TW201703604A - Rigid-flex print circuit board and method for manufacturing same - Google Patents

Abstract

The present invention relates to a rigid-flex print circuit board. The rigid-flex print circuit board includes a substrate layer, a first conductive circuit layer, an adhesive piece, a fourth conductive circuit layer and a flexible substrate. The first conductive circuit layer is formed on one surface of the substrate layer. The adhesive piece is formed on the surface of the first conductive circuit layer which is far away from the substrate layer. The fourth conductive circuit layer is formed on the surface of the adhesive piece which is far away from the substrate layer. The flexible substrate lies in the outside of the rigid-flex print circuit board. The shape and size of the adhesive piece is equal to the shape and size of the substrate layer approximately. The adhesive piece is opposite to the substrate layer approximately. One end of the flexible substrate is jointed with part surface of the adhesive piece which is far away from the substrate layer and another end of the flexible substrate extents from the adhesive piece.

Description

Rigid-flexible bonding plate and manufacturing method thereof

The present invention relates to the field of circuit boards, and in particular, to a rigid-flex board and a manufacturing method thereof.

At present, the rigid-flex plate is formed by layer-adding, that is, the inner soft plate is formed first, then the hard plate material is formed on both sides of the inner soft plate, and a part of the inner soft plate is exposed, thereby forming a rigid-flex combination. board. However, since the circuit board is generally contiguous for a plurality of circuit board units, the plurality of circuit board units are divided into individual circuit boards after the completion of the fabrication, which causes the accumulation of the inner layer of the rigid-flexed version to accumulate. To the entire circuit board, for example, even if some of the plurality of circuit board units in the inner soft board are known to be defective, a hard board material is formed on both sides of the defective product, and a hard board corresponding to the defective products is required. The material is processed, which causes waste of materials and processes, and increases the cost of rigid-flexed production.

In view of this, it is necessary to provide a rigid-flex plate and a manufacturing method thereof to reduce waste of subsequent processes caused by partial circuit board defects.

A method for manufacturing a rigid-flex board, comprising the steps of: providing a rigid substrate, the rigid substrate comprising a plurality of good rigid circuit board units, each of the hard circuit board units being divided into the connected first area and the second area; Providing a film having the same shape and size as the shape and size of the rigid substrate; providing a plurality of flexible substrates having a single piece; and pressing a plurality of good flexible substrates through the film The outermost side of the rigid substrate, and each flexible substrate corresponds to a good rigid circuit board unit, thereby obtaining a rigid-flexed version of the continuous piece; wherein the film is substantially aligned with the rigid substrate, each The flexible substrate is press-fitted to the second region of the corresponding rigid rigid circuit board unit and the portion of the first region, and the rigid flexible bonding plate of the connecting piece forms a plurality of rigid bending corresponding to each of the good rigid circuit board units. Combining the board unit; and dividing the plurality of rigid-flex unit units, and removing the hard board unit and the film corresponding to each of the second areas, exposing each Partial regions of the flexible substrate, to thereby obtain a plurality of rigid flex boards.

A rigid-flex bonding plate comprising a substrate layer, a first conductive circuit layer formed on one side of the substrate layer, a film formed on a side of the first conductive circuit layer away from the substrate layer, formed on the film away from a fourth conductive circuit layer on a surface of the base material layer and a flexible substrate located at an outermost side of the rigid flexible bonding plate, wherein the shape and size of the film are substantially the same as the shape and size of the substrate layer. The film is substantially aligned with the substrate layer, one end of the flexible substrate is attached to a portion of the surface of the film away from the substrate layer, the other end extends out of the film, and the fourth conductive circuit layer is formed. The film is away from the substrate layer and does not conform to the surface of the flexible substrate.

In the rigid-flex board and the manufacturing method thereof provided by the technical solution, a good flexible substrate is formed on the outermost layer of the rigid flexible bonding board, thereby avoiding adding a hard material on the poor flexible substrate; The single-piece flexible substrate of the good product is bonded to the rigid rigid circuit board unit of the rigid substrate one by one, so that the cross-bonding of the good product and the defective product can be avoided, that is, the flexible substrate and the good product are avoided. The waste of the rigid circuit board unit; and the various processes after pressing are also performed only in the area corresponding to the good hard circuit board unit, thereby reducing the waste of the process material used for the defective product.

1 is a schematic cross-sectional view of a rigid-flex plate provided by a first embodiment of the present technical solution.

2 is a schematic top plan view of a rigid substrate according to a second embodiment of the present technology.

3 is a schematic cross-sectional view of a rigid substrate according to a second embodiment of the present technology.

4 is a schematic plan view showing a guide groove formed on the rigid substrate of FIG. 2.

Fig. 5 is a schematic cross-sectional view showing a guide groove formed on the rigid substrate of Fig. 2;

Figure 6 is a cross-sectional view showing the first and second films provided in the second embodiment of the present technical solution.

FIG. 7 is a cross-sectional view of a flexible substrate according to a second embodiment of the present technology.

Fig. 8 is a schematic cross-sectional view showing a release film formed on the flexible substrate of Fig. 7.

Fig. 9 is a schematic cross-sectional view showing the rigid substrate, the film, and the flexible substrate of Figs. 5, 6, and 8 superposed.

Fig. 10 is a schematic cross-sectional view showing a structure in which the laminated structure of Fig. 9 is pressed to form a rigid-flex substrate.

Figure 11 is a schematic cross-sectional view showing the formation of a conductive wiring layer on the rigid flexible substrate of Figure 10;

Fig. 12 is a schematic cross-sectional view showing a solder resist layer formed on both sides of the rigid flexible substrate of Fig. 11;

Figure 13 is a top plan view of Figure 12.

The rigid-flex plate and the manufacturing method thereof provided by the technical solution are further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 , a rigid flexible bonding board 100 according to a first embodiment of the present invention includes a substrate layer 102 , a first conductive circuit layer 101 and a second conductive circuit layer 103 formed on opposite sides of the substrate layer 102 . a first film 20 on a side of the first conductive circuit layer 101 away from the substrate layer 102, and a second film 21 formed on a side of the second conductive circuit layer 103 away from the substrate layer 102. a flexible substrate 30 extending from the surface portion of the first film 20 away from the substrate layer 102 and extending from the first film 20, and another portion of the surface of the first film 20 away from the substrate layer 102 a fourth conductive circuit layer 501, a fifth conductive circuit layer 502 formed on the surface of the second film 21 away from the substrate layer 102, and a first solder resist layer formed on the surface of the fourth conductive circuit layer 501. 60 and a second solder resist layer 70 formed on a surface of the fifth conductive wiring layer 502.

The base material layer 102 may be an insulating base material layer or a base material layer including a conductive circuit layer. In this embodiment, the base material layer 102 is an insulating base material layer, and the base material layer 102 is preferably formed by curing a prepreg.

The shapes and sizes of the first and second films 20, 21 are substantially the same as the shape and size of the substrate layer 102, and are substantially aligned with the substrate layer 102. The first and second films 20, 21 are also preferably formed by curing the prepreg.

The flexible substrate 30 is located at the outermost side of the rigid flexible bonding board 100, and includes a flexible insulating layer 301, a third conductive wiring layer 302, and a cover film layer 303 which are sequentially attached. A first cover film opening 3033 is formed on the cover film layer 303 corresponding to a region of the flexible substrate 30 corresponding to the second film 21, and a region corresponding to the region of the second film 21 is extended. A second cover film opening 3034 is formed on the cover film layer 303. a portion of the third conductive circuit layer 302 is exposed to the first cover film opening 3033 to form a first electrical connection pad 3021, and a portion of the third conductive circuit layer 302 is exposed to the second cover film opening 3034. The second electrical connection pad 3022. A gold layer 305 is formed on a surface of the first electrical connection pad 3021. The cover film layer 303 around the second cover film opening 3034 of the flexible substrate 30, the second electrical connection pad 3022, and a portion of the line gap exposed from the third conductive circuit layer 302 are exposed. The flexible insulating layer 301 is formed substantially in a plurality of steps so as to be in contact with the first film 20, and the flexible insulating layer 301 is away from the substrate layer 102 than the cover film layer 303. The first electrical connection pad 3021 is exposed to the outside. In this embodiment, the cover film layer 303 includes a film layer 3031 and a glue layer 3032. The film layer 3031 and the flexible insulation layer 301 are made of the same or similar materials, and are preferably pure flexible resin materials, such as polyimide materials. , polyester materials, polycarbonate materials, etc., can be bent.

A region corresponding to the base material layer 102 is a rigid region of the rigid flexible bonding plate 100, and a region substantially corresponding to the first electrical connection pad 3021 is a finger region of the rigid flexible bonding plate 100, corresponding to the The region between the hard region and the finger region is a flexible region of the rigid flexible panel 100.

The first conductive circuit layer 101 and the second conductive circuit layer 103 are electrically connected through at least one conductive hole 105. The fourth conductive circuit layer 501 is electrically connected to the first conductive circuit layer 101 through at least one first conductive body 207 in the first film 20, and the first electrical connection pad of the third conductive circuit layer 302 3021 is electrically connected to the first conductive wiring layer 101 through at least one third electrical conductor 208 in the first film 20, and the fifth conductive wiring layer 502 passes through at least one second electrical conductor 214 in the second film 21. The second conductive circuit layer 103 is electrically connected to the second conductive circuit layer 103.

A second embodiment of the present invention provides a method for manufacturing the rigid-flex board 100, which includes the following steps:

In the first step, referring to Figures 2-3, a rigid substrate 10 is provided.

The rigid substrate 10 may be a single-layer circuit substrate, a two-layer circuit substrate, or a multilayer circuit substrate. In the embodiment, the rigid substrate 10 is a two-layer circuit substrate, and includes a first conductive wiring layer 101, a substrate layer 102, and a second conductive wiring layer 103 which are sequentially bonded. The base material layer 102 is an insulating base material layer, and the base material layer 102 is preferably formed by curing a prepreg. The rigid substrate 10 includes a plurality of connected rigid circuit board units 104 (the boundary of the plurality of rigid circuit board units 104 is indicated by a broken line A in the figure) and a waste area 1043 formed at the edge of the rigid circuit board unit 104. The plurality of rigid circuit board units 104 include a good rigid circuit board unit and a defective hard circuit board unit. In the illustration of the embodiment, only a part of the hard circuit board unit is drawn. Each of the rigid circuit board units 104 is artificially divided into a connected first area 1041 and a second area 1042. The second area 1042 and the waste area 1043 need to be removed during the process of forming the rigid-flex board 100. The first conductive circuit layer 101 and the second conductive circuit layer 103 are formed only in the first region 1041, and in each of the rigid circuit board units 104, the first conductive circuit layer 101 and the second The conductive wiring layer 103 is electrically connected through at least one conductive via 105 on the rigid substrate 10. In other embodiments, when the substrate layer 102 is a substrate including a conductive wiring layer, each conductive wiring layer is formed only in the first region 1041.

In the second step, referring to FIG. 4-5, a plurality of first guiding grooves 106 and second guiding grooves 107 are formed on the rigid substrate 10.

Each of the first guiding grooves 106 is formed at a boundary between the first region 1041 and the second region 1042, and each of the second guiding grooves 107 is formed in the second region 1042 and the scrap region. The junction of 1043. Each of the first guiding groove 106 and the second guiding groove 107 penetrates through the rigid substrate 10 , and penetrates the base material layer 102 in this embodiment. Both ends of the first guiding groove 106 and the second guiding groove 107 in each rigid circuit board unit 104 are respectively close to the edge of the rigid circuit board unit 104, but the first and second regions and the scrap area are not 1041, 1042, 1043 are separated.

The first and second guiding grooves 106, 107 can be formed by mechanical drilling, fishing, and laser cutting. In this embodiment, the first and second guiding grooves 106 and 107 are formed only at the rigid rigid circuit board unit to save the process.

In the third step, referring to FIG. 6, the first and second films 20 and 21 are provided, and a plurality of third guiding grooves 201 and fourth guiding grooves 202 penetrating the first film 20 are formed on the first film 20, And a plurality of fifth guiding grooves 203 and sixth guiding grooves 204 penetrating the second film 21 are formed on the second film 21.

The first and second films 20 and 21 respectively correspond to the rigid substrate 10, and the shapes and sizes of the first and second films 20 and 21 are the same as those of the rigid substrate 10. In this embodiment, the first film 20 and the region corresponding to each of the first regions 1041 are formed with at least one first through hole 205 and at least one third through hole 206, and the first through hole 205 is filled therein. The first conductive body 207 is filled with the third conductive body 208, and the second film 21 is formed with at least one second through hole 213 in a region corresponding to each of the first regions 1041. The second through hole 213 is filled with the second electrical conductor 214. In this embodiment, the first, second, and third through holes 205, 213, and 206 are formed by mechanical drilling or laser etching, and the first, second, and third conductive bodies 207, 214, 208 is a conductive paste, formed by printing or the like, and may be a conductive copper paste, a conductive silver paste, a conductive solder paste, or the like. The first and second films 20, 21 are preferably semi-cured prepregs which are fully cured during the subsequent pressing step.

In other embodiments, the through holes and the conductors may not be formed in this step, and the through holes and the conductors may be formed by a process such as laser etching and plating after pressing the film.

The third guiding slot 201 and the fifth guiding slot 203 are in one-to-one correspondence with the plurality of first guiding slots 106, and the fourth guiding slot 202 and the sixth guiding slot 204 are respectively associated with the plurality of second guiding channels. The slots 107 correspond one-to-one. The third to sixth guide grooves 201, 202, 203, and 204 may be formed by mechanical drilling, fishing, and laser cutting.

In the fourth step, referring to FIG. 7, a plurality of flexible substrates 30 are provided.

The flexible substrate 30 can be a single panel or a double panel. In this embodiment, a single panel is taken as an example for description. The plurality of flexible substrates 30 are in one-to-one correspondence with the plurality of good hard circuit board units in the rigid substrate 10 and have the same number.

Each of the flexible substrates 30 includes a flexible insulating layer 301, a third conductive wiring layer 302, and a cover film layer 303 which are sequentially attached. The cover film layer 303 includes a film layer 3031 and a glue layer 3032 for bonding the film layer 3031 to the surface of the third conductive circuit layer 302 and the flexible portion from the line gap of the third conductive circuit layer 302. The surface of the insulating layer 301. In this embodiment, the material of the film layer 3031 is the same as that of the flexible insulating layer 301, and is preferably a pure flexible resin material, such as a polyimide material, a polyester material, a polycarbonate material, etc. Can be bent.

Each of the flexible substrates 30 is artificially divided into a connected fourth region 310 and a fifth region 311, and the fourth region 310 corresponds to the second region 1042 of the rigid circuit board unit 104, and the fifth region 311 Corresponding to a portion of the first region 1041 of the rigid circuit board unit 104. Each of the flexible substrates 30 is substantially elongated, and the length of the flexible substrate 30 is smaller than the length of the entire rigid circuit board unit 104 in the extending direction of the flexible substrate 30. Greater than the length of the rigid circuit board unit 104 within the second region 1042. In each of the flexible substrates 30, the lines of the third conductive wiring layer 302 extend substantially along the extending direction of the flexible substrate 30. The cover film layer 303 is provided with at least one first cover film opening 3033 and at least one second cover film opening 3034, and the third conductive circuit layer 302 corresponding to the fourth region 310 is partially exposed to the first The cover film opening 3033 is formed to form a first electrical connection pad 3021. The third conductive circuit layer 302 corresponding to the fifth region 311 is partially exposed to the second cover film opening 3034 to form a second electrical connection pad. 3022. In this embodiment, the surface of the first electrical connection pad 3021 is further formed with a gold layer 305.

In the fifth step, referring to FIG. 8, a release film 31 is formed on each of the flexible substrates 30.

The release film 31 is formed on a surface of the cover film layer 303 corresponding to the fourth region 310 of each of the flexible substrates 30, and the cover is exposed to the first cover film opening 3033. The surface of the third conductive circuit layer 302, that is, the surface of the gold layer 305.

In the sixth step, referring to FIG. 9-10, the first and second films 20, 21 are respectively laminated on both sides of the rigid substrate 10, and a plurality of the films 10 are formed. The flexible substrate 30 is superposed on a side of the first film 20 away from the rigid substrate 10, and corresponds to a plurality of the hard circuit board units 104 of the good product one by one; two copper foils 40 are provided, and two a copper foil 40 covering the first and second films 20, 21, respectively, and the copper foil 40 on the first film 20 side also covers the flexible substrate 30; then pressing to make the first The second film 20, 21, the rigid substrate 10, and the plurality of the flexible substrates 30 are cured as a whole to form a rigid-flex substrate 50.

Specifically, the shape and size of the two copper foils 40 are the same as the shape and size of the rigid substrate 10. The release film 31 is attached to a portion of the first film 20 corresponding to the second region 1042. When stacked, the first and second films 20, 21 cover the first and second conductive wiring layers 101, 103 of the rigid substrate 10, respectively, and cover the first and second conductive wiring layers 101. The substrate layer 102 exposed by the line gap of 103, the first and second films 20, 21, the rigid substrate 10 and the two copper foils 40 are aligned, and each flexible substrate 30 is disposed correspondingly On the rigid rigid circuit board unit 104, the boundary line between the fourth and fifth regions 310, 311 of the flexible substrate 30 is superposed on the boundary line between the first region 1041 and the second region 1042. After pressing, the two films 20, 21 bond the rigid substrate 10, the flexible substrate 30 and the copper foil 40, and part of the gel of the film 20, 21 flows and fills the first to sixth The guide grooves 106, 107, 201, 202, 203, 204, and the rigid substrate 10 flowing and filled to the waste region 1043 between the copper foil 40 on the same side as the flexible substrate 30, thereby The copper foil 40 on the same side of the flexible substrate 30 is bonded to the first film 20 at a position corresponding to the scrap region 1043 and a portion of the first region 1041, that is, the copper foil 40 on the side of the flexible substrate 30. The position of the flexible substrate 30 is not bonded, and the position of the flexible substrate 30 corresponding to the second region 1042 is not bonded to the first film 20 due to the interval of the release film 31, but the copper foil 40 is still not present. And the flexible substrate 30 is lifted up. The copper foil 40 on the side of the first film 20 is electrically connected to the first conductive wiring layer 101 through at least one first conductive body 207, and the copper foil 40 on the second film 21 side passes at least one The second electrical conductor 214 is electrically connected to the second conductive circuit layer 103, and the second electrical connection pad 3022 of the flexible substrate 30 passes through at least one third electrical conductor in the first film 20 208 is electrically connected to the first conductive wiring layer 101.

The function of the copper foil is to form a conductive line in a subsequent step. In other embodiments, the copper foil 40 may be replaced with a release material, the release material is removed after pressing, and the addition is performed in a subsequent step. Processes such as the process directly form conductive lines on the film.

In the seventh step, referring to FIG. 11, the two copper foils 40 are respectively formed into a fourth conductive circuit layer 501 and a fifth conductive circuit layer 502. The fourth conductive circuit layer 501 is formed on the flexible substrate 30 side, and is electrically connected to the first conductive wiring layer 101 through the first conductive body 207.

The fourth conductive circuit layer 501 and the fifth conductive circuit layer 502 may be formed by an image transfer and etching process. Moreover, the fourth conductive wiring layer 501 and the fifth conductive wiring layer 502 are also formed at positions corresponding to the first region 1041.

In the eighth step, referring to FIG. 12-13, the first and second solder resist layers are respectively formed on the surfaces of the fourth conductive circuit layer 501 and the fifth conductive circuit layer 502 corresponding to the rigid circuit board unit 104 of each good product. 60, 70 to protect the fourth and fifth conductive circuit layers 501, 502, thereby forming a rigid rigid joint plate 80.

The first and second solder resist layers 60, 70 are also formed in the first region 1041, and the first solder resist layer 60 also covers the first exposed portion of the fourth conductive trace layer 501. A film 20, the second solder mask 70 also covers the second film 21 exposed from the line gap of the fifth conductive wiring layer 502. The first and second solder resist layers 60, 70 may also be formed with solder resist openings (not shown) to expose portions of the fourth and fifth conductive trace layers 501, 502 to form connections for other electronic components. Electrical contact pads (not shown).

Referring to FIG. 13, the rigid flexible bonding plate 80 of the contig is formed with a plurality of rigid flexible bonding plate units 801 (shown by broken lines in the figure) corresponding to the regions of the plurality of rigid circuit board units 104.

In the ninth step, referring to FIG. 1, the plurality of rigid-flex board units 801 are divided, and the portion of each of the good rigid-flex board units 801 corresponding to the scrap area 1043 is removed, and the second area 1042 is removed. Positioning the first and second films 20, 21 and the substrate layer 102, and then peeling off the release film 31 to expose the flexible substrate 30 corresponding to the second region 1042, thereby forming a plurality of the rigid-flex bonds Board 100.

Specifically, first, along the boundary between the first region 1041 and the second region 1042, the rigid flexible bonding plate 80 of the contig is cut from the second film 21 toward the first film 20. The first film and the second film 20, 21 and the substrate layer 102, wherein the cutting method may be a deep-cut type or a laser cutting method, etc., since the previous step has already corresponded to the substrate layer 102 and the two films 20, 21 A guide groove is formed at a position of a boundary line between the first and second regions 1041 and 1042, that is, a portion of the base material layer 102 containing the reinforcing material and the first and second films 20 and 21 are removed, and the guide grooves are corresponding to each of the guide grooves after the pressing step. The position has no reinforcing material but only the gel, and the gel is easier to cut than the reinforcing material, that is, the existence of the guiding groove makes the cutting of the step easier; afterwards, the boundary between the plurality of rigid-flex plate units 801 is taken. And removing the scrap region 801 of each good by the fishing type corresponding to the scrap area 1043. At this time, the first and second films 20, 21, the substrate layer 102 and the distance corresponding to the second area 1042 The film 31 can be separated from the flexible substrate 30 from To obtain a plurality of separate plate 100 of the rigid-flex.

The rigid-flex board and the manufacturing method thereof provided by the technical solution, the good flexible substrate 30 is formed on the outermost layer of the rigid flexible board, thereby avoiding adding a hard material on the poor flexible substrate; A good single-piece flexible substrate 30 is bonded to the rigid board unit 104 of the rigid substrate one by one, so that the cross-bonding of the good product and the defective product can be avoided, that is, the good flexible substrate can be avoided. 30 and the waste of the rigid circuit board unit 104 are good; and the various processes after the pressing are also performed only in the area corresponding to the good rigid circuit board unit 104, thereby reducing the waste of the process material used for the defective product.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧ rigid-flex board

102‧‧‧Substrate layer

101‧‧‧First conductive circuit layer

103‧‧‧Second conductive circuit layer

20‧‧‧First film

21‧‧‧Second film

30‧‧‧Flexible substrate

501‧‧‧fourth conductive layer

502‧‧‧ fifth conductive circuit layer

60‧‧‧First solder mask

70‧‧‧Second solder mask

301‧‧‧Flexible insulation

302‧‧‧ Third conductive circuit layer

303‧‧ ‧ cover film

3031‧‧‧ film layer

3032‧‧‧ glue layer

3033‧‧‧First cover film opening

3034‧‧‧Second cover film opening

3021‧‧‧First electrical connection pad

3022‧‧‧Second electrical connection pad

105‧‧‧Electrical hole

10‧‧‧hard substrate

104‧‧‧Hard circuit board unit

1043‧‧‧ scrap area

1041‧‧‧First area

1042‧‧‧Second area

106‧‧‧First channel

107‧‧‧Second guiding channel

201‧‧‧3rd guide channel

202‧‧‧fourth guide channel

203‧‧‧5th guide channel

204‧‧‧6th guide channel

205‧‧‧ first through hole

213‧‧‧Second through hole

206‧‧‧ third through hole

207‧‧‧First conductor

214‧‧‧Second conductor

208‧‧‧ Third conductor

310‧‧‧ fourth area

311‧‧‧ Fifth Area

305‧‧‧ gold layer

31‧‧‧ release film

40‧‧‧ copper foil

50‧‧‧ rigid-flex substrate

80‧‧‧Continuous rigid-flex board

801‧‧‧ rigid-flex board unit

no.

100‧‧‧ rigid-flex board

102‧‧‧Substrate layer

101‧‧‧First conductive circuit layer

103‧‧‧Second conductive circuit layer

20‧‧‧First film

21‧‧‧Second film

30‧‧‧Flexible substrate

501‧‧‧fourth conductive layer

502‧‧‧ fifth conductive circuit layer

60‧‧‧First solder mask

70‧‧‧Second solder mask

301‧‧‧Flexible insulation

302‧‧‧ Third conductive circuit layer

303‧‧ ‧ cover film

3033‧‧‧First cover film opening

3034‧‧‧Second cover film opening

3021‧‧‧First electrical connection pad

3022‧‧‧Second electrical connection pad

105‧‧‧Electrical hole

207‧‧‧First conductor

214‧‧‧Second conductor

208‧‧‧ Third conductor

305‧‧‧ gold layer

Claims (14)

A method for manufacturing a rigid-flex plate, comprising the steps of:
Providing a rigid substrate, the rigid substrate comprises a plurality of connected rigid circuit board units, and each of the good hard circuit board units is divided into the connected first area and the second area;
Providing a film having the same shape and size as the shape and size of the rigid substrate;
Providing a plurality of single-piece flexible substrates, each of which corresponds to a good rigid circuit board unit;
Passing a plurality of good flexible substrates through the film to the outermost side of the rigid substrate, thereby obtaining a rigid-flexed version of the contig; wherein the film is substantially aligned with the rigid substrate, each of which is The flexible substrate is press-fitted to the second region of the corresponding rigid rigid circuit board unit and the portion of the first region, and the rigid flexible bonding plate of the connecting piece forms a plurality of rigid-flexible joints corresponding to each of the good rigid circuit board units. a board unit; and a hard board unit and a film that divides the plurality of rigid-flex unit units and removes good products corresponding to each of the second areas, thereby exposing a partial area of each flexible substrate, thereby A plurality of rigid-flex bonded plates are obtained. The method of manufacturing the rigid-flex board according to claim 1, wherein the rigid substrate comprises a substrate layer and a first conductive line formed on one side of the substrate layer and formed only in the first region a layer, each of the flexible circuit substrates includes a third conductive circuit layer, after a plurality of good flexible substrates are pressed through the film to the first conductive circuit layer side of the rigid substrate, The first conductive circuit layer and the third conductive circuit layer are electrically connected by at least one electrical conductor penetrating through the film. The manufacturing method of the rigid-flex board according to claim 1, wherein after the plurality of good flexible substrates are pressed against the first conductive wiring layer side of the rigid substrate by the film, A step of forming a fourth conductive wiring layer on a surface of the film away from the rigid substrate, wherein the fourth conductive wiring layer is formed on the film corresponding to the first region and is not attached The surface of the flexible substrate. The method for producing a rigid-flex board according to the above aspect, wherein, when a plurality of good flexible substrates are pressed against the first conductive wiring layer side of the rigid substrate by the film, Pressing a copper foil against the surface of the film away from the rigid substrate, so that the copper foil is bonded to a position of the film corresponding to the first region and not attached to the flexible substrate, Thereafter, the copper foil is formed to form the fourth conductive wiring layer. The method for manufacturing a rigid-flex board according to claim 1, wherein the plurality of rigid-flex unit units are divided, and the hard board unit and the film corresponding to each of the second areas are removed. The step of: first cutting the film from a side of the splicing rigid-flex board away from the flexible substrate along a boundary line between the first area and the second area; The boundary line of the good hard circuit board unit is cut; then the hard circuit board unit and the film at the corresponding area of the second area are taken out. The method of manufacturing a rigid-flex board according to claim 5, wherein before the plurality of good flexible substrates are pressed by the film to the first conductive layer layer side of the rigid substrate, Forming a release film between each of the flexible substrate and the film, and the release film is disposed on a surface of the flexible substrate corresponding to the second region, After the second region corresponds to the good hard circuit board unit and the film, the release film is removed to expose a portion of each flexible substrate corresponding to the second region. The manufacturing method of the rigid-flex board according to the item 5, wherein the plurality of good flexible substrates are pressed by the film before the first conductive circuit layer side of the rigid substrate, and further includes The step of forming a plurality of penetrating first guiding grooves on the rigid substrate, each of the first guiding grooves being formed at a boundary between the first region and the second region. The manufacturing method of the rigid-flex board according to claim 7, wherein the plurality of good flexible substrates are pressed by the film before the first conductive circuit layer side of the rigid substrate, and further includes The step of forming a plurality of penetrating third guide grooves on the film, each of the third guide grooves corresponding to one of the first guide grooves. The method for fabricating a rigid-flex board according to claim 8, wherein a plurality of penetrating second guides are formed on the rigid substrate when a plurality of first guiding grooves are formed on the rigid substrate. a groove, each of the second guide grooves being formed at a boundary between the second region and the scrap region; and forming a plurality of third guide grooves penetrating through the film, further forming on the film a fourth through slot, each of the fourth guide slots corresponding to one of the second guide slots. A rigid-flex bonding plate comprising a substrate layer, a first conductive circuit layer formed on one side of the substrate layer, a film formed on a side of the first conductive circuit layer away from the substrate layer, formed on the film away from a fourth conductive circuit layer in a surface portion of the base material layer and a flexible substrate on an outermost side of the rigid flexible bonding plate, the film having substantially the same shape and size as the substrate layer And the film is substantially aligned with the substrate layer, one end of the flexible substrate is attached to a portion of the film away from the surface of the substrate layer, and the other end extends out of the film. The rigid-flex board according to claim 10, wherein the flexible substrate comprises a flexible insulating layer, a third conductive circuit layer and a cover film layer which are sequentially attached; the flexible substrate a first cover film opening is formed on the cover film layer corresponding to a region adjacent to the second film, and a second cover film opening is formed on the cover film layer corresponding to a region extending from the second film Part of the third conductive circuit layer is exposed to the first cover film opening to form a first electrical connection pad, and a portion of the third conductive circuit layer is exposed to the second cover film opening to form a second electrical a connection pad; the cover film layer around the second cover film opening of the flexible substrate, the second electrical connection pad, and the portion of the line gap exposed from the third conductive circuit layer The flexible insulating layer is formed substantially in a plurality of steps so as to be in contact with the first film, and the flexible insulating layer is away from the substrate layer than the cover film layer. The rigid flexible bonding board of claim 11, wherein the fourth conductive circuit layer is electrically connected to the first conductive circuit layer through at least one first electrical conductor in the first film, the The first electrical connection pads of the three conductive circuit layers are electrically connected to the first conductive circuit layer through at least one third electrical conductor in the first film. The rigid flexible bonding board of claim 11, wherein the first electrical connection pad is exposed to the outside, and the first electrical contact pad surface is formed with a gold layer. The rigid-flex board according to claim 10, further comprising a first solder resist layer formed on a surface of the fourth conductive circuit layer.