JP2014045164A - Rigid flexible circuit board and manufacturing method therefor and rigid flexible circuit plate and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rigid flexible circuit board and a manufacturing method therefor, and a rigid flexible circuit plate and a manufacturing method therefor.SOLUTION: A rigid flexible circuit board includes: a flexible circuit board having an exposure region and a pressure bonding region connected therewith; a core substrate connected with the pressure bonding region; a first adhesive sheet for lamination and a second adhesive sheet for lamination located on both sides of the core substrate and pressure bonding region; and a fifth conductive circuit layer and a sixth conductive circuit layer formed, respectively, on the surfaces of the first and second adhesive sheets for lamination separated from the core substrate. Electric connection bodies are formed on both first and second adhesive sheets for lamination, and the conductive circuit layer of a flexible circuit board is in electric conduction with the fifth and sixth conductive circuit layers by the electric connection bodies. A manufacturing method for the rigid flexible circuit board, a rigid flexible circuit plate and a manufacturing method for the rigid flexible circuit plate are also provided.

Description

  The present invention relates to a rigid flexible circuit board and a manufacturing method thereof, and a rigid flexible circuit board and a manufacturing method thereof.

  A printed circuit board is widely applied because it has an advantage of high mounting density (refer to Non-Patent Document 1 for application of a circuit board).

  A rigid flexible circuit board is a board in which a flexible board and a rigid board are integrated, and has both functions of a rigid board and a flexible board. In the manufacturing process of the rigid flexible circuit board, the insulating layer and the conductive layer are sequentially pressed onto the flexible circuit board, and then the conductive layer is formed on the conductive circuit layer. As described above, in the process of manufacturing the rigid flexible circuit board, since the pressing is performed many times and the conductive circuit needs to be manufactured, the manufacturing efficiency is lowered.

Takahashi, A .; Oki, N .; Nagai, A .; Akahoshi, H .; Mukoh, A .; Wajima, M .; Res. Lab, High density multi-layer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15 (4): 1418-1425.

  An object of the present invention is to solve the above-mentioned problems and provide a rigid flexible circuit board and a manufacturing method thereof, a rigid flexible circuit board and a manufacturing method thereof having high manufacturing efficiency.

  A rigid flexible circuit board according to the present invention includes an exposed area and a flexible circuit board having a compression area connected to the exposed area, a core board having a first opening for accommodating the flexible circuit board, and the core board. Formed on the surface of the adhesive sheet for first lamination and the adhesive sheet for second lamination, which are compressed on both sides of the compression area, and on the surface of the first adhesive sheet for lamination, which are located on both sides of the compression region. A fifth conductive circuit layer; and a sixth conductive circuit layer formed on a surface of the second lamination adhesive sheet away from the core substrate, wherein the first lamination adhesive sheet is a first lamination adhesive A sheet body, a plurality of first electrical connection bodies, and a plurality of second electrical connection bodies, wherein the first lamination adhesive sheet body has a second opening corresponding to the exposed region, and the plurality of first electrical connection bodies. Connecting body and several front The second electrical connection bodies are both installed in the first lamination adhesive sheet body and are both in contact with the fifth conductive circuit layer, and the plurality of first electrical connection bodies are located in the compression region. A plurality of the second electrical connection members are electrically connected to the core substrate, and the second lamination adhesive sheet is a second lamination adhesive sheet body. A plurality of third electrical connection bodies and a plurality of fourth electrical connection bodies, wherein the second laminated adhesive sheet body has a third opening corresponding to the exposed area, and the plurality of third electrical connection bodies And a plurality of the fourth electrical connection bodies are both installed in the second laminated adhesive sheet body and are in contact with the sixth conductive circuit layer, and the plurality of third electrical connection bodies are connected to the compression joint. Located in the region and electrically connected to the flexible circuit board, a plurality of front Fourth conductive connection member is electrically connected to the core substrate.

  A method of manufacturing a rigid flexible circuit board according to the present invention includes a step of providing a flexible circuit board having an exposed region and a compression region connected to the exposed region, a core substrate, an adhesive sheet for first lamination, a second A laminate adhesive sheet, a first copper foil and a second copper foil are provided, the core substrate has a first opening corresponding to the flexible circuit board, and the first laminate adhesive sheet is for the first laminate. An adhesive sheet main body, a plurality of first electrical connection bodies and a plurality of second electrical connection bodies, wherein the first laminating adhesive sheet main body has a second opening corresponding to the exposed region, The electrical connection body and the plurality of second electrical connection bodies are both installed in the first laminating adhesive sheet body, and the plurality of first electrical connection bodies correspond to the compression region, The second laminate adhesive sheet is the second laminate adhesive A second main body, a plurality of third electric connectors, and a plurality of fourth electric connectors, wherein the second lamination adhesive sheet main body has a third opening corresponding to the exposed area, and a plurality of the third electric connectors. The electrical connection body and the plurality of fourth electrical connection bodies are both installed in the second laminated adhesive sheet body, and the plurality of third electrical connection bodies correspond to the compression region; The flexible circuit board, the core board, the first laminating adhesive sheet, the second laminating adhesive sheet, the first copper foil, and the second copper foil, and the flexible circuit board is the core The first lamination adhesive sheet and the second lamination adhesive sheet are accommodated in both sides of the core substrate and are located on both sides of the compression region, One copper foil is formed from the core substrate of the first lamination adhesive sheet. The second copper foil is formed on the surface of the second laminating adhesive sheet away from the core substrate, and the first copper foil is formed on the core substrate by the second electrical connector. The second copper foil is electrically connected to the core substrate by the fourth electrical connection body, and the first electrical connection body includes the compression region of the flexible circuit board and the first copper foil. Electrically connecting, the third electrical connection body electrically connecting the compression region of the flexible circuit board and the second copper foil, and selectively removing the first copper foil Forming a fifth conductive circuit layer, selectively removing the second copper foil to form a sixth conductive circuit layer, and the fifth conductive circuit layer is electrically connected to the core substrate by the second electric connection body; The sixth conductive circuit layer is electrically conductive to the core substrate by the fourth electric connection body. Through, the first electrical connection body electrically connects the compression region of the flexible circuit board and the fifth conductive circuit layer, the third electrical connection body, the compression region of the flexible circuit board and the Electrically connecting the sixth conductive circuit layer.

  The rigid flexible circuit board according to the present invention includes the flexible circuit board, the first adhesive sheet, and the first outer layer board that are integrally pressed together, and the first adhesive sheet includes the first outer layer board and the flexible circuit board. The first outer layer substrate is sequentially provided with a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer, and the fifth insulating layer includes: A plurality of second conductive holes for electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer are formed, and the first adhesive sheet is installed in the first adhesive sheet main body and the first adhesive sheet main body. A plurality of fifth electrical connection bodies, wherein the fifth conductive circuit layer and the eighth conductive circuit layer are electrically connected by the fifth electrical connection body, and the first outer layer substrate and the first adhesive sheet main body have The exposed area of the flexible circuit board And corresponding opening is provided, and exposing the flexible circuit board.

  The rigid flexible circuit board according to the present invention includes the flexible circuit board, the first outer layer board, the second outer layer board, the first adhesive sheet, and the second adhesive sheet that are integrally pressed together. The first outer layer substrate and the fifth conductive circuit layer of the flexible circuit board are pressed together, and the second adhesive sheet is between the second outer layer substrate and the sixth conductive circuit layer of the flexible circuit board. And the first outer layer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer in sequence, and the fifth insulating layer includes the seventh conductive circuit layer and the seventh conductive circuit layer. A plurality of second conductive holes for electrically conducting the eight conductive circuit layers are formed, and the first adhesive sheet includes a first adhesive sheet body and a plurality of fifth electrical connectors installed in the first adhesive sheet body. The fifth conductive circuit layer and the eighth conductive circuit The layer is electrically connected by the fifth electrical connection body, and the second outer layer substrate includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer in order, and the sixth insulating layer includes: A plurality of third conductive holes for electrically conducting the ninth conductive circuit layer and the tenth conductive circuit layer are formed, and the second adhesive sheet is installed in the second adhesive sheet main body and the second adhesive sheet main body. A plurality of sixth electrical connection bodies, wherein the sixth conductive circuit layer and the tenth conductive circuit layer are electrically connected by the sixth electrical connection body, the first adhesive sheet main body, the first outer layer substrate, the The second adhesive sheet main body and the second outer layer substrate are provided with an opening corresponding to the exposed area of the flexible circuit board to expose the flexible circuit board.

  A rigid flexible circuit board according to the present invention includes the flexible circuit board, a plurality of first outer layer substrates, a plurality of second outer layer substrates, a plurality of first adhesive sheets, and a plurality of second adhesive sheets that are integrally pressed together. The plurality of first outer layer substrates and the plurality of first adhesive sheets are pressed together on one side of the flexible circuit board on which the fifth conductive circuit layer is formed, and the first outer layer substrates are sequentially connected to the seventh conductive layer. A circuit layer, a fifth insulating layer, and an eighth conductive circuit layer, wherein the fifth insulating layer is formed with a plurality of second conductive holes that electrically connect the seventh conductive circuit layer and the eighth conductive circuit layer; The first adhesive sheet is formed with a plurality of fifth electrical connectors penetrating the first adhesive sheet, and the plurality of first adhesive sheets and the plurality of first outer layer substrates are alternately installed and adjacent to each other. One between the two first outer layer substrates The first adhesive sheet is installed, the first conductive sheet is adjacent to the fifth conductive circuit layer, and the fifth electrical connector electrically connects the conductive circuit layers on both sides thereof, and a plurality of the first conductive sheets are provided. The second outer layer substrate and the plurality of second adhesive sheets are pressed together on one side of the flexible circuit board on which the sixth conductive circuit layer is formed, and the second outer layer substrate is sequentially connected to the ninth conductive circuit layer and the sixth conductive layer. The sixth insulating layer includes an insulating layer and a tenth conductive circuit layer, and a plurality of third conductive holes are formed in the sixth insulating layer to electrically connect the ninth conductive circuit layer and the tenth conductive circuit layer. The sheet is formed with a plurality of sixth electric connecting bodies penetrating the second adhesive sheet, the plurality of second adhesive sheets and the plurality of second outer layer substrates are alternately arranged, and the two adjacent second second sheets One second adhesive sheet is placed between the outer layer substrates, and the front The sixth conductive circuit layer and adjacent said second adhesive sheet, the sixth conductive connecting member is electrically conducting conductive circuit layers on both sides thereof.

  A manufacturing method of a rigid flexible circuit board according to the present invention provides a step of manufacturing a rigid flexible circuit board by employing the manufacturing method of the rigid flexible circuit board, a first outer layer substrate, and a first adhesive sheet, The outer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer in sequence, and the fifth conductive layer is electrically connected to the seventh conductive circuit layer and the eighth conductive circuit layer. A plurality of second conductive holes are formed, and the first adhesive sheet includes a plurality of fifth electrical connectors penetrating the first adhesive sheet, the first outer layer substrate, the first A step of pressing the adhesive sheet and the rigid flexible circuit board to electrically connect the fifth conductive circuit layer and the eighth conductive circuit layer to each other, and the flexible circuit board Forming a first opening through the first outer layer substrate and the first adhesive sheet along a boundary line between the exposed region and the compression region, and the first outer layer substrate surrounded by the first opening; Removing the first adhesive sheet to obtain a rigid flexible circuit board.

  A manufacturing method of a rigid flexible circuit board according to the present invention includes a step of manufacturing a rigid flexible circuit board by using the manufacturing method of the rigid flexible circuit board, a first outer layer substrate, a second outer layer substrate, a first adhesive sheet, and A second adhesive sheet is provided, and the first outer layer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer in order, and the fifth insulating layer includes the seventh conductive circuit layer. And a plurality of second conductive holes for electrically conducting the eighth conductive circuit layer, and a plurality of fifth electrical connecting members penetrating the first adhesive sheet are formed on the first adhesive sheet. The outer layer substrate sequentially includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer, and the sixth insulating layer electrically conducts the ninth conductive circuit layer and the tenth conductive circuit layer. A plurality of third conductive holes are formed; The second adhesive sheet includes a step in which a plurality of sixth electric connecting bodies penetrating the second adhesive sheet are formed, the first outer layer substrate, the first adhesive sheet, the rigid flexible circuit substrate, and the second adhesive The sheet and the second outer layer substrate are pressed together, the fifth electric connecting body electrically connects the fifth conductive circuit layer and the first outer layer substrate, and the sixth electric connecting body is the sixth conductive layer. Electrical conduction between the circuit layer and the second outer layer substrate, and a first through the first outer layer substrate and the first adhesive sheet along a boundary line between the exposed region and the compression region of the flexible circuit substrate. Forming a second cut through the mouth and the second outer layer substrate and the second adhesive sheet; removing the first outer layer substrate and the first adhesive sheet surrounded by the first mouth; and by the second cut Said second outer layer surrounded To remove the plate and the second adhesive sheet, and a, a step of acquiring a rigid flexible circuit board.

  A manufacturing method of a rigid flexible circuit board according to the present invention includes a step of manufacturing a rigid flexible circuit board by using the manufacturing method of the rigid flexible circuit board, a plurality of first outer layer substrates, a plurality of second outer layer substrates, a plurality of A first adhesive sheet and a plurality of second adhesive sheets, wherein the first outer layer substrate comprises a seventh conductive circuit layer, a fifth insulating layer and an eighth conductive circuit layer in order, Are formed with a plurality of second conductive holes for electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer, and the first adhesive sheet has a plurality of fifth electrical connections penetrating the first adhesive sheet. And the second outer layer substrate sequentially includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer. The sixth insulating layer includes the ninth conductive circuit layer and the ninth conductive layer. A plurality of conductive layers electrically conducting the ten conductive circuit layers; Conductive holes are formed, and the second adhesive sheet includes a plurality of sixth electrical connectors that penetrate the second adhesive sheet, a plurality of first outer layer substrates, a plurality of first adhesive sheets, Pressurizing the rigid flexible circuit board, the plurality of second adhesive sheets, and the plurality of second outer layer boards, wherein the plurality of first outer layer boards and the plurality of first adhesive sheets are formed on the flexible circuit board. A plurality of the first adhesive sheets and a plurality of the first outer layer substrates are alternately arranged on one side where the fifth conductive circuit layer is formed, and 1 between two adjacent first outer layer substrates. Two first adhesive sheets are installed, the first adhesive sheet is adjacent to the fifth conductive circuit layer, and the fifth electrical connection body electrically conducts the conductive circuit layers on both sides thereof, and a plurality of the first adhesive sheets are provided. Two outer layer substrates and multiple front The second adhesive sheet is pressed on one side of the flexible circuit board on which the sixth conductive circuit layer is formed, and the plurality of second adhesive sheets and the plurality of second outer layer boards are alternately installed and adjacent to each other. One second adhesive sheet is disposed between the two second outer layer substrates, the second adhesive sheet is adjacent to the sixth conductive circuit layer, and the sixth electric connector is electrically conductive on both sides thereof. Electrically conducting the circuit layer, and a first opening through the plurality of first outer layer substrates and the plurality of first adhesive sheets along a boundary line between the exposed area and the compression area of the flexible circuit board; Forming a second cut through the plurality of second outer layer substrates and the plurality of second adhesive sheets, and removing the plurality of first outer layer substrates and the plurality of first adhesive sheets surrounded by the first ports; And surrounded by the second cut Removing the plurality of second outer layer substrates and the plurality of second adhesive sheets to obtain a rigid flexible circuit board.

  In the rigid flexible circuit board and the manufacturing method thereof according to the present invention, in the manufacturing process, the conductive holes are formed by a method of printing a metal conductive paste. Therefore, the conductive holes are formed by an electroplating method according to the conventional technique. In comparison, the reliability of the rigid flexible circuit board can be increased, and the production cost of the rigid flexible circuit board can be reduced. Further, in the present invention, since the hole filling material is formed on the connection sheet or the substrate by the printing method in advance, the rigid flexible circuit board is compared with the conventional technology in which the layers are pressed and conductive for each layer. The number of press-fitting operations in the manufacturing process can be reduced, and the manufacturing efficiency of the rigid flexible circuit board can be increased.

It is sectional drawing of the flexible circuit board which concerns on embodiment of this invention. It is sectional drawing of the core board | substrate which concerns on embodiment of this invention. It is sectional drawing of the adhesive sheet for 1st lamination | stacking which concerns on embodiment of this invention. It is sectional drawing of the adhesive sheet for 2nd lamination | stacking which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the core board | substrate which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the core board | substrate which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the core board | substrate which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the core board | substrate which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the adhesive sheet for 1st lamination | stacking which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the adhesive sheet for 1st lamination | stacking which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the adhesive sheet for 1st lamination | stacking which concerns on embodiment of this invention. It is a figure which shows the manufacture process of the adhesive sheet for 1st lamination | stacking which concerns on embodiment of this invention. It is sectional drawing of the 1st copper foil and 2nd copper foil which concern on embodiment of this invention. It is sectional drawing after pressing the flexible circuit board which concerns on embodiment of this invention, a core board | substrate, the adhesive sheet for 1st lamination | stacking, the adhesive sheet for 2nd lamination | stacking, 1st copper foil, and 2nd copper foil. 1 is a cross-sectional view of a rigid flexible circuit board according to an embodiment of the present invention. It is sectional drawing of the 1st outer layer board | substrate which concerns on embodiment of this invention. It is sectional drawing of the 2nd outer layer board | substrate which concerns on embodiment of this invention. It is sectional drawing of the 1st adhesive sheet which concerns on embodiment of this invention. It is sectional drawing of the 2nd adhesive sheet which concerns on embodiment of this invention. It is sectional drawing of the multilayer circuit board formed by pressing together the 1st outer layer board | substrate, 1st adhesive sheet, flexible circuit board, 2nd adhesive sheet, and 2nd outer layer board | substrate which concern on embodiment of this invention. It is sectional drawing after forming the 1st opening and the 2nd cut in the multilayer circuit board shown in FIG. It is sectional drawing of the rigid flexible circuit board which concerns on embodiment of this invention. FIG. 23 is a cross-sectional view after forming an outer solder mask layer on the rigid flexible circuit board shown in FIG. 22.

  Embodiments of the present invention will be described below with reference to the drawings.

  A manufacturing method of a rigid flexible circuit board according to an embodiment of the present invention includes the following steps.

  First step: As shown in FIG. 1, a flexible circuit board 110 is provided.

  The flexible circuit board 110 is a circuit board having a conductive circuit, and is a double-sided circuit board or a single-sided circuit board. In the present embodiment, the flexible circuit board 110 is a double-sided circuit board. The flexible circuit board 110 includes a first cap layer 118, a first electromagnetic shield layer 116, a second insulating layer 114, a first conductive circuit layer 112, a first insulating layer 111, and a second layer, which are sequentially stacked. A conductive circuit layer 113, a third insulating layer 115, a second electromagnetic shield layer 117, and a second cap layer 119 are provided. The first insulating layer 111 includes a first surface 1111 and a second surface 1112 facing each other. The first conductive circuit layer 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive circuit layer 113 is , Formed on the second surface 1112 of the first insulating layer 111.

  The flexible circuit board 110 has a substantially rectangular shape, and includes an exposed region 1101, and a first compression region 1102 and a second compression region 1103 connected to both sides of the exposed region 1101. The exposed area 1101 has a rectangular shape and is used to form a flexible area of the rigid flexible circuit board. The first compression area 1102 and the second compression area 1103 are used for fixed connection to the rigid circuit board. In this embodiment, in the plane of the flexible circuit board 110, the extending direction of the first compression area 1102 and the second compression area 1103 is the longitudinal direction of the flexible circuit board 110, and the first compression area 1102 and the second pressure area A direction orthogonal to the extending direction of the joint region 1103 is a short direction of the flexible circuit board 110. The first conductive circuit layer 112 and the second conductive circuit layer 113 all extend along the longitudinal direction of the flexible circuit board 110, and the second compression region from the first compression region 1102 through the exposed region 1101. 1103.

  A plurality of first holes 1141 are formed in the second insulating layer 114 located in the first compression region 1102 and the second compression region 1103, and a part of the first conductive circuit layer 112 is exposed from the first hole 1141. To do. A plurality of second holes 1151 are formed in the third insulating layer 115 located in the first compression region 1102 and the second compression region 1103, and a part of the second conductive circuit layer 113 is exposed from the second hole 1151. To do.

  The first electromagnetic shield layer 116, the second electromagnetic shield layer 117, the first cap layer 118, and the second cap layer 119 include an exposed region 1101 and a portion of the first compression region 1102 adjacent to the exposed region 1101 and a portion of the second cap layer 119. Located in the compression area 1103. The first electromagnetic shield layer 116 and the second electromagnetic shield layer 117 are formed by a method of printing a conductive silver paste. The first cap layer 118 is formed on the exposed surface outside the first electromagnetic shield layer 116. That is, the first electromagnetic shield layer 116 is formed on the surface of the first electromagnetic shield layer 116 away from the second insulating layer 114 and the side surface of the first electromagnetic shield layer 116. The second cap layer 119 is formed on the exposed surface outside the second electromagnetic shield layer 117. That is, the second electromagnetic shield layer 117 is formed on the surface of the second electromagnetic shield layer 117 away from the third insulating layer 115 and the side surface of the second electromagnetic shield layer 117 to protect the second electromagnetic shield layer 117.

  Second Step: Referring to FIGS. 2 to 13, the core substrate 120, the first lamination adhesive sheet 130, the second lamination adhesive sheet 140, the first copper foil 150 and the second copper foil 160 are provided.

  Referring to FIG. 2, the thickness of the core substrate 120 is substantially the same as the thickness of the flexible circuit board 110. The core substrate 120 is provided with a first opening 121 corresponding to the flexible circuit board 110. The cross-sectional area and shape of the first opening 121 are the same as the cross-sectional area and shape of the flexible circuit board 110. The core substrate 120 includes a first molding region 127 and a second molding region 128 that are connected to both ends of the first opening 121 along the longitudinal direction thereof. The core substrate 120 includes a fourth insulating layer 124, a third conductive circuit layer 122, and a fourth conductive circuit layer 123. The third conductive circuit layer 122 and the fourth conductive circuit layer 123 are formed on two opposing surfaces of the fourth insulating layer 124, respectively. A plurality of first conductive holes 125 are formed in the core substrate 120, and the third conductive circuit layer 122 is electrically connected to the fourth conductive circuit layer 123 through the plurality of first conductive holes 125.

  Referring to FIG. 3, the first lamination adhesive sheet 130 is a low-fluidity prepreg (PP). The first lamination adhesive sheet 130 is provided with a second opening 131 corresponding to the exposed area 1101 of the flexible circuit board 110. The first lamination adhesive sheet 130 includes a first lamination adhesive sheet main body 130 a, a plurality of first electrical connectors 1331, and a plurality of second electrical connectors 1332. The first lamination adhesive sheet main body 130 a is provided with a plurality of first through holes 1321 and a plurality of second through holes 1322. The first through hole 1321 is closer to the second opening 131 than the second through hole 1322, and the first through hole 1321 is located between the second opening 131 and the plurality of second through holes 1322. In each first through-hole 1321, a first electrical connection body 1331 is formed coaxially, the first electrical connection body 1331 penetrates the first through-hole 1321, and both ends of the first electrical connection body 1331 are the first through-holes. It extends from 1321. The first electric connection body 1331 corresponds to the first hole 1141 of the second insulating layer 114 of the flexible circuit board 110. In each second through hole 1322, a second electrical connection body 1332 is formed coaxially, the second electrical connection body 1332 penetrates through the second through hole 1322, and both ends of the second electrical connection body 1332 are second through holes. It extends from 1322. In the present embodiment, the first electrical connection body 1331 and the second electrical connection body 1332 are all made of a metal conductive paste, preferably a copper conductive paste.

  Referring to FIG. 4, the structure of the second lamination adhesive sheet 140 is the same as the structure of the first lamination adhesive sheet 130. The second lamination adhesive sheet 140 is a low-fluidity prepreg. A third opening 141 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed in the second lamination adhesive sheet 140. The second lamination adhesive sheet 140 includes a second lamination adhesive sheet main body 140 a, a plurality of third electrical connectors 1431, and a plurality of fourth electrical connectors 1432. A plurality of third through holes 1421 and a plurality of fourth through holes 1422 are provided in the second lamination adhesive sheet main body 140a. The third through hole 1421 is closer to the third opening 141 than the fourth through hole 1422, and the third through hole 1421 is located between the third opening 141 and the plurality of fourth through holes 1422. In each third through hole 1421, a third electrical connection body 1431 is formed coaxially, the third electrical connection body 1431 penetrates the third through hole 1421, and both ends of the third electrical connection body 1431 are third through holes. It extends from 1421. The third electric connector 1431 corresponds to the second hole 1151 of the third insulating layer 115 of the flexible circuit board 110. A fourth electric connecting body 1432 is formed coaxially in each fourth through hole 1422, the fourth electric connecting body 1432 penetrates the fourth through hole 1422, and both ends of the fourth electric connecting body 1432 are the fourth through holes. It extends from 1422. In the present embodiment, the third electrical connection body 1431 and the fourth electrical connection body 1432 are all made of a metal conductive paste, preferably a copper conductive paste.

  Referring to FIG. 13, the first copper foil 150 and the second copper foil 160 are continuous rolled copper foils and may be continuous electrolytic copper foils.

  The lengths of the core substrate 120, the first lamination adhesive sheet 130, the second lamination adhesive sheet 140, the first copper foil 150, and the second copper foil 160 are all greater than the length of the flexible circuit board 110. In the present embodiment, the lengths of the core substrate 120, the first lamination adhesive sheet 130, the second lamination adhesive sheet 140, the first copper foil 150, and the second copper foil 160 are the same.

  The manufacturing process of the core substrate 120 will be described with reference to FIGS.

  First, as shown in FIG. 5, a copper clad laminate 120a is provided. The copper clad laminate 120a is a double-sided copper clad laminate, and includes a first copper foil layer 122a, a fourth insulating layer 124, and a second copper foil layer 123a. The fourth insulating layer 124 is located between the first copper foil layer 122a and the second copper foil layer 123a. The copper-clad laminate 120 a is provided with a first opening 121, and the shape and dimensions of the first opening 121 are the same as the shape and dimensions of the flexible circuit board 110.

  Next, as shown in FIG. 5, a first peelable protective layer 129 is formed on the surface of the first copper foil layer 122 a away from the fourth insulating layer 124. The first peelable protective layer 129 can be a peelable polyethylene terephthalate film. Furthermore, the 2nd copper foil layer 123a can be protected by forming the 1st peelable protective layer 129 also in the surface away from the 4th insulating layer 124 of the 2nd copper foil layer 123a.

  Next, as shown in FIG. 6, after forming the first blind via hole 125a penetrating the first peelable protective layer 129, the first copper foil layer 122a and the fourth insulating layer 124 by a laser piercing method, As shown in FIG. 7, the first conductive material 125 b is formed inside the first blind via hole 125 a to obtain the first conductive hole 125. In the present embodiment, the first blind via hole 125a is formed from the first peelable protective layer 129 toward the fourth insulating layer 124 by a method of combining a carbon dioxide laser and an ultraviolet laser. The first conductive material 125b is formed by a method in which a conductive paste is printed and then solidified. The first conductive material 125b is preferably made of a conductive copper paste. The first peelable protective layer 129 avoids forming a conductive paste on the surfaces of the first copper foil layer 122a and the second copper foil layer 123a when the first conductive material 125b is printed.

  Next, as shown in FIG. 8, the first peelable protective layer 129 is removed. The first peelable protective layer 129 can be removed by a direct peeling method.

  Finally, as shown in FIG. 2, a part of the first copper foil layer 122a is selectively removed to form a third conductive circuit layer 122, and a part of the second copper foil layer 123a is selectively removed. Thus, the fourth conductive circuit layer 123 is formed.

  A part of the first copper foil layer 122a is selectively removed by an image transfer process and an etching process to form a third conductive circuit layer 122, and a part of the second copper foil layer 123a is selectively removed. The fourth conductive circuit layer 123 can be formed by removing.

  With reference to FIGS. 9-12, the manufacturing method of the adhesive sheet 130 for 1st lamination | stacking is demonstrated.

  First, as shown in FIG. 9, a first lamination adhesive sheet main body 130a is provided. The first lamination adhesive sheet main body 130 a is provided with a second opening 131, and the second opening 131 corresponds to the exposed area 1101 of the flexible circuit board 110.

  Next, as shown in FIG. 10, a second peelable protective layer 135 that covers the second opening 131 is formed on each of the two opposing surfaces of the first lamination adhesive sheet main body 130a. The second peelable protective layer 135 can be a peelable polyethylene terephthalate film.

  Next, as shown in FIG. 11, a plurality of first penetrations penetrating through the second peelable protective layer 135 and the first lamination adhesive sheet main body 130a into the first lamination adhesive sheet main body 130a by a laser piercing method. A hole 1321 and a plurality of second through holes 1322 are formed. The first through hole 1321 is closer to the second opening 131 than the second through hole 1322, that is, the first through hole 1321 is located between the second opening 131 and the plurality of second through holes 1322. As shown in FIG. 12, when the conductive paste is printed in the first through-hole 1321 and the second through-hole 1322 and the conductive paste is solidified, the first electrical connection body 1331 and the second electrical connection body 1332 are formed. The Since the second peelable protective layer 135 has a thickness, the first electrical connection body 1331 and the second electrical connection body 1332 all protrude from the two opposing surfaces of the first lamination adhesive sheet main body 130a.

  Finally, as shown in FIG. 3, the second peelable protective layer 135 on the two opposing surfaces of the first laminating adhesive sheet body 130 a is removed to obtain the first laminating adhesive sheet 130.

  The production method of the second lamination adhesive sheet 140 is the same as the production method of the first lamination adhesive sheet 130.

  Third step: As shown in FIG. 14, the flexible circuit board 110, the core board 120, the first lamination adhesive sheet 130, the second lamination adhesive sheet 140, the first copper foil 150 and the second copper foil 160 Align and press to integrate.

  For the alignment, the first copper foil 150, the first laminating adhesive sheet 130, the core substrate 120, the second laminating adhesive sheet 140, and the second copper foil 160 are sequentially laminated. It is located between the first lamination adhesive sheet 130 and the second lamination adhesive sheet 140 and is located in the first opening 121 of the core substrate 120. Both the second opening 131 of the first lamination adhesive sheet 130 and the third opening 141 of the second lamination adhesive sheet 140 correspond to the exposed area 1101 of the flexible circuit board 110. The first lamination adhesive sheet 130 is positioned on one surface of the first compression region 1102, the second compression region 1103, and the core substrate 120 of the flexible circuit board 110. The second lamination adhesive sheet 140 is positioned on the first compression region 1102, the second compression region 1103, and the other surface of the core substrate 120 of the flexible circuit board 110.

  The first electrical connection body 1331, the second electrical connection body 1332, the third electrical connection body 1431, and the fourth electrical connection body 1432 are all made of a conductive paste, and can be deformed during the heating and pressing process. When the compression is performed, the first electrical connection body 1331 of the first lamination adhesive sheet 130 passes through the first hole 1141 of the flexible circuit board 110 and comes into contact with the first conductive circuit layer 112 to be electrically connected. The first electrical connection body 1331 forms a first conductive blind via hole that electrically connects the first conductive circuit layer 112 and the first copper foil 150. The second electrical connection body 1332 of the first lamination adhesive sheet 130 is brought into electrical contact with the first conductive hole 125 of the core substrate 120. The third electrical connection body 1431 of the second lamination adhesive sheet 140 passes through the second hole 1151 of the flexible circuit board 110 and comes into electrical contact with the second conductive circuit layer 113. The third electrical connection body 1431 forms a second conductive blind via hole that electrically connects the second conductive circuit layer 113 and the second copper foil 160. The fourth electrical connection body 1432 of the second lamination adhesive sheet 140 is in electrical contact with the fourth conductive circuit layer 123 in contact with the first conductive hole 125 of the core substrate 120. One end of each first conductive hole 125 is connected to the second electrical connection body 1332, and the other end of each first conductive hole 125 is connected to the fourth conductive circuit layer 123. Each first conductive hole 125 and the second electrical connection body 1332, the fourth conductive circuit layer 123, and the fourth electrical connection body 1432 connected to both ends thereof are electrically connected to the first copper foil 150 and the second copper foil 160. A third conductive blind via hole is formed.

  The second electrical connection body 1332 is not directly connected to the first conductive hole 125 but can be electrically connected to the third conductive circuit layer 122 of the core substrate 120.

  After the compression, the core substrate 120, the first laminating adhesive sheet 130, and the second laminating adhesive sheet 140 are solidified to form a hard portion, and the exposed area 1101 of the flexible circuit board 110 forms a soft portion.

  Fourth Step: As shown in FIG. 15, the first copper foil 150 is selectively removed, and the fifth conductive is caused by at least a portion of the first copper foil 150 located on the surface of the first laminating adhesive sheet 130. The circuit layer 151 is formed, the second copper foil 160 is selectively removed, and the sixth conductive circuit layer 161 is formed by at least a portion of the second copper foil 160 located on the surface of the second lamination adhesive sheet 140. Thus, the rigid flexible circuit board 100a is obtained. The fifth conductive circuit layer 151 and the sixth conductive circuit layer 161 are formed by an image transfer process and an etching process.

  In the present embodiment, the first copper foil 150 corresponding to the first molding region 127 and the second molding region 128 of the core substrate 120 and the first compression region 1102 and the second compression region 1103 of the flexible circuit board 110 is selected. The fifth conductive circuit layer 151 was formed by etching. That is, the first copper foil 150 pressed onto the surface of the first lamination adhesive sheet 130 was selectively etched to form the fifth conductive circuit layer 151. Further, the first copper region 160 and the second molding region 128 of the core substrate 120 and the second copper foil 160 corresponding to the first compression region 1102 and the second compression region 1103 of the flexible circuit board 110 are selectively etched. Thus, the sixth conductive circuit layer 161 was formed. That is, the sixth conductive circuit layer 161 was formed by selectively etching the second copper foil 160 pressed onto the surface of the second lamination adhesive sheet 140. The first copper foil 150 and the second copper foil 160 covering the exposed area 1101 of the flexible circuit board 110 are not etched. In other embodiments, the first copper foil 150 and the second copper foil 160 corresponding to the exposed area 1101 of the flexible circuit board 110 may be removed by etching.

  In the present embodiment, the first copper foil 150 and the second copper foil 160 that cover the exposed region 1101 of the flexible circuit board 110 are not etched, and when the rigid flexible circuit board 100 is manufactured later, the first copper foil is used. The flexible circuit board 110 blocked by the 150 and the second copper foil 160 can be protected.

  In the rigid flexible circuit board 100a, the exposed area 1101 of the flexible circuit board 110, the first copper foil 150 and the second copper foil 160 on the surface thereof constitute the flexible board area of the rigid flexible circuit board 100a, and the other parts are rigid. The rigid substrate region of the flexible circuit board 100a is configured, the thickness of the flexible substrate region is smaller than the thickness of the rigid substrate region, and the material of the flexible substrate region is flexible, so that it is bent and deformed relative to the rigid substrate region. Therefore, the rigid flexible circuit board 100a is configured.

  As shown in FIG. 15, the rigid flexible circuit board 100a manufactured by the above-described manufacturing method includes the flexible circuit board 110, the core substrate 120, the first lamination adhesive sheet 130, and the second lamination laminated together. Adhesive sheet 140, fifth conductive circuit layer 151, and sixth conductive circuit layer 161.

  The flexible circuit board 110 includes a first cap layer 118, a first electromagnetic shield layer 116, a second insulating layer 114, a first conductive circuit layer 112, a first insulating layer 111, and a second layer, which are sequentially stacked. A conductive circuit layer 113, a third insulating layer 115, a second electromagnetic shield layer 117, and a second cap layer 119 are provided. The first insulating layer 111 includes a first surface 1111 and a second surface 1112 facing each other. The first conductive circuit layer 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive circuit layer 113 is , Formed on the second surface 1112 of the first insulating layer 111.

  The flexible circuit board 110 has a substantially rectangular shape, and includes an exposed region 1101 and a first compression region 1102 and a second compression region 1103 connected to both sides of the exposed region 1101. The exposed area 1101 has a rectangular shape and is used to form a flexible area of the rigid flexible circuit board. The first compression region 1102 and the second compression region 1103 are used for fixed connection to the rigid board. In this embodiment, in the plane of the flexible circuit board 110, the extending direction of the first compression area 1102 and the second compression area 1103 is the longitudinal direction of the flexible circuit board 110, and the first compression area 1102 and the second pressure area A direction orthogonal to the extending direction of the joint region 1103 is a short direction of the flexible circuit board 110. The first conductive circuit layer 112 and the second conductive circuit layer 113 both extend along the longitudinal direction of the flexible circuit board 110, and from the first compression region 1102 to the second compression region via the exposed region 1101. 1103.

  A plurality of first holes 1141 are formed in the second insulating layer 114 of the first compression region 1102 and the second compression region 1103, and a part of the first conductive circuit layer 112 is exposed from the first hole 1141. A plurality of second holes 1151 are formed in the third insulating layer 115 of the first compression region 1102 and the second compression region 1103, and a part of the second conductive circuit layer 113 is exposed from the second hole 1151.

  The first electromagnetic shield layer 116, the second electromagnetic shield layer 117, the first cap layer 118, and the second cap layer 119 include an exposed region 1101 and a portion of the first compression region 1102 adjacent to the exposed region 1101 and a portion of the second cap layer 119. It is located in the compression area 1103. The first electromagnetic shield layer 116 and the second electromagnetic shield layer 117 are formed by a method of printing a conductive silver paste. The first cap layer 118 protects the first electromagnetic shield layer 116. The second cap layer 119 protects the second electromagnetic shield layer 117.

  The core substrate 120 includes a first molding region 127 and a second molding region 128 connected to both ends of the first opening 121 along the longitudinal direction thereof. The core substrate 120 includes a fourth insulating layer 124, a third conductive circuit layer 122, and a fourth conductive circuit layer 123. The third conductive circuit layer 122 and the fourth conductive circuit layer 123 are formed on two opposing surfaces of the fourth insulating layer 124, respectively. A plurality of first conductive holes 125 are formed in the core substrate 120, and the third conductive circuit layer 122 is electrically connected to the fourth conductive circuit layer 123 through the plurality of first conductive holes 125.

  The first lamination adhesive sheet 130 is a low-fluidity prepreg. The first lamination adhesive sheet 130 is provided with a second opening 131 corresponding to the exposed area 1101 of the flexible circuit board 110. The first lamination adhesive sheet 130 includes a first lamination adhesive sheet main body 130 a, a plurality of first electrical connectors 1331, and a plurality of second electrical connectors 1332. The first lamination adhesive sheet main body 130 a is provided with a plurality of first through holes 1321 and a plurality of second through holes 1322. The first through hole 1321 is closer to the second opening 131 than the second through hole 1322, and the first through hole 1321 is located between the second opening 131 and the plurality of second through holes 1322. In each first through-hole 1321, a first electrical connection body 1331 is formed coaxially, the first electrical connection body 1331 penetrates the first through-hole 1321, and both ends of the first electrical connection body 1331 are the first through-holes. It extends from 1321. The first electric connection body 1331 corresponds to the first hole 1141 of the second insulating layer 114 of the flexible circuit board 110. In each second through hole 1322, a second electrical connection body 1332 is formed coaxially, the second electrical connection body 1332 penetrates through the second through hole 1322, and both ends of the second electrical connection body 1332 are second through holes. It extends from 1322. The second electrical connection body 1332 corresponds to the first conductive hole 125 of the core substrate 120. In the present embodiment, the first electrical connection body 1331 and the second electrical connection body 1332 are all made of a metal conductive paste, preferably a copper conductive paste.

  The structure of the second lamination adhesive sheet 140 is the same as the structure of the first lamination adhesive sheet 130. The second lamination adhesive sheet 140 is a low-fluidity prepreg. A third opening 141 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed in the second lamination adhesive sheet 140. The second lamination adhesive sheet 140 includes a second lamination adhesive sheet main body 140 a, a plurality of third electrical connectors 1431, and a plurality of fourth electrical connectors 1432. A plurality of third through holes 1421 and a plurality of fourth through holes 1422 are provided in the second adhesive sheet main body 140a. The third through hole 1421 is closer to the third opening 141 than the fourth through hole 1422, and the third through hole 1421 is located between the third opening 141 and the plurality of fourth through holes 1422. In each third through hole 1421, a third electrical connection body 1431 is formed coaxially, the third electrical connection body 1431 penetrates the third through hole 1421, and both ends of the third electrical connection body 1431 are third through holes. It extends from 1421. The third electrical connector 1431 corresponds to the second hole 1151 of the third insulating layer 115. A fourth electric connecting body 1432 is formed coaxially in each fourth through hole 1422, the fourth electric connecting body 1432 penetrates the fourth through hole 1422, and both ends of the fourth electric connecting body 1432 are the fourth through holes. It extends from 1422. The fourth electrical connector 1432 corresponds to the fourth conductive circuit layer 123 that contacts the first conductive hole 125 of the core substrate 120. In the present embodiment, the third electrical connection body 1431 and the fourth electrical connection body 1432 are all made of a metal conductive paste, preferably a copper conductive paste.

  The fifth conductive circuit layer 151 is formed on the surface of the first lamination adhesive sheet 130 away from the core substrate 120, and the sixth conductive circuit layer 161 is the surface of the second lamination adhesive sheet 140 away from the core substrate 120. Formed. The exposed area 1101 of the flexible circuit board 110 is covered with the first copper foil 150 and the second copper foil 160 on both sides.

  The first electrical connection body 1331 of the first lamination adhesive sheet 130 passes through the first hole 1141 of the flexible circuit board 110 and contacts the first conductive circuit layer 112 to be electrically connected. The first electrical connection body 1331 forms a first conductive blind via hole that electrically connects the first conductive circuit layer 112 and the first copper foil 150. The third electrical connection body 1431 of the second lamination adhesive sheet 140 passes through the second hole 1151 of the flexible circuit board 110 and comes into electrical contact with the second conductive circuit layer 113. The third electrical connection body 1431 forms a second conductive blind via hole that electrically connects the second conductive circuit layer 113 and the second copper foil 160. One end of each first conductive hole 125 is connected to the second electrical connection body 1332, and the other end of each first conductive hole 125 is connected to the fourth conductive circuit layer 123. Each first conductive hole 125 and the second electrical connection body 1332, the fourth conductive circuit layer 123, and the fourth electrical connection body 1432 at both ends thereof are electrically connected to the first copper foil 150 and the second copper foil 160. Conductive blind via holes are formed. Accordingly, the third conductive circuit layer 122 of the core substrate 120 is electrically connected to the fifth conductive circuit layer 151, and the fourth conductive circuit layer 123 of the core substrate 120 is electrically connected to the sixth conductive circuit layer 161.

  The manufacturing method of a rigid flexible circuit board includes the following steps.

  First step: As shown in FIG. 15, a rigid flexible circuit board 100a is provided. The rigid flexible circuit board 100a can be manufactured by the above-described manufacturing method of the rigid flexible circuit substrate.

  Second Step: As shown in FIGS. 16 and 19, a first adhesive sheet 171, a second adhesive sheet 172, a first outer layer substrate 181 and a second outer layer substrate 182 are provided.

  The manufacturing method of the first adhesive sheet 171 and the second adhesive sheet 172 is similar to the manufacturing method of the first laminating adhesive sheet 130. The difference is that openings are provided in the first adhesive sheet 171 and the second adhesive sheet 172. It is not.

  As shown in FIG. 18, the first adhesive sheet 171 includes a first adhesive sheet main body 1711 and a plurality of fifth electrical connectors 174. The first adhesive sheet main body 1711 is provided with a plurality of fifth through holes 173, and a fifth electrical connector 174 is formed in each of the fifth through holes 173. The position of the fifth through hole 173 corresponds to the conductive circuit of the fifth conductive circuit layer 151, and the fifth electrical connector 174 is electrically connected to the fifth conductive circuit layer 151.

  As shown in FIG. 19, the second adhesive sheet 172 includes a second adhesive sheet main body 1721 and a plurality of sixth electrical connectors 176. The second adhesive sheet main body 1721 is provided with a plurality of sixth through holes 175, and a sixth electrical connection body 176 is formed in each of the sixth through holes 175. The position of the sixth through hole 175 corresponds to the conductive circuit of the sixth conductive circuit layer 161, and the sixth electrical connection body 176 is electrically connected to the sixth conductive circuit layer 161.

  As shown in FIG. 16, the first outer layer substrate 181 includes a fifth insulating layer 183, a seventh conductive circuit layer 184, and an eighth conductive circuit layer 185. The seventh conductive circuit layer 184 and the eighth conductive circuit layer 185 are formed on both surfaces of the fifth insulating layer 183, respectively. The fifth insulating layer 183 is located between the seventh conductive circuit layer 184 and the eighth conductive circuit layer 185. A plurality of second conductive holes 1811 are formed in the first outer layer substrate 181, and the seventh conductive circuit layer 184 is electrically connected to the eighth conductive circuit layer 185 through the plurality of second conductive holes 1811. A part of the conductive circuit of the eighth conductive circuit layer 185 corresponds to the position of the fifth through hole 173 of the first adhesive sheet 171.

  As shown in FIG. 17, the second outer layer substrate 182 includes a sixth insulating layer 186, a ninth conductive circuit layer 187, and a tenth conductive circuit layer 188. The ninth conductive circuit layer 187 and the tenth conductive circuit layer 188 are formed on the surfaces on both sides of the sixth insulating layer 186, respectively. The sixth insulating layer 186 is located between the ninth conductive circuit layer 187 and the tenth conductive circuit layer 188. A plurality of third conductive holes 1812 are formed in the second outer layer substrate 182, and the ninth conductive circuit layer 187 is electrically connected to the tenth conductive circuit layer 188 through the plurality of third conductive holes 1812. The conductive circuit of a part of the tenth conductive circuit layer 188 corresponds to the position of the sixth through hole 175 of the second adhesive sheet 172.

  The manufacturing method of the first outer layer substrate 181 and the second outer layer substrate 182 is the same as the manufacturing method of the core substrate 120.

  The second conductive hole 1811 and the third conductive hole 1812 can be conductive through holes. The conductive through hole is formed by forming a through hole in a copper clad laminate and then filling the through hole with a conductive material. It is formed.

  Third Step: As shown in FIG. 20, the first outer layer substrate 181, the first adhesive sheet 171, the rigid flexible circuit board 100a, the second adhesive sheet 172, and the second outer layer substrate 182 are sequentially stacked and then once. The multilayer circuit board 100b is obtained by compression.

  The first adhesive sheet 171, the second adhesive sheet 172, the fifth electrical connector 174 in the first adhesive sheet 171 and the sixth electrical connector 176 in the second adhesive sheet 172 are all deformed when heated and pressurized. After being pressed in this way, the fifth conductive circuit layer 151 is electrically connected to the eighth conductive circuit layer 185 via the fifth electrical connector 174 in the first adhesive sheet 171. The connection material of the first adhesive sheet 171 becomes an insulating layer between the fifth conductive circuit layer 151 and the eighth conductive circuit layer 185. The sixth conductive circuit layer 161 is electrically connected to the tenth conductive circuit layer 188 via the sixth electric connection body 176 in the second adhesive sheet 172. The connection material of the second adhesive sheet 172 becomes an insulating layer between the sixth conductive circuit layer 161 and the tenth conductive circuit layer 188.

  Fourth Step: As shown in FIG. 21 and FIG. 22, the first step is performed along the boundary line between the exposed region 1101 of the flexible circuit board 110 and the first compression region 1102 and the second compression region 1103. A first opening 191 penetrating the first copper foil 150 corresponding to the exposed area 1101 of the outer layer substrate 181, the first adhesive sheet 171 and the flexible circuit board 110 is formed, and the second outer layer substrate 182, the second adhesive sheet 172, A second cutout 192 that penetrates the second copper foil 160 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed, and the first outer layer substrate 181, the first adhesive sheet 171, and the flexible circuit located inside the first opening 191. The first copper foil 150 corresponding to the exposed area 1101 of the substrate 110 is removed, and a second outer layer substrate 182 located inside the second cut 192, a second adhesive sheet 72 and by removing the second copper foil 160 corresponding to the exposed regions 1101 of the flexible circuit board 110, and exposing the exposed region 1101 of the flexible circuit board 110, to acquire the rigid flexible circuit board 100.

  The first and second openings 191 and 192 are formed by an ultraviolet laser cutting method. The first opening 191 and the second cut 192 do not penetrate the flexible circuit board 110.

  The seventh conductive circuit layer 184 and the eighth conductive circuit layer 185 have an opening corresponding to the exposed area 1101 of the flexible circuit board 110, and a portion corresponding to the exposed area 1101 of the flexible circuit board 110 in the first adhesive sheet 171. Since the fifth electric connector 174 is not installed, the first port 191 can be easily formed by the ultraviolet laser cutting method. The ninth conductive circuit layer 187 and the tenth conductive circuit layer 188 have an opening corresponding to the exposed area 1101 of the flexible circuit board 110, and a portion corresponding to the exposed area 1101 of the flexible circuit board 110 in the second adhesive sheet 172. Since the sixth electric connector 176 was not installed, the second cut 192 can be easily formed by the ultraviolet laser cutting method.

  As shown in FIG. 21, the first all opening 191 and the second cut 192 all have two cut edges.

  The first molding region 127, the first compression region 1102 of the flexible circuit board 110, and the first adhesive sheet 171, the second adhesive sheet 172, the first outer layer substrate 181, and the second outer layer substrate 182 corresponding to these two parts are rigid. The rigid area 107 of the flexible circuit board 100 is formed, and the rigid portions corresponding to the second molding area 128 and the second compression area 1103 of the flexible circuit board 110 form another rigid area 107 of the rigid flexible circuit board 100. . An exposed area 1101 of the flexible circuit board 110 connected between the two hard areas 107 forms a flexible area 108 of the rigid flexible circuit board 100.

  If the fifth conductive circuit layer 151 and the sixth conductive circuit layer 161 are not provided on both sides of the exposed area 1101 of the flexible circuit board 110, the fifth conductive circuit layer 151 and the sixth conductive circuit layer 161 may not be removed. The first adhesive sheet 171, the second adhesive sheet 172, the first outer layer substrate 181, and the second outer layer substrate 182 corresponding to the exposed area 1101 of the flexible circuit board 110 may be removed.

  Fifth step: As shown in FIG. 23, a solder mask layer is formed on the surface of the outer conductive circuit layer and the outer insulating layer in the two hard regions of the rigid flexible circuit board 100.

  Since the first solder mask layer 1010 is formed on the surface of the seventh conductive circuit layer 184 and the surface of the fifth insulating layer 183 exposed from the seventh conductive circuit layer 184, the first solder mask layer 1010 has an opening. The seventh conductive circuit layer 184 is exposed from the opening of the first solder mask layer 1010. The second solder mask layer 1011 is formed on the surface of the ninth conductive circuit layer 187 and the surface of the sixth insulating layer 186 exposed from the ninth conductive circuit layer 187. Since the second solder mask layer 1011 has an opening, The ninth conductive circuit layer 187 is exposed from the opening of the second solder mask layer 1011.

  The first solder mask layer 1010 and the second solder mask layer 1011 can be formed after the third step of the method of manufacturing the rigid flexible circuit board.

  In the third step of manufacturing the rigid flexible circuit board according to the present invention, more outer layer circuit boards and adhesive sheets may be pressed on both sides of the rigid flexible circuit board 100a. A multilayer rigid flexible circuit board having a larger number of layers can be manufactured by installing an adhesive sheet between two adjacent outer layer circuit boards.

  In the compression process, the materials of the first laminating adhesive sheet 130 and the second laminating adhesive sheet 140 flow to the first cap layer 118 and the second cap layer 119 located in the exposed area 1101 of the flexible circuit board 110, and In order to avoid being difficult to remove in this step, a peelable protective film is formed on the surface of the first cap layer 118 and the second cap layer 119 located in the exposed region 1101 of the flexible circuit board 110, and in the fourth step, When removing the first outer layer substrate 181 and the first adhesive sheet 171 located inside the first opening 191 and removing the second outer layer substrate 182 and the second adhesive sheet 172 located inside the second cut 192 The peelable protective film located on the surfaces of the first cap layer 118 and the second cap layer 119 can be removed together.

  The rigid flexible circuit board according to the present invention can include only a flexible circuit board and a rigid circuit structure pressed onto one side of the flexible circuit board. In this case, in the process of manufacturing the rigid flexible circuit board, the pressing operation can be performed on one side of the flexible circuit board.

  As shown in FIG. 22, the rigid flexible circuit board 100 manufactured by the above-described rigid flexible circuit board manufacturing method includes a soft region 108 and two hard regions 107 connected to both ends of the soft region 108. In the present embodiment, the rigid flexible circuit board 100 includes a rigid flexible circuit board 100a, a first adhesive sheet 171, a second adhesive sheet 172, a first outer layer board 181, and a second outer layer board 182 that are integrally pressed together. Yes.

  The fifth conductive circuit layer 151 is electrically connected to the eighth conductive circuit layer 185 of the first outer layer substrate 181 through the fifth electric connector 174 of the first adhesive sheet 171. The fifth electric connector 174 becomes a conductive blind via hole. The sixth conductive circuit layer 161 is electrically connected to the tenth conductive circuit layer 188 via the sixth electric connection body 176 of the second adhesive sheet 172. The sixth electric connector 176 becomes a conductive blind via hole.

  A plurality of first adhesive sheets 171 and a plurality of first outer layer substrates 181 may be alternately disposed on the fifth conductive circuit layer 151, and one adjacent first adhesive sheet 171 has one The first outer layer substrate 181 exists, one first adhesive sheet 171 exists between two adjacent first outer layer substrates 181, and the first adhesive sheet 171 is adjacent to the fifth conductive circuit layer 151. The fifth electrical connector 174 electrically conducts the conductive circuit layers on both sides thereof.

  A plurality of second adhesive sheets 172 and a plurality of second outer layer substrates 182 may be alternately disposed on the sixth conductive circuit layer 161, and one adjacent second second adhesive sheet 172 has one The second outer layer substrate 182 exists, one second adhesive sheet 172 exists between two adjacent second outer layer substrates 182, and the second adhesive sheet 172 is adjacent to the sixth conductive circuit layer 161. The sixth electrical connector 176 electrically conducts the conductive circuit layers on both sides thereof.

  In the rigid flexible circuit board and the manufacturing method thereof according to the present invention, the conductive holes are formed by printing the metal conductive paste in the manufacturing process, so the conductive holes are formed by the electroplating method according to the prior art. As compared with the above, the reliability of the rigid flexible circuit board can be increased, and the production cost of the rigid flexible circuit board can be reduced. Further, in the present invention, since the hole filling material is formed on the connection sheet or the substrate by the printing method in advance, the rigid flexible circuit board is compared with the conventional technology in which the layers are pressed and conductive for each layer. The number of press-fitting operations in the manufacturing process can be reduced, and the manufacturing efficiency of the rigid flexible circuit board can be increased.

  Although the present invention has been specifically described above based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. Of course, the technical scope of the present invention is determined by the following claims.

100 Rigid Flexible Circuit Board 100a Rigid Flexible Circuit Board 100b Multilayer Circuit Board 107 Hard Area 108 Soft Area 110 Flexible Circuit Board 111 First Insulating Layer 112 First Conducting Circuit Layer 113 Second Conducting Circuit Layer 114 Second Insulating Layer 115 Third Insulating Layer 116 first electromagnetic shield layer 117 second electromagnetic shield layer 118 first cap layer 119 second cap layer 120 core substrate 121 first opening 122 third conductive circuit layer 122a first copper foil layer 123 fourth conductive circuit layer 123a second Second copper foil layer 124 Fourth insulating layer 125 First conductive hole 125a First blind via hole 125b First conductive material 127 First molding region 128 Second molding region 129 First peelable protective layer 130 First lamination adhesive sheet 130a First Adhesive sheet main body 131 for one lamination Second opening 135 Two peelable protective layer 140 Second laminated adhesive sheet 140a Second laminated adhesive sheet main body 141 Third opening 150 First copper foil 151 Fifth conductive circuit layer 160 Second copper foil 161 Sixth conductive circuit layer 171 First adhesion Sheet 172 Second adhesive sheet 173 Fifth through-hole 174 Fifth electric connector 175 Sixth through-hole 176 Sixth electric connector 181 First outer substrate 182 Second outer substrate 183 Fifth insulating layer 184 Seventh conductive circuit layer 185 Eighth conductive circuit layer 186 Sixth insulating layer 187 Ninth conductive circuit layer 188 Tenth conductive circuit layer 191 First all opening 192 Second cut 1010 First solder mask layer 1011 Second solder mask layer 1101 Exposed area 1102 First pressure Combined region 1103 Second compression region 1111 First surface 1112 Second surface 1141 First hole 1151 Second hole 1321 First through hole 1322 Second through hole 1 31 1st electrical connection body 1332 2nd electrical connection body 1421 3rd through-hole 1422 4th through-hole 1431 3rd electrical connection body 1432 4th electrical connection body 1711 1st adhesive sheet main body 1721 2nd adhesive sheet main body 1811 2nd electroconductivity Hole 1812 Third conductive hole

Claims (26)

A flexible circuit board having an exposed area and a press-fit area connected to the exposed area; a core board having a first opening for accommodating the flexible circuit board; A first laminating adhesive sheet and a second laminating adhesive sheet located on both sides of the region; a fifth conductive circuit layer formed on the surface of the first laminating adhesive sheet away from the core substrate; A sixth conductive circuit layer formed on a surface away from the core substrate of the lamination adhesive sheet,
The first laminating adhesive sheet includes a first laminating adhesive sheet body, a plurality of first electrical connection bodies, and a plurality of second electrical connection bodies, and the first laminating adhesive sheet body corresponds to the exposed area. A plurality of the first electrical connection bodies and a plurality of the second electrical connection bodies are both installed in the first laminated adhesive sheet body and both are connected to the fifth conductive circuit layer. The plurality of first electrical connecting bodies are in contact with each other and are electrically connected to the flexible circuit board in the compression region, and the plurality of second electrical connecting bodies are electrically connected to the core board. Has been
The second lamination adhesive sheet includes a second lamination adhesive sheet body, a plurality of third electrical connection bodies, and a plurality of fourth electrical connection bodies, and the second lamination adhesive sheet body corresponds to the exposed area. A plurality of third electrical connection bodies and a plurality of fourth electrical connection bodies are both installed in the second laminated adhesive sheet main body and both are connected to the sixth conductive circuit layer. The plurality of third electrical connecting bodies are in contact with each other and are electrically connected to the flexible circuit board in the compression region, and the plurality of fourth electrical connecting bodies are electrically connected to the core board. A rigid flexible circuit board characterized by being made.   The flexible circuit board includes a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer, and a third insulating layer in order, and the second insulating layer includes the plurality of first insulating layers. A plurality of first holes corresponding to the electrical connection bodies are provided, and each of the first electrical connection bodies is electrically connected through the corresponding first holes and in contact with the first conductive circuit layer, The third insulating layer is provided with a plurality of second holes corresponding to the plurality of third electric connecting members, and each of the third electric connecting members passes through the corresponding second hole and the second electric connecting member. The rigid flexible circuit board according to claim 1, wherein the rigid flexible circuit board is electrically connected in contact with the conductive circuit layer.   The flexible circuit board further includes a first electromagnetic shield layer and a second electromagnetic shield layer positioned in the exposed area, and the first electromagnetic shield layer is formed on a surface of the second insulating layer, and The rigid flexible circuit board according to claim 2, wherein the shield layer is formed on a surface of the third insulating layer.   The flexible circuit board further includes a first cap layer and a second cap layer located in the exposed region, wherein the first cap layer is formed on a surface of the first electromagnetic shield layer, and the second cap layer is The rigid flexible circuit board according to claim 3, wherein the rigid flexible circuit board is formed on a surface of the second electromagnetic shield layer.   The flexible circuit board includes two compression areas, and the exposed area is located between the two compression areas, and the conductive circuit of the first conductive circuit layer and the conductive circuit of the second conductive circuit layer. The rigid flexible circuit board according to claim 2, wherein both of the circuits extend from one of the compression regions to the other one of the compression regions via the exposed region.   The core substrate includes a fourth insulating layer, a third conductive circuit layer and a fourth conductive circuit layer formed on two opposing surfaces of the fourth insulating layer, respectively. One conductive hole is formed, and both ends of the plurality of first conductive holes are electrically connected to the plurality of the second electrical connection bodies and the fourth conductive circuit layer, respectively. 2. The rigid flexible circuit board according to 1.   The rigid flexible circuit board according to claim 1, wherein surfaces of both sides of the exposed area of the flexible circuit board are covered with copper foil.   2. The rigid flexible circuit board according to claim 1, wherein a material of the first electrical connection body, the second electrical connection body, the third electrical connection body, and the fourth electrical connection body is a conductive paste. 3. Providing a flexible circuit board with an exposed area and a compression area connected to the exposed area;
A core substrate, a first lamination adhesive sheet, a second lamination adhesive sheet, a first copper foil and a second copper foil are provided, and the core substrate has a first opening corresponding to the flexible circuit board, The first lamination adhesive sheet includes a first lamination adhesive sheet main body, a plurality of first electrical connection bodies, and a plurality of second electrical connection bodies, and the first lamination adhesive sheet main body corresponds to the exposed region. A plurality of the first electrical connection bodies and the plurality of second electrical connection bodies are both installed in the first laminated adhesive sheet body, and the plurality of first electrical connection bodies are provided with a second opening. The second laminated adhesive sheet includes a second laminated adhesive sheet main body, a plurality of third electrical connectors, and a plurality of fourth electrical connectors, and the second laminate. The adhesive sheet main body for use has a third opening corresponding to the exposed area, and a plurality of the third power supplies. Continued body and a plurality of said fourth conductive connecting member is disposed both in said second lamination adhesive sheet body, a plurality of the third conductive connection member includes the steps that are corresponding to the pressure merging region,
The flexible circuit board, the core board, the first laminating adhesive sheet, the second laminating adhesive sheet, the first copper foil and the second copper foil are pressed together, and the flexible circuit board is used as the core board The first laminating adhesive sheet and the second laminating adhesive sheet are pressed on both sides of the core substrate and located on both sides of the pressing area, Copper foil is formed on the surface of the first lamination adhesive sheet away from the core substrate, and the second copper foil is formed on the surface of the second lamination adhesive sheet away from the core substrate, The first copper foil is electrically connected to the core substrate by the second electrical connection body, the second copper foil is electrically connected to the core substrate by the fourth electrical connection body, and the first electrical connection body is The compression area of the flexible circuit board and the Electrically connecting one copper foil, wherein the third conductive connection member includes the steps of electrically connecting the pressure merging region and the second copper foil of the flexible circuit board,
The first copper foil is selectively removed to form a fifth conductive circuit layer, the second copper foil is selectively removed to form a sixth conductive circuit layer, and the fifth conductive circuit layer is The second electrical connection body is electrically connected to the core substrate, the sixth conductive circuit layer is electrically connected to the core substrate by the fourth electrical connection body, and the first electrical connection body is the flexible circuit board. Electrically connecting the compression region and the fifth conductive circuit layer, and the third electrical connection body electrically connecting the compression region of the flexible circuit board and the sixth conductive circuit layer;
A method for manufacturing a rigid flexible circuit board, comprising:   10. The first electrical connection body, the second electrical connection body, the third electrical connection body, and the fourth electrical connection body are formed by printing a conductive paste and then solidifying. The manufacturing method of the rigid flexible circuit board of description.   The flexible circuit board includes a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer, and a third insulating layer in order, and the second insulating layer includes the plurality of first insulating layers. A plurality of first holes corresponding to the electrical connection bodies are provided, and each of the first electrical connection bodies is electrically connected through the corresponding first holes and in contact with the first conductive circuit layer, The third insulating layer is provided with a plurality of second holes corresponding to the plurality of third electric connecting members, and each of the third electric connecting members passes through the corresponding second hole and the second electric connecting member. The method for manufacturing a rigid flexible circuit board according to claim 9, wherein the conductive circuit layer is electrically connected in contact with the conductive circuit layer.   The flexible circuit board further includes a first electromagnetic shield layer and a second electromagnetic shield layer positioned in the exposed area, and the first electromagnetic shield layer is formed on a surface of the second insulating layer, and The method for manufacturing a rigid flexible circuit board according to claim 11, wherein the shield layer is formed on a surface of the third insulating layer.   When the flexible circuit board, the core substrate, the first laminating adhesive sheet, the second laminating adhesive sheet, the first copper foil and the second copper foil are pressed together, a part of the first copper foil and A portion of the second copper foil is attached to both sides of the exposed area of the flexible circuit board, selectively removing the first copper foil to form a fifth conductive circuit layer, and selecting the second copper foil. The rigid flexible circuit of claim 9, wherein the first copper foil and the second copper foil attached to the exposed region are not removed when the sixth conductive circuit layer is formed by removing the first conductive circuit layer. A method for manufacturing a substrate.   The core substrate includes a fourth insulating layer, a third conductive circuit layer and a fourth conductive circuit layer formed on two opposing surfaces of the fourth insulating layer, respectively. The one conductive hole is formed, and both ends of the plurality of first conductive holes are electrically connected to the plurality of second electric connection bodies and the fourth conductive circuit layer, respectively. A method for producing a rigid flexible circuit board according to claim 9.   The flexible circuit board according to claim 1, the first adhesive sheet, and the first outer layer board, which are pressed together, wherein the first adhesive sheet is a fifth conductive circuit of the first outer layer board and the flexible circuit board. The first outer layer substrate is sequentially provided with a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer, and the fifth insulating layer includes the seventh conductive circuit layer. A plurality of second conductive holes for electrically conducting the layer and the eighth conductive circuit layer, and the first adhesive sheet includes a plurality of fifth electric conductors installed in the first adhesive sheet main body and the first adhesive sheet main body. The fifth conductive circuit layer and the eighth conductive circuit layer are electrically connected by the fifth electrical connection body, and the first outer layer substrate and the first adhesive sheet main body include the flexible circuit board. An opening corresponding to the exposed area of the Rigid flexible circuit board, characterized in that by exposing the flexible circuit board.   The flexible circuit board according to claim 1, the first outer layer board, the second outer layer board, the first adhesive sheet, and the second adhesive sheet, wherein the first adhesive sheet is the first outer layer board. And the second conductive sheet is pressed between the second outer layer substrate and the sixth conductive circuit layer of the flexible circuit board, and the fifth conductive circuit layer of the flexible circuit board. The first outer layer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer in sequence, and the fifth insulating layer includes the seventh conductive circuit layer and the eighth conductive circuit layer. A plurality of second conductive holes for electrical conduction are formed, and the first adhesive sheet includes a first adhesive sheet main body and a plurality of fifth electric connecting members installed in the first adhesive sheet main body, and the fifth conductive The circuit layer and the eighth conductive circuit layer are formed by the fifth electric connector. The second outer layer substrate is electrically conductive, and sequentially includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer. The sixth insulating layer includes the ninth conductive circuit layer and the tenth conductive layer. A plurality of third conductive holes for electrically conducting the conductive circuit layer are formed, and the second adhesive sheet includes a second adhesive sheet main body and a plurality of sixth electrical connectors installed in the second adhesive sheet main body, The sixth conductive circuit layer and the tenth conductive circuit layer are electrically connected by the sixth electric connection body, and the first adhesive sheet body, the first outer layer substrate, the second adhesive sheet body, and the second outer layer. A rigid flexible circuit board, wherein an opening corresponding to an exposed area of the flexible circuit board is provided in the board to expose the flexible circuit board.   The flexible circuit board according to claim 1, the plurality of first outer layer substrates, the plurality of second outer layer substrates, the plurality of first adhesive sheets, and the plurality of second adhesive sheets, which are integrally pressed together, The one outer layer substrate and the plurality of first adhesive sheets are pressed together on one side of the flexible circuit board on which the fifth conductive circuit layer is formed, and the first outer layer substrate is sequentially connected to the seventh conductive circuit layer and the fifth conductive circuit layer. An insulating layer and an eighth conductive circuit layer, wherein the fifth insulating layer is formed with a plurality of second conductive holes for electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer; The sheet is formed with a plurality of fifth electric connecting bodies penetrating the first adhesive sheet, the plurality of first adhesive sheets and the plurality of first outer layer substrates are alternately arranged, and the two adjacent first electrodes One first adhesive sheet is installed between the outer layer substrates. The first conductive sheet is adjacent to the fifth conductive circuit layer, and the fifth electrical connection body electrically conducts the conductive circuit layers on both sides thereof, and includes a plurality of the second outer layer substrates and a plurality of the second conductive layers. The adhesive sheet is pressed on one side of the flexible circuit board on which the sixth conductive circuit layer is formed, and the second outer layer board sequentially includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer. A plurality of third conductive holes are formed in the sixth insulating layer to electrically connect the ninth conductive circuit layer and the tenth conductive circuit layer, and the second adhesive sheet includes the second adhesive sheet. A plurality of sixth electrical connection bodies are formed, the plurality of second adhesive sheets and the plurality of second outer layer substrates are alternately disposed, and one of the second outer layer substrates is adjacent to the second outer layer substrate. A second adhesive sheet is installed, and the second conductive sheet layer has the second contact sheet. Sheets are adjacent, the sixth conductive connecting member is a rigid flexible circuit board, characterized in that electrically conducting conductive circuit layers on both sides thereof.   The rigid flexible circuit board according to any one of claims 15 to 17, wherein a material of the fifth electric connection body and the sixth electric connection body is a conductive paste.   The flexible circuit board includes a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer, and a third insulating layer in order, and the second insulating layer includes the plurality of first insulating layers. A plurality of first holes corresponding to the electrical connection bodies are provided, and each of the first electrical connection bodies is electrically connected through the corresponding first holes and in contact with the first conductive circuit layer, The third insulating layer is provided with a plurality of second holes corresponding to the plurality of third electric connecting members, and each of the third electric connecting members passes through the corresponding second hole and the second electric connecting member. The rigid flexible circuit board according to any one of claims 15 to 17, wherein the rigid flexible circuit board is in contact with and electrically connected to the conductive circuit layer.   The flexible circuit board further includes a first electromagnetic shield layer and a second electromagnetic shield layer positioned in the exposed area, and the first electromagnetic shield layer is formed on a surface of the second insulating layer, and The rigid flexible circuit board according to claim 19, wherein a shield layer is formed on a surface of the third insulating layer.   The flexible circuit board includes two compression areas, and the exposed area is located between the two compression areas, and the conductive circuit of the first conductive circuit layer and the conductive circuit of the second conductive circuit layer. 18. The circuit according to any one of claims 15 to 17, characterized in that both circuits extend from one said compression area via said exposure area to one other said compression area. Rigid flexible circuit board.   The rigid flexible circuit board according to any one of claims 15 to 17, wherein the second conductive hole is filled with a conductive paste.   The core substrate includes a fourth insulating layer, a third conductive circuit layer and a fourth conductive circuit layer formed on two opposing surfaces of the fourth insulating layer, respectively. 16. One conductive hole is formed, and both ends of the plurality of first conductive holes are electrically connected to the plurality of second electric connection bodies and the fourth conductive circuit layer, respectively. The rigid flexible circuit board according to any one of 17. Employing the method for manufacturing a rigid flexible circuit board according to claim 9 to produce a rigid flexible circuit board;
Providing a first outer layer substrate and a first adhesive sheet, the first outer layer substrate sequentially comprises a seventh conductive circuit layer, a fifth insulating layer and an eighth conductive circuit layer, the fifth insulating layer, A plurality of second conductive holes for electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer are formed, and a plurality of fifth electrical connectors that penetrate the first adhesive sheet are formed in the first adhesive sheet. Steps that are
The first outer layer substrate, the first adhesive sheet, and the rigid flexible circuit substrate are pressed together, and a plurality of the fifth electrical connectors electrically conduct the fifth conductive circuit layer and the eighth conductive circuit layer. Steps,
A first opening is formed through the first outer layer substrate and the first adhesive sheet along a boundary line between the exposed area and the compression area of the flexible circuit board, and the first opening surrounded by the first opening. Removing one outer layer substrate and the first adhesive sheet to obtain a rigid flexible circuit board;
A method of manufacturing a rigid flexible circuit board, comprising: Employing the method for manufacturing a rigid flexible circuit board according to claim 9 to produce a rigid flexible circuit board;
A first outer layer substrate, a second outer layer substrate, a first adhesive sheet, and a second adhesive sheet are provided, and the first outer layer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer in sequence. The fifth insulating layer is formed with a plurality of second conductive holes for electrically connecting the seventh conductive circuit layer and the eighth conductive circuit layer, and the first adhesive sheet includes the first adhesive sheet. A plurality of fifth electric connecting bodies penetrating therethrough is formed, and the second outer substrate includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer in order, and the sixth insulating layer includes the A plurality of third conductive holes for electrically conducting the ninth conductive circuit layer and the tenth conductive circuit layer are formed, and the second adhesive sheet is formed with a plurality of sixth electrical connecting bodies penetrating the second adhesive sheet. And steps
The first outer layer substrate, the first adhesive sheet, the rigid flexible circuit board, the second adhesive sheet, and the second outer layer substrate are pressed together, and the fifth electrical connection body includes the fifth conductive circuit layer and Electrically conducting the first outer layer substrate, and the sixth electrical connector electrically conducting the sixth conductive circuit layer and the second outer layer substrate;
Along the boundary line between the exposed area and the compression area of the flexible circuit board, a first opening that penetrates the first outer layer substrate and the first adhesive sheet, and a second outer layer substrate and the second adhesive sheet. Forming a second cut, removing the first outer layer substrate and the first adhesive sheet surrounded by the first cut; removing the second outer layer substrate and the second adhesive sheet surrounded by the second cut; Acquiring a rigid flexible circuit board; and
A method of manufacturing a rigid flexible circuit board, comprising: Employing the method for manufacturing a rigid flexible circuit board according to claim 9 to produce a rigid flexible circuit board;
A plurality of first outer layer substrates, a plurality of second outer layer substrates, a plurality of first adhesive sheets, and a plurality of second adhesive sheets are provided, and the first outer layer substrate sequentially includes a seventh conductive circuit layer and a fifth insulating layer. A plurality of second conductive holes for electrically connecting the seventh conductive circuit layer and the eighth conductive circuit layer to the first adhesive sheet. A plurality of fifth electrical connecting members penetrating the first adhesive sheet, and the second outer substrate includes a ninth conductive circuit layer, a sixth insulating layer, and a tenth conductive circuit layer in order, The sixth insulating layer is formed with a plurality of third conductive holes for electrically conducting the ninth conductive circuit layer and the tenth conductive circuit layer, and the second adhesive sheet has a plurality of holes penetrating the second adhesive sheet. A step in which a sixth electric connector is formed;
A plurality of first outer layer substrates, a plurality of first adhesive sheets, the rigid flexible circuit substrate, a plurality of second adhesive sheets, and a plurality of second outer layer substrates, wherein the plurality of first outer layer substrates and The plurality of first adhesive sheets are pressed together on one side where the fifth conductive circuit layer of the flexible circuit board is formed, the plurality of first adhesive sheets and the plurality of first outer layer substrates are alternately installed, One first adhesive sheet is installed between two adjacent first outer layer substrates, the first adhesive sheet is adjacent to the fifth conductive circuit layer, and the fifth electrical connector is The conductive circuit layers on both sides are electrically connected, and the plurality of second outer layer substrates and the plurality of second adhesive sheets are pressed together on one side where the sixth conductive circuit layer of the flexible circuit substrate is formed, Second adhesive sheet and The plurality of second outer layer substrates are alternately disposed, one second adhesive sheet is disposed between two adjacent second outer layer substrates, and the second adhesive sheet is disposed on the sixth conductive circuit layer. The sixth electrical connector is electrically connected to the conductive circuit layers on both sides thereof; and
A plurality of first openings penetrating the plurality of first outer layer substrates and the plurality of first adhesive sheets, a plurality of the second outer layer substrates, and a plurality of the plurality of first outer layer substrates and a plurality of the first adhesive sheets along a boundary line between the exposed region and the compression region of the flexible circuit board Forming a second cut through the second adhesive sheet, removing the plurality of first outer layer substrates surrounded by the first opening and the plurality of first adhesive sheets, and being surrounded by the second cut. Removing the second outer layer substrate and the plurality of second adhesive sheets to obtain a rigid flexible circuit board;
A method of manufacturing a rigid flexible circuit board, comprising: