WO2022041320A1 - Multilayer lcp circuit board - Google Patents

Multilayer lcp circuit board Download PDF

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Publication number
WO2022041320A1
WO2022041320A1 PCT/CN2020/114191 CN2020114191W WO2022041320A1 WO 2022041320 A1 WO2022041320 A1 WO 2022041320A1 CN 2020114191 W CN2020114191 W CN 2020114191W WO 2022041320 A1 WO2022041320 A1 WO 2022041320A1
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Prior art keywords
lcp
layer
clad laminate
copper clad
circuit board
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PCT/CN2020/114191
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French (fr)
Chinese (zh)
Inventor
计美阳
陈勇利
韩佳明
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声精密制造科技(常州)有限公司
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Publication of WO2022041320A1 publication Critical patent/WO2022041320A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Definitions

  • the present application relates to the technical field of circuit board fabrication, in particular to a multi-layer LCP circuit board.
  • Liquid Crystal Polymer resin microwave dielectric substrate material has high heat resistance, low water absorption, low dielectric loss, and high dimensional stability, and is an ideal material for 5G high-frequency signal transmission.
  • the inner layer circuit is produced through the processes of exposure, development and etching, and the copper foil in the inner layer waste area is designed as grid copper or etching.
  • the product is laminated by setting the appropriate parameters such as temperature, pressure and time through the press machine.
  • the purpose of the present application is to provide a multi-layer LCP circuit board, which can effectively reduce air bubbles, release pressing stress, reduce product expansion and shrinkage deformation, and improve product yield.
  • a multi-layer LCP circuit board including: a first LCP copper clad laminate, at least one second LCP copper clad laminate, and a third LCP copper clad laminate, which are laminated without glue and laminated in sequence, wherein the first LCP copper clad laminate is Two LCP copper clad laminates include a second LCP layer and a second copper foil layer laminated with the second LCP layer, the second copper foil layer includes a product forming area and a waste area surrounding the product forming area, The waste area is etched with a plurality of honeycomb structures, and the etched edges of the honeycomb structures penetrate each other.
  • the side length of the honeycomb structure is 1-1.6 mm, and the distance between two adjacent honeycomb structures is 0.1-0.5 mm.
  • the side length of the honeycomb structure is 1.4 mm, and the distance between two adjacent honeycomb structures is 0.3 mm.
  • the etched edge communicates with the product forming area and the outer space of the imposition.
  • the first LCP copper clad laminate includes a first LCP layer laminated with the second copper foil layer and a first copper foil layer disposed on the upper surface of the first LCP layer.
  • the third LCP copper clad laminate includes a third LCP layer laminated with the second LCP layer and a third copper foil layer disposed on the lower surface of the third LCP layer.
  • the honeycomb structure is etched in the waste area through the LCP copper clad laminate of the inner layer, and the etched edges of the honeycomb structure penetrate each other, which can effectively discharge the air bubbles generated when the product is pressed, and at the same time, the honeycomb structure is conducive to releasing the pressing Stress, reduce product expansion and shrinkage deformation, thereby improving product yield.
  • FIG. 1 is a schematic structural diagram of a multilayer LCP circuit board according to an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a second LCP copper clad laminate according to an embodiment of the application
  • Fig. 3 is a partial enlarged view of area A in Fig. 2;
  • FIG. 4 is a schematic structural diagram of a first LCP copper clad laminate according to an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a third LCP copper clad laminate according to an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a multi-layer LCP circuit board according to an embodiment of the present application. Please refer to FIG. 1 .
  • the multi-layer LCP circuit board 100 includes a first LCP copper clad laminate 10 and at least one second LCP copper clad laminate 10 , which are stacked in sequence and are not glued together.
  • the LCP copper clad laminate 20 and the third LCP copper clad laminate 30 are stacked in sequence and are not glued together.
  • the multiple second LCP copper clad laminates 20 have the same structure and are stacked in sequence.
  • the second LCP copper clad laminate 20 includes a second LCP layer 21 and a second LCP layer 21 .
  • the second copper foil layer 22 is provided.
  • the second copper foil layer 22 includes a product forming area 221 and a waste area 222 surrounding the product forming area 221 .
  • the waste area 222 is etched with a plurality of honeycomb structures 200 .
  • the etched edges communicate with each other, and the etched edges communicate with the product forming area 221 and the outer space of the imposition.
  • the side length of the honeycomb structure 200 is 1-1.6mm, the distance between two adjacent honeycomb structures 200 is 0.1-0.5mm, preferably, the side length of the honeycomb structure 200 is 1.4mm, and the distance between the two adjacent honeycomb structures 200 The spacing between them is 0.3mm.
  • the design of the honeycomb structure 200 in this embodiment is beneficial to release the pressing stress, reduce the expansion and shrinkage deformation of the product, thereby improving the yield of the product, and the etched edges of the honeycomb structure 200 penetrate each other, and The etched edge is connected with the product forming area and the external space of the imposition, which can effectively discharge the air bubbles generated when the product is pressed, and prevent the product bonding force caused by the air bubbles.
  • the first LCP copper clad laminate 10 includes a first LCP layer 11 laminated with the second copper foil layer 22 and a first copper foil layer 12 disposed on the upper surface of the first LCP layer 11 .
  • the third LCP copper clad laminate 30 includes a third LCP layer 31 laminated with the second LCP layer and a third copper foil layer 32 disposed on the lower surface of the third LCP layer 31 .
  • copper foil layers are provided on the upper surface of the first LCP copper clad laminate 10 and the lower surface of the third LCP copper clad laminate 30, and both surfaces of the inner copper foil layer are laminated with the LCP layer, which is To improve the bonding force after pressing, reduce air bubbles and deformation, and etch the honeycomb structure 200 on the waste area of the inner copper foil layer, which effectively improves the product yield.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present application provides a multilayer LCP circuit board, comprising: a first LCP copper clad laminate, at least one second LCP copper clad laminate, and a third LCP copper clad laminate that are sequentially stacked and laminated without glue. The second LCP copper clad laminate comprises a second LCP layer and a second copper foil layer laminated with the second LCP layer; the second copper foil layer comprises product molding areas and a waste area surrounding the product molding areas; a plurality of honeycomb structures are etched in the waste area; and the etching edges of the honeycomb structures are communicated with each other. According to the multilayer LCP circuit board of the present application, the honeycomb structures are etched in the waste area of the LCP copper clad laminate at the inner layer, and the etching edges of the honeycomb structures are communicated with each other, such that bubbles generated when a product is laminated can be effectively discharged, and meanwhile, the honeycomb structures are beneficial for releasing pressing stress and preventing expansion and contraction deformations of the product, thereby improving the yield of the product.

Description

一种多层LCP电路板A multilayer LCP circuit board 技术领域technical field
本申请涉及电路板制作技术领域，具体涉及一种多层LCP电路板。The present application relates to the technical field of circuit board fabrication, in particular to a multi-layer LCP circuit board.
背景技术Background technique
随着电子技术的飞速发展，电路板设计越来越趋于高精度、高密度化。为了获得更多的布线空间或需要铜箔以进行接地屏蔽时，就需要用到双面板或多层板。液晶聚合物树脂（简称LCP，Liquid Crystal Polymer）类微波介质基板材料具有高耐热性、低吸水率、低介质损耗，以及高的尺寸稳定性，是5G高频信号传输的理想材料。With the rapid development of electronic technology, circuit board design is becoming more and more high-precision and high-density. Double-sided or multi-layer boards are required to obtain more wiring space or when copper foil is required for ground shielding. Liquid Crystal Polymer resin (LCP for short) microwave dielectric substrate material has high heat resistance, low water absorption, low dielectric loss, and high dimensional stability, and is an ideal material for 5G high-frequency signal transmission.
但目前以LCP为基材的印制电路板在LCP覆铜板无胶压合时，通过曝光、显影和蚀刻等工序制作出内层线路，内层废料区的铜箔设计为网格铜或蚀刻圆，与产品外层叠板后，通过传压机设置合适的温度、压力和时间等参数对产品进行层压。LCP压合时，从高弹态向黏流态转变的温度较高，基材的流动性较大，容易造成产品变形，且容易出现气泡，影响产品品质。However, at present, when the printed circuit board with LCP as the base material is pressed without glue on the LCP copper clad laminate, the inner layer circuit is produced through the processes of exposure, development and etching, and the copper foil in the inner layer waste area is designed as grid copper or etching. After laminating the plate with the product, the product is laminated by setting the appropriate parameters such as temperature, pressure and time through the press machine. When LCP is pressed, the temperature of transition from high elastic state to viscous flow state is high, and the fluidity of the substrate is large, which is easy to cause product deformation, and bubbles are easy to appear, which affects product quality.
因此，有必要提供一种新的技术方案以解决上述缺陷。Therefore, it is necessary to provide a new technical solution to solve the above-mentioned defects.
技术问题technical problem
本申请的目的在于提供一种多层LCP电路板，能够有效减小气泡，释放压合应力，减小产品涨缩变形并提高产品良率。The purpose of the present application is to provide a multi-layer LCP circuit board, which can effectively reduce air bubbles, release pressing stress, reduce product expansion and shrinkage deformation, and improve product yield.
技术解决方案technical solutions
本申请的技术方案如下：提供一种多层LCP电路板，包括：依次叠设并无胶压合的第一LCP覆铜板、至少一个第二LCP覆铜板以及第三LCP覆铜板，所述第二LCP覆铜板包括第二LCP层和与所述第二LCP层压合的第二铜箔层，所述第二铜箔层包括产品成型区和围设于所述产品成型区的废料区，所述废料区蚀刻有多个蜂巢结构，所述蜂巢结构的蚀刻边缘相互贯通。The technical solution of the present application is as follows: a multi-layer LCP circuit board is provided, including: a first LCP copper clad laminate, at least one second LCP copper clad laminate, and a third LCP copper clad laminate, which are laminated without glue and laminated in sequence, wherein the first LCP copper clad laminate is Two LCP copper clad laminates include a second LCP layer and a second copper foil layer laminated with the second LCP layer, the second copper foil layer includes a product forming area and a waste area surrounding the product forming area, The waste area is etched with a plurality of honeycomb structures, and the etched edges of the honeycomb structures penetrate each other.
根据本申请的一个实施例，所述蜂巢结构的边长为1-1.6mm，相邻两个所述蜂巢结构之间的间距为0.1-0.5mm。According to an embodiment of the present application, the side length of the honeycomb structure is 1-1.6 mm, and the distance between two adjacent honeycomb structures is 0.1-0.5 mm.
根据本申请的一个实施例，所述蜂巢结构的边长为1.4mm，相邻两个所述蜂巢结构之间的间距为0.3mm。According to an embodiment of the present application, the side length of the honeycomb structure is 1.4 mm, and the distance between two adjacent honeycomb structures is 0.3 mm.
根据本申请的一个实施例，所述蚀刻边缘与所述产品成型区、拼版外部空间相互贯通。According to an embodiment of the present application, the etched edge communicates with the product forming area and the outer space of the imposition.
根据本申请的一个实施例，所述第一LCP覆铜板包括与所述第二铜箔层压合的第一LCP层以及设于所述第一LCP层上表面的第一铜箔层。According to an embodiment of the present application, the first LCP copper clad laminate includes a first LCP layer laminated with the second copper foil layer and a first copper foil layer disposed on the upper surface of the first LCP layer.
根据本申请的一个实施例，所述第三LCP覆铜板包括与所述第二LCP层压合的第三LCP层以及设于所述第三LCP层下表面的第三铜箔层。According to an embodiment of the present application, the third LCP copper clad laminate includes a third LCP layer laminated with the second LCP layer and a third copper foil layer disposed on the lower surface of the third LCP layer.
有益效果beneficial effect
本申请的有益效果在于：通过内层的LCP覆铜板在废料区蚀刻有蜂巢结构，同时蜂巢结构的蚀刻边缘相互贯通，能够有效排出产品压合时产生的气泡，同时蜂巢结构有利于释放压合应力，减小产品涨缩变形，从而提高产品的良率。The beneficial effects of the present application are: the honeycomb structure is etched in the waste area through the LCP copper clad laminate of the inner layer, and the etched edges of the honeycomb structure penetrate each other, which can effectively discharge the air bubbles generated when the product is pressed, and at the same time, the honeycomb structure is conducive to releasing the pressing Stress, reduce product expansion and shrinkage deformation, thereby improving product yield.
附图说明Description of drawings
图1为本申请实施例的多层LCP电路板的结构示意图； 1 is a schematic structural diagram of a multilayer LCP circuit board according to an embodiment of the application;
图2为本申请实施例的第二LCP覆铜板的结构示意图；2 is a schematic structural diagram of a second LCP copper clad laminate according to an embodiment of the application;
图3为图2中A区域的局部放大图；Fig. 3 is a partial enlarged view of area A in Fig. 2;
图4为本申请实施例的第一LCP覆铜板的结构示意图；4 is a schematic structural diagram of a first LCP copper clad laminate according to an embodiment of the application;
图5为本申请实施例的第三LCP覆铜板的结构示意图。FIG. 5 is a schematic structural diagram of a third LCP copper clad laminate according to an embodiment of the present application.
本发明的实施方式Embodiments of the present invention
下面结合附图和实施方式对本申请作进一步说明。The present application will be further described below with reference to the accompanying drawings and embodiments.
图1是本申请实施例的多层LCP电路板的结构示意图，请参见图1，该多层LCP电路板100包括依次叠设并无胶压合的第一LCP覆铜板10、至少一个第二LCP覆铜板20以及第三LCP覆铜板30。FIG. 1 is a schematic structural diagram of a multi-layer LCP circuit board according to an embodiment of the present application. Please refer to FIG. 1 . The multi-layer LCP circuit board 100 includes a first LCP copper clad laminate 10 and at least one second LCP copper clad laminate 10 , which are stacked in sequence and are not glued together. The LCP copper clad laminate 20 and the third LCP copper clad laminate 30 .
本实施例中，第二LCP覆铜板20设置多个时，多个第二LCP覆铜板20的结构相同且依次叠设。在一实施例中，请参见图1，第二LCP覆铜板20设置一个，请参见图1和图2，第二LCP覆铜板20包括第二LCP层21和与第二LCP层21压合的第二铜箔层22。In this embodiment, when multiple second LCP copper clad laminates 20 are provided, the multiple second LCP copper clad laminates 20 have the same structure and are stacked in sequence. In one embodiment, please refer to FIG. 1 , one second LCP copper clad laminate 20 is provided, please refer to FIGS. 1 and 2 , the second LCP copper clad laminate 20 includes a second LCP layer 21 and a second LCP layer 21 . The second copper foil layer 22 .
进一步地，请参见图2和图3，第二铜箔层22包括产品成型区221和围设于产品成型区221的废料区222，废料区222蚀刻有多个蜂巢结构200，蜂巢结构200的蚀刻边缘相互贯通，并且蚀刻边缘与产品成型区221、拼版外部空间相互贯通。蜂巢结构200的边长为1-1.6mm，相邻两个蜂巢结构200之间的间距为0.1-0.5mm，优选地，蜂巢结构200的边长为1.4mm，相邻两个蜂巢结构200之间的间距为0.3mm。Further, referring to FIG. 2 and FIG. 3 , the second copper foil layer 22 includes a product forming area 221 and a waste area 222 surrounding the product forming area 221 . The waste area 222 is etched with a plurality of honeycomb structures 200 . The etched edges communicate with each other, and the etched edges communicate with the product forming area 221 and the outer space of the imposition. The side length of the honeycomb structure 200 is 1-1.6mm, the distance between two adjacent honeycomb structures 200 is 0.1-0.5mm, preferably, the side length of the honeycomb structure 200 is 1.4mm, and the distance between the two adjacent honeycomb structures 200 The spacing between them is 0.3mm.
相对于网格铜和蚀刻圆的设计，本实施例的蜂巢结构200设计有利于释放压合应力，减小产品涨缩变形，从而提高产品的良率，蜂巢结构200的蚀刻边缘相互贯通，并且蚀刻边缘与产品成型区、拼版外部空间相互贯通，能够有效排出产品压合时产生的气泡，防止因气泡而产生的产品结合力问题。Compared with the design of grid copper and etched circles, the design of the honeycomb structure 200 in this embodiment is beneficial to release the pressing stress, reduce the expansion and shrinkage deformation of the product, thereby improving the yield of the product, and the etched edges of the honeycomb structure 200 penetrate each other, and The etched edge is connected with the product forming area and the external space of the imposition, which can effectively discharge the air bubbles generated when the product is pressed, and prevent the product bonding force caused by the air bubbles.
请参见图1和图4，第一LCP覆铜板10包括与第二铜箔层22压合的第一LCP层11以及设于第一LCP层11上表面的第一铜箔层12。Referring to FIGS. 1 and 4 , the first LCP copper clad laminate 10 includes a first LCP layer 11 laminated with the second copper foil layer 22 and a first copper foil layer 12 disposed on the upper surface of the first LCP layer 11 .
请参见图1和图5，第三LCP覆铜板30包括与第二LCP层压合的第三LCP层31以及设于第三LCP层31下表面的第三铜箔层32。Referring to FIGS. 1 and 5 , the third LCP copper clad laminate 30 includes a third LCP layer 31 laminated with the second LCP layer and a third copper foil layer 32 disposed on the lower surface of the third LCP layer 31 .
本实施例的多层LCP电路板在第一LCP覆铜板10的上表面和第三LCP覆铜板30下表面均设置铜箔层，内部铜箔层的两个表面均与LCP层压合，为提升压合后的结合力，减少气泡和形变，对内部铜箔层的废料区作了蚀刻蜂巢结构200的处理，有效提高产品良率。In the multilayer LCP circuit board of this embodiment, copper foil layers are provided on the upper surface of the first LCP copper clad laminate 10 and the lower surface of the third LCP copper clad laminate 30, and both surfaces of the inner copper foil layer are laminated with the LCP layer, which is To improve the bonding force after pressing, reduce air bubbles and deformation, and etch the honeycomb structure 200 on the waste area of the inner copper foil layer, which effectively improves the product yield.
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。The above are only the embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, improvements can be made without departing from the creative concept of the present application, but these belong to the present application. scope of protection.

Claims (6)

1、一种多层LCP电路板，其特征在于，包括：依次叠设并无胶压合的第一LCP覆铜板、至少一个第二LCP覆铜板以及第三LCP覆铜板，所述第二LCP覆铜板包括第二LCP层和与所述第二LCP层压合的第二铜箔层，所述第二铜箔层包括产品成型区和围设于所述产品成型区的废料区，所述废料区蚀刻有多个蜂巢结构，所述蜂巢结构的蚀刻边缘相互贯通。1. A multi-layer LCP circuit board, characterized in that it comprises: a first LCP copper clad laminate, at least one second LCP copper clad laminate, and a third LCP copper clad laminate, which are stacked in sequence without glue, and the second LCP copper clad laminate is The copper clad laminate includes a second LCP layer and a second copper foil layer laminated with the second LCP layer, the second copper foil layer includes a product forming area and a waste area surrounding the product forming area, the The waste area is etched with a plurality of honeycomb structures, and the etched edges of the honeycomb structures penetrate each other.
2、根据权利要求1所述的多层LCP电路板，其特征在于，所述蜂巢结构的边长为1-1.6mm，相邻两个所述蜂巢结构之间的间距为0.1-0.5mm。2. The multilayer LCP circuit board according to claim 1, wherein the side length of the honeycomb structure is 1-1.6mm, and the distance between two adjacent honeycomb structures is 0.1-0.5mm.
3、根据权利要求2所述的多层LCP电路板，其特征在于，所述蜂巢结构的边长为1.4mm，相邻两个所述蜂巢结构之间的间距为0.3mm。3. The multilayer LCP circuit board according to claim 2, wherein the side length of the honeycomb structure is 1.4mm, and the distance between two adjacent honeycomb structures is 0.3mm.
4、根据权利要求1所述的多层LCP电路板，其特征在于，所述蚀刻边缘与所述产品成型区、拼版外部空间相互贯通。4. The multi-layer LCP circuit board according to claim 1, wherein the etched edge communicates with the product forming area and the outer space of the imposition.
5、根据权利要求1所述的多层LCP电路板，其特征在于，所述第一LCP覆铜板包括与所述第二铜箔层压合的第一LCP层以及设于所述第一LCP层上表面的第一铜箔层。5. The multilayer LCP circuit board according to claim 1, wherein the first LCP copper clad laminate comprises a first LCP layer laminated with the second copper foil layer and a layer disposed on the first LCP Layer the first copper foil layer on the upper surface.
6、根据权利要求1所述的多层LCP电路板，其特征在于，所述第三LCP覆铜板包括与所述第二LCP层压合的第三LCP层以及设于所述第三LCP层下表面的第三铜箔层。6. The multilayer LCP circuit board of claim 1, wherein the third LCP copper clad laminate comprises a third LCP layer laminated with the second LCP layer and a third LCP layer disposed on the third LCP layer The third copper foil layer on the lower surface.
PCT/CN2020/114191 2020-08-28 2020-09-09 Multilayer lcp circuit board WO2022041320A1 (en)

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CN202010888583.1 2020-08-28
CN202010888583.1A CN112087861A (en) 2020-08-28 2020-08-28 Multilayer LCP circuit board

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WO2022041320A1 true WO2022041320A1 (en) 2022-03-03

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