200803635 九、發明說明： 〜 【發明所屬之技術領域】 本發明涉及印刷電路板方面的技術，尤其與多層印刷電 路板之壓合製程有關。 • 【先前技術】 多層電路板的壓合製程，影響後續品質的成敗責任，且 無法重工，可說是多層板製程中最關鍵之工序。該壓合製程 主要係將已完成電路圖案製作之各内層板（thin core)壓合 成一體的多層電路板，而在壓合過程中，該内層板之樹脂材 料因受熱壓呈熔融狀態而向四邊擠壓，經由此間之過程以完 成層間的接著及空隙的填補。 ，在台灣公告第508012號新型專利案中，係揭露一電路 板壓合溢流口結構，其主要係於該電路板板邊四角位置設有 流膠口及溢流口，用以在電路板壓合製程中，排出一部份溶 鲁 融的樹脂及殘存在層間的氣泡。 在第五圖中，係顯示一電路板的週邊形成有複數個圓形 偽焊墊（8 1 ) (Dummy Pads)，這些圓形偽焊墊（8 1 ) 之間形成有流道（8 2 )，用以在電路板壓合製程中排出一 • 部份熔融的樹脂及殘存在層間的氣泡。這種結構會導致流失 . 過多的樹脂，造成介電層厚度過薄及均勻性控制不易等問 題0 另外，亦有在一電路板的週邊轉角處各形成一條寬度約 lOOmil·的流道。這種結構雖然可以避免流失過多的樹脂， 200803635 唯用諸於大尺寸或特殊之電路板的壓合製程，例如H d工扳 (high density interconnect)或R c c板（知咖 c_d200803635 IX. Description of the Invention: ~ Technical Field of the Invention The present invention relates to a technique for printed circuit boards, and more particularly to a press-bonding process for a multilayer printed circuit board. • [Prior Art] The lamination process of multi-layer boards affects the success or failure of subsequent quality and cannot be reworked. It is the most critical process in the multi-layer board process. The pressing process is mainly a multi-layer circuit board in which the inner cores of the completed circuit pattern are integrated into one body, and during the pressing process, the resin material of the inner layer plate is melted by the hot pressing. Four-side extrusion, through the process between the two to complete the filling between the layers and the filling of the gap. In the new patent case No. 508012 published in Taiwan, a circuit board press-over overflow structure is disclosed, which is mainly provided with a flow glue port and an overflow port at the four corners of the circuit board board for the circuit board. During the press-bonding process, a portion of the melted resin and bubbles remaining between the layers are discharged. In the fifth figure, a plurality of circular dummy pads (8 1 ) (Dummy Pads) are formed on the periphery of a circuit board, and flow paths are formed between the circular dummy pads (8 1 ) (8 2 ). ) for discharging a portion of the molten resin and bubbles remaining between the layers during the board press-bonding process. This structure causes loss. Excessive resin causes the thickness of the dielectric layer to be too thin and the uniformity control is difficult. In addition, a flow path having a width of about 100 mils is formed at a peripheral corner of a circuit board. Although this structure can avoid the loss of excess resin, 200803635 is only used for the pressing process of large size or special circuit boards, such as high density interconnect or R c c board (known as c_d
Copper foil)，層間的氣泡無法順利地排出。目前，雖施以 高壓壓合，惟僅使氣泡變小，並非完全排除。 【發明内容】 、，本發明之主要目的在於提供一種具有锋巢式樹脂流出 返之電路板。藉由位在該電路板週邊的蜂巢式樹脂流出道， I使該電路板能夠在較低壓力下，與另—上層電路板進行孰 且在壓合過程中，殘存在層間的氣泡及_部份溶融的 树月曰，可經由該蜂巢式樹脂流出道均勻排出。 具體而言’本發虹述電路板包括—介電層及-線路芦 係开f成於該介電層的一面。該線路層具有-電路圖案區及二 =區係m繞錢路圖案區。該週邊區具有複數個六角形的 且^鋪排為-蜂巢狀陣列，且其中任意_鄰之偽焊塾間 八有-通魏此_通形辆蜂巢式樹脂流出道。 =述=蜂巢狀樹脂排出道中的每一對外路徑，都是曲折 的’因而&供較長的流出路徑。再者，每 输術中的圓形偽谭塾更能輸融樹以 ΐί的:Γ之寬度都是相同的，使得㈣樹脂能夠以 ==ΐ ，藉此可精密的控制流出量繼而獲取所 欲之介電層厚度。 【實施方式】 6 200803635 請參閱第一圖所示之本發明的一個較佳實施例。為簡化 說明起見，圖中所示的電路板（1 〇 0 )僅包括一介面層（工） 及一線路層（2 )。在此情形下，該電路板（丄〇 〇 )通a 只是一多層印刷電路板中的一層。 在第一圖中’该介電層（1)係含有樹脂成份，該線路 層（2)係形成於該介電層（1 )的一面，並具有一電路 案區（2 1)及一週邊區（2 2)係圍繞在該電路圖案（^ 1 )區的周圍。其中，該電路圖案區（2丄）共有八個成品 區（2 1 0 )，各成品區（2 1 〇 )與該週邊區（2 2 )之 間係隔著一間隙（2 3 )。此外，對一多層印刷電路板而言， 該介電層（1 )通常是由含有樹脂成份之一黏合片（pre 所構成。該線路層（2 )通常是由附在該黏合片表面上的銅 箔所形成。無論如何，本發明的重點在於該週邊區（2 中具有複數個六角形的偽烊墊（3 ) (Dummy _)鋪 —蜂巢狀陣列。 氣 在第一、二圖中係更清楚地指出在該週邊區（2 2 ) 任意兩相鄰之傷焊塾（3)間各具有-通道（3 i )彼此奉 樹脂排f道佈滿該週邊區（2 2 )，並連竭 f f(23)與該週邊區（22)之外圍。藉此，—上展 二=可/車交低㈣下與該電路板（1進行熱i 柯月匕^乂間㈣脂會轉而㈣成膠狀，—部份的_ 存在層_氣㈣卩經由触通道（3 i )所組成之 手巢式树脂排出道平均排出。 不同於先前技術的是，該電路板（1〇〇)上的週邊區 200803635 蜂巢狀陣^的^塾（3 )都是六角形的，且間隔地鋪排成 邊區（22)_成該蜂1式樹脂 條對外路徑，都是曲:f於，5亥蜂桌式樹脂排出道中的每一 由於每-偽焊墊’因而提供較長的流出路徑。再者’ ( 8 1 ，Sltb ^ 此，可使Ά嫁融樹脂的流出速度。藉 (1 0 0)與I亥上声命敗延向避免因》亥电路板 板彎或_之問題θ。板之_介電層厚度過薄所造成之 月吝閱第四圖，其中指出各通道（3 ]pi & *奋,η、 都是相同的，此音味m〜广、川之間的I度(D ) 出拉t卜叮林〜心者该熔融樹脂能夠以穩定的流速平均排 出猎此可精岔的控制流出量，繼而4被取m,、a+入 及良好的麗板品質。又每一他=隻取所欲之介電層厚度 且1每一邊Η τ\^母細塾（3 )最好是等邊六角形， =1}之寬度(D)則最好介於十：： 紅…一條件下，可得到相當實用的結果。 .無确如何’任何人都可以從上述例子 教導，並_了_本發明確實具有錢 性，且本發明在同—領域中均未見有相_== 法提"請。 確已付合發料利要件，爰依 8 200803635 【圖式簡單說明】 第一圖，係顯示士於 第 第 圖’係為該广較佳實施例。 圖，係為該較^ 的部份斷面放大圖。 第四圖，係顧土 例的局部平面放大圖。 m Γ、、、不邻份六角形偽焊墊的放大圖。 乐立圖，你顧- 牙、肩不一種週邊具有多個圓形偽焊墊之習知電路 板0Copper foil), the bubbles between the layers cannot be discharged smoothly. At present, although high pressure is applied, only the bubbles are made small, and it is not completely excluded. SUMMARY OF THE INVENTION The main object of the present invention is to provide a circuit board having a front-end resin flowing back. By means of the honeycomb resin outflow channel located at the periphery of the circuit board, I enable the circuit board to be smashed with the other upper circuit board at a lower pressure, and during the pressing process, bubbles and _ portions between the layers remain. The partially melted tree sap can be uniformly discharged through the honeycomb resin outflow channel. Specifically, the present invention includes a dielectric layer and a wiring layer formed on one side of the dielectric layer. The circuit layer has a circuit pattern area and a second = area m winding path pattern area. The peripheral zone has a plurality of hexagonal and ^-arranged-honey-like arrays, and any of the adjacent yokes has a honeycomb-type resin outflow channel. ===Each external path in the honeycomb resin discharge channel is meandering 'and thus a longer outflow path. In addition, the round pseudo-tank in each transfusion can more effectively infuse the tree with the same width: the (4) resin can be controlled by ==ΐ, so that the outflow can be precisely controlled and then the desired The thickness of the dielectric layer. [Embodiment] 6 200803635 Please refer to a preferred embodiment of the present invention shown in the first figure. For simplicity of explanation, the circuit board (1 〇 0 ) shown in the figure includes only one interface layer (work) and one circuit layer (2). In this case, the board (a) is only one layer of a multilayer printed circuit board. In the first figure, the dielectric layer (1) contains a resin component, and the circuit layer (2) is formed on one side of the dielectric layer (1) and has a circuit case (2 1) and a periphery. The area (2 2) surrounds the area of the circuit pattern (^ 1 ). The circuit pattern area (2丄) has a total of eight finished areas (2 1 0 ), and a gap (2 3 ) is arranged between each finished area (2 1 〇 ) and the peripheral area (2 2 ). Further, for a multilayer printed circuit board, the dielectric layer (1) is usually composed of a bonding sheet (pre) containing a resin component. The wiring layer (2) is usually attached to the surface of the bonding sheet. In any case, the focus of the present invention is on the peripheral region (2 having a plurality of hexagonal pseudo-pads (3) (Dummy _)-honey-like arrays. Gas is in the first and second figures It is more clearly pointed out that in the peripheral zone (2 2 ) any two adjacent damaged welds (3) each have a channel (3 i ) which is filled with the resin zone f to fill the peripheral zone (2 2 ), and Even ff (23) and the periphery of the surrounding area (22). By this, - the second exhibition = can be / car low (four) under the circuit board (1 heat i Ke Yue 匕 ^ ( (four) fat will turn And (4) gelatinized, part of the _ existing layer _ gas (four) 平均 through the contact channel (3 i ) consists of the nested resin discharge channel is evenly discharged. Unlike the prior art, the circuit board (1〇〇 Peripheral area 200803635 The honeycomb array ^^(3) is hexagonal and is laid out at intervals (22)_ into the external path of the bee type 1 resin strip All of them are: f, each of the 5 hai table-type resin discharge channels provides a longer outflow path due to each-pse solder pad'. Again, (8 1 , Sltb ^, this can make Ά Ά 树脂 resin The speed of the outflow. Borrowing (1 0 0) and I Haisheng defeated the delay to avoid the problem caused by the "black board board bending or _ θ. The _ dielectric layer thickness is too thin caused by the monthly reading of the fourth Figure, which indicates that each channel (3)pi & *ex, η, are the same, this tone m~guang, I degree between the rivers (D) out pull t Bu Yulin ~ heart the molten resin It is able to discharge the fine control flow out at a steady flow rate, and then 4 is taken m, a+ and good slab quality. Each of them = only the thickness of the desired dielectric layer and 1 per One side Η τ\^ mother fine 塾 (3) is preferably an equilateral hexagon, =1} width (D) is preferably between ten:: red... under one condition, can get quite practical results. Indeed, 'anyone can teach from the above examples, and _ _ the invention is indeed valuable, and the invention has no phase in the same field - _== Fati " Please. Material requirements爰 8 8 200803635 [Simple description of the drawings] The first figure shows that the figure in the first figure is the preferred embodiment. The figure is a partial enlarged view of the comparison. A magnified view of the partial plane of the soil case. m Γ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Know the circuit board 0
【主要元件符號說明】 (1 )介電層 (2 )線路層 (210)成品區 (2 2)週邊區 (3)六角形的偽焊墊 (D)寬度 (8 1)圓形偽焊塾 (1 0 0)電路板 (21)電路圖案區 (2 3)間隙 (31)通道 (L )邊長 (8 2 )通道[Main component symbol description] (1) Dielectric layer (2) Circuit layer (210) Finished area (2 2) Peripheral area (3) Hexagonal dummy pad (D) Width (8 1) Round pseudo-weld (1 0 0) circuit board (21) circuit pattern area (2 3) gap (31) channel (L) side length (8 2 ) channel