JP2012230954A - Printed wiring board and printed wiring board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board, on which electronic components are mounted, which can increase manufacturing efficiency and cut down manufacturing costs and also makes it possible to manufacture printed wiring boards of various specifications efficiently, and a method for manufacturing the printed wiring board.SOLUTION: A printed wiring board 1 consists of a body section 10 including an electrode formation region K and an electronic component mounting section 20 composed of the electrode formation region K and an electronic component mounting region B, which sections are electrically connected together as one body. The electronic component mounting section 20 is, in part of the electrode formation region K, electrically connected to the electrode formation region K of the body section 10 via an anisotropic conductive adhesive 30, and also is folded back in the middle thereof so as to lay the electronic component mounting region B on top of the electrode formation region K.

Description

  The present invention provides a printed wiring board on which electronic components can be mounted. In addition to being able to realize high efficiency and low cost of manufacturing efficiency, the printed wiring board can efficiently manufacture printed wiring boards having various specifications. And a method of manufacturing the printed wiring board.

2. Description of the Related Art Conventionally, a printed wiring board on which electronic components are mounted generally forms an area for mounting electronic components on one board (hereinafter referred to as an electronic component mounting area) and other areas. there were.
In addition, from the viewpoint of manufacturing efficiency, such a conventional printed wiring board is generally manufactured by punching the outer shape of a plurality of printed wiring boards having the same shape from a single original plate with a press machine. Met.
As a prior art showing such a printed wiring board, for example, there is Patent Document 1 below.

JP 2004-281512 A

The above Patent Document 1 is an invention relating to a method for manufacturing an electronic device, and is a flexible that forms all of an area for mounting an electronic component (hereinafter referred to as an electronic component mounting area) on one substrate and other areas. A printed wiring board is disclosed.
Moreover, the process of manufacturing the external shape of a some flexible printed wiring board is disclosed by cut | disconnecting a large-sized insulating film in a predetermined location.
However, in such a conventional printed wiring board, since the outer shape of a plurality of printed wiring boards having the same shape is configured to be punched or cut from one original board, it can be cut from the original board. The number of sheets (the so-called number) is limited by the outer shape of the entire printed wiring board, and there is a problem that the manufacturing efficiency is poor.
In addition, since all of the electronic component mounting area and other areas are formed on a single board, even when changing the specifications of only the electronic component mounting area, for example, the entire specification is changed. There is a problem that printed wiring boards with various specifications cannot be efficiently manufactured.

  Accordingly, the present invention solves the above-mentioned conventional problems, and in the printed wiring board on which electronic components are mounted, it is possible to realize high efficiency and low cost of manufacturing efficiency, and to efficiently use printed wiring boards with various specifications. It is an object to provide a printed wiring board that can be manufactured well and a method for manufacturing the printed wiring board.

  The printed wiring board of the present invention is a printed wiring board in which a main body portion including an electrode formation region and an electronic component mounting portion including an electrode formation region and an electronic component mounting region are electrically connected together, The component mounting portion is electrically connected to the electrode forming region of the main body portion via an anisotropic conductive adhesive at the electrode forming region, and is folded back halfway to form the electronic component mounting region. The first feature is that it is provided so as to overlap the region.

According to the first aspect of the present invention, the printed wiring board is formed by integrally connecting the main body portion including the electrode formation region and the electronic component mounting portion including the electrode formation region and the electronic component mounting region. In the printed wiring board, the electronic component mounting portion is electrically connected to the electrode forming region of the main body portion via an anisotropic conductive adhesive at a portion of the electrode forming region, and folded in the middle thereof. Since the electronic component mounting region is provided so as to overlap the electrode forming region, the main body portion and the electronic component mounting portion are separated from each other in the manufacturing process by using the main body portion and the electronic component mounting portion as separate members. The original plate can be used. Therefore, the number of sheets that can be punched from the original plate (so-called number of picks) is not limited by the overall shape of the printed wiring board. Therefore, the number of sheets that can be punched from the original plate can be effectively increased, and the unnecessary portions of the original plate that are not used as printed wiring boards can be reduced. Therefore, it is possible to achieve high production efficiency and low production cost.
Even when only the specifications of the main body part or the electronic component mounting part are changed, it is only necessary to change the design of only one of them, and printed wiring boards with various specifications can be efficiently manufactured.
Further, by adopting a configuration in which the electronic component mounting area is provided so as to overlap the electrode forming area, the electronic component mounting area and the electrode forming area can be provided in the same area of the printed wiring board, thereby realizing space saving. be able to.
In addition, by using an anisotropic conductive adhesive, the thickness of the printed wiring board can be easily adjusted, good conductivity can be achieved in the thickness direction, and reliable insulation can be achieved in the surface direction. Can be secured.

  Further, in the printed wiring board of the present invention, in addition to the first feature of the present invention, the main body portion includes a projecting region formed by projecting a part of the outer periphery, and the electrode forming region is provided in the projecting region. The second feature is that it is provided.

According to the second feature of the present invention, in addition to the function and effect of the first feature of the present invention, the main body includes a projecting region formed by projecting a part of the outer periphery, and the projecting region. Since the electrode forming area is provided in the protruding area, the protruding area can be used as an electronic component mounting area.
Therefore, it is possible to give various functions to regions other than the projecting region in the main body portion, and it is possible to obtain a multifunctional printed wiring board.

  In addition to the first or second feature of the present invention, the printed wiring board of the present invention has a third feature that the electronic component mounting portion includes a terminal formation region electrically connected to the electronic component. It is said.

  According to the third feature of the present invention, in addition to the function and effect of the first or second feature of the present invention, the electronic component mounting portion includes a terminal formation region electrically connected to the electronic component. For this reason, the printed wiring board can be electrically connected to other electronic devices or the like through the terminal formation region, so that a more versatile printed wiring board can be obtained.

  Moreover, the manufacturing method of the printed wiring board of this invention is a manufacturing method of the printed wiring board of Claim 1, Comprising: The process of forming a main-body part provided with an electrode formation area, an electrode formation area, and an electronic component mounting area | region A step of forming an electronic component mounting portion, a step of preparing the main body portion, a step of preparing the electronic component mounting portion at a position facing the main body portion, an electrode formation region of the main body portion, and the electronic component A step of electrically connecting the electrode forming region of the mounting part via an anisotropic conductive adhesive, a step of arranging an adhesive on the surface of the electronic component mounting part opposite to the electrode forming region, and the electrode formation And a step of bonding the surface of the electronic component mounting portion with the adhesive in a state where the electronic component mounting portion is folded so that the region and the electronic component mounting region overlap each other. There.

According to the fourth aspect of the present invention, a printed wiring board manufacturing method according to claim 1, wherein the printed wiring board manufacturing method includes a step of forming a main body having an electrode forming region, and an electrode. A step of forming an electronic component mounting portion including a forming region and an electronic component mounting region; a step of disposing the main body portion; a step of disposing the electronic component mounting portion at a position facing the main body portion; and the main body portion. And electrically connecting the electrode forming region of the electronic component mounting portion and the electrode forming region of the electronic component mounting portion via an anisotropic conductive adhesive, and an adhesive on the surface of the electronic component mounting portion opposite to the electrode forming region. And a step of adhering the surface of the electronic component mounting portion via the adhesive in a state where the electronic component mounting portion is folded so that the electrode formation region and the electronic component mounting region overlap. Prepare From, by the main body and the electronic component mounting portion with another member, it is possible to form the main body and the electronic component mounting portion with a separate master plate. Therefore, the number of sheets that can be punched from the original plate (so-called number of picks) is not limited by the overall shape of the printed wiring board. Therefore, the number of sheets that can be punched from the original plate can be effectively increased, and the unnecessary portions of the original plate that are not used as printed wiring boards can be reduced. Therefore, it is possible to achieve high production efficiency and low production cost. Even when only the specifications of the main body part or the electronic component mounting part are changed, it is only necessary to change the design of only one of them, and printed wiring boards with various specifications can be efficiently manufactured.
In addition, by adopting a configuration in which the electrode formation region and the electronic component mounting region overlap, the electronic component mounting region and the electrode formation region can be provided in the same region of the printed wiring board, and space saving can be realized. it can.
In addition, by using an anisotropic conductive adhesive, the thickness of the printed wiring board can be easily adjusted, good conductivity can be achieved in the thickness direction, and reliable insulation can be achieved in the surface direction. Can be secured.

  According to the printed wiring board and the method for manufacturing the printed wiring board of the present invention, in the printed wiring board on which the electronic component is mounted, the manufacturing efficiency can be increased and the cost can be reduced, and various specifications can be achieved. A printed wiring board can be manufactured efficiently.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the principal part of the printed wiring board which concerns on embodiment of this invention, (a) is a top view which shows the state with which the main-body part and the electronic component mounting part were integrated, (b) is a main-body part and an electronic component. It is a top view which shows the state before a mounting part is integrated. It is a figure which shows the principal part of the printed wiring board concerning embodiment of this invention, (a) is a perspective view, (b) is sectional drawing. It is sectional drawing which simplifies and shows the manufacturing method of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing which simplifies and shows the manufacturing method of the printed wiring board which concerns on embodiment of this invention. It is a top view which shows the principal part of the conventional printed wiring board. It is a figure which shows the principal part of the conventional printed wiring board, (a) is a top view which shows the state before a main-body part and an electronic component mounting part are integrated, (b) is a main-body part, an electronic component mounting part, and It is sectional drawing which shows the state by which was integrated.

  With reference to the following drawings, a printed wiring board and a method for manufacturing the printed wiring board according to an embodiment of the present invention will be described for understanding of the present invention. However, the following description is an embodiment of the present invention, and does not limit the contents described in the claims.

  First, a printed wiring board according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, the printed wiring board 1 according to the embodiment of the present invention includes a main body portion 10 including an electrode formation region K, and an electronic component mounting portion including an electrode formation region K and an electronic component mounting region B. 20 is a printed wiring board integrally connected through an anisotropic conductive adhesive 30.

  The main body 10 is a printed circuit board that constitutes the skeleton of the printed wiring board 1, and includes a base material layer 11, a conductive layer 12, and an insulating layer 13 as shown in FIG.

The base material layer 11 is a base of the main body 10 and is formed of an insulating resin film.
As a resin film, what consists of a resin material excellent in the softness | flexibility is used. For example, any film may be used as long as it is normally used as a resin film for forming a substrate of a printed circuit board, such as a polyimide film or a polyester film.
In particular, those having high heat resistance in addition to flexibility are desirable. For example, polyamide resin films, polyimide resin films such as polyimide and polyamideimide, and polyethylene naphthalate can be preferably used.
As the heat-resistant resin, any resin such as polyimide resin or epoxy resin may be used as long as it is normally used as a heat-resistant resin for forming a printed circuit board.
The thickness of the base material layer 11 is desirably about 5 μm to 50 μm.

The conductive layer 12 is a layer that is laminated on the base material layer 11 and constitutes the electrode 12a, the circuit wiring 12b, and the like of the main body portion 10.
In this embodiment, as shown in FIGS. 1B and 2B, a part of the insulating layer 13 is removed to form an opening 13a, and the conductive layer 12 exposed to the opening 13a is an electrode. By using 12a, the electrode formation region K is formed. That is, here and in the following description, “the electrode forming region K in the main body 10” means “the region of the opening 13a exposing the electrode 12a”.
Further, in the present embodiment, as shown in FIG. 1B, an electrode forming region K is provided in a protruding region D formed by protruding a part of the outer periphery of the main body 10.

The conductive layer 12 can be formed by a known forming method such as laminating a conductive metal foil on the base material layer 11 using plating (so-called additive method).
Moreover, copper (Cu) can be used as the conductive metal foil. Of course, it is not limited to copper (Cu), and any material may be used as long as it is normally used as a conductive metal foil for forming a conductive layer of a printed board.
The thickness of the conductive layer 12 is preferably about 5 μm to 50 μm.
The number of electrodes 12a formed on the conductive layer 12 is not limited to that of the present embodiment, and can be changed as appropriate.

The insulating layer 13 is a layer for ensuring insulation of the main body 10.
This insulating layer 13 can be formed by covering the surfaces of the base material layer 11 and the conductive layer 12 with a coverlay made of an insulating resin such as a polyimide film using a known forming method.
As described above, the insulating layer 13 has the opening 13a as the electrode formation region K.
The thickness of the insulating layer 13 is desirably about 5 μm to 80 μm.

The electronic component mounting portion 20 is a printed circuit board for mainly mounting electronic components on the printed wiring board 1, and as shown in FIG. 2B, a base material layer 21, a conductive layer 22, and an insulating layer 23. It consists of.
The base material layer 21, the conductive layer 22, and the insulating layer 23 are formed by the same member and the same method as the base material layer 11, the conductive layer 12, and the insulating layer 13 in the main body 10 described above. Therefore, the following detailed description will be omitted, and portions different from the main body 10 described above will be mainly described.

In the conductive layer 22 in the present embodiment, as shown in FIGS. 1B and 2B, a part of the insulating layer 23 is removed to form an opening 23a, and the conductive exposed to the opening 23a. The electrode formation region K is formed by using the layer 22 as the electrode 22a. That is, here and in the following description, “the electrode formation region K in the electronic component mounting portion 20” means “the region of the opening 23a exposing the electrode 22a”.
Further, as shown in FIG. 2B, a part of the insulating layer 23 is removed to form an opening 23a, and the conductive layer 22 exposed to the opening 23a and the electronic component 24 are electrically connected via a solder 40. By doing so, the electronic component mounting region B is formed. That is, in this and the following description, the “electronic component mounting region B” is “a region where the electronic component 24 is mounted in the electronic component mounting unit 20, more specifically, surrounded by the outer periphery of the electronic component 24. It means “area”.
Further, as shown in FIGS. 1 and 2, a part of the insulating layer 23 is removed to form an opening 23a, and the conductive layer 22 exposed in the opening 23a is used as a terminal 22c, so that a terminal formation region T is formed. It is formed. That is, here and in the following description, the “terminal formation region T” means “the region of the opening 23a exposing the terminal 22c”.
The terminal 22c is electrically connected to the electronic component 24 as shown in FIG.
In the present embodiment, as shown in FIG. 2B, the electrode 22 a, the electronic component 24, and the terminal 22 c are provided on the same surface of the electronic component mounting unit 20.
In this embodiment, as shown in FIGS. 1A and 2B, the electrode forming region K of the main body 10, the electrode forming region K of the electronic component mounting unit 20, and the electronic component mounting unit 20 The size (area) of the three regions with the electronic component mounting region B is formed to the same size (area).

As shown in FIG. 2B, the electronic component mounting portion 20 is electrically connected to the electrode forming region K of the main body 10 through the anisotropic conductive adhesive 30 in the electrode forming region K. The electronic component mounting area B is provided so as to overlap the electrode forming area K by folding back halfway.
More specifically, the electrode 22a of the electronic component mounting portion 20 and the electrode 12a of the main body portion 10 are electrically connected via the anisotropic conductive adhesive 30, and the electrode forming region K and the electronic component mounting region are also connected. The electronic component mounting unit 20 is folded 180 degrees with B (more specifically, by a folding line F indicated by a one-dot chain line in FIG. 1B), so that a folding region E is formed in the electronic component mounting unit 20. In the folded region E, the surface of the electronic component mounting part 20 (the surface of the base material layer 21 facing each other) is bonded in a state where the center of the electrode forming region K and the center of the electronic component mounting region B are vertically overlapped. It is adhered via the agent 50.
Here, and in the following description, “folding region E” means “a region where printed circuit boards constituting electronic component mounting unit 20 overlap each other”.

The anisotropic conductive adhesive 30 electrically connects the electrode 12a of the main body 10 and the electrode 22a of the electronic component mounting portion 20 and mechanically connects the main body 10 and the electronic component mounting portion 20. It is an adhesive.
This anisotropic conductive adhesive 30 contains conductive particles 30a in a binder (binder) and has conductivity in the thickness direction by heating and pressurization during thermocompression bonding. It has an insulating property in the direction, and further has an adhesive property for bonding members together.
The binder may be any material as long as it is normally used as a binder for forming the anisotropic conductive adhesive 30, such as a thermoplastic resin or a thermosetting resin.
The conductive particles 30a may be any material as long as it is normally used as a conductive component for forming the anisotropic conductive adhesive 30, such as nickel.
In addition, the size of the anisotropic conductive adhesive 30 is such that the length P in the horizontal direction before the thermocompression bonding is a length connecting both ends of the plurality of electrodes 12a, as shown by a one-dot chain line in FIG. It is desirable that the length Q in the vertical direction is slightly longer than the length in the vertical direction of the electrode 12a so as to cover a region surrounded by a substantially square.
In this embodiment, an anisotropic conductive film formed in a film shape is used as the anisotropic conductive adhesive 30.
Of course, the configuration is not limited to such a configuration, and an anisotropic conductive paste may be used as the anisotropic conductive adhesive 30.

The adhesive 50 is for bonding the surfaces of the electronic component mounting portions 20 facing each other in the folding region E (the surfaces of the base material layers 21 facing each other).
In the present embodiment, a double-sided tape is used as the adhesive 50.
Of course, the adhesive 50 is not limited to the double-sided tape, and can be any material that can adhere the surfaces of the electronic component mounting portions 20 facing each other (the surfaces of the base material layers 21 facing each other) with a certain strength in the folding region E. Any adhesive may be used.

The printed wiring board 1 having such a configuration has the following effects.
First, by using the main body 10 and the electronic component mounting portion 20 as separate members, the main body 10 and the electronic component mounting portion 20 can be formed using separate original plates in the manufacturing process. Therefore, the number of sheets that can be cut from the original plate (so-called number of copies) is not limited by the overall outer shape of the printed wiring board 1. Therefore, it is possible to effectively increase the number of sheets that can be cut out from the original plate, and it is possible to reduce an unnecessary portion of the original plate that is not used as the printed wiring board 1. Therefore, it is possible to achieve high production efficiency and low production cost. Even when only the specifications of the main unit 10 or the electronic component mounting unit 20 are changed (for example, when changing the external shape or changing the material of the print base material to a cheap material), only one of the designs is changed. As a result, printed wiring boards with various specifications can be manufactured efficiently.
Further, by providing the electronic component mounting region B so as to overlap the electrode forming region K, the electronic component mounting region B and the electrode forming region K are the same region of the printed wiring board 1 (folding region E in the present embodiment). Can be provided. That is, the region where the main body 10 and the electronic component mounting unit 20 are electrically and mechanically connected and the region where the electronic component 24 is mounted can be integrated into the same region, and space saving can be realized. . In addition, in the main body 10, the electrode forming region K is provided in the protruding region D, so that the protruding region D can be used as the electronic component mounting region B, and there are various areas other than the protruding region D in the main body. Can have a special function. Therefore, the multifunctional printed wiring board 1 can be obtained.
Furthermore, the size (area) of the three regions of the electrode forming region K of the main body 10, the electrode forming region K of the electronic component mounting unit 20, and the electronic component mounting region B of the electronic component mounting unit 20 is the same ( And the center of the electrode formation region K and the center of the electronic component mounting region B overlap each other in the folding region E so that the main body 10 and the electronic component mounting unit 20 are electrically connected. In addition, the area to be mechanically connected and the area on which the electronic component 24 is mounted can be integrated into the same area, and further space saving can be realized.
Further, by adopting a configuration in which the surface of the electronic component mounting portion 20 facing each other in the folding region E is bonded via the adhesive 50, the spring back of the electronic component mounting portion 20 can be effectively prevented. It is possible to obtain a printed wiring board 1 with high connection reliability.
Further, the terminal 22c is formed in the terminal formation region T, and the terminal 22c and the electronic component 24 are electrically connected, so that the printed wiring board 1 is electrically connected to another electronic device or the like via the terminal 22c. Therefore, the printed wiring board can be made more multifunctional.
Further, by using the anisotropic conductive adhesive 30, the thickness of the printed wiring board 1 can be easily adjusted, good conductivity can be realized in the thickness direction, and reliable insulation can be achieved in the surface direction. Sex can be secured.

Although not shown in detail as a conventional printed wiring board for mounting electronic components, for example, as shown in FIG. 5, all of the electronic component mounting region B and other regions are formed on one substrate. There was a printed circuit board 2 to be
However, in the printed wiring board 2 having such a configuration, in the manufacturing process of the printed wiring board 2, the number of sheets that can be cut from the original board (so-called number) is limited by the overall shape of the printed wiring board 2. Thus, there was a problem that the production efficiency was poor.
In addition, since the electronic component mounting region B and all other regions are formed on a single substrate, the entire specification is considered even when the specification of only the electronic component mounting region B is changed, for example. There is a problem that printed wiring boards having various specifications cannot be efficiently manufactured.

As a conventional configuration for solving such a problem, for example, as shown in FIG. 6, a printed wiring board includes a main body portion 100 including an electrode formation region K, and an electrode including an electrode formation region K and an electronic component mounting region B. There has been developed a printed wiring board 3 that is composed of two members including the electronic component mounting unit 200 and in which the electrode 120 a and the electrode 220 a are electrically connected via an anisotropic conductive adhesive 300.
However, in the printed wiring board 3 having such a configuration, since the anisotropic conductive adhesive 300 is used, the electronic component mounting region B cannot be provided so as to overlap the electrode forming region K. There was a problem that space could not be realized.
That is, as shown in FIG. 6B, before the electrode 120a and the electrode 220a are thermocompression bonded via the anisotropic conductive adhesive 300, the electronic component 240 (shown by a broken line) is preliminarily placed in a region overlapping the electrode 220a. In the case of mounting, since the anisotropic conductive adhesive 300 cannot be thermocompression bonded using the thermocompression bonding means 600 due to the presence of the electronic component 240, the electronic component mounting region B is changed to the electrode forming region K. There was a problem that it could not be provided to overlap.
On the other hand, when the electronic component 240 (shown by a broken line) is mounted so as to overlap the electrode 220a after the electrodes 120a and 220a are thermocompression bonded via the anisotropic conductive adhesive 300, the thermocompression bonding means 600 is used. By providing an opening 230a and the like (not shown) for connecting the electronic component 240 and the electrode 220a on the surface to which heat and pressure are applied (specifically, on the base material layer 210), The surface on which heat and pressure are applied by the thermocompression bonding means 600 cannot be a flat surface without unevenness. Therefore, the heat and pressure from the thermocompression bonding means 600 cannot be uniformly applied to the anisotropic conductive adhesive 300, and the electrical and mechanical connection between the main body 10 and the electronic component mounting part 20 is incomplete. Therefore, there is a problem that the electronic component mounting region B cannot be provided so as to overlap the electrode forming region K.
In the conventional printed wiring boards 2 and 3, the same members and the same functions as those of the printed wiring board 1 described above are given the same two-digit numbers and alphabets, and detailed description is omitted. It shall be.

  Therefore, by using the configuration of the printed wiring board 1 according to the embodiment of the present invention, the printed wiring board on which the electronic component 24 is mounted can achieve high manufacturing efficiency and low cost, and various types. It is an object of the present invention to provide a printed wiring board capable of efficiently manufacturing a printed wiring board having specifications and a method for manufacturing the printed wiring board.

  Next, a method for manufacturing the printed wiring board 1 according to the embodiment of the present invention will be described with reference to FIGS.

First, using a known printed circuit board forming method such as an additive method or a subtractive method, the main body 10 having the electrode forming region K in the protruding region D, the electrode forming region K, the electronic component mounting region B, and the terminal forming region T The electronic component mounting part 20 provided is formed (not shown).
At this time, the sizes (areas) of the three regions of the electrode forming region K of the main body 10, the electrode forming region K of the electronic component mounting unit 20, and the electronic component mounting region B of the electronic component mounting unit 20 are the same. Form in size (area). Further, in the electronic component mounting portion 20, the electrode forming region K and the electronic component mounting region B are formed at predetermined positions on the same surface, and the opposite surface of the electrode forming region K and the electronic component mounting region B are opposite to each other. The side surface is formed as a flat surface consisting only of the surface of the electronic component mounting unit 20.
In this case and the following description, “predetermined position” means “when the electronic component mounting portion 20 is folded 180 degrees between the electrode forming region K and the electronic component mounting region B, the electrode in the folding region E”. It means a position where the center of the formation region K and the center of the electronic component mounting region B overlap each other.
Next, referring to FIG. 3A, the main body 10 is prepared.
Next, referring to FIG. 3B, the electronic component mounting part 20 is prepared at a position facing the main body part 10. More specifically, the electronic component mounting unit 20 is prepared so that the electrode 12a and the electrode 22a face each other.
Next, referring to FIG. 3C, the electrode 12 a formed in the electrode formation region K of the main body 10 and the electrode formed in the electrode formation region K of the electronic component mounting portion 20 using the thermocompression bonding means 60. 22a is electrically connected through the anisotropic conductive adhesive 30.
Next, referring to FIG. 4A, the adhesive 50 is disposed on the surface of the electronic component mounting unit 20 on the side opposite to the electrode formation region K. More specifically, a double-sided tape having a predetermined size is affixed to the surface of the electronic component mounting unit 20 opposite to the electrode formation region K. The size (area) of the double-sided tape is desirably set to a size that can cover the size (area) of the region where the surface of the electronic component mounting portion 20 that faces the folding region E is formed.
Next, referring to FIG. 4B, the electronic component mounting portion 20 is folded 180 degrees between the electrode forming region K and the electronic component mounting region B, thereby forming a folding region E in the electronic component mounting portion 20. At the same time, the surface of the electronic component mounting portion 20 facing the electronic component mounting region B and the electrode forming region K in the folded region E (the surface of the facing base material layer 21) is placed via the adhesive 50. Adhere.
The printed wiring board 1 which concerns on embodiment of this invention is manufactured according to the above process.

The manufacturing method of the printed wiring board 1 which concerns on embodiment of this invention which consists of such a structure has the following effects.
By using the main body part 10 and the electronic component mounting part 20 as separate members, the main body part 10 and the electronic component mounting part 20 can be formed using different original plates. Therefore, the number of sheets that can be cut from the original plate (so-called number of copies) is not limited by the overall outer shape of the printed wiring board 1. Therefore, it is possible to effectively increase the number of sheets that can be cut out from the original plate, and it is possible to reduce an unnecessary portion of the original plate that is not used as the printed wiring board 1. Therefore, it is possible to achieve high production efficiency and low production cost. Even when only the specifications of the main body unit 10 or the electronic component mounting unit 20 are changed, it is only necessary to change the design of either one, and the printed wiring board 1 having various specifications can be efficiently manufactured.
Further, by configuring the electrode forming region K and the electronic component mounting region B to overlap, the electronic component mounting region B and the electrode forming region K are the same region of the printed wiring board 1 (folded region E in the present embodiment). Can be provided. That is, the region where the main body 10 and the electronic component mounting unit 20 are electrically and mechanically connected and the region where the electronic component 24 is mounted can be integrated into the same region, and space saving can be realized. . In addition, in the main body 10, the electrode forming region K is provided in the protruding region D, so that the protruding region D can be used as the electronic component mounting region B, and there are various areas other than the protruding region D in the main body. Can have a special function. Therefore, the multifunctional printed wiring board 1 can be obtained.
Furthermore, the size (area) of the three regions of the electrode forming region K of the main body 10, the electrode forming region K of the electronic component mounting unit 20, and the electronic component mounting region B of the electronic component mounting unit 20 is the same ( In the electronic component mounting portion 20, the electrode forming region K and the electronic component mounting region B are formed at predetermined positions, so that the main body portion 10 and the electronic component mounting portion 20 The area where the electrical components are electrically and mechanically connected and the area where the electronic component 24 is mounted can be consolidated into the same area, and further space saving can be realized.
Further, in the electronic component mounting part 20, the electrode forming region K and the electronic component mounting region B are formed at predetermined positions, and the surface opposite to the electrode forming region K and the surface opposite to the electronic component mounting region B are By setting the electronic component mounting portion 20 as a flat surface consisting only of the surface of the electronic component mounting portion 20 and turning the electronic component mounting portion 20 180 degrees between the electrode forming region K and the electronic component mounting region B, Electrical and mechanical connection with the component mounting unit 20 can be performed with high accuracy. That is, as shown in FIG. 3 (c), the surface to which heat and pressure are applied by the thermocompression bonding means 60 is a flat surface without unevenness, so that the electrodes 12a and 22a formed by the anisotropic conductive adhesive 30 At the time of connection, uniform heat and pressure can be applied to the anisotropic conductive adhesive 30 by the thermocompression bonding means 60, and the electrical and mechanical connection between the main body part 10 and the electronic component mounting part 20 can be accurately performed. It can be carried out. Furthermore, as shown in FIG. 4A, the surfaces of the electronic component mounting portions 20 facing each other can be bonded to each other via an adhesive 50. Therefore, the springback of the electronic component mounting part 20 can be effectively prevented, and the printed wiring board 1 with high electrical and mechanical connection reliability can be obtained.
Further, by using the anisotropic conductive adhesive 30, the thickness of the printed wiring board 1 can be easily adjusted, good conductivity can be realized in the vertical direction, and reliable insulation in the horizontal direction. Sex can be secured.

In addition, in this embodiment, although the structure of the main-body part 10 and the electronic component mounting part 20 was set as the structure formed with what is called a single-sided board | substrate provided with a conductive layer only in the single side | surface side of a base material layer, it is not necessarily restricted to such a structure. It is good also as a structure formed with what is called a double-sided board | substrate provided with a conductive layer on both surfaces of a base material layer instead of a thing.
In the present embodiment, one electronic component mounting unit 20 is connected to the main body unit 10 via the anisotropic conductive adhesive 30. However, the configuration is not necessarily limited to such a configuration. The electronic component mounting unit 20 may be configured to be connected to the main body unit 10 via the anisotropic conductive adhesive 30.
Further, in the present embodiment, by providing the electrode forming region K in the protruding region D in the main body 10, the electronic component 24 mounted on the electronic component mounting unit 20 is provided in the protruding region D of the main body 10. However, the configuration is not necessarily limited to this, and the position of the electrode formation region K provided in the main body 10 can be changed as appropriate.
Moreover, as a kind of printed circuit board which forms the main-body part 10 and the electronic component mounting part 20, what is normally used as a printed circuit board which forms a printed wiring board, such as a flexible substrate, a rigid substrate, a rigid flexible substrate, etc. May be used. However, since the electronic component mounting part 20 needs to be folded back, it is desirable to form it with a flexible substrate having good flexibility.
In the present embodiment, the electronic component mounting unit 20 is provided with the terminal 22c that is electrically connected to the electronic component 24. However, the present invention is not limited to this configuration, and the connector that is electrically connected to the electronic component 24 is used. It is good also as a structure which provides. By setting it as such a structure, the connection and disconnection of the printed wiring board 1 and another electronic device etc. can be performed easily.

In the present embodiment, the electronic component 24 is mounted on the electronic component mounting unit 20 by electrically connecting the conductive layer 22 and the electronic component 24 via the solder 40. However, such a configuration is not necessarily required. The configuration is not limited, and any configuration is possible as long as the conductive layer 22 and the electronic component 24 can be electrically connected. For example, the electronic component mounting unit 20 may be formed of a double-sided board, and the electronic component 24 may be mounted on the electronic component mounting unit 20 by electrically connecting the conductive layer 22 and the electronic component 24 via a blind via. . By setting it as such a structure, it can be set as the printed wiring board in which high-density wiring is possible.
In the present embodiment, the three regions of the electrode forming region K of the main body 10, the electrode forming region K of the electronic component mounting unit 20, and the electronic component mounting region B have the same size (area). However, it is not necessarily limited to such a configuration, and the sizes (areas) of the electrode forming region K of the main body 10, the electrode forming region K of the electronic component mounting unit 20, and the electronic component mounting region B are appropriately determined. It can be changed.
Further, in the present embodiment, the positions where the electrode forming region K and the electronic component mounting region B are formed in the electronic component mounting unit 20 are set to 180 degrees between the electrode forming region K and the electronic component mounting region B. In the folding region E, the center of the electrode formation region K and the center of the electronic component mounting region B are positioned so as to overlap each other in the folding region E, but is not necessarily limited to such a configuration, The formation positions of the electrode formation region K and the electronic component mounting region B can be changed as appropriate. However, when the electronic component mounting portion 20 is folded back 180 degrees between the electrode forming region K and the electronic component mounting region B, the electrode forming region K and the electronic component mounting region B overlap vertically in the folding region E. It needs to be a forming position. Further, from the viewpoint of space saving, the electrode formation region K and the electronic component mounting region B are formed such that the center of the electrode formation region K and the center of the electronic component mounting region B overlap vertically in the folding region E. It is desirable to set the position.
In the present embodiment, in the electronic component mounting portion 20, the terminal forming region T is formed on the same surface as the electrode forming region K and the electronic component mounting region B. However, the present invention is not necessarily limited to such a configuration. The terminal forming region T may be formed on a different surface from the electrode forming region K and the electronic component mounting region B.
Further, the outer shape, size, and the like of the main body 10 and the electronic component mounting unit 20 are not limited to those of the present embodiment, and can be changed as appropriate.

  According to the present invention, in a printed wiring board on which electronic components are mounted, it is possible to realize high efficiency and low cost of manufacturing efficiency, and it is possible to efficiently manufacture printed wiring boards with various specifications. Industrial applicability in the field of printed wiring boards for mounting electronic components is high.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Printed wiring board 3 Printed wiring board 10 Main body part 11 Base material layer 12 Conductive layer 12a Electrode 12b Circuit wiring 13 Insulating layer 13a Opening part 20 Electronic component mounting part 21 Base material layer 22 Conductive layer 22a Electrode 22b Circuit wiring 22c Terminal 23 Insulating layer 23a Opening 24 Electronic component 30 Anisotropic conductive adhesive 30a Conductive particle 40 Solder 50 Adhesive 60 Thermocompression bonding means 100 Main body 110 Base material layer 120 Conductive layer 120a Electrode 120b Circuit wiring 120c Terminal 130 Insulation Layer 130a Opening 140 Electronic component 200 Electronic component mounting portion 210 Base layer 220 Conductive layer 220a Electrode 220b Circuit wiring 220c Terminal 230 Insulating layer 230a Opening 300 Conductive adhesive 300a Conductive particles 400 Solder 600 Thermocompression bonding means B Electronic component Mounting area Region folded projecting region E F folding line K electrode formation region T terminal formation region P length Q Length

Claims (4)

  A printed wiring board in which a main body portion including an electrode formation region and an electronic component mounting portion including an electrode formation region and an electronic component mounting region are integrally electrically connected, and the electronic component mounting portion includes the electrode formation The region is electrically connected to the electrode forming region of the main body part via an anisotropic conductive adhesive, and is folded back in the middle to provide the electronic component mounting region so as to overlap the electrode forming region. A printed wiring board characterized by that.   2. The printed wiring board according to claim 1, wherein the main body portion includes a protruding region formed by protruding a part of the outer periphery, and the electrode forming region is provided in the protruding region.   The printed wiring board according to claim 1, wherein the electronic component mounting portion includes a terminal formation region that is electrically connected to the electronic component.   It is a manufacturing method of the printed wiring board according to claim 1, forming a main part provided with an electrode formation field, forming an electronic component mounting part provided with an electrode formation field and an electronic component mounting field, Anisotropy conduction between the step of preparing the main body, the step of preparing the electronic component mounting portion at a position facing the main body, and the electrode forming region of the main body and the electrode forming region of the electronic component mounting portion The step of electrical connection through an adhesive, the step of placing an adhesive on the surface of the electronic component mounting portion opposite to the electrode formation region, and the electrode formation region and the electronic component mounting region overlap. And a step of bonding the surface of the electronic component mounting portion with the adhesive in a state in which the electronic component mounting portion is folded back.

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