CN210469853U

CN210469853U - High-density multilayer PCB technology edge choking block

Info

Publication number: CN210469853U
Application number: CN201921062328.0U
Authority: CN
Inventors: 曾祥福; 彭晓华; 何德海; 贺仁虎
Original assignee: HUIZHOU DAYA BAY MILLION SOURCES PCB CO LTD
Current assignee: HUIZHOU DAYA BAY MILLION SOURCES PCB CO LTD
Priority date: 2019-07-09
Filing date: 2019-07-09
Publication date: 2020-05-05
Anticipated expiration: 2029-07-09

Abstract

The utility model relates to a high density multilayer PCB technology limit spoiler sets up on PCB technology edge, including being used for preventing the three-layer spoiler that the resin flows, the three-layer spoiler basis is interior spoiler by nearly to far away in proper order with PCB inter-plate distance, well spoiler and outer spoiler, is provided with guiding gutter one between interior spoiler and the PCB inter-plate, is provided with guiding gutter two between well spoiler and the interior spoiler, is provided with guiding gutter three between outer spoiler and the well spoiler, guiding gutter one, guiding gutter two and guiding gutter three communicate each other. The utility model provides a high density multilayer PCB technology limit choking piece can play the effect that prevents resin loss and the unnecessary resin of discharge to the high density multiply wood, and the homogeneity of guaranteeing the board thickness is higher.

Description

High-density multilayer PCB technology edge choking block

Technical Field

The utility model relates to a PCB field especially is about a choking piece on high density multilayer PCB technology limit.

Background

The multilayer PCB is formed by bonding 1 or more PP between layers, the PP is in a semi-cured state before lamination, the components of the PP mainly comprise glass fiber cloth and epoxy resin, the resin is changed into a liquid state after the temperature reaches the melting point of the resin during lamination, and the resin flows to fill the blank positions between circuits on the inner core plate under certain pressure, and no cavity can be formed, so that the balance is kept.

In order to ensure full filling of glue in a PCB and uniform thickness of the PCB, the prior art designs the edges of the PCB to be copper-paved and designs a plurality of diversion trenches to play roles of preventing resin from losing and discharging redundant resin.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a solve above-mentioned technical problem, provide a high density multilayer PCB technology limit choking piece, can play the effect that prevents resin loss and discharge unnecessary resin to the high density multiply wood, guarantee that thick homogeneity is higher.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a high density multilayer PCB technology limit bluff block, sets up on PCB technology edge, including the three-layer choking layer that is used for preventing resin flow, the three-layer choking layer is interior choking layer, well choking layer and outer choking layer according to in proper order from near to far away with PCB board interval, be provided with guiding gutter one between interior choking layer and the PCB board, be provided with guiding gutter two between well choking layer and the interior choking layer, be provided with guiding gutter three between outer choking layer and the well choking layer, guiding gutter one, guiding gutter two and guiding gutter three communicate each other.

Preferably, the inner flow blocking layer comprises a plurality of inner flow blocking blocks and a first communication groove arranged between adjacent inner flow blocking blocks, and the first communication groove communicates the first flow guide groove with the second flow guide groove.

Preferably, the middle choke layer comprises a plurality of middle choke blocks and a second communication groove arranged between the adjacent middle choke blocks, and the second communication groove communicates the second guide groove with the third guide groove.

Preferably, the outer flow blocking layer comprises a plurality of outer flow blocking blocks and a third communicating groove arranged between the adjacent outer flow blocking blocks, and the third communicating groove communicates the third flow guiding groove with the outside.

Preferably, the upper surfaces of the inner flow blocking block, the middle flow blocking block and the outer flow blocking block are flush with the upper surface of the PCB, the first diversion groove, the second diversion groove, the third diversion groove, the first communication groove, the second communication groove and the third communication groove jointly form a diversion groove channel, and the height of the upper surface of the diversion groove channel is lower than that of the upper surface of the PCB.

Preferably, the inner, middle and outer baffles are each shaped as a parallelogram.

Preferably, the width of the flow guide groove channel is 1-3 mm.

Preferably, the length of the inner flow blocking block is 30-40mm, the width of the inner flow blocking block is 4-6mm, the length of the middle flow blocking block is 30-40mm, the width of the middle flow blocking block is 2-4mm, the length of the outer flow blocking block is 30-40mm, and the width of the technical edge is 12-16 mm.

Preferably, the minimum internal angle degree of the inner flow blocking block is 45 degrees, the minimum internal angle degree of the middle flow blocking block is 50 degrees, and the minimum internal angle degree of the outer flow blocking block is 45 degrees.

The utility model discloses compare in prior art's beneficial effect and be:

a group of flow blocking modules are designed on an inner bottom sheet of engineering materials, the flow blocking modules are distributed on four process edges and are specifically divided into an inner flow blocking layer, a middle flow blocking layer and an outer flow blocking layer, the resin flow is prevented by the three layers of the inner flow blocking layer, the inner flow blocking layer comprises a plurality of inner flow blocking blocks, the middle flow blocking layer comprises a plurality of middle flow blocking blocks, the outer flow blocking layer comprises a plurality of outer flow blocking blocks, flow guide groove channels are arranged between the adjacent inner flow blocking blocks, the middle flow blocking blocks and the outer flow blocking blocks, all parts of the flow guide groove channels are mutually communicated and are in three-dimensional staggering, redundant resin can be removed in all aspects, the effect of improving the flowability of the resin can be achieved in the laminating process, and the uniform.

Drawings

Fig. 1 is a structural diagram of a high-density multilayer PCB process edge choking block according to an embodiment of the present invention.

Detailed Description

To facilitate understanding of those skilled in the art, the present invention will be described in further detail with reference to specific embodiments and drawings.

Referring to fig. 1, an embodiment of the present invention includes:

the utility model provides a high density multilayer PCB technology limit spoiler, sets up on PCB technology edge, including the three-layer choking layer that is used for preventing the resin flow, the three-layer choking layer is interior choking layer, well choking layer and outer choking layer according to being in proper order from near to far away with PCB board 10 interval, be provided with guiding gutter 1 between interior choking layer and PCB board 10, be provided with guiding gutter two 2 between well choking layer and the interior choking layer, be provided with guiding gutter three 3 between outer choking layer and the well choking layer, guiding gutter 1, guiding gutter two 2 and guiding gutter three 3 communicate each other. The inner flow blocking layer comprises a plurality of inner flow blocking blocks 4 and a first communication groove 7 arranged between the adjacent inner flow blocking blocks 4, and the first communication groove 7 is used for communicating the first diversion groove 1 with the second diversion groove 2. The middle flow blocking layer comprises a plurality of middle flow blocking blocks 5 and a second communication groove 8 arranged between the adjacent middle flow blocking blocks 5, and the second communication groove 8 is used for communicating the second diversion groove 2 with the third diversion groove 3. The outer flow-resisting layer comprises a plurality of outer flow-resisting blocks 6 and a communication groove III 9 arranged between the adjacent outer flow-resisting blocks 6, and the communication groove III 9 communicates the flow-guiding groove III 3 with the outside. The upper surfaces of the inner flow blocking block 4, the middle flow blocking block 5 and the outer flow blocking block 6 are flush with the upper surface of the PCB 10, the first diversion groove 1, the second diversion groove 2, the third diversion groove 3, the first communication groove 7, the second communication groove 8 and the third communication groove 9 jointly form a diversion groove channel, and the height of the upper surface of the diversion groove channel is lower than that of the upper surface of the PCB 10. The inner flow blocking block 4, the middle flow blocking block 5 and the outer flow blocking block 6 are all in the shape of a parallelogram. The width of the flow guide groove channel is 1.9 mm. The length of the inner flow blocking block 4 is 36mm, the width of the inner flow blocking block is 5mm, the length of the middle flow blocking block 5 is 36mm, the width of the middle flow blocking block is 3mm, the length of the outer flow blocking block 6 is 36mm, the width of the outer flow blocking block is determined according to the thickness of the technical edge, and the width of the technical edge is about 14 mm. The minimum internal angle degree of the inner flow blocking block 4 is 45 degrees, the minimum internal angle degree of the middle flow blocking block 5 is 50 degrees, and the minimum internal angle degree of the outer flow blocking block 6 is 45 degrees.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims

1. The utility model provides a bluff block on high density multilayer PCB technology limit, its characterized in that sets up on PCB technology edge, including the three-layer bluff layer that is used for preventing the resin flow, the three-layer bluff layer is according to and PCB board (10) interval from nearly to far in proper order in the bluff layer, well bluff layer and outer bluff layer, in the bluff layer and be provided with guiding gutter (1) between PCB board (10), well bluff layer with be provided with guiding gutter two (2) between the interior bluff layer, outer bluff layer with be provided with guiding gutter three (3) between the well bluff layer, guiding gutter (1) guiding gutter two (2) with guiding gutter three (3) communicate each other.

2. The high-density multilayer PCB process edge choke block of claim 1, wherein the inner choke layer comprises a plurality of inner choke blocks (4) and a first communication groove (7) arranged between adjacent inner choke blocks (4), and the first communication groove (7) communicates the first flow guide groove (1) with the second flow guide groove (2).

3. The high-density multilayer PCB process edge choke block of claim 2, wherein the middle choke layer comprises a plurality of middle choke blocks (5) and a second communication groove (8) arranged between the adjacent middle choke blocks (5), and the second communication groove (8) communicates the second diversion groove (2) with the third diversion groove (3).

4. The high-density multilayer PCB process edge choke block of claim 3, characterized in that the outer choke layer comprises a plurality of outer choke blocks (6) and a third communication groove (9) arranged between adjacent outer choke blocks (6), wherein the third communication groove (9) communicates the third flow guide groove (3) with the outside.

5. The high-density multilayer PCB process edge choke block of claim 4, wherein the upper surfaces of the inner choke block (4), the middle choke block (5) and the outer choke block (6) are flush with the upper surface of the PCB (10), the diversion trench I (1), the diversion trench II (2), the diversion trench III (3), the communication trench I (7), the communication trench II (8) and the communication trench III (9) jointly form a diversion trench channel, and the height of the upper surface of the diversion trench channel is lower than that of the upper surface of the PCB (10).

6. The high-density multi-layer PCB process edge choke block of claim 4, characterized in that the inner choke block (4), the middle choke block (5) and the outer choke block (6) are each parallelogram shaped.

7. The high density multilayer PCB process edge dam of claim 5, wherein the channel width of the flow leader is 1-3 mm.

8. The high-density multi-layer PCB process edge choke block of claim 4, wherein the length of the inner choke block (4) is 30-40mm, the width of the inner choke block is 4-6mm, the length of the middle choke block (5) is 30-40mm, the width of the middle choke block is 2-4mm, the length of the outer choke block (6) is 30-40mm, and the width of the process edge is 12-16 mm.

9. The high density multi-layer PCB process edge choke block of claim 4, characterized in that the minimum inner angle degree of the inner choke block (4) is 45 degrees, the minimum inner angle degree of the middle choke block (5) is 50 degrees, and the minimum inner angle degree of the outer choke block (6) is 45 degrees.