CN113395844B - 12oz glue filling process for PCB - Google Patents
12oz glue filling process for PCB Download PDFInfo
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- CN113395844B CN113395844B CN202110643203.2A CN202110643203A CN113395844B CN 113395844 B CN113395844 B CN 113395844B CN 202110643203 A CN202110643203 A CN 202110643203A CN 113395844 B CN113395844 B CN 113395844B
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- glue
- pcb
- layer plate
- copper foil
- resin mixture
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a 12oz glue filling process of a PCB (printed circuit board), which comprises the steps of forming tapered glue flowing cavities on the peripheries of two surfaces of an inner layer board of the PCB, arranging a plurality of flow guide strips with the interval smaller than 0.2mm in the glue flowing cavities, and forming glue outlets from the tapered tip parts of the glue flowing cavities to the outer side of the inner layer board of the PCB; copper foils are superposed on the upper surface and the lower surface of the PCB inner layer board, and glue injection holes are formed in the conical bottoms of the copper foils corresponding to the glue flowing cavities; and selecting four glue injection machines to connect the glue injection ports. Placing a heater below the PCB inner-layer plate and the copper foil, increasing the temperature of the PCB inner-layer plate and the copper foil through the heater, injecting a resin mixture into the glue flowing cavity through the glue injection hole, and reducing the temperature of the heater after the glue injection amount exceeds 95% of a calibration value so as to gradually reduce the temperature of the PCB inner-layer plate and the copper foil; when the resin mixture overflows from the glue outlet, liquid nitrogen is sprayed to the PCB inner-layer plate and the copper foil, the PCB inner-layer plate and the copper foil are rapidly cooled, and glue is injected until the glue outlet stops overflowing; and removing the overflowing resin mixture on the side surface of the PCB inner layer plate.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a 12oz glue filling process of a PCB.
Background
In recent years, with the development of wireless communication, optical fiber communication, high-performance electronic computers, and high-speed data network products, the trend is inevitable for the information processing to be faster, the wireless analog front end to be modular, and the development of high-frequency and high-speed PCBs and antenna rf PCB products. PCB board pressfitting joint filler is not enough takes place occasionally at the pressfitting processing procedure, along with the rapid development of modern electronic product, and partial multiply wood product design is comparatively special, and the same region of the different levels of inlayer all does not have the copper design, and this brings and big difficulty for PCB board factory pressfitting processing procedure, and the filler is not enough all appearing after this product pressfitting, and the section discovery is exploded the board layering because of filling up the production inadequately after the thermal stress experiment, leads to the unable shipment of product.
Disclosure of Invention
The invention aims to provide a 12oz glue filling process of a PCB.
In order to achieve the above object, the present invention employs the following:
a12 oz glue filling process of a PCB comprises the following steps:
the first step is as follows: arranging tapered glue flowing cavities on the peripheries of two surfaces of the PCB inner layer board, and arranging a plurality of guide strips with intervals smaller than 0.2mm in the glue flowing cavities to enable the guide strips to be arranged in a fish scale shape; a glue outlet is formed in the conical tip of the glue flowing cavity towards the outer side of the PCB inner-layer plate;
the second step is that: copper foils are superposed on the upper surface and the lower surface of the PCB inner layer board, and glue injection holes are formed in the conical bottoms of the copper foils corresponding to the glue flowing cavities; selecting four glue injection machines to be connected with the glue injection ports;
the third step: placing a heater below the PCB inner-layer plate and the copper foil, increasing the temperature of the PCB inner-layer plate and the copper foil through the heater, and injecting a resin mixture into the glue flowing cavity through the glue injection hole; the resin mixture comprises the following components: 60-65 parts of vinyl-terminated silicone oil, 20-25 parts of epoxy resin, 5-10 parts of liquid methylhexahydrophthalic anhydride and liquid methyltetrahydrophthalic anhydride, 15-20 parts of aluminum oxide, 1-2 parts of methacryloxypropyltrimethoxysilane and 1-2 parts of a platinum catalyst;
the fourth step: when the glue injection amount exceeds 95% of a calibration value, the temperature of the heater is reduced, so that the temperature of the inner layer plate and the copper foil of the PCB is gradually reduced;
the fifth step: when the resin mixture overflows from the glue outlet, liquid nitrogen is sprayed to the PCB inner-layer plate and the copper foil, the PCB inner-layer plate and the copper foil are rapidly cooled, and glue is injected until the glue outlet stops overflowing;
and a sixth step: and removing the overflowing resin mixture on the side surface of the PCB inner layer plate.
Preferably, the number of the flow guide strips in the glue flowing cavity is sequentially reduced in an arithmetic progression, and the number of the flow guide strips at two ends is respectively ten and five.
Preferably, the copper foil and the PCB inner layer board are sandwiched and stacked by a jig.
Preferably, the heating temperature in the third step is 250 ℃ to 400 ℃.
Preferably, the vinyl-terminated silicone oil of the resin mixture is mixed with the epoxy resin to prepare a base rubber, liquid methylhexahydrophthalic anhydride and liquid methyltetrahydrophthalic anhydride are used as cross-linking agents, aluminum oxide is used as a heat-conducting filler, methacryloxypropyltrimethoxysilane is used as a coupling agent, and a platinum catalyst is used as a catalyst.
Preferably, the temperature in the fourth step is reduced from 150 ℃ to 200 ℃ to 50 ℃ to 70 ℃ within 1 minute.
Preferably, the injection direction of the liquid nitrogen in the fifth step is from the tapered tip of the gummosis chamber toward the other end.
The invention has the following advantages:
1. through design flow gluey chamber and guide plate, make resin mixture can cover the clearance between the guide plate, resin mixture's surface tension is less, can not produce the phenomenon of scarce glue because the injecting glue is too fast.
2. The purpose of controlling the flowing speed of the resin mixture is achieved through the temperature difference before and after glue injection, and the phenomenon that the sealing position is lack of glue due to the difference of the flow speed of injection and overflow in the later stage of glue injection is avoided.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic view showing the structure of an inner layer board and upper and lower copper foils of a PCB of the present invention.
Fig. 2 is a schematic structural view of one corner of an inner board of a PCB according to the present invention.
In the figures, the various reference numbers are:
1-glue flowing cavity, 2-flow guide strip, 3-glue outlet and 4-copper foil.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below in connection with preferred embodiments. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
As shown in fig. 1, a 12oz underfill process for a PCB board includes the following steps:
the first step is as follows: arranging conical glue flowing cavities 1 on the peripheries of two surfaces of a PCB inner layer board, and arranging a plurality of guide strips 2 with intervals smaller than 0.2mm in the glue flowing cavities 1 to enable the guide strips 2 to be arranged in a fish scale shape; a glue outlet 3 is formed in the conical tip part of the glue flowing cavity 1 towards the outer side of the PCB inner-layer plate; the number of the diversion strips 2 in the glue flowing cavity 1 is reduced in an arithmetic progression, and the number of the diversion strips at two ends is respectively ten and five.
The tension of the resin mixture is utilized at the interval of 0.2mm, the adhesion force of the resin mixture in the casting cavity is greatly improved, and meanwhile, the fine interval can avoid generating bubbles when the resin mixture flows in. According to the conical glue flowing cavity designed in the invention, in the process of gradually filling glue, the injection flow rate of the resin mixture is greater than the outflow flow rate of the glue outlet, the resin mixture is gradually accumulated at the tip part of the glue flowing cavity, and then the whole glue flowing cavity is slowly filled. The design of water conservancy diversion strip can discharge the bubble between two arbitrary water conservancy diversion strips fast to resin mixture's concentration degree, curing speed has reduced the requirement, and this design can be applicable to more extensive PCB processing promptly.
The second step is that: copper foils 4 are superposed on the upper surface and the lower surface of the PCB inner layer board, and glue injection holes are formed in the conical bottoms of the copper foils 4 corresponding to the glue flowing cavities; and selecting four glue injection machines to connect the glue injection ports. The copper foil and the PCB inner layer plate are clamped and overlapped through a clamp.
The third step: placing a heater below the PCB inner-layer plate and the copper foil, increasing the temperature of the PCB inner-layer plate and the copper foil through the heater, and injecting a resin mixture into the glue flowing cavity through the glue injection hole; the resin mixture comprises the following components: 60-65 parts of vinyl-terminated silicone oil, 20-25 parts of epoxy resin, 5-10 parts of liquid methylhexahydrophthalic anhydride and liquid methyltetrahydrophthalic anhydride, 15-20 parts of aluminum oxide, 1-2 parts of methacryloxypropyltrimethoxysilane and 1-2 parts of a platinum catalyst. The heating temperature in the third step is 150-200 ℃.
The vinyl-terminated silicone oil and the epoxy resin of the resin mixture are mixed to prepare base glue, liquid methylhexahydrophthalic anhydride and liquid methyltetrahydrophthalic anhydride are used as cross-linking agents, aluminum oxide is used as heat-conducting filler, methacryloxypropyltrimethoxysilane is used as a coupling agent, and a platinum catalyst is used as a catalyst.
The resin mixture which usually takes the vinyl-terminated silicone oil as the base adhesive often shows the characteristics of viscosity, strong adhesive force and poor fluidity, and the resin mixture which takes the epoxy resin as the base adhesive shows the characteristics of good fluidity, poor adhesive force, long curing time and the like. The resin mixture with moderate curing speed, strong adhesive force and moderate fluidity is prepared by mixing the vinyl-terminated silicone oil and the epoxy resin according to the proportion, and the filling effect is ensured by matching the design of the glue flowing cavity.
Resin mixture in this application joins in marriage and glues thick type liquid for the dark brown, keeps flowing gluey intracavity dry clean and tidy, when waiting to the temperature of PCB inner plating and being close to heating temperature, begins the injecting glue. The resin mixture is gradually filled, and particularly, after the first glue injection is finished, the second compensatory glue injection can be carried out if necessary.
The fourth step: when the glue injection amount exceeds 95% of a calibration value, the temperature of the heater is reduced, so that the temperature of the inner layer plate and the copper foil of the PCB is gradually reduced; the temperature is reduced from 150 ℃ to 200 ℃ to 50 ℃ to 70 ℃ within 1 minute. As the temperature is lowered, the resin mixture gradually cures.
The fifth step: when the resin mixture overflows from the glue outlet, liquid nitrogen is sprayed to the PCB inner-layer plate and the copper foil, the PCB inner-layer plate and the copper foil are rapidly cooled, and glue is injected until the glue outlet stops overflowing; the injection direction of the liquid nitrogen is from the conical tip of the gummosis cavity to the other end. The cooling end is directly and rapidly cooled to accelerate solidification, and cavity formation caused by temperature difference is reduced.
And a sixth step: and removing the overflowing resin mixture on the side surface of the PCB inner layer plate. Scraping with a scraper.
Generally, air bubbles are brought in the glue mixing process or the glue filling process, air is easily brought into the glue solution due to high viscosity of the resin mixture or the stirring mode, and the air bubbles are difficult to eliminate if the glue solution has high viscosity. If the viscosity of the glue solution is low, and the resin mixture is solidified slowly, the air bubbles float slowly to the surface and are automatically eliminated. In order to eliminate bubbles in the processes of adjustment and glue filling, the bubbles can be eliminated by adopting modes of vacuumizing, heating to reduce viscosity, adding a diluent to reduce viscosity or adding a defoaming agent, and the like.
Secondly, bubbles generated in the curing process. There are several reasons for the generation of bubbles during curing: too fast curing speed, high heat release temperature, large curing shrinkage of the resin mixture, and excessive addition of solvent and plasticizer in the resin mixture are all easy to generate bubbles in the curing process. The technical purpose of steps four and five is to solve the above problems.
Organic silicon pouring sealant: it is suitable for encapsulating various electronic components working in severe environment. The anti-aging performance is strong, the weather resistance is good, and the impact resistance is excellent; the curing agent has no corrosion to electronic components and does not generate any by-product in the curing reaction; can be cured at room temperature or heated, has good self-defoaming property and is more convenient to use; the curing shrinkage is small, and the waterproof performance and the shock resistance are excellent. The rubber has excellent cold and heat change resistance, can be used in a wide working temperature range, can keep elasticity in a temperature range of-60-200 ℃, and does not crack; the potting material has excellent electrical performance and insulating capability, effectively improves the insulation between internal elements and circuits after potting, and improves the use stability of electronic components; the heat-conducting material has excellent heat-conducting property and flame-retardant capability, and effectively improves the heat-radiating capability and safety coefficient of electronic components; the adhesive has low viscosity and good fluidity, and can penetrate into fine gaps and the lower surfaces of components.
Epoxy resin pouring sealant: the method is suitable for encapsulating electronic components which have no special requirements on environmental mechanical properties at normal temperature. The high-temperature-resistant and high-insulation-performance composite material has excellent high-temperature resistance and electrical insulation capacity, is simple to operate, is very stable before and after curing, and has excellent adhesive force to various metal substrates and porous substrates.
The disadvantages are as follows: the cold and heat change resistance is weak, and cracks are easily generated after cold and heat impact, so that water vapor permeates into electronic components from the cracks, and the moisture resistance is poor. And the solidified colloid has higher hardness and is brittle, and electronic components are easy to be scratched.
Polyurethane pouring sealant: is suitable for encapsulating indoor electrical elements with low calorific value. The temperature is required to be not more than 100 ℃, bubbles are more generated after encapsulation, the adhesion is between epoxy and organic silicon under the encapsulation condition in vacuum. The low temperature property is excellent, and the shock resistance is the best of the three.
The disadvantages are as follows: the high temperature resistance is poor, the surface of the cured colloid is not smooth and poor in toughness, the ageing resistance and the shock resistance ultraviolet rays are weak, and the colloid is easy to discolor.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (7)
1. A12 oz glue filling process of a PCB is characterized by comprising the following steps:
the first step is as follows: arranging tapered glue flowing cavities (1) on the peripheries of two surfaces of the PCB inner-layer plate along the cross section direction, and arranging a plurality of guide strips (2) with intervals smaller than 0.2mm in the glue flowing cavities (1) to enable the guide strips (2) to be arranged in a fish scale shape; a glue outlet (3) is formed in the conical tip part of the glue flowing cavity (1) towards the outer side of the PCB inner-layer plate;
the second step is that: copper foils (4) are superposed on the upper surface and the lower surface of the PCB inner layer board, and glue injection holes are formed in the conical bottoms of the copper foils (4) corresponding to the glue flowing cavities; selecting four glue injection machines to be connected with the glue injection ports;
the third step: placing a heater below the PCB inner-layer plate and the copper foil, increasing the temperature of the PCB inner-layer plate and the copper foil through the heater, and injecting a resin mixture into the glue flowing cavity through the glue injection hole; the resin mixture comprises the following components in parts by mass: 60-65 parts of vinyl-terminated silicone oil, 20-25 parts of epoxy resin, 5-10 parts of liquid methylhexahydrophthalic anhydride and liquid methyltetrahydrophthalic anhydride, 15-20 parts of aluminum oxide, 1-2 parts of methacryloxypropyltrimethoxysilane and 1-2 parts of a platinum catalyst;
the fourth step: when the glue injection amount exceeds 95% of a calibration value, the temperature of the heater is reduced, so that the temperature of the inner layer plate and the copper foil of the PCB is gradually reduced;
the fifth step: when the resin mixture overflows from the glue outlet, liquid nitrogen is sprayed to the PCB inner-layer plate and the copper foil, the PCB inner-layer plate and the copper foil are rapidly cooled, and glue is injected until the glue outlet stops overflowing;
and a sixth step: and removing the overflowing resin mixture on the side surface of the PCB inner layer plate.
2. The 12oz glue filling process of the PCB as recited in claim 1, wherein the number of the flow guide strips in the glue flow cavity is sequentially reduced in an arithmetic progression, and the number of the flow guide strips at two ends is ten and five respectively.
3. The 12oz underfill process for a PCB of claim 1, wherein the copper foil and the PCB inner layer board are clamped and stacked by a clamp.
4. A 12oz underfill process for PCB board as claimed in claim 1, wherein the heating temperature in the third step is 150-200 ℃.
5. The 12oz underfill process for PCB of claim 1, wherein the vinyl-terminated silicone oil of the resin mixture is mixed with epoxy resin to form a base adhesive, liquid methylhexahydrophthalic anhydride and liquid methyltetrahydrophthalic anhydride are used as cross-linking agents, aluminum oxide is used as heat conductive filler, methacryloxypropyltrimethoxysilane is used as coupling agent, and platinum catalyst is used as catalyst.
6. A 12oz underfill process for PCB board as claimed in claim 1, wherein the temperature in the fourth step is decreased from 150-200 ℃ to 50-70 ℃ within 1 minute.
7. The 12oz underfill process for a PCB according to claim 1, wherein the injection direction of the liquid nitrogen in the fifth step is from the tapered tip of the underfill chamber toward the other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110643203.2A CN113395844B (en) | 2021-06-09 | 2021-06-09 | 12oz glue filling process for PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110643203.2A CN113395844B (en) | 2021-06-09 | 2021-06-09 | 12oz glue filling process for PCB |
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| Publication Number | Publication Date |
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| CN113395844A CN113395844A (en) | 2021-09-14 |
| CN113395844B true CN113395844B (en) | 2022-02-08 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180397A (en) * | 2005-12-28 | 2007-07-12 | Sharp Corp | Printed wiring board and liquid crystal display apparatus |
| CN202425188U (en) * | 2011-11-15 | 2012-09-05 | 胜宏科技（惠州）股份有限公司 | PCB with rhombic meshy gummosis slots |
| WO2015010400A1 (en) * | 2013-07-24 | 2015-01-29 | 北大方正集团有限公司 | Sub-board of printed circuit board, manufacturing method for printed circuit board, and printed circuit board |
| CN108990257A (en) * | 2018-08-01 | 2018-12-11 | 深圳市景旺电子股份有限公司 | The production method of the reducing-flow structure and pcb board of pcb board |
| CN210469853U (en) * | 2019-07-09 | 2020-05-05 | 惠州市大亚湾科翔科技电路板有限公司 | High-density multilayer PCB technology edge choking block |
-
2021
- 2021-06-09 CN CN202110643203.2A patent/CN113395844B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180397A (en) * | 2005-12-28 | 2007-07-12 | Sharp Corp | Printed wiring board and liquid crystal display apparatus |
| CN202425188U (en) * | 2011-11-15 | 2012-09-05 | 胜宏科技（惠州）股份有限公司 | PCB with rhombic meshy gummosis slots |
| WO2015010400A1 (en) * | 2013-07-24 | 2015-01-29 | 北大方正集团有限公司 | Sub-board of printed circuit board, manufacturing method for printed circuit board, and printed circuit board |
| CN108990257A (en) * | 2018-08-01 | 2018-12-11 | 深圳市景旺电子股份有限公司 | The production method of the reducing-flow structure and pcb board of pcb board |
| CN210469853U (en) * | 2019-07-09 | 2020-05-05 | 惠州市大亚湾科翔科技电路板有限公司 | High-density multilayer PCB technology edge choking block |
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| CN113395844A (en) | 2021-09-14 |
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