TWI469705B - Rigid-flexible printed circuit board and method for manufacturing same - Google Patents

Description

Soft and hard combined circuit board and manufacturing method thereof

The present invention relates to the field of circuit board manufacturing, and in particular, to a soft and hard combined circuit board and a manufacturing method thereof.

Printed circuit boards have been widely used due to their high assembly density. For application of the board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans On Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.

The hard and soft bonding circuit board is a circuit board structure including a flexible circuit board and a rigid circuit board which are connected to each other, and can have both the flexibility of the flexible circuit board and the hardness of the rigid circuit board. In the manufacturing process of the soft and hard circuit board, the material of the hard circuit board is sequentially layered and added on the flexible circuit board, and the flexible circuit board part and the hard circuit board part are connected by the through hole/buried hole/blind hole. Turn on. However, the method of sequentially adding layers is to add a layer of a rigid circuit board after the flexible circuit board is completed, which takes a long time, and the soft and hard combined circuit board is inefficient.

A method for fabricating a hard and soft combination circuit board, comprising the steps of: providing a flexible circuit board comprising a first substrate layer, a first conductive line pattern and a second cover film, the first substrate layer having an opposite first surface And a second surface, the first conductive trace pattern is disposed on the first surface, the second cover film covers the second surface, the flexible circuit board includes a first product region, and the first product region has a connected exposed region And a first nip region, the first nip has a plurality of first through holes; a surface of the second cover film of the flexible circuit board is attached with a strong sheet to support and protect the flexible circuit board, the reinforcing sheet includes a second a product area, the second product area includes an adjacent third pressing area and a first opening, the third pressing area is attached to the first pressing area, the first opening exposing the exposed area; providing rigidity a circuit board, the rigid circuit board includes a second substrate layer and a fourth conductive line pattern disposed on a surface of the second substrate layer, the rigid circuit board including a third product area corresponding to the first product area, the third product area Have adjacent a fifth pressing area corresponding to the exposed area; and a film having a third opening corresponding to the exposed area on the rigid circuit board to cover the fourth conductive line pattern surface And exposing a surface of the rigid circuit board from the fourth conductive line pattern, and exposing a portion of the fourth conductive line pattern to form a plurality of fourth connection terminals; and printing a conductive paste on the surface of the plurality of fourth connection terminals, each fourth The connecting terminal and the conductive paste printed on the surface thereof form a connecting protrusion; and align and press the rigid circuit board, the flexible circuit board and the reinforcing sheet, so that the first pressing area and the fifth pressing area are bonded to each other through the film, The material of the film is filled in the plurality of first through holes by the pressing force and adhered to the reinforcing sheet through the plurality of first through holes, and the exposed area is exposed by the first opening and the third opening, and each Each of the connection protrusions is electrically connected to the first conductive line pattern.

A combination of a soft and hard circuit board, including a flexible circuit board, a reinforcing sheet, a rigid circuit board, and a film. The flexible circuit board includes a first base layer, a first conductive trace pattern, and a second cover film, the first base layer having opposite first and second surfaces, the first conductive trace pattern being disposed on the first surface The second cover film covers the second surface, the flexible circuit board includes a first product area, the first product area has a connected exposed area and a first nip area, the first nip area has a plurality of first The through hole, the first conductive line pattern of the first nip has a plurality of first connection terminals. The reinforcing sheet includes a second product area, the second product area includes an adjacent third pressing area and a first opening, and the third pressing area of the reinforcing sheet is attached to the first pressing area, the first An opening exposes one side of the exposed area. The rigid circuit board includes a second substrate layer and a fourth conductive line pattern disposed on a surface of the second substrate layer, the rigid circuit board including a third product area corresponding to the first product area, the third product area having an adjacent a fifth pressing area corresponding to the exposed area, the second conductive line pattern having a plurality of fourth connecting terminals corresponding to the plurality of first connecting terminals, each fourth The surface of the connection terminal is printed with a conductive paste, and each of the fourth connection terminals and the conductive paste on the surface thereof constitute a connection bump. The film has a third opening corresponding to the exposed area, which bonds the first conductive line pattern of the first nip and the fourth conductive line pattern, and the other side of the exposed area is exposed from the second opening and the third opening The film has a plurality of sixth through holes corresponding to the plurality of first connecting terminals, and each of the connecting protrusions is electrically connected to a corresponding first connecting terminal through a corresponding sixth through hole, the film extending to the The first through hole is adhered to the reinforcing plate by the first through hole.

In the manufacturing method of the soft and hard combined circuit board of the embodiment, the flexible circuit board and the rigid circuit board can be simultaneously fabricated, and then pressed together to form a soft and hard combined circuit board, which takes a short time, and the manufacturing efficiency of the soft and hard combined circuit board is effective. improve.

Referring to FIG. 1 , a first embodiment of the present invention provides a method for fabricating a soft and hard combined circuit board, including the following steps:

In the first step, referring to Figures 1 and 2, a flexible circuit board 110 is provided.

The flexible circuit board 110 is a circuit board on which conductive lines are formed. In this embodiment, the flexible circuit board 110 is a double-sided circuit board. The flexible circuit board 110 includes a first base layer 111, a first conductive trace pattern 112, a second conductive trace pattern 113, a first cover film 116, and a second cover film 117. The first base layer 111 is a flexible resin layer such as Polyimide (PI), Polyethylene Terephthalate (PET) or Polythylene Naphthalate (Polythylene Naphthalate). PEN). The first base layer 111 includes an opposite first surface 1111 and a second surface 1112. The first conductive trace pattern 112 is formed on the first surface 1111 of the first base layer 111, and the second conductive trace pattern 113 is formed on the first base layer. The second surface 1112 of the 111. The first conductive line pattern 112 and the second conductive line pattern 113 may be formed by selective etching of a copper layer.

It can be understood that the flexible circuit board 110 can also be a single panel. Of course, the flexible circuit board 110 can also be a multi-layer board with more than two layers of conductive lines, that is, the first base layer 111 can be a multi-layer substrate, including a plurality of layers of resin layers and a plurality of layers of conductive lines.

The flexible circuit board 110 includes a first product zone 119 and a first waste zone 118 that is coupled around the first product zone 119. The first product area 119 has an exposed area 114 and a first pressing area 115a and a second pressing area 115b connected to opposite sides of the exposed area 114. The first waste area 118 is formed in the exposed area 114 and the first pressure. The periphery of the junction 115a and the second nip 115b. The first waste area 118 is used to protect the exposed area 114, the first nip 115a and the second nip 115b during the fabrication of the soft and hard bonded circuit board, and is removed after the hard and soft bonded circuit board is completed. The exposed area 114 is used to form a bending zone of the hard and soft bonding circuit board, and the first pressing area 115a and the second pressing area 115b are used for fixed connection with the rigid circuit board. A first conductive trace pattern 112 and a second conductive trace pattern 113 are distributed in the exposed region 114, the first nip 115a, and the second nip 115b.

The first conductive line patterns 112 in the first nip 115a and the second nip 115b respectively have a plurality of lines and a plurality of first connection terminals 1122. In this embodiment, the number of the first connection terminals 1122 in the first nip 115a and the second nip 115b is two. The first connection terminal 1122 is for electrically conducting with a circuit layer of a rigid circuit board, and the first connection terminal 1122 is generally a pad.

Figure 1 only schematically depicts that the line patterns in the first nip 115a and the second nip 115b do not depict the line pattern in the exposed region 114, as will be understood by those skilled in the art, the first nip 115a The circuit pattern in the second nip 115b may have other designs, and the line pattern in the exposed area 114 may be designed according to actual needs, and generally includes a plurality of lines. FIG. 2 only schematically depicts the first connection terminal 1122 of the first conductive trace pattern 112, and does not depict the complete trace pattern of the first conductive trace pattern 112. As will be understood by those skilled in the art, the first conductive trace pattern 112 The circuit pattern in the design can be designed according to actual needs, and generally includes a plurality of lines.

The first cover film 116 covers the exposed area 114 and a portion of the first conductive line pattern 115a adjacent to the exposed area 114 and a portion of the first conductive line pattern 115b and the first conductive line pattern 112 The first surface 1111 of the exposed first substrate layer 111 is 112. The first cover film 116 completely covers the exposed area 114. The first cover film 116 is spaced apart from the edge of the first nip 115a away from the exposed area 114 by a distance from the edge of the first nip 115a away from the exposed area 114, thereby exposing the first press. The first connection terminal 1122 and a portion of the first surface 1111 in the region 115a. The first cover film 116 is spaced apart from the edge of the first nip area away from the exposed area 114 by a distance from the edge of the first nip area away from the exposed area 114, thereby exposing the second nip area. A first connection terminal 1122 and a portion of the first surface 1111 in 115b. In this embodiment, the first cover film 116 completely covers one side of the exposed area 114 and partially covers the same side of the first nip 115a and the second nip 115b. The second cover film 117 completely covers the surface of the second conductive trace pattern 113 and the second surface 1112 of the first base layer 111 exposed from the second conductive trace pattern 113. Generally, the first cover film 116 and the second cover film 117 are solder resist layers, and may be formed by a method of screen printing solder resist ink or a method of directly bonding a solder resist film.

The first nip 115a of the flexible circuit board 110 further has a plurality of first through holes 1201 penetrating the first base layer 111 and the second cover film 117, and the second nip 115b further has a plurality of first through holes. The layer 111 and the second through hole 1202 of the second cover film 117. The first through hole 1201 is disposed in a region where the first conductive line pattern 115a is not disposed with the first conductive line pattern 112 and the second conductive line pattern 113, and the second through hole 1202 is disposed in the second pressing area 115b. The areas of the first conductive line pattern 112 and the second conductive line pattern 113, that is, the positions of the first through hole 1201 and the second through hole 1202 and the first conductive line pattern 112 and the second conductive line pattern 113 are offset from each other, first The through hole 1201 and the second through hole 1202 avoid the positions where the lines of the first conductive line pattern 112 and the second conductive line pattern 113 of the first surface 1111 and the second surface 1112 are located. In addition, the first cover film 116 does not cover the first through hole 1201 and the second through hole 1202. In this embodiment, the first through hole 1201 and the second through hole 1202 have a circular cross section. Of course, the cross section of the first through hole 1201 and the second through hole 1202 may have other shapes, and This embodiment is limited. In this embodiment, the first through hole 1201 and the second through hole 1202 may be fabricated by a mechanical drilling or a laser drilling drilling process.

It can be understood that the first cover film 116 can only completely cover the first conductive line pattern 112 in the exposed area 114 and the first surface 1111 exposed from the first conductive line pattern in the exposed area 114 without extending. To the first nip 115a and the second nip 115b.

In the second step, referring to Figures 3 and 4, a reinforcing sheet 22 is provided. The reinforcing sheet 22 includes a second product area 221 and a second waste area 222 connected around the second product area 221. The second product area 221 has a first opening 223 corresponding to the exposed area 114 and two in the first opening 223. a third nip area 224 and a fourth nip area 225 corresponding to the first nip area 115a and the second nip area 115b, respectively, the second waste area 222 is formed in the first opening 223, the third pressing The area 224 and the fourth nip area 225 are peripheral. The second scrap area 222 has the same contour shape and size as the first scrap area 118, and is used to connect and protect the second product area 221 during the hard and soft board manufacturing process, and is completed after the soft and hard board is completed. Remove. The shape and size of the first opening 223 are the same as the shape and size of the exposed region 114. The third pressing area 224 is provided with a plurality of third through holes 226 corresponding to the plurality of first through holes 1201. The fourth pressing area 225 is provided with a plurality of fourth corresponding to the plurality of second through holes 1202. Through hole 227.

The material of the reinforcing sheet 22 may be PI, a glass fiber laminate or a metal such as copper or the like. In this embodiment, the third through hole 226 and the fourth through hole 227 are both circular in cross section, and the third through hole 226 has the same cross-sectional diameter as the corresponding first through hole 1201, and the fourth through hole 227 is the same. The cross-sectional diameter is the same as the corresponding second through hole 1202. The third through hole 226 and the fourth through hole 227 may be fabricated by a mechanical drilling or a laser drilling process.

In the third step, referring to FIG. 5, the reinforcing sheet 22 is attached to the surface of the second cover film 117 of the flexible circuit board 110. The third nip 224 completely covers the first nip 115a. The fourth nip 225 completely covers the second nip 115b. Each of the third through holes 226 is connected to a corresponding first through hole 1201. Each of the fourth through holes 227 is in communication with a corresponding second through hole 1202. The exposed area 114 is exposed from the first opening 223, and the second waste area 222 and the first waste area 118 are stacked on each other.

The reinforcing sheet 22 can be attached to the surface of the second cover film 117 of the flexible circuit board 110 by glue or film.

In the fourth step, please refer to FIG. 6 and FIG. 7 together to provide a rigid circuit board 120. The rigid circuit board 120 includes a third product area 129 and a third waste area 127 connected around the third product area 129, the third product area 129 having a second opening 128 corresponding to the exposed area 114 and a second opening 128 Two fifth nips 126 on the two sides corresponding to the first nip 115a and the second nip 115b, respectively, are formed on the periphery of the second opening 128 and the fifth nip 126. The third scrap area 127 has the same contour shape and size as the first scrap area 118, and is used to connect and protect the product area during the fabrication of the hard and soft bonded circuit board, and is removed after the hard and soft bonded circuit board is completed. The shape and size of the second opening 128 are the same as the shape and size of the exposed region 114.

The rigid circuit board 120 includes a second base layer 121, a third conductive trace pattern 122, a fourth conductive trace pattern 123, and a third cover film 124. The second base layer 121 is a hard resin layer such as an epoxy resin, a fiberglass cloth, or the like. The second substrate layer 121 includes an opposite third surface 1211 and a fourth surface 1212. The third conductive trace pattern 122 is formed on the third surface 1211. The fourth conductive trace pattern 123 is formed on the fourth surface 1212. The third conductive line pattern 122 and the fourth conductive line pattern 123 may be formed by selective etching of a copper layer. The third conductive line pattern 122 and the fourth conductive line pattern 123 are electrically connected to each other through the plurality of via holes 125. The third conductive line pattern 122 has a plurality of lines and a plurality of third connection terminals 1222. In this embodiment, the third connection terminal 1222 is located at one end opening of the via hole 125, and the third connection terminal 1222 and the via hole are 125 one-to-one correspondence. It can be understood that the via hole 125 can also be connected to other portions of the third conductive line pattern 122 without being connected to the third connection terminal 1222. The fourth conductive line pattern 123 has a fourth connection terminal 1232. In this embodiment, the fourth connection terminal 1232 is located at the other end opening of the via hole 125. The number and position of the fourth connection terminal 1232 are connected to the first connection. The number and position of the terminals 1122 respectively correspond to be electrically connected to the first connection terminal 1122. The third conductive line pattern 122 and the fourth conductive line pattern 123 in FIG. 6 only schematically depict the third connection terminal 1222 and the fourth connection terminal 1232. As will be understood by those skilled in the art, the third conductive line pattern 122 and The fourth conductive line pattern 123 may also have other designs and is not limited to the structure shown in FIG.

The via hole 125 may be formed before selectively etching the copper layer to form the third conductive line pattern 122 and the fourth conductive line pattern 123. The via hole 125 may be formed by: forming a through hole by a mechanical drilling process Forming a copper layer of the third conductive line pattern 122, a second base layer 121, and a through hole for forming a copper layer of the fourth conductive line pattern 123; depositing a conductive material on the sidewall of the via hole by electroplating; filling the via hole a via material; and a conductive material is deposited again on the surface of the plug material to form the via 125. Of course, as shown in FIG. 14 , the via hole 125 can also be replaced with a blind via hole 125 a , which can be formed by using a laser drilling process to form only the fourth conductive line pattern 123 for forming. The copper layer and the second substrate layer 121 do not penetrate the blind holes for forming the copper layer of the third conductive line pattern 122; the conductive material is deposited on the walls of the blind via holes by electroplating, thereby forming the blind via holes 125a. As shown in FIG. 15, the blind via hole 125a may further fill the plug hole material in the blind via hole 125a, and deposit a conductive material on the surface of the plug hole material to form a blind via hole 125b having a hole filling material.

The third cover film 124 covers the surface of the third conductive line pattern 122 and the third surface 1211 of the second base layer 121 exposed from the third conductive line pattern 122, partially covering the third conductive line pattern 122, exposing the third The third connection terminal 1222 of the conductive line pattern 122. That is, the third cover film 124 is formed with a plurality of fifth through holes 1241 corresponding to the region of the plurality of third connection terminals 1222, and each of the third connection terminals 1222 is exposed from a corresponding fifth through hole 1241. In this embodiment, the third cover film 124 does not cover the second opening 128 of the rigid circuit board 120 and partially covers the same side of the rigid circuit board 120. Generally, the third cover film 124 is a solder resist layer, which is formed after the via hole 125, the third conductive line pattern 122, and the fourth conductive line pattern 123 are completed. The third cover film 124 can be screen printed. A method of soldering ink or a method of directly bonding a solder mask is formed.

In this embodiment, the rigid circuit board 120 is a rigid circuit board including two layers of conductive lines. It can be understood that the rigid circuit board 120 can also be a multi-layer rigid circuit board with more than two layers of conductive lines, that is, the second base layer 121 can be a multi-layer substrate, including alternating layers of resin layers and multiple layers of conductive lines.

In the fifth step, referring to FIG. 8, the film 140 and the protective film 150 are sequentially attached to the fourth conductive line pattern 123 of the rigid circuit board 120.

The film 140 can be made of a less fluid type 2116 type prepreg. The protective film 150 is used to protect the film 140 before the film 140 is attached to the flexible circuit board 110. The protective film 150 may be a protective release film, and the material thereof may be PET. A third opening 1401 corresponding to the exposed area 114 is opened in the film 140 and the protective film 150.

In a sixth step, referring to FIG. 9, a sixth through hole 142 is formed through the laser drilling method through the film 140 and the protective film 150. The number and position of the sixth through hole 142 are respectively opposite to the fourth connecting terminal 1232. Correspondingly, the sixth through hole 142 exposes the fourth connection terminal 1232.

After the laser drilling, a step of cleaning the hole wall of the sixth through hole 142 and the surface of the rigid circuit board 120 is also required to erase the debris remaining on the surface of the circuit board and the wall of the hole.

In the seventh step, please refer to FIG. 10, the conductive via paste is filled in the sixth via hole 142, and the conductive paste is cured, and the protective film 150 is removed, thereby forming a fourth connection terminal 1232 in the sixth through hole 142. A connection bump 143 composed of a conductive paste printed on the surface thereof.

The conductive paste may be a copper conductive paste, a silver conductive paste or other paste conductive material having a low electrical resistivity, and generally includes a resin, a curing agent, and a conductive powder mixed in the resin. Since the conductive paste is relatively viscous and has a certain fluidity, the conductive paste can be printed in a predetermined place by screen printing, thereby forming a solid conductive material by curing the conductive paste. The conductive paste may be filled into the surface of the fourth connection terminal 1232 in the sixth through hole 142 by screen printing, thereby forming the connection protrusion 143: providing a screen, the pattern of the screen and the sixth The through holes 142 correspond to each other; the conductive paste is scraped from the pattern on the screen to the surface of the fourth connection terminal 1232 in the sixth through hole 142 by a doctor blade, and after the conductive paste is further cured, the connection protrusion 143 is formed. When the via holes 125 are replaced with the blind via holes 125a as shown in FIG. 14, when the conductive paste is filled in this step, the conductive paste is also filled in the blind via holes 125a.

In this embodiment, the connection protrusion 143 is equal to the thickness of the film 140. It can be understood that the thickness of the connecting protrusion 143 can also be larger or smaller than the thickness of the film 140, and is not limited to the embodiment.

In an eighth step, referring to FIG. 11, a first spacer 18 corresponding to the shape of the exposed region 114, and a second spacer 20 and a third pad respectively corresponding to the shapes of the rigid circuit board 120 and the reinforcing sheet 22 are provided. Slice 21.

The first spacer 18, the second spacer 20, and the third spacer 21 are each made of a peelable film. The thickness of the first spacer 18 is substantially equal to the thickness and thickness of the rigid circuit board 120 and the film 140. The cross section of the first spacer 18 should be smaller than the cross section of the exposed region 114. For example, when the exposed area 114 is rectangular, the shape of the first spacer 18 is also rectangular, but the length of the first spacer 18 is 50 micrometers to 100 micrometers smaller than the length of the exposed region 114, and the width ratio of the first spacer 18 is The width of the exposed region 114 is as small as 50 microns to 100 microns. The second spacer 20 has the same shape and the same size as the rigid circuit board 120, and the third spacer 21 and the reinforcing sheet 22 have the same shape and are equal in size.

In the ninth step, referring to FIG. 12, the second spacer 20, the rigid circuit board 120, the flexible circuit board 110, the reinforcing sheet 22 and the third spacer 21 are sequentially aligned and pressed to make the first of the flexible circuit board 110 The nip 115a and the second nip 115b are bonded to the two fifth nips 126 by the film 140, respectively. The second opening 128 of the rigid circuit board 120 communicates with the third opening 1401 of the film 140, and the first spacer 18 is received in the second opening 128 and the third opening 1401.

When the first spacer 18 is received in the second opening 128 and the third opening 1401 of the rigid circuit board 120, the first spacer 18 should be placed at the center of the exposed region 114 of the flexible circuit board 110, thereby making the first A spacer 18 has a gap between the rigid circuit board 120 and the film 140. In addition, the third scrap area 127 of the rigid circuit board 120, the first waste area 118 of the flexible circuit board 110, and the second waste area 222 of the reinforcing sheet 22 are aligned with each other and sequentially stacked.

After being pressed, the conductive paste material in the connection protrusion 143 is bonded to the first connection terminal 1122 of the first conductive line pattern 112 under the force of the pressing force and electrically connected to each other. The film 140 is filled in the gap between the first conductive line pattern 112 in the first nip 115a and the second nip 115b by the pressing force, and is adhered to the surface of the first conductive line pattern 112. And a first surface 1111 exposing the first conductive trace pattern 112 in the first nip 115a and the second nip 115b. The film 140 is filled in the plurality of first through holes 1201 of the first nip 115a and the corresponding third through holes 226 and the plurality of second through holes 1202 of the second nip 115b under the action of the pressing force. And correspondingly communicating with the fourth through hole 227, and bonding with the inner walls of the first through hole 1201 and the third through hole 226 and the second through hole 1202 and the fourth through hole 227. Moreover, since the via holes are provided in the rigid circuit board 120, the layers of the rigid circuit board 120 and the flexible circuit board 110 can be electrically connected to each other.

In the tenth step, referring to FIG. 13, the second spacer 20, the third spacer 21 and the first spacer 18 are removed, and the third waste area 127 of the rigid circuit board 120 and the first waste area of the flexible circuit board 110 are removed. 118. The second scrap area 222 of the reinforcing sheet 22 and the film 140 correspond to portions of the third scrap area 127, thereby obtaining a soft and hard bonded circuit board 100.

Since the second spacer 20 and the third spacer 21 are peelable films, they can be easily peeled off from the rigid circuit board 120 and the reinforcing sheet 22. After the second spacer 20 is peeled off, the first spacer 18 can be exposed, so that the first spacer 18 can be taken out. The laminated structure 100a composed of the rigid circuit board 120, the film 140, the flexible circuit board 110, and the reinforcing sheet 22 may be cut along the boundary of the third scrap area 127 by laser cutting, thereby the third scrap area 127, The first waste zone 118, the second waste zone 222, and the film 140 are partially removed corresponding to the third waste zone 127.

It can be understood that after removing the first spacer 18, the second spacer 20 and the third spacer 21, the third waste area 127, the first waste area 118, the second waste area 222, and the film 140 are corresponding to the third. Before the portion of the waste region 127, the step of soldering the electronic component on the third connection terminal 1222 may be performed, and the third waste region 127, the first waste region 118, and the second portion are removed after the soft and hard circuit board 100 is completely formed. Waste area 222 and film 140 correspond to portions of the third waste area 127.

The soft-hard bonded circuit board 100 formed by the manufacturing method of the present embodiment includes a flexible region 102 formed by the exposed regions 114 of the flexible circuit board 110, and a rigid region 104 on opposite sides of the flexible region 102. In this embodiment, the flexible and hard-bonded circuit board 100 includes two rigid regions 104, wherein the rigid region 104 includes a first nip 115a of the flexible circuit board 110 at a central position and is disposed opposite to the first nip 115. One of the fifth pressing area 126 of the rigid circuit board 120 on both sides and the third pressing area 224 of the reinforcing sheet 22, and the other rigid area 104 includes the second pressing area 115b of the flexible circuit board 110 at the center position and The other fifth pressing area 126 of the rigid circuit board 120 and the fourth pressing area 225 of the reinforcing sheet 22 are disposed on opposite sides of the second pressing area 115b.

It can be understood that the manufacturing method of the soft and hard combined circuit board provided by the technical solution can also be used to fabricate the soft and hard combined circuit board of other structures, as shown in FIG. 16 to FIG. 18 , which are the second to sixth embodiments of the present invention. There are provided three other soft and hard bonded circuit boards which are fabricated using a method similar to the manufacturing method of the soft and hard bonded circuit board of the first embodiment.

As shown in FIG. 16, a second embodiment of the present invention provides a soft and hard circuit board 200. The structure of the hard and soft circuit board 200 is similar to that of the soft and hard circuit board 100. The difference is that the hard and soft circuit board is made. In combination with the circuit board 200, a rigid circuit board 120a is used as the hard circuit board 120 as shown in FIG. In the present embodiment, the conductive paste material of the connection bump 243 is filled in the blind via hole 125a.

As shown in FIG. 17, a third embodiment of the present invention provides a soft and hard combined circuit board 300. The structure of the soft and hard combined circuit board 300 is similar to that of the soft and hard combined circuit board 100, except that the soft and hard is made. When the circuit board 300 is combined, a rigid circuit board 120 is used as the rigid circuit board 120 as shown in FIG.

As shown in FIG. 18, a fourth embodiment of the present invention provides a soft and hard bonding circuit board 400. The number of the fifth pressing regions 126c in the rigid circuit board 120c for molding the hard and soft bonding circuit board 400 is only one. The first nip 115ca of the flexible circuit board 110c faces away from the side of the reinforcing sheet 22c. To protect the first conductive trace pattern 112c in the second nip 115cb, the first cover film 116c further extends throughout the second nip 115cb. That is, in the second nip 115cb, the first cover film 116c completely covers the first surface 1111c exposed from the first conductive trace pattern 112c, and partially covers the first conductive trace pattern 112c, exposing the first conductive trace pattern 112c The first connection terminal 1122c.

In the method for manufacturing a soft and hard circuit board according to the embodiment of the present invention, the flexible circuit board and the rigid circuit board can be simultaneously fabricated, and then pressed together to form a soft and hard combined circuit board, which takes a short time, and the manufacturing efficiency of the soft and hard combined circuit board is effectively effective. improve. In addition, the film material attached to the rigid circuit board is filled in the through hole formed in the flexible circuit board and the reinforcing sheet, so that the flexible circuit board and the rigid circuit board and the reinforcing sheet have stronger adhesive force, thereby forming a soft and hard combination. Board performance is more stable.

It can be understood that the reinforcing sheet 22 can also not open the third through hole 226 and the fourth through hole 227. At this time, the material of the film 140 directly contacts and adheres to the surface of the reinforcing sheet 22, and can also enhance the flexible circuit board. It has stronger adhesive force with the rigid circuit board and the reinforcing sheet, and is not limited to this embodiment.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

110,110c. . . Flexible circuit board

111. . . First substrate layer

112, 112c. . . First conductive line pattern

113. . . Second conductive line pattern

116,116c. . . First cover film

117. . . Second cover film

1111, 1111c. . . First surface

1112. . . Second surface

114. . . Exposed area

115a, 115ca. . . First nip

115b, 115cb. . . Second nip

118. . . First waste area

119. . . First product area

1122, 1122c. . . First connection terminal

1201. . . First through hole

1202. . . Second through hole

22,22c. . . Strengthening film

221. . . Second product area

222. . . Second waste area

223. . . First opening

224. . . Third nip

225. . . Fourth nip

226. . . Third through hole

227. . . Fourth through hole

120, 120a, 120b, 120c. . . Hard board

128. . . Second opening

129. . . Third product area

126, 126c. . . Fifth nip

127. . . Third waste area

121. . . Second base layer

122. . . Third conductive line pattern

123. . . Fourth conductive line pattern

124. . . Third cover film

1211. . . Third surface

1212. . . Fourth surface

125. . . Via

1222. . . Third connection terminal

1232. . . Fourth connection terminal

125a, 125b. . . Blind guide hole

1241. . . Fifth through hole

140. . . film

150. . . Protective film

1401. . . Third opening

142. . . Sixth through hole

143,243. . . Connection bulge

18. . . First gasket

20. . . Second gasket

twenty one. . . Third gasket

100,200,300,400. . . Soft and hard combined circuit board

102. . . Flexible zone

104. . . Rigid zone

100a. . . Cascading structure

1 is a cross-sectional view of a flexible circuit board according to a first embodiment of the present invention.

2 is a top plan view of the flexible circuit board of FIG. 1.

Figure 3 is a cross-sectional view of a reinforcing sheet according to a first embodiment of the present invention.

Figure 4 is a plan view of the reinforcing sheet of Figure 3.

Figure 5 is a cross-sectional view showing the reinforcing sheet of Figure 3 attached to the flexible circuit board of Figure 1.

Figure 6 is a cross-sectional view of a rigid circuit board provided by a first embodiment of the present invention.

Figure 7 is a top plan view of the rigid circuit board of Figure 6.

Figure 8 is a cross-sectional view showing the rigid circuit board of Figure 6 after attaching a film and a protective film.

Figure 9 is a cross-sectional view of the film and protective film on the rigid circuit board of Figure 8 after drilling.

Figure 10 is a cross-sectional view of the film of Figure 9 after filling the holes of the film on the rigid circuit board with the conductive paste and removing the protective film.

Figure 11 is a cross-sectional view of the first to third spacers provided by the embodiment of the present invention.

Fig. 12 is a cross-sectional view showing the flexible circuit board of Fig. 1, the reinforcing sheet of Fig. 3, the rigid circuit board of Fig. 6, and the first to third spacers of Fig. 11 being pressed together.

Figure 13 is a cross-sectional view showing the soft-hardened circuit board formed by removing the first to third pads of Figure 12 and the waste regions of the rigid circuit board, the flexible circuit board, and the reinforcing sheets.

Figure 14 is a cross-sectional view showing another embodiment of the rigid circuit board shown in Figure 6.

Figure 15 is a cross-sectional view showing still another embodiment of the rigid circuit board shown in Figure 6.

Figure 16 is a cross-sectional view showing a soft and hard bonded circuit board according to a second embodiment of the present invention.

Figure 17 is a cross-sectional view showing a soft-hardened circuit board according to a third embodiment of the present invention.

Figure 18 is a cross-sectional view showing a soft and hard bonded circuit board according to a fourth embodiment of the present invention.

120. . . Hard board

110. . . Flexible circuit board

140. . . film

twenty two. . . Strengthening piece

100a. . . Cascading structure

1232. . . Fourth connection terminal

143. . . Connection bulge

1122. . . First connection terminal

1401. . . Third opening

18. . . First gasket

128. . . Second opening

20. . . Second gasket

twenty one. . . Third gasket

Claims (24)

A method for manufacturing a soft and hard combined circuit board, comprising the steps of:
Providing a flexible circuit board comprising a first substrate layer, a first conductive line pattern and a second cover film, the first substrate layer having opposite first and second surfaces, the first conductive line pattern being disposed on The first surface, the second cover film covers the second surface, the flexible circuit board includes a first product area, the first product area has a connected exposed area and a first nip area, the first nip area Having a plurality of first through holes;
Attaching a strong sheet to the surface of the second cover film of the flexible circuit board to support and protect the flexible circuit board, the reinforcement sheet includes a second product area, and the second product area includes an adjacent third nip area and a An opening, the third nip is attached to the first nip, the first opening exposing the exposed area;
Providing a rigid circuit board, the rigid circuit board comprising a second substrate layer and a fourth conductive line pattern disposed on a surface of the second substrate layer, the rigid circuit board including a third product area corresponding to the first product area, the third The product area has an adjacent fifth pressing area and a second opening, the second opening corresponding to the exposed area;
Attaching a film having a third opening corresponding to the exposed area on the rigid circuit board to cover the surface of the fourth conductive line pattern and the surface of the rigid circuit board exposed from the fourth conductive line pattern, and exposing a portion Four conductive line patterns to form a plurality of fourth connection terminals;
Conductive paste is printed on the surface of the plurality of fourth connection terminals, each of the fourth connection terminals and the conductive paste printed on the surface thereof form a connection protrusion; and the rigid circuit board, the flexible circuit board and the reinforcement sheet are aligned and pressed so that The first nip area and the fifth nip area are bonded to each other by a film, and the material of the film is filled in the plurality of first through holes by the pressing force and adhered to the reinforcing sheet through the plurality of first through holes, the exposed area The first opening and the third opening are exposed, and each connecting protrusion is electrically connected to the first conductive line pattern. The manufacturing method of the soft-hardened circuit board of claim 1, wherein the first product area of the flexible circuit board further comprises a second nip area, the second nip area is connected to the exposed area and located at the The second nip has a plurality of second through holes; the second product region of the reinforcing sheet further includes a fourth nip region, and the fourth nip region and the exposed portion of the first nip region The first opening is adjacent to and located on a side of the first opening relative to the third nip, the fourth nip is attached to the second cover film surface of the second nip; the rigid circuit The third product zone of the plate includes two fifth press-fit zones, respectively corresponding to the first press-fit zone and the second press-fit zone, the second opening being located at the two fifth press-fits Between the regions, after aligning and pressing the rigid circuit board, the flexible circuit board and the reinforcing sheet, the first nip and the fifth nip are bonded to each other through the film, and the second nip and the other fifth The nip area is bonded to each other through the film, and the material of the film is further filled in the plural number under the action of the pressing force The two through holes are adhered to the reinforcing sheet through the plurality of second through holes. The manufacturing method of the soft-hardened circuit board of claim 1, wherein the third nip of the reinforcing sheet has a third through hole corresponding to the plurality of first through holes, and each of the third through holes Each of the first through holes is in communication with the corresponding first through hole. After the rigid circuit board, the flexible circuit board and the reinforcing sheet are aligned and pressed, the material of the film is further filled through the plurality of first through holes under the pressing force. The plurality of third through holes are bonded to the inner wall of the plurality of third through holes. The method of manufacturing the soft-hardened circuit board of claim 2, wherein the third nip of the reinforcing sheet has a third through hole corresponding to the plurality of first through holes, and each of the third through holes Each of the first through holes is in communication with the corresponding first through hole. After the rigid circuit board, the flexible circuit board and the reinforcing sheet are aligned and pressed, the material of the film is further filled through the plurality of first through holes under the pressing force. a plurality of third through holes are adhered to the inner wall of the plurality of third through holes; a fourth pressing portion of the reinforcing sheet has a fourth through hole corresponding to the plurality of second through holes, and each of the fourth through holes The through holes are connected to the corresponding one of the second through holes. After the rigid circuit board, the flexible circuit board and the reinforcing sheets are aligned and pressed, the material of the film is further filled through the plurality of second through holes by the pressing force. And forming a plurality of fourth through holes and bonding to the inner wall of the plurality of fourth through holes. The method of fabricating a soft-hardened circuit board according to claim 4, wherein the flexible circuit board further comprises a second conductive line pattern, the second conductive line pattern is disposed on the second surface, and the second cover film is completely covered. The second conductive line pattern surface and the second surface exposed from the second conductive line pattern, the positions of the plurality of first through holes and the plurality of second through holes and the positions of the first conductive line pattern and the second conductive line pattern They are staggered to expose the plurality of first through holes and the plurality of second through holes. The manufacturing method of the soft-hardened circuit board according to claim 1, wherein the reinforcing sheet is made of polyimide, glass fiber laminate or metal. The method of fabricating a soft-hard bonded circuit board according to claim 1, wherein the flexible circuit board further comprises a first waste area connected around the first product area, the reinforcing sheet further comprising a connection around the second product area. a second waste area, the rigid circuit board further comprising a third waste area connected around the third product area, after aligning and pressing the rigid circuit board, the flexible circuit board and the reinforcing piece, removing the first waste area, The second scrap zone, the third scrap zone, and the film correspond to portions of the third scrap zone. The method of manufacturing the soft-hardened circuit board of claim 1, wherein the first conductive line pattern of the first nip has a plurality of first connection terminals, the flexible circuit board further comprising a first cover film, a first cover film covering the first conductive trace pattern of the exposed region and a first surface exposed from the first conductive trace pattern in the exposed region; the second substrate layer having opposite third and fourth surfaces, the fourth a conductive line pattern is formed on the fourth surface, and the plurality of fourth connection terminals are in one-to-one correspondence with the plurality of first connection terminals. After the rigid circuit board, the flexible circuit board and the reinforcement sheet are aligned and pressed, each of the first connection terminals Electrically connected to a corresponding connection bump. The method of fabricating a soft-hardened circuit board according to claim 8, wherein the rigid circuit board further comprises a third conductive line pattern and a third cover film, the third conductive line pattern being formed on the third surface and passing The plurality of conductive holes are electrically connected to the fourth conductive line pattern, and the third cover film covers the third conductive line pattern surface and the third surface exposed from the third conductive line pattern. The method of fabricating a soft-hardened circuit board according to claim 1, wherein the first base layer is a single-layer flexible resin layer or a multi-layer substrate comprising a plurality of alternately arranged insulating layers and a plurality of conductive line patterns, the second The base layer is a single layer of a hard resin layer or a multilayer substrate including a plurality of alternately arranged insulating layers and a plurality of conductive line patterns. The method of fabricating a soft-hardened circuit board according to claim 1, wherein before the rigid circuit board, the flexible circuit board and the reinforcing sheet are aligned and pressed, a first spacer corresponding to the exposed area is further provided, a second gasket corresponding to the rigid circuit board and a third gasket corresponding to the reinforcing sheet, the first gasket when aligning and pressing the rigid circuit board, the flexible circuit board and the reinforcing sheet The second gasket is received in the first opening and the third opening, and the second gasket is attached to a side of the rigid circuit board away from the flexible circuit board, the third gasket and the side of the reinforcing sheet away from the flexible circuit board The second gasket, the third gasket and the first gasket are also removed after the rigid circuit board, the flexible circuit board and the reinforcing sheet are aligned and pressed. The method of manufacturing the soft-hardened circuit board of claim 11, wherein the thickness of the first spacer is equal to the sum of the thicknesses of the rigid circuit board and the first film, and the cross-sectional area of the first spacer is smaller than The cross-sectional area of the exposed region has a gap between the first spacer and an edge at the first opening of the rigid circuit board and an edge at the third opening of the first film. The method of fabricating a soft-hardened circuit board according to claim 8, wherein the first cover film completely covers only the first conductive line pattern in the exposed area and the exposed area from the first conductive line pattern in the exposed area. The first surface, the first conductive line pattern and the first surface in the first nip are exposed from the first cover film. The method for fabricating a soft-hardened circuit board according to claim 8, wherein the first cover film completely covers the first conductive line pattern in the exposed area and the first exposed conductive pattern in the exposed area a first conductive line pattern extending in a portion of the first nip and adjacent the exposed area and a first surface exposed from the first conductive line pattern in the partial area, the first A portion of the first conductive trace pattern and a portion of the first surface in the nip are exposed from the first cover film. A soft and hard combination circuit board, comprising:
a flexible circuit board comprising a first substrate layer, a first conductive trace pattern and a second cover film, the first substrate layer having opposite first and second surfaces, the first conductive trace pattern being disposed on the first surface The second cover film covers the second surface, the flexible circuit board includes a first product area, the first product area has a connected exposed area and a first nip area, and the first nip area has a plurality of a through hole, the first conductive line pattern of the first nip has a plurality of first connection terminals;
a reinforcing sheet comprising a second product area, the second product area comprising an adjacent third pressing area and a first opening, the third pressing area of the reinforcing sheet being attached to the first pressing area, The first opening exposes one side of the exposed area;
a rigid circuit board comprising a second substrate layer and a fourth conductive trace pattern disposed on a surface of the second substrate layer, the rigid circuit board comprising a third product region corresponding to the first product region, the third product region having a phase Adjacent fifth pressing area corresponding to the exposed area, the second conductive line pattern has a plurality of fourth connecting terminals corresponding to the plurality of first connecting terminals, each of the plurality The surface of the four connection terminals is printed with a conductive paste, and each of the fourth connection terminals and the conductive paste on the surface thereof constitute a connection protrusion;
a film having a third opening corresponding to the exposed area, the first conductive line pattern and the fourth conductive line pattern of the first nip area being bonded, and the other side of the exposed area is exposed from the second opening and the third opening The film has a plurality of sixth through holes corresponding to the plurality of first connecting terminals, and each of the connecting protrusions is electrically connected to a corresponding first connecting terminal through a corresponding sixth through hole, the film extending to the The first through hole is adhered to the reinforcing plate by the first through hole. The soft-hardened circuit board of claim 15, wherein the first product region of the flexible circuit board further comprises a second nip region, the second nip region being connected to the exposed region and located in the exposed region The second nip has a plurality of second through holes on one side of the first nip; the second product region of the reinforcing sheet further includes a fourth nip, the fourth nip and the first The opening is adjacent to and located on a side of the first opening relative to the third nip, the fourth nip is attached to the second cover film surface of the second nip; the hard circuit board The three product zone includes two fifth pressing zones respectively corresponding to the first pressing zone and the second pressing zone, the second opening being located between the two fifth pressing zones The film is bonded to the first conductive line pattern of the first nip and the fourth conductive line pattern of the fifth nip, and further bonding the first conductive line pattern of the second nip and another a fourth conductive line pattern of the nip region, the film material extending to the plurality of second through holes and passing through the complex The second through-hole in the reinforcing bonding sheet. The soft-hardened circuit board of claim 15, wherein the third nip of the reinforcing sheet has a third through hole corresponding to the plurality of first through holes, and each of the third through holes corresponds to A first through hole communicates with the material of the film extending from the first through hole into the plurality of third through holes and is adhered to the inner wall of the plurality of third through holes. The soft-hardened circuit board of claim 16, wherein the third nip of the reinforcing sheet has a third through hole corresponding to the plurality of first through holes, and each of the third through holes corresponds to a first through hole is connected, the material of the film further extends from the plurality of first through holes into the plurality of third through holes, and is adhered to the inner wall of the plurality of third through holes; The four nips have a fourth through hole corresponding to the plurality of second through holes, and each of the fourth through holes communicates with a corresponding one of the second through holes, and the material of the film is from the plurality of second through holes Further extending into the plurality of fourth through holes and bonding to the inner wall of the plurality of fourth through holes. The soft-hardened circuit board of claim 5, wherein the flexible circuit board further comprises a second conductive line pattern, the second conductive line pattern is disposed on the second surface, and the second cover film completely covers the second a surface of the conductive line pattern and a second surface exposed from the second conductive line pattern, the positions of the plurality of first through holes and the positions of the first conductive line pattern and the second conductive line pattern are offset from each other to expose the plurality of a through hole. The soft-hardened circuit board according to claim 15, wherein the reinforcing sheet is made of polyimide, glass fiber laminate or metal. The hard and soft circuit board of claim 15, wherein the rigid circuit board further comprises a third conductive line pattern and a third cover film, the third conductive line pattern is formed on the third surface and passes through the plurality of conductive holes And electrically connected to the fourth conductive line pattern, the third cover film covers the third conductive line pattern surface and the third surface exposed from the third conductive line pattern. The soft-hardened circuit board of claim 15, wherein the first base layer is a single-layer flexible resin layer or a multi-layer substrate comprising a plurality of alternately arranged insulating layers and a plurality of conductive line patterns, the second substrate layer being The single-layered hard resin layer is a multilayer substrate including a plurality of alternately arranged insulating layers and a plurality of conductive wiring patterns. The soft-hardened circuit board of claim 15, wherein the flexible circuit board further comprises a first cover film, the first cover film only completely covering the first conductive line pattern in the exposed area and the exposed area The first conductive line pattern exposes the first surface, and the first conductive line pattern and the first surface in the first nip are exposed from the first cover film. The soft-hardened circuit board of claim 15, wherein the flexible circuit board further comprises a first cover film, the first cover film completely covering the first conductive line pattern in the exposed area and the exposed area a first conductive line pattern exposed first surface, and a first conductive line pattern extending in a portion of the first nip area adjacent to the exposed area and a portion of the partial conductive area exposed from the first conductive line pattern The first surface, a portion of the first conductive trace pattern and a portion of the first surface in the first nip region are exposed from the first cover film.