CN103582325B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN103582325B CN103582325B CN201210267133.6A CN201210267133A CN103582325B CN 103582325 B CN103582325 B CN 103582325B CN 201210267133 A CN201210267133 A CN 201210267133A CN 103582325 B CN103582325 B CN 103582325B
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Abstract
A kind of circuit board, including the solderless substrate being pressed on together and internal layer circuit substrate, internal layer circuit substrate includes insulating barrier and is fitted in the conductive circuit layer of surface of insulating layer, described conductive circuit layer has exposed region and pressing district, described exposed region surface configuration has welding resisting layer, and multiple connection gaskets of exposed region expose from described welding resisting layer, solderless substrate includes being pressed on the adhesive sheet together with opening, pressing film and conductive pattern layer, adhesive sheet is formed in the pressing district of internal layer circuit substrate, adhesive sheet contacts with pressing film, the groove of solderless substrate it is formed through in multilayer circuit board, described groove is corresponding with described exposed region, so that described welding resisting layer and the connection gasket exposed from welding resisting layer are exposed in described groove, described groove is used for holding electronic components and parts.The present invention also provides for the manufacture method of a kind of described circuit board.
Description
Technical field
The present invention relates to circuit board making field, particularly relate to a kind of circuit board with groove structure and making side thereof
Method.
Background technology
Printed circuit board (PCB) is widely used because having packaging density advantages of higher.Application about circuit board please
See document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High
Density multilayer printed circuit board for HITAC M-880, IEEE Trans.on
Components,Packaging,and Manufacturing Technology,1992,15(4):418-425。
Due to the demand of electronics miniaturization, being provided with groove structure the most in the circuit board, this encapsulation groove is used for
Cooperate with the electronic component of other encapsulation or grafting, thus reduce the space occupied by whole circuit board package.But,
In prior art, making above-mentioned groove needs to form corresponding opening then at the glue-line of circuit board during circuit board making
Carry out the step such as pressing and circuit making.Owing to the film of respective slot part being formed with opening.In carrying out bonding processes,
Be easily caused between the bottom portion of groove of groove part and the conductive layer of pressing combine poor.So, in circuit manufacturing process, hold
It is easily caused and makes liquid medicine flow into the conducting wire of bottom portion of groove due to the conductive layer breakage of outer layer, thus cause bottom portion of groove
Conducting wire is damaged.
Summary of the invention
Therefore, it is necessary to provide a kind of making and the method thereof of circuit board, described circuit board manufacturing method can effectively be protected
Protect the line pattern of inside grooves.
A kind of circuit board, including the solderless substrate being pressed on together and internal layer circuit substrate, internal layer circuit substrate includes base
The end and be fitted in the conductive circuit layer of substrate surface, described conductive circuit layer have exposed region with around the pressing being connected exposed region
District, described exposed region surface configuration has welding resisting layer, and multiple connection gaskets of exposed region expose from described welding resisting layer, solderless substrate
Including the adhesive sheet being pressed on together, pressing film and conductive pattern layer, described adhesive sheet is bonded in internal layer circuit substrate
Pressing district and pressing film between, and constitute dielectric layer, in described circuit board with bonding with it this pressing film bonding
Having the groove only running through described solderless substrate, described groove is corresponding with described exposed region, so that exposed region surface is anti-welding
Layer and the plurality of connection gasket exposed from welding resisting layer are exposed in described groove, and described groove is used for holding electronic unit device
Part.
The manufacture method of a kind of circuit board, including step: providing internal layer circuit substrate, described circuit substrate includes insulating barrier
And it being formed at the first conductive circuit layer of surface of insulating layer, described first conductive circuit layer includes the first exposed region and around connecting
First pressing district of the first exposed region；The first exposed region in the first conductive circuit layer arranges the first protection film；At internal layer electricity
First conductive circuit layer side riveted the first adhesive sheet of base board, described first adhesive sheet has and the first exposed region phase
The first corresponding opening, described first protection film is positioned at the first opening；The first adhesive sheet one at internal layer circuit substrate
Side forms the first solderless substrate and obtains multilager base plate, described first solderless substrate include at least one of which pressing film, at least one
Layer conductive pattern layer and described first adhesive sheet, described at least one of which pressing film, at least one of which conductive pattern layer alternately row
Row, described first adhesive sheet contacts with the lamination rubber alloy sheet in described first solderless substrate, and with in contact
Pressing film bonding constitutes the first dielectric layer；And at multilager base plate near the side of the first solderless substrate along the first exposed region
Border cut the first solderless substrate, that only run through the first solderless substrate and corresponding with the border of the first exposed region to be formed
First otch of annular, removes by this part first solderless substrate of the first otch cincture, and removes the first protection film, thus
Form the groove corresponding with the first exposed region.
Compared with prior art, the manufacture method of the circuit board that the technical program provides, at the table of inner layer conductive line layer
Face pressing has two films, and wherein a film offers the opening corresponding with inner layer conductive line layer exposed region, and another
And it is not provided with the opening corresponding with groove.Compared to only arranging the method that a film with corresponding opening carries out pressing,
When pressing, it is ensured that have more gummosis to flow between protection film and the Copper Foil of pressing, thus be positioned at inner layer conductive
Copper Foil on line layer exposed region combines with corresponding position internal layer circuit substrates into intimate, further, it is possible to ensure two film shapes
The thickness of dielectric layer become disclosure satisfy that requirement, with prevent follow-up Copper Foil made form conducting wire time due to the thickness of dielectric layer
Degree can not meet requirement and cause liquid medicine to be corroded the conducting wire of internal substrate.
Accompanying drawing explanation
Fig. 1 is the generalized section of the internal substrate that the technical program embodiment provides.
Fig. 2 is the top view of Fig. 1.
Fig. 3 is the upward view of Fig. 1.
Fig. 4 is that the first conductive circuit layer side of the internal layer circuit substrate of Fig. 1 forms the first welding resisting layer and the first protection glue
Sheet, the second conductive circuit layer forms the generalized section after the second welding resisting layer and the second protection film.
First adhesive sheet of Fig. 5 the technical program offer and the generalized section of the first pressing film.
Fig. 6 is cuing open of the internal substrate of Fig. 4 and the first adhesive sheet and the first pressing film riveted postforming sheet structure
View.
Fig. 7 is at side pressing second adhesive sheet of laminate structure of Fig. 6 and the first Copper Foil, in opposite side pressing second
Sectional view after pressing film and the second Copper Foil.
Fig. 8 is that in Fig. 7, the first Copper Foil makes formation the first conductive pattern layer, and the second Copper Foil makes and forms the second conducting wire
The sectional view of the multilager base plate obtained after Ceng.
Fig. 9 is formation the 3rd welding resisting layer in first conductive pattern layer of Fig. 8, the second conductive pattern layer forms the 4th anti-welding
Sectional view after Ceng.
Figure 10 is the sectional view after the multilager base plate of Fig. 9 forms the first otch and the second otch.
Figure 11 is to be removed formation the first groove by the material of the first otch cincture, by the material of the second otch cincture in Figure 10
Material is removed the sectional view of the multilayer circuit board forming the second groove and obtain.
Main element symbol description
Circuit board 100
Rivet 101
First otch 102
First groove 103
Second otch 104
Second groove 105
Internal layer circuit substrate 110
Laminate structure 110a
Multilager base plate 110b
First solderless substrate 110c
Second solderless substrate 110d
First registration holes 1100
First conductive circuit layer 111
Conductive via structure 1101
First conducting wire 1111
First connection gasket 1112
First exposed region 1113
First pressing district 1114
Second conductive circuit layer 112
Second conducting wire 1121
Second connection gasket 1122
Second exposed region 1123
Second pressing district 1124
Substrate 113
First welding resisting layer 114
First through hole 1141
First protection film 115
Second welding resisting layer 116
Second through hole 1161
Second protection film 117
First dielectric layer 130
First conductive blind hole 131
Second dielectric layer 140
Second conductive blind hole 141
First conductive pattern layer 150
Second conductive pattern layer 160
3rd welding resisting layer 170
4th welding resisting layer 180
Conductive through hole 190
First adhesive sheet 20
First opening 21
Second registration holes 22
Second adhesive sheet 30
Second opening 31
3rd registration holes 32
First Copper Foil 41
Second Copper Foil 42
First pressing film 51
Second pressing film 52
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
The circuit board manufacturing method that the technical program provides comprises the steps:
The first step, sees also Fig. 1 to Fig. 3, it is provided that internal layer circuit substrate 110.
Internal layer circuit substrate 110 includes substrate the 113, first conductive circuit layer 111 and the second conductive circuit layer 112.First
Conductive circuit layer 111 is respectively formed in relative two surfaces of substrate 113 with the second conductive circuit layer 112.
First conductive circuit layer 111 includes a plurality of first conducting wire 1111 and multiple first connection gasket 1112.First leads
The mid portion region of electric line layer 111 is defined as the first exposed region 1113, has the circuit board of groove structure for making
The bottom of groove.Beyond first exposed region 1113 for the first pressing district 1114.First pressing district 1114 is sudden and violent around connecting first
Dew district 1113.The shape of the groove of the circuit board that the shape of the first exposed region 1113 can make according to actual needs sets
Fixed.In the present embodiment, the first exposed region 1113 be generally shaped like rectangle.First connection gasket 1112 and the first conduction of part
Circuit 1111 is arranged in the first exposed region 1113.First connection gasket 1112 is used for and the electronics in the groove being packaged in circuit board
Element is electrically connected to each other, and the first conducting wire 1111 in the first exposed region 1113 is for by sudden and violent with first for the first connection gasket 1112
Outside dew district 1113, other the first conducting wire 1111 is electrically connected to each other.Certainly, it will be understood by those skilled in the art that in Fig. 2
Only illustrate first connection gasket 1112 and minority the first conducting wire 1111 is illustrated, in fact the first conductive circuit layer
In 111, the first conducting wire 1111 and the quantity of the first connection gasket 1112, shape and distribution do not limit.
Second conductive circuit layer 112 includes the second conducting wire 1121 and the second connection gasket 1122.Second conductive circuit layer
The mid portion region of 112 is defined as the second exposed region 1123, for making the end of the groove of the circuit board with groove structure
Portion.Beyond second exposed region 1123 for the second pressing district 1124.The shape of the second exposed region 1123 can be according to actual needs
The shape of the groove of the circuit board made is set.In the present embodiment, the second exposed region 1123 be generally shaped like rectangle.
Second conducting wire 1121 of the second connection gasket 1122 and part is arranged in the second exposed region 1123.Second connection gasket 1122 is used
In being electrically connected to each other with the electronic component in the groove being packaged in circuit board, the second conducting wire in the second exposed region 1123
1121 for being electrically connected to each other the second connection gasket 1122 and the second exposed region 1123 other the second conducting wire 1121 outward.When
So, the second conducting wire 1121 can also be not provided with in the second exposed region 1123.
It is understood that internal layer circuit substrate 110 can be multi-layer sheet, it is also possible to double-sided PCB.In the present embodiment,
Internal layer circuit substrate 110 is double-sided PCB, i.e. substrate 113 is a layer insulating.Substrate 113 at internal layer circuit substrate 110
Interior making conductive via structure 1101, mutually to conduct the first conductive circuit layer 111 and the second conductive circuit layer 112.When interior
When layer circuit substrate 110 is multilayer circuit board, substrate 113 can be to include at least dielectric layers and at least one of which conducting wire
The multiple structure of layer.In described multiple structure, mutually can be conducted by conductive hole between conductive circuit layer.
In the present embodiment, in internal layer circuit substrate 110, it is further opened with multiple first registration holes 1100, the plurality of first right
Hole 1100, position is the through hole running through internal layer circuit substrate 110.First registration holes 1100 not through the first exposed region 1113 and
In two exposed regions 1123.
Second step, sees also Fig. 4, and the surface of the first conducting wire 1111 in the first exposed region 1113 forms the
One welding resisting layer 114, to cover the first conducting wire 1111 in the first exposed region 1113, and the first connection gasket 1112 is prevented from first
Layer 114 exposes.And whole first exposed region 1113 of covering is formed on the surface of the first welding resisting layer 114 and the first connection gasket 1112
First protection film 115.The surface of the second conducting wire 1121 in the second exposed region 1123 forms the second welding resisting layer
116, to cover the second conducting wire 1121 in the second exposed region 1123, and the second connection gasket 1122 is from the second welding resisting layer 116
Expose.And the second of whole second exposed region 1123 of covering is formed on the surface of the second welding resisting layer 116 and the second connection gasket 1122
Protection film 117.
In the present embodiment, at the first conductor wire of the first exposed region 1113 correspondence by the way of silk screen printing anti-solder ink
The surface on road 1111 and the surface of substrate 113 exposed by the first conductive circuit layer 111 form the first welding resisting layer 114.?
The surface of the second conducting wire 1121 of two exposed region 1123 correspondences and the substrate 113 exposed by the second conductive circuit layer 112
Surface form the second welding resisting layer 116.The region corresponding with the first connection gasket 1112 at the first welding resisting layer 114 is formed with first
Through hole 1141 so that each first connection gasket 1112 all exposes from the first corresponding through hole 1141.At the second welding resisting layer 116
The region corresponding with the second connection gasket 1122 is formed with the second through hole 1161 so that each second connection gasket 1122 all from its
The second corresponding through hole 1161 exposes.
When not including the first conducting wire 1111 in the first exposed region 1113, can not be in the first exposed region 1113 shape
Become the first welding resisting layer 114.When not including the second conducting wire 1121 in the second exposed region 1123, can not expose second
District 1123 forms the second welding resisting layer 116.
In the present embodiment, so that the welding resisting layer formed can preferably protect conducting wire, the first welding resisting layer 114
The region covered is more than the first exposed region 1113, and the i.e. first welding resisting layer 114 also covers the part around the first exposed region 1,113 the
One pressing district 1114.The region that second welding resisting layer 116 covers is more than the second exposed region 1123, and the i.e. second welding resisting layer 116 also covers
Part the second pressing district 1124 around second exposed region 1123.
In the present embodiment, by the first welding resisting layer 114 of the first exposed region 1113 correspondence and the first connection gasket 1112
The mode of surface printing fluid oil ink material forms the first protection film 115.By in the second of the second exposed region 1123 correspondence
The mode of the surface printing fluid oil ink material of welding resisting layer 116 and the second connection gasket 1122 forms the second protection film 117.Described
Fluid oil ink material can be thermosetting peelable type ink, it is also possible to for developable ink.The fluid oil ink material used is solid
After change, its maximum temperature that can bear should be greater than 200 degrees Celsius, it is possible to bears the pressure that pressure is 25 kilograms per square centimetres
Power.And fluid oil ink material has the corrosive nature of good acid and alkali resistance and oxidant after hardening.
When using thermosetting peelable type ink, directly the ink material of liquid can be printed in the first exposed region 1113 corresponding
The first welding resisting layer 114 and the surface of the first connection gasket 1112 and the second welding resisting layer 116 of the second exposed region 1123 correspondence and
The surface of two connection gaskets 1122, and through heat treated so that the ink material of liquid solidify to form the first protection film 115
With the second protection film 117.Heat curing-type peelable type ink has the advantages that to be prone to divest, such that it is able to avoid divesting carrying out
Journey is damaged the first connection gasket the 1112, first welding resisting layer the 114, second connection gasket 1122 and the second welding resisting layer 116.The thermosetting used
Type ink can be the peelable release ink of LM-600PSMS thermmohardening.
When using developable ink, first directly the ink material of liquid can be printed in the first exposed region 1113 correspondence
First welding resisting layer 114 and the surface of the first connection gasket 1112 and the second welding resisting layer 116 and second of the second exposed region 1123 correspondence
The surface of connection gasket 1122, then the ink material to the liquid formed is exposed developing, thus first after being hardened
Protection film 115 and the second protection film 117.Need after the solidification of developable ink material to use corresponding stripper solution to be gone
Remove.The developable ink material used can be PR 2000SA photosensitive type ink.
It is understood that when the first exposed region 1113 is formed without the first welding resisting layer 114, can directly lead first
The surface of electric line layer 111 forms the first protection film 115.When the second exposed region 1123 is formed without the second welding resisting layer 116,
The second protection film 117 directly can be formed on the surface of the second conductive circuit layer 112.
In the present embodiment, the form and dimension of the first protection film 115 is equal with the shapes and sizes of the first exposed region 1113
Identical.The shapes and sizes of the second protection film 117 are the most identical with the shapes and sizes of the second exposed region 1123.
So that the second conductive circuit layer 112 and the first conductive circuit layer 111 with follow-up be pressed together on glue-line thereon it
Between have and good can keep stronger pull-out capacity after pressing.After this step, can be to being formed with the first protection film
115 and second the second conductive circuit layer 112 exposed after protection film 117 and the first conductive circuit layer 111 exposed are carried out
Roughening treatment, to increase by the second conductive circuit layer 112 and roughness on the first conductive circuit layer 111 surface.Described roughening treatment
Melanism or brown can be used to process, will the second conductive circuit layer 112 and the first conductive circuit layer 111 surface exposed
Copper carries out oxidation processes so that part copper is oxidized to monovalence copper or cupric so that the second conductive circuit layer 112 and first is led
Electric line layer 111 surface coarsening.
3rd step, sees also Fig. 5, it is provided that first adhesive sheet the 20, second adhesive sheet 30.First adhesive sheet 20
Inside offer first opening 21 corresponding with the first exposed region 1113, offer and the second exposed region in the second adhesive sheet 30
1123 the second corresponding openings 31.
In the present embodiment, the first adhesive sheet 20 and the second adhesive sheet 30 are semi-solid preparation film.First opening 21
The shape of shape of cross section and the first exposed region 1113 is identical, and the area of the cross section of the first opening 21 is more than the first exposed region
The area of 1113.The shape of cross section of the second opening 31 and the shape of the second exposed region 1123 are identical, the second opening 31 transversal
The area in face is more than the area of the second exposed region 1123.In the present embodiment, the shape of cross section of the first opening 21 is also rectangle,
The length of the cross section of the first opening 21 is more than the length of the first corresponding exposed region 1113, the width of the cross section of the first opening 21
Degree more than the width of the first corresponding exposed region 1113, long than the first exposed region 1113 of the length of the cross section of the first opening 21
Spend big 10 to 20 microns, big 10 to 20 microns of the width of width ratio first exposed region 1113 of the cross section of the first opening 21.The
The shape of cross section of two openings 31 is also rectangle, and the length of the cross section of the second opening 31 is more than the second corresponding exposed region
The length of 1123, the width of the cross section of the second opening 31 is more than the width of the second corresponding exposed region 1123, the second opening 31
The length of cross section than big 10 to 20 microns of the length of the second exposed region 1123, the width ratio of the cross section of the second opening 31
Big 10 to 20 microns of the width of two exposed regions 1123.
In the present embodiment, the first adhesive sheet 20 offers multiple second registration holes 22, at the second adhesive sheet 30
In offer multiple 3rd registration holes 32, each second registration holes 22 and each 3rd registration holes 32 all with first registration holes
1100 is corresponding.
4th step, refers to Fig. 6, successively para-position stack the first adhesive sheet 20, internal layer circuit substrate 110 and second and glue
Gum deposit sheet 30 so that the first protection film 115 is positioned at the first opening 21, the second protection film 117 is positioned at the second opening 31,
And the first adhesive sheet 20, internal layer circuit substrate 110 and the second adhesive sheet 30 described in riveted, obtain laminate structure 110a.
In this step, use riveting device in the first corresponding registration holes the 1100, second registration holes 22 and the 3rd registration holes
Rivet 101 is set in 32, and under the effect of rivet 101 pressure, makes the first adhesive sheet 20 around rivet 101, internal layer electricity
Base board 110 and the second adhesive sheet 30 are in close contact.First adhesive sheet the 20, second adhesive sheet is can ensure that by riveted
30 all accurate with internal layer circuit substrate 110 para-positions so that the first protection film 115 is positioned at the first opening 21, the second protection glue
Sheet 117 is positioned at the second opening 31.Preferably, first around edge and first opening 21 of the first protection film 115 bonds
Gap width between film 20 is roughly equal.Gap width between edge and second opening 31 of the second protection film 117
Roughly equal.
5th step, refers to Fig. 7～8, forms the first pressing in the first adhesive sheet 20 side of internal layer circuit substrate 110
Substrate 110c, forms the second solderless substrate 110d in the second adhesive sheet 30 side of laminate structure 110a and obtains multilager base plate
110b。
Described first solderless substrate 110c can include at least one of which pressing film, at least one of which conductive pattern layer and described
First adhesive sheet 20, described at least one of which pressing film, at least one of which conductive pattern layer are alternately arranged, described first adhesive glue
Sheet 20 contacts with the lamination rubber alloy sheet in described first solderless substrate, and constitutes with pressing film in contact bonding
First dielectric layer 130.
In the present embodiment, only include going back as a example by a lamination rubber alloy sheet and one layer of conductive pattern layer by the first solderless substrate 110c
Illustrate the specific practice of the 5th step.
First, it is provided that the first Copper Foil the 41, second Copper Foil the 42, first pressing film 51 and the second pressing film 52, and successively
Stacking pressing the first Copper Foil the 41, first pressing film 51, laminate structure 110a, the first Copper Foil 41 and the second pressing film 52,
First adhesive sheet 20 and the first pressing film 51 collectively form the first dielectric layer 130, the second adhesive sheet 30 and the second pressing
Film 52 collectively forms the second dielectric layer 140.The material of the first pressing film 51 and the material of the first adhesive sheet 20 can phases
With, it is also possible to differ.Material higher than the first adhesive sheet 20 mobility when first pressing film 51 can use pressing
Make.The material of the second adhesive sheet 30 and the material of the second pressing film 52 can be identical, it is also possible to differ.Second pressing
Material higher than the 3rd year adhesive sheet 30 mobility when film 52 can use pressing is made.First pressing film 51 and
Two pressing films 52 can be respectively smooth prepreg.In bonding processes, the gummosis of the first pressing film 51 is filled into
In space between first protection film 115 and the first Copper Foil 41, the gummosis of the second pressing film 52 is filled into the second protection glue
In space between sheet 117 and the second Copper Foil 42.Thus, the first Copper Foil 41 and the second Copper Foil 42 can with internal layer circuit substrate 110
To combine closely.And ensure that the first adhesive sheet 20 in the first pressing district 1114 being positioned at the first exposed region 1113 periphery
Disclosure satisfy that requirement with the thickness of the first dielectric layer 130 of the first pressing film 51 formation, be positioned at the second exposed region 1123 periphery
The second pressing district 1124 on the thickness of the second dielectric layer 140 that formed of the second adhesive sheet 30 and the second pressing film 52 can
Meet requirement.
Then, in the first Copper Foil 41 and the first dielectric layer 130, form the first conductive blind hole 131, at the second Copper Foil 42 and
Form the second conductive blind hole 141 in second dielectric layer 140, and formation runs through first Copper Foil the 41, first dielectric layer 130, internal layer electricity
Base board the 110, second dielectric layer 140 and the conductive through hole 190 of the second Copper Foil 42, and selective etch the first Copper Foil 41 forms
One conductive pattern layer 150, selective etch the second Copper Foil 42 forms the second conductive pattern layer 160, obtains multilager base plate 110b.
In the present embodiment, before forming the first conductive pattern 150 and the second conductive pattern 160, form the first conductive blind hole
131 and conductive through hole 190.The formation of the first conductive blind hole 131 can make in the following way: first at the first Copper Foil 41 and
Perforate in first dielectric layer 130, then obtains at the interior formation conductive material in described hole by the way of chemical plating and plating
First conductive blind hole 131.First conductive circuit layer 111 is mutually conducted with the first Copper Foil 41 by the first conductive blind hole 131.The
The forming method of two conductive blind holes 141 is identical with the forming method of the first conductive blind hole 131, and the second conductive circuit layer 112 is passed through
Second conductive blind hole 141 mutually conducts with the second Copper Foil 42.
Conductive through hole 190 can by be initially formed first Copper Foil the 41, first dielectric layer 130, internal layer circuit substrate 110,
Two dielectric layer 140 and the through holes of the second Copper Foil 42, the mode then filling conductive material in through hole is formed.
First conductive pattern layer 150 and the second conductive pattern layer 160 all use image transfer technique and etch process to be formed.
First conductive pattern layer 150 is mutually conducted with the first conductive circuit layer 111 by the first conductive blind hole 131, the second conductive pattern
Shape layer 160 is mutually conducted with the second conductive circuit layer 112 by the second conductive blind hole 141.In the present embodiment, the first conductive pattern
Shape layer 150 covers the first exposed region 1113, and the second conductive pattern layer 160 covers the second exposed region 1123.
After this, it is also possible to repeat the operation of above-mentioned 6th step, with obtain more layers the first solderless substrate 110c and
Second solderless substrate 110d.
6th step, refers to Fig. 9, forms the 3rd welding resisting layer 170, at the second conductive pattern in the first conductive pattern layer 150
The 4th welding resisting layer 180 is formed on shape layer 160.
In this step, the 3rd welding resisting layer 170 and the 4th welding resisting layer 180 can be formed in the way of using solder-mask printing ink.
It is respectively provided with opening so that part the first conductive pattern 150 is anti-welding from first in 3rd welding resisting layer 170 and the 4th welding resisting layer 180
The opening part of layer 170 exposes, and part the second conductive pattern 160 exposes from the opening part of the second welding resisting layer 180.
7th step, sees also Figure 10 and Figure 11, along the first exposed region 1113 and boundary in the first pressing district 1114
Line, forms the first otch 102 of annular, and will be removed by the first solderless substrate 110c of the first otch 102 cincture, is formed and the
First groove 103 of one exposed region 1113 correspondence.Cover the first welding resisting layer 114 of the first exposed region 1113 and from the first welding resisting layer
114 the first connection gaskets 1112 exposed are exposed in the first groove 103.Along the second exposed region 1123 and the second pressing district
The boundary line of 1124, forms the second otch 104 from the surface of described multilager base plate 110b to the second protection film 117, and will be by
Second otch 104 around second conductive pattern layer the 160, second dielectric layer 140 and the second protection film 117 remove, formed with
Second groove 105 of the second exposed region 1123 correspondence.Cover the second welding resisting layer 116 of the second exposed region 1123 and anti-welding from second
The second connection gasket 1122 that layer 116 exposes is exposed in the second groove 105.So, can be prepared by having reeded multilamellar electricity
Road plate 100.
First groove 103 and the second groove 105 are respectively used to install electronic component.Exposed in first groove 103
One connection gasket 1112 is for being electrically connected to each other with the electronic component of collecting in the first groove 103.Expose in second groove 105
Second connection gasket 1122 is for being electrically connected to each other with the electronic component of collecting in the second groove 105.
In the present embodiment, the shape of the first otch 102 is corresponding with the shape of the first exposed region 1113, the first otch
102 cinctures be shaped as tetragon.First otch 102 only runs through first conductive pattern layer the 150, first dielectric layer 130 and first
Protection film 115.By the first conductive pattern layer the 150, first dielectric layer 130 and the first protection film of the first otch 102 cincture
115 can remove it in the way of using manual work.First the first conductive pattern layer 150 and the first dielectric layer 130 can be gone
Remove, then the first protection film 115 is removed.Can also the first conductive pattern layer the 150, first dielectric layer 130 and the first protection glue
Sheet 115 is removed simultaneously.
In the present embodiment, the shape of the second otch 104 is corresponding with the shape of the second exposed region 1123, the second otch
The shape of 104 cinctures is also tetragon.Second otch 104 only runs through second conductive pattern layer the 160, second dielectric layer 140 and
Two protection films 117.By the second conductive pattern layer the 160, second dielectric layer 140 and the second protection glue of the second otch 104 cincture
Sheet 117 can remove it in the way of using manual work.First second conductive pattern layer the 160, second dielectric layer 140 can be gone
Remove, then the second protection film 117 is removed.Can also the second conductive pattern layer the 160, second dielectric layer 140 and the second protection glue
Sheet 117 is removed simultaneously.
In the present embodiment, the first otch 102 and the second otch 104 can in the way of using the cutting of Ultra-Violet Laser depthkeeping shape
Become.Owing to being provided with the first protection film 115 and the second protection film 117, the first dielectric layer 130 not with the first exposed region 1113
In the first connection gasket 1112 and the first welding resisting layer 114 contact, the second dielectric layer 140 not with the in the second exposed region 1123
Two connection gaskets 1122 and the second welding resisting layer 116 contact, such that it is able to protection first connection gasket the 1112, first welding resisting layer 114, the
Two connection gasket 1122 and the second welding resisting layers 116.Further, the first protection film 115 and the second protection film 117 have good can
Peel property, it is easy to remove.
It is understood that the quantity of groove, position and the degree of depth in multilayer circuit board 100 are not limited by the present embodiment
System, the quantity of the groove in multilayer circuit board 100, position and the degree of depth can be set according to the needs of multilayer circuit board.
After this step, it is also possible to include the step being shaped multilayer circuit board 100, to obtain, shape is satisfied to be wanted
The multilayer circuit board asked.
The circuit board manufacturing method that the present embodiment provides, it is also possible to make and only there is the first groove 103 and do not have second
The circuit board of groove 105, so, the second conductive circuit layer 112 need not have the second exposed region 1123.When pressing, it is only necessary to
Between the second Copper Foil 42 and internal layer circuit substrate 110, to form the second dielectric layer 140 by pressing the second pressing film 52, and to be not required to
Second adhesive sheet 30 is set.
In the manufacture method that the present embodiment provides, the most each step is steps necessary, for example, it may not be necessary to use the
The operation of six steps, and directly stack gradually and pressing the first Copper Foil the 41, first pressing film the 51, first adhesive sheet 20, internal layer
Circuit substrate the 110, second adhesive sheet the 30, second Copper Foil 42 and the second pressing film 52.It addition, the making side of described circuit board
Method can not also include forming the 3rd welding resisting layer 170 and the step of the 4th welding resisting layer 180.
The technical program also provides for a kind of multilayer circuit board 100, including the first solderless substrate 110c being pressed on together, interior
Layer circuit substrate the 110, second solderless substrate 110d, internal layer circuit substrate 110 includes substrate 113 and to be fitted in substrate 113 biphase
The first conductive circuit layer 111 and the second conductive circuit layer 112 to surface.It is sudden and violent that described first conductive circuit layer 111 has first
Dew district 1113 and the first pressing district 1114, described first exposed region 1113 surface configuration has the first welding resisting layer 114, and first exposes
Multiple first connection gaskets 1112 in district 1113 expose from described first welding resisting layer 114.Described second conductive circuit layer 112 has
Second exposed region 1123 and the second pressing district 1124, described second exposed region 1123 surface configuration has the second welding resisting layer 116, and
Multiple second connection gaskets 1122 of two exposed regions 1123 expose from described second welding resisting layer 116.
In the present embodiment, the first solderless substrate 110c and the second solderless substrate 110d refers both to include one layer of conductive pattern layer.
I.e. first solderless substrate 110c includes being pressed on first adhesive sheet 20, the first pressing film 51 and first together with opening
Conductive pattern layer 150, the first adhesive sheet 20 is formed in the first pressing district 1114 of internal layer circuit substrate 110, the first bonding
Film 20 is adjacent with the first pressing film 51.The first of the first solderless substrate 110c it is formed through in multilayer circuit board 100
Groove 103, described first groove 103 is corresponding with described first welding resisting layer 114, so that described first welding resisting layer 114 and from
The first connection gasket 1112 exposed in one welding resisting layer 114 is exposed in described first groove 103, and described first groove 103 is used for
Holding electronic components and parts.
Second solderless substrate 110d includes being pressed on second adhesive sheet 30, the second pressing film 52 together with opening
With the second conductive pattern layer 160, the second adhesive sheet 30 is formed in the second pressing district 1124 of internal layer circuit substrate 110, the
Two adhesive sheets 30 are adjacent with the second pressing film 52.The second solderless substrate 110d it is formed through in multilayer circuit board 100
The second groove 105, described second groove 105 is corresponding with described second welding resisting layer 116, so that described second welding resisting layer 116
It is exposed in described second groove 105 with the second connection gasket 1122 exposed from the second welding resisting layer 116, described second groove
105 are used for holding electronic components and parts.
When the first solderless substrate 110c and the second solderless substrate 110d is multilager base plate, its structure can be for following institute
State.
Described first solderless substrate 110c includes being pressed on and has the first adhesive sheet 20 of opening, multilayer grooved together
First pressing film 51 and the first conductive pattern layer 150 of multilamellar opening, the first adhesive sheet 20 and the first pressing film 51 phase
Neighbour, the first pressing film 51 of described multilayer grooved and the first conductive pattern layer 150 of multilamellar opening are alternately arranged, and the most adjacent two
The first conductive pattern layer 150 of one layer of opening, described first solderless substrate is only had between first pressing film 51 of layer fluting
110c has first groove 103, and described first groove 103 runs through the first pressure of every layer of fluting of the first solderless substrate 110c
Rubber alloy sheet 51 and the first conductive pattern layer 150 of every layer of opening, described first groove 103 is relative with described first welding resisting layer 114
Should, so that described first welding resisting layer 114 and the first connection gasket 1112 exposed from the first welding resisting layer 114 are exposed to described first
In groove 103, described first groove 103 is for holding electronic components and parts.
Described second solderless substrate 110d include being pressed on together there is the second adhesive sheet 30 of opening, multilayer grooved
The second pressing film 52 and the second conductive pattern layer 160 of multilamellar opening, the second pressing film 52 He of described multilayer grooved
Second conductive pattern layer 160 of multilamellar opening is alternately arranged, only has one between the second pressing film 52 of every adjacent two layers fluting
Second conductive pattern layer 160 of layer opening, described second solderless substrate 110d has second groove 105, described second recessed
Groove 105 runs through the second pressing film 52 and second conductive pattern layer of every layer of opening of every layer of fluting of the second solderless substrate 110d
160, described second groove 103 is corresponding with described second welding resisting layer 116 so that described second welding resisting layer 116 and from second prevent
The second connection gasket 1122 exposed in layer 116 is exposed in described second groove 105, and described second groove 105 is used for housing
Electronic devices and components.
The manufacture method of the circuit board that the technical program provides, the surface pressing at inner layer conductive line layer has two glue
Sheet, wherein a film offers the opening corresponding with inner layer conductive line layer exposed region, and another and be not provided with exposing
The opening that district is corresponding.Compared to only arranging the method that a film with corresponding opening carries out pressing, when pressing, Ke Yibao
Card has more gummosis to flow between protection film and the Copper Foil of pressing, thus is positioned on inner layer conductive line layer exposed region
Copper Foil combines with corresponding position internal layer circuit substrates into intimate, further, it is possible to ensure the thickness of the dielectric layer of two films formation
Disclosure satisfy that requirement, with prevent follow-up Copper Foil made form conducting wire time owing to the thickness of dielectric layer can not meet requirement
Liquid medicine is caused to be corroded the conducting wire of internal substrate.
It is understood that for the person of ordinary skill of the art, can conceive according to the technology of the present invention and do
Go out other various corresponding changes and deformation, and all these change all should belong to the protection model of the claims in the present invention with deformation
Enclose.
Claims (15)
1. a manufacture method for circuit board, including step:
Thering is provided internal layer circuit substrate, described internal layer circuit substrate includes substrate and is formed at the first conducting wire of substrate surface
Layer, described first conductive circuit layer includes the first exposed region and around the first pressing district connecting the first exposed region；
The first exposed region in the first conductive circuit layer arranges the first protection film；
At first conductive circuit layer side riveted the first adhesive sheet of internal layer circuit substrate, described first adhesive sheet have with
The first opening that first exposed region is corresponding, described first protection film is positioned at the first opening；
First Copper Foil and the first pressing film, and the of pressing the first Copper Foil, the first pressing film to internal layer circuit substrate are provided
One adhesive sheet side, makes the first Copper Foil and forms the first conductive pattern layer, thus in the first bonding of internal layer circuit substrate
Film side forms the first solderless substrate and obtains multilager base plate, described first solderless substrate include at least one of which pressing film,
At least one of which conductive pattern layer and described first adhesive sheet, described at least one of which pressing film and described at least one of which conductive pattern
Shape layer is alternately arranged, and described first adhesive sheet contacts with the lamination rubber alloy sheet in described first solderless substrate, and described
At least one of which conductive pattern layer be positioned at the pressing film that contacts with this first adhesive sheet away from this first adhesive sheet
Side, this first adhesive sheet constitutes the first dielectric layer with pressing film in contact bonding；And
At multilager base plate, near the side of the first solderless substrate, the first solderless substrate is cut, with shape in border along the first exposed region
Become only to run through the first solderless substrate and corresponding with the border of the first exposed region the first annular otch, remove and cut by first
Choma around this part first solderless substrate, and remove the first protection film, thus form the groove corresponding with the first exposed region.
2. the manufacture method of circuit board as claimed in claim 1, it is characterised in that described first conductive circuit layer includes a plurality of
First conducting wire and multiple first connection gasket, the plurality of first connection gasket and part the first conducting wire are positioned at described first
In exposed region.
3. the manufacture method of circuit board as claimed in claim 2, it is characterised in that the first conductor wire in the first exposed region
Before the surface of road floor forms the first protection film, it is additionally included in the step that the first welding resisting layer is set on the first exposed region, described
First welding resisting layer covers a plurality of first conducting wire in the first exposed region, covers the surface of substrate in the first exposed region, and
Exposing multiple first connection gaskets of the first exposed region, described first protection film covers surface and the institute of described first welding resisting layer
State the surface of multiple first connection gasket.
4. the manufacture method of circuit board as claimed in claim 3, it is characterised in that it is sudden and violent that described first welding resisting layer also covers first
Part the first pressing district around dew district.
5. the manufacture method of circuit board as claimed in claim 1, it is characterised in that lead the first Copper Foil is made formation first
Before electricity graph layer, in being additionally included in the first pressing film and the first Copper Foil, form the first conductive blind hole, described first conductor wire
Road floor and the first Copper Foil are mutually conducted by the first conductive blind hole.
6. the manufacture method of circuit board as claimed in claim 1, it is characterised in that lead the first Copper Foil is made formation first
Before electrograph shape, also include being formed and run through the first Copper Foil, the first pressing film and the conductive through hole of internal layer circuit substrate, internal layer electricity
The first conductive circuit layer in base board is mutually conducted by described conductive through hole with the first Copper Foil.
7. the manufacture method of circuit board as claimed in claim 1, it is characterised in that the shape of cross section of described first opening with
The shape of the first protection film is identical, and the area of the cross section of the first opening is more than the area of the first protection film, in riveted institute
After stating the first adhesive sheet and internal layer circuit substrate, the edge of described first protection film and the first parameatal first bonding
There is between film the gap of an annular.
8. a manufacture method for circuit board, including step:
Thering is provided internal layer circuit substrate, described internal layer circuit substrate includes substrate, is formed at the first conductive circuit layer of substrate surface
And it being formed at second conductive circuit layer of another apparent surface of substrate, described first conductive circuit layer includes the first exposed region and ring
Around connecting the first pressing district of the first exposed region, described second conductive circuit layer includes the second exposed region and sudden and violent around connecting second
The second pressing district in dew district；
The first exposed region in the first conductive circuit layer arranges the first protection film, at the second exposed region of the second conductive circuit layer
Second protection film is set；
At first conductive circuit layer side riveted the first adhesive sheet of described internal layer circuit substrate, and at internal layer circuit substrate
Second conductive circuit layer side riveted the second adhesive sheet, described first adhesive sheet has corresponding with the first exposed region
One opening, described first protection film is positioned at the first opening, and described second adhesive sheet has corresponding with the second exposed region
The second opening, described second protection film be positioned at the second opening；
The first solderless substrate is formed, in the second bonding of internal layer circuit substrate in the first adhesive sheet side of internal layer circuit substrate
Film side forms the second solderless substrate, and obtains multilager base plate, and described first solderless substrate includes at least one of which the first pressing
Film, at least one of which the first conductive pattern layer and described first adhesive sheet, described at least one of which the first pressing film is with described
At least one of which the first conductive pattern layer is alternately arranged, described first adhesive sheet and a layer first in described first solderless substrate
Pressing film contacts, and constitutes the first dielectric layer, described second pressing base with the first pressing film bonding in contact
Plate includes at least one of which the second pressing film, at least one of which the second conductive pattern layer and described second adhesive sheet, described at least
One layer of second pressing film is alternately arranged with described at least one of which the second conductive pattern layer, described second adhesive sheet and described the
One layer of second pressing film in two solderless substrates contacts, and with in contact second pressing film bonding composition second
Dielectric layer；And
At multilager base plate, near the side of the first solderless substrate, the first solderless substrate is cut, with shape in border along the first exposed region
Become only to run through the first solderless substrate and corresponding with the border of the first exposed region the first annular otch, remove and cut by first
Choma around this part first solderless substrate, and remove the first protection film, thus form corresponding with the first exposed region first
Groove, at multilager base plate, near the side of the second solderless substrate, the second solderless substrate is cut on border along the second exposed region, with
Formed and only run through the second solderless substrate and corresponding with the border of the second exposed region the second annular otch, remove by second
This part second solderless substrate of otch cincture, and remove the second protection film, thus form corresponding with the second exposed region the
Two grooves.
9. the manufacture method of circuit board as claimed in claim 8, it is characterised in that described first conductive circuit layer includes a plurality of
First conducting wire and multiple first connection gasket, the plurality of first connection gasket and part the first conducting wire are positioned at described first
In exposed region, described second conductive circuit layer includes a plurality of second conducting wire and multiple second connection gasket, and described second connects
Pad and part the second conducting wire are positioned at described second exposed region.
10. the manufacture method of circuit board as claimed in claim 9, it is characterised in that the first conductor wire in the first exposed region
The first protection film is formed on the floor of road, before the first conductive circuit layer in the second exposed region is formed the second protection film,
The surface of the first conducting wire being additionally included in the first exposed region forms the first welding resisting layer, with by first in the first exposed region
Conducting wire covers and the first connection gasket exposes from described first welding resisting layer, and it is anti-welding that described first protection film is formed at first
Layer and the surface of the first connection gasket, the surface of the second conducting wire in the second exposed region forms the second welding resisting layer, with by the
The second conducting wire in two exposed regions covers and the second connection gasket exposes from described second welding resisting layer, described second protection glue
Sheet is formed at the second welding resisting layer and the surface of the second connection gasket.
The manufacture method of 11. 1 kinds of circuit boards, including step:
Thering is provided internal layer circuit substrate, described internal layer circuit substrate includes substrate and is formed at the first conductor wire of substrate opposite sides
Road floor and the second conductive circuit layer, described first conductive circuit layer includes the first exposed region and around connecting the of the first exposed region
One pressing district；
The first exposed region in the first conductive circuit layer arranges the first protection film；
At first conductive circuit layer side riveted the first adhesive sheet of internal layer circuit substrate, described first adhesive sheet have with
The first opening that first exposed region is corresponding, described first protection film is positioned at the first opening；
The first solderless substrate is formed, in the second bonding of internal layer circuit substrate in the first adhesive sheet side of internal layer circuit substrate
Film side forms the second solderless substrate, and obtains multilager base plate, and described first solderless substrate includes at least one of which the first pressing
Film, at least one of which the first conductive pattern layer and described first adhesive sheet, described at least one of which the first pressing film is with described
At least one of which the first conductive pattern layer is alternately arranged, described first adhesive sheet and a layer first in described first solderless substrate
Pressing film contacts, and constitutes the first dielectric layer, described second pressing base with the first pressing film bonding in contact
Plate includes at least one of which the second pressing film, at least one of which the second conductive pattern layer, described at least one of which the second pressing film with
Described at least one of which the second conductive pattern layer is alternately arranged, and one layer in described second solderless substrate connects with internal layer circuit substrate
Touch, and constitute the second dielectric layer；And
At multilager base plate, near the side of the first solderless substrate, the first solderless substrate is cut, with shape in border along the first exposed region
Become only to run through the first solderless substrate and corresponding with the border of the first exposed region the first annular otch, remove and cut by first
Choma around this part first solderless substrate, and remove the first protection film, thus form the groove corresponding with the first exposed region.
The manufacture method of 12. circuit boards as claimed in claim 11, it is characterised in that described first conductive circuit layer includes many
Bar the first conducting wire and multiple first connection gasket, the plurality of first connection gasket and part the first conducting wire are positioned at described
In one exposed region.
The manufacture method of 13. circuit boards as claimed in claim 12, it is characterised in that the first conductor wire in the first exposed region
The first protection film is formed on the floor of road, before the first conductive circuit layer in the second exposed region is formed the second protection film,
The surface of the first conducting wire being additionally included in the first exposed region forms the first welding resisting layer, with by first in the first exposed region
Conducting wire covers and the first connection gasket exposes from described first welding resisting layer, and it is anti-welding that described first protection film is formed at first
Layer and the surface of the first connection gasket.
14. 1 kinds of circuit boards, including the first solderless substrate being pressed on together, internal layer circuit substrate and the second solderless substrate, interior
Layer circuit substrate includes substrate, the first conductive circuit layer being formed at substrate one surface and is formed at another apparent surface's of substrate
Second conductive circuit layer, described first conductive circuit layer has the first exposed region and is connected the first pressing of the first exposed region with cincture
District, described first exposed region surface configuration has the first welding resisting layer, and multiple first connection gaskets of the first exposed region are from described first
Exposing in welding resisting layer, described second conductive circuit layer has the second exposed region and is connected the second pressing of the second exposed region with cincture
District, described second exposed region surface configuration has the second welding resisting layer, and multiple second connection gaskets of the second exposed region are from described second
Exposing in welding resisting layer, described first solderless substrate includes being pressed on the first adhesive sheet together, the first pressing film and first
Conductive pattern layer, described first adhesive sheet is bonded between the first pressing district of internal layer circuit substrate and the first pressing film,
And constitute dielectric layer with this first pressing film bonding, have in described circuit board and run through the first recessed of the only first solderless substrate
Groove, described first groove is corresponding with described first exposed region, so that first welding resisting layer on the first exposed region surface and from first
The plurality of first connection gasket exposed in welding resisting layer is exposed in described first groove, and the second solderless substrate includes being pressed on one
The second adhesive sheet, the second pressing film and the second conductive pattern layer risen, the second adhesive sheet is bonded in internal layer circuit substrate
The second pressing district and the second pressing film between, and with this second pressing film bonding constitute another dielectric layer, described circuit
Having the second groove only running through the second solderless substrate in plate, described second groove is corresponding with described second exposed region, so that
Second welding resisting layer and the plurality of second connection gasket exposed from the second welding resisting layer on the second exposed region surface are exposed to described
In second groove, described first groove and the second groove are used to holding electronic components and parts.
15. 1 kinds of circuit boards, including the first solderless substrate being pressed on together, internal layer circuit substrate and the second solderless substrate, interior
Layer circuit substrate includes substrate, the first conductive circuit layer being formed at substrate one surface and is formed on another apparent surface of substrate
The second conductive circuit layer, described first conductive circuit layer have the first exposed region with around is connected the first exposed region first press
Closing district, described first exposed region surface configuration has the first welding resisting layer, and multiple first connection gaskets of the first exposed region are from described the
Exposing in one welding resisting layer, described second conductive circuit layer has the second exposed region and is connected the second pressing of the second exposed region with cincture
District, described second exposed region surface configuration has the second welding resisting layer, and multiple second connection gaskets of the second exposed region are from described second
Welding resisting layer exposes, described first solderless substrate include being pressed on the first adhesive sheet together, multilamellar the first pressing film and
Multilamellar the first conductive pattern layer, the first adhesive sheet is bonded in floor the first pressing glue of the first pressing district and the first solderless substrate
Between sheet, and constituting dielectric layer with the first pressing film bondd with it, described multilamellar the first pressing film and multilamellar first are led
Electricity graph layer is alternately arranged, only has one layer of first conductive pattern layer, described first pressure between every adjacent two layers the first pressing film
Closing substrate and have first groove, described first groove runs through every layer of first pressing film in the first solderless substrate and every layer
First conductive pattern layer, thus the first adhesive sheet in the first solderless substrate, every layer of first pressing film and every layer first
Being respectively formed opening in conductive pattern layer, described first groove is corresponding with described first exposed region, so that described first exposed region
First welding resisting layer and the plurality of first connection gasket exposed from the first welding resisting layer on surface are exposed in described first groove,
Described second solderless substrate includes the second adhesive sheet, multilamellar the second pressing film and multilamellar the second conductive pattern being pressed on together
Shape layer, the first adhesive sheet is bonded between the second pressing district and floor the second pressing film of the second solderless substrate, and with
Second pressing film of its bonding constitutes another dielectric layer, described multilamellar the second pressing film and multilamellar the second conductive pattern layer and hands over
For arrangement, only having one layer of second conductive pattern layer between every adjacent two layers the second pressing film, described second solderless substrate has
One the second groove, described second groove run through the second adhesive sheet in the second solderless substrate, every layer of second pressing film and
Every layer of second conductive pattern layer, thus the second adhesive sheet in the second solderless substrate, every layer of second pressing film and every layer
Being respectively formed opening in second conductive pattern layer, described second groove is corresponding with described second exposed region, so that described second sudden and violent
Dew second welding resisting layer on surface, district and the plurality of second connection gasket exposed from the second welding resisting layer are exposed to described second recessed
In groove, described first groove and the second groove are used to install electronic devices and components.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210267133.6A CN103582325B (en) | 2012-07-31 | 2012-07-31 | Circuit board and preparation method thereof |
| TW101128099A TW201406244A (en) | 2012-07-31 | 2012-08-03 | Printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210267133.6A CN103582325B (en) | 2012-07-31 | 2012-07-31 | Circuit board and preparation method thereof |
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| CN103582325A CN103582325A (en) | 2014-02-12 |
| CN103582325B true CN103582325B (en) | 2016-12-21 |
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| CN201210267133.6A Active CN103582325B (en) | 2012-07-31 | 2012-07-31 | Circuit board and preparation method thereof |
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| CN (1) | CN103582325B (en) |
| TW (1) | TW201406244A (en) |
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| CN109688733B (en) * | 2017-10-19 | 2021-11-30 | 宏启胜精密电子(秦皇岛)有限公司 | Multi-layer flexible circuit board and manufacturing method thereof |
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
| CN116471764A (en) * | 2018-07-16 | 2023-07-21 | 健鼎（无锡）电子有限公司 | Circuit board and manufacturing method thereof |
| CN112165788B (en) * | 2020-09-28 | 2024-02-06 | 高德(苏州)电子有限公司 | Manufacturing method of waterproof PCB |
| TWI808716B (en) * | 2022-04-08 | 2023-07-11 | 欣興電子股份有限公司 | Circuit board and circuit board module with docking structure and manufacture method of the circuit board |
| TWI829370B (en) * | 2022-09-29 | 2024-01-11 | 健鼎科技股份有限公司 | Method for manufacturing semi-flex printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201215508A (en) * | 2010-10-01 | 2012-04-16 | Elite Material Co Ltd | Manufacturing method of substrate and structure capable of simplifying its manufacturing process |
| TW201228511A (en) * | 2010-12-31 | 2012-07-01 | Zhen Ding Technology Co Ltd | Method for manufacturing multilayer printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4885097B2 (en) * | 2007-09-19 | 2012-02-29 | 日本メクトロン株式会社 | Manufacturing method of printed wiring board with built-in resistor |
-
2012
- 2012-07-31 CN CN201210267133.6A patent/CN103582325B/en active Active
- 2012-08-03 TW TW101128099A patent/TW201406244A/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201215508A (en) * | 2010-10-01 | 2012-04-16 | Elite Material Co Ltd | Manufacturing method of substrate and structure capable of simplifying its manufacturing process |
| TW201228511A (en) * | 2010-12-31 | 2012-07-01 | Zhen Ding Technology Co Ltd | Method for manufacturing multilayer printed circuit board |
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| TW201406244A (en) | 2014-02-01 |
| CN103582325A (en) | 2014-02-12 |
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Effective date of registration: 20170303 Address after: 518103 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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