layer in the transfer sheet (1), the epoxy resin in the adhesive layer is completely cured by post-heating treatment at 160 ° C. for 60 minutes, so that the length is 15 cm in the horizontal direction. A printed wiring body having a boat shape of 10 cm and a depth of 3 cm, that is, a printed wiring body (A) made of an injection-molded body of polyphenylene sulfide resin in which a conductive circuit is attached to the inner wall surface of the boat frame is obtained. ..

The injection molding conditions for the polyphenylene sulfide resin in this example are the cylinder temperature ...
300 to 340 ° C., injection pressure ···· 1000Kgf / cm ^2, mold temperature ..
.. It is 150 ℃.

Example 3 In the manufacturing process of the conductive circuit transfer sheet (1) of Example 1, instead of the 3 wt% acetone solution of the mixture of the composition [A], a resole type phenol resin [Dainippon Ink Chemical Industry Co., Ltd .: Priorofen 5030-
Conductive circuit transfer sheet (2) according to the same procedure as the corresponding procedure in Example 1 except that the adhesive layer is formed using a 3 wt% acetone solution of 40 K].
Got

Example 4 Except that the conductive circuit transfer sheet (2) obtained in Example 3 is used in place of the conductive circuit transfer sheet (1) in the process for producing a printed wiring body according to Example 2. According to the same procedure as the corresponding procedure in Example 2 above,
A printed wiring body (B) made of an injection-molded body of polyphenylene sulfide resin in which a conductive circuit was attached to the inner wall surface of a boat-shaped frame was obtained.

Comparative Example 1 In the manufacturing process of the conductive circuit transfer sheet (1) of Example 1, a mixture of the composition [A] was used instead of the 3 wt% acetone solution of the mixture of the composition [A]. A 0.5 wt% acetone solution was used, which was
A conductive circuit transfer sheet for comparison according to the same procedure as the corresponding procedure in Example 1 except that the adhesive layer is formed by coating and drying at a ratio of g (dry) / m ^2.
I got (3).

Comparative Example 2 In the manufacturing process of the conductive circuit transfer sheet (1) of Example 1, a copper foil is pressure-bonded by a heat pressure roll to manufacture a laminated sheet, and then the copper foil surface of the laminated sheet is etched. A conductive circuit is formed by treatment, and further 30 g (dry) / by screen printing with a polyvinyl formal resin [Denka Formal # 30] on the surface of the copper foil forming the conductive circuit. By forming an m ² adhesive layer, a conductive circuit transfer sheet (4) for comparison was obtained.

Comparative Example 3 In the manufacturing process of the printed wiring body according to Example 2, the molded injection molded body was taken out from the mold, and the carrier film and the release agent layer in the transfer sheet (1) were peeled off. A printed wiring body (C) was obtained according to the same procedure as the corresponding procedure in Example 2 except that the subsequent post-heating treatment was performed at 90 ° C. for 60 minutes.

Comparative Example 4 Except that the conductive circuit transfer sheet (3) obtained in Comparative Example 1 was used in place of the conductive circuit transfer sheet (1) in the manufacturing process of the printed wiring body according to Example 2. According to the same procedure as the corresponding procedure in Example 2 above,
A printed wiring body (D) was obtained.

Comparative Example 5 Except that the conductive circuit transfer sheet (4) obtained in Comparative Example 2 is used in place of the conductive circuit transfer sheet (1) in the manufacturing process of the printed wiring body according to Example 2. According to the same procedure as the corresponding procedure in Example 2 above,
A printed wiring body (E) was obtained.

[Experiment] Examples 2, 4 and Comparative Examples 3 to
For each printed wiring board obtained in 5, peel strength of copper foil (JIS-K 6481) and solder heat resistance (JIS-K 6481)
And the results of the thermal shock test are shown in [Table 1].

In the thermal shock test, the following steps (1) to (4) were sequentially performed as one cycle, and the state of the sample after 1000 cycles was described.

One cycle of thermal shock test (1) Hold the sample at -50 ° C for 30 minutes, (2) Heat the sample and raise it to 150 ° C in about 5 minutes, (3) Sample to 150 ° C Hold for 30 minutes, (4) Cool the sample to about 5
The temperature is lowered to −50 ° C. in minutes.

[0056]

[Table 1]

[0057]

As is apparent from the above description of the embodiments, a printed wiring body obtained by using the conductive circuit transfer sheet of the first and second inventions is a substrate of the wiring body. The adhesiveness between the resin molded body that forms the substrate and the conductive circuit is extremely good, and the adhesive layer that remains adhered to the resin molded body that forms the substrate of the printed wiring body has excellent heat resistance. In addition, it is possible to form a printed wiring body of any shape.

Further, in the method for manufacturing the conductive circuit transfer sheet of the third and fourth inventions, the adhesive layer is formed by coating the entire surface, which does not require complicated labor.
A homogeneous conductive circuit transfer sheet is obtained.

In the printed wiring body of the fifth aspect of the present invention, the resin molded body forming the substrate of the printed wiring body is made of polyphenylene sulfide resin, and the resin molded body forming the conductive circuit and the substrate of the printed wiring body is Since the adhesion between the two is achieved by the adhesive function of thermosetting resin, the adhesive strength of the conductive circuit is high and it has excellent solder heat resistance, and it is possible to mount IC chips etc. In addition, the shape is not limited to the flat plate shape, and the printed wiring body has a non-planar three-dimensional shape, and has an excellent effect in practical value.

The method for producing a printed wiring body according to the sixth aspect of the present invention uses the conventional technique of injection molding of a thermoplastic resin as it is, and the print having the characteristics of the fifth aspect of the present invention having excellent practical value. The wiring body can be mass-produced.

In the method for manufacturing a printed wiring body according to the sixth aspect of the present invention, it is possible to manufacture a wiring body in which a conductive circuit is formed on a molded body having a shape such as a device frame.
Since the molded body composed of the combination of the device frame and the printed wiring body can be obtained only by the conventional manufacturing process of the device frame, the cost can be reduced due to the simplification of the manufacturing process.

Claims (6)

[Claims] 1. A carrier film made of plastic, a conductive circuit formed of a metal foil laminated on the carrier film via a release agent layer, and the circuit side so as to cover the conductive circuit. And an adhesive layer agent formed on the entire surface of the adhesive layer, wherein the adhesive layer is 0.1 to 5.0 g of an epoxy resin or a phenol resin.
A conductive circuit transfer sheet comprising a coating layer of (dry) / m ² . 2. A carrier film made of plastic, a conductive circuit formed of a metal foil laminated on the carrier film via a release agent layer, and a metal foil forming the conductive circuit. And an adhesive layer formed so as to cover the adhesive layer, wherein the adhesive layer is made of an epoxy resin or a phenol resin in an amount of 0.1 to 5.0.
A conductive circuit transfer sheet comprising a coating layer of g (dry) / m ² . 3. A metal foil is heated and pressure-bonded on a plastic carrier film via a release agent layer, a conductive circuit is formed by etching, and the conductive circuit is further covered. 0.1-5 by epoxy resin or phenol resin on the entire surface of the conductive circuit side.
A method for producing a conductive circuit transfer sheet, which comprises forming an adhesive layer of 0 g (dry) / m ² . 4. A metal foil is heated and pressure-bonded on a plastic carrier film via a release agent layer, and then 0.1 to 5.0 g (dry) of epoxy resin or phenol resin is applied to the entire surface of the metal foil. Adhesion of 0.1 to 5.0 g (dry) / m ² with epoxy resin or phenol resin by forming an adhesive layer of / m ² or via a release agent layer on a plastic carrier film The metal foil covered with the agent layer is heated or pressure-bonded to form a release agent layer / metal foil / adhesive layer, and then a conductive circuit is formed by etching. A method for manufacturing a conductive circuit transfer sheet. 5. A printed wiring body made of an integrally molded body in which the conductive circuit is transferred at the same time as the injection molding of the polyphenylene sulfide resin, and the conductive circuit in the printed wiring body is the conductive circuit. The peel strength between the injection molded body of the polyphenylene sulfide resin and the metal foil forming the conductive circuit (JIS-
K 6481) is 1.0 Kgf / 25 mm or more, a printed wiring body. 6. The conductive circuit transfer sheet according to claim 1 or 2 in the cavity of a mold for injection molding, and the plastic carrier film surface of the transfer sheet is the surface of the cavity. And a polyphenylene sulfide resin are injection-molded to form a polyphenylene sulfide resin injection-molded product having a conductive circuit transfer sheet laminated thereon, and then the injection-molded product The carrier film made of plastic and the release agent layer in the conductive circuit transfer sheet are peeled and removed from the
A method for producing a printed wiring body, characterized in that the epoxy resin or the phenol resin forming the adhesive layer between the conductive circuit and the injection molded body is completely cured by performing a post heat treatment at a temperature of ℃ or higher. ..