TWI472277B - Rigid-flexible circuit substrate, rigid-flexible circuit board and method for manufacturing same - Google Patents

Description

Soft and hard combined circuit board, soft and hard combined circuit board and manufacturing method thereof

The invention relates to the field of circuit board manufacturing, in particular to a soft and hard combined circuit substrate, a manufacturing method thereof, a soft and hard combined circuit board and a manufacturing method thereof.

Printed circuit boards have been widely used due to their high assembly density. For application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima,M.Res.Lab,High density multilayer printed circuit board for HITAC M-880,IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.

The hard and soft bonding circuit board is a circuit board structure including both a flexible board and a hard board which are connected to each other, and can have both the flexibility of the flexible circuit board and the hardness of the rigid circuit board. In the manufacturing process of the soft-hard bonded circuit board, the insulating layer and the conductive layer are laminated on the flexible circuit board, and then the conductive layer is formed to form a conductive circuit layer. Thus, in the manufacturing process of the soft and hard combined circuit board, multiple press-fitting and conductive circuit manufacturing steps are required, so that the manufacturing process of the flexible combined circuit board is long, and the efficiency of the hard and soft combined circuit board production is low.

In view of the above, a soft and hard combined circuit substrate and a manufacturing method thereof, and a combination of soft and hard are provided The circuit board and its manufacturing method are necessary to provide a combination of soft and hard circuit board fabrication efficiency.

A soft and hard combined circuit substrate comprising a flexible circuit board, a first press film, a second press film, a third press film, a third conductive circuit layer and a fourth conductive circuit layer, wherein the flexible circuit board comprises an exposed area And a nip area connected to the exposed area, the first press film comprises a first press film body and a plurality of first electrical connectors disposed in the first press film body, the first pressure The film body has a first opening corresponding to the flexible circuit board, the flexible circuit board is received in the first opening, and the second pressing film and the third pressing film are respectively pressed against the relative surface of the first pressing film On both sides, and also on opposite sides of the nip, the fourth conductive circuit layer is formed on the surface of the second press film away from the first press film, and the fifth conductive circuit layer is formed on the third press film away from the first Pressing the surface of the film, the second press film comprises a second press film body, a plurality of second electrical connectors and a plurality of third electrical connectors, the second film body having a corresponding portion of the exposed regions Two openings, the plurality of second electrical connections The plurality of third electrical connectors are disposed in the second embossed film body and are in contact with the fourth conductive circuit layer, and the plurality of second electrical connectors are further in contact with the nip and electrically Optionally, the plurality of third electrical connectors are further in one-to-one contact with the plurality of first electrical connectors, and the third laminated film comprises a third film body, a plurality of fourth electrical connectors, and a plurality of a fifth electrical connector having a third opening corresponding to the exposed area, wherein the plurality of fourth electrical connectors and the plurality of fifth electrical connectors are disposed in the third film body and are both electrically conductive The circuit layers are in contact with each other. The plurality of fourth electrical connectors are also in contact with and electrically connected to the nip. The plurality of fifth electrical connectors are also in one-to-one contact with the plurality of first electrical connectors.

A method for manufacturing a soft and hard combined circuit substrate, comprising the steps of: providing a flexible circuit board The flexible circuit board includes an exposed area and a nip area connected to the exposed area; providing a first press film, a second press film, a third press film, a first copper foil, and a second copper foil, The first press-fit film includes a first press-fit film body and a plurality of first electrical connectors disposed in the first press-fit film body, the first press-fit film body having a corresponding portion of the flexible circuit board An opening, the second press film comprises a second press film body, a plurality of second electrical connectors and a plurality of third electrical connectors, the second film body having a second opening corresponding to the exposed area, The plurality of second electrical connectors and the plurality of third electrical connectors are disposed on the second press film body, and the plurality of second electrical connectors correspond to the nip region, the plurality of The third electrical connector is in one-to-one contact with the plurality of first electrical connectors, and the third laminated film comprises a third film body, a plurality of fourth electrical connectors, and a plurality of fifth electrical connectors, and the third film body Having a third opening corresponding to the exposed area, the plurality of fourth electrical connectors, and the plurality The five electrical connectors are disposed in the third film body, the plurality of fourth electrical connectors are corresponding to the nip, and the plurality of fifth electrical connectors are further connected to the plurality of first electrical connectors Corresponding to: pressing the flexible circuit board, the first press film, the second press film, the third press film, the first copper foil and the second copper foil, so that the flexible circuit board is matched with the first pressure In the first opening of the film, the second press film and the third press film are respectively pressed on opposite sides of the first press film, and also on opposite sides of the nip, the first copper foil Forming on the surface of the second press-fit film away from the first press-fit film, the second copper foil is formed on the surface of the third press-fit film away from the first press-fit film, and the first copper foil and the second copper foil pass the first The electrical connector, the third electrical connector and the fifth electrical connector that are in communication with the first electrical connector are in electrical communication, and the second electrical connector electrically connects the nip of the flexible circuit board with the first copper foil The fourth electrical connector electrically connects the nip area of the flexible circuit board with the second copper foil; and selectively goes Forming a third portion of the first copper wiring layer, selectively removing portions of the second copper foil forming a fourth conductive The third conductive layer and the fourth conductive layer are electrically connected to each other through a first electrical connector, a third electrical connector and a fifth electrical connector that are in communication with the first electrical connector, The second electrical connector electrically connects the nip of the flexible circuit board with the third conductive circuit layer, and the fourth electrical connector electrically connects the nip of the flexible circuit board with the fourth conductive circuit layer.

A soft and hard combined circuit board comprising the soft and hard bonded circuit substrate, the first connecting film and the first outer substrate pressed together, the first connecting film being pressed against the first outer substrate and the Between the third conductive circuit layers of the flexible circuit board, the first outer substrate includes a fifth conductive circuit layer, a fourth insulating layer and a sixth conductive circuit layer, which are sequentially disposed, and the fourth insulating layer is formed in the fourth insulating layer. Conducting a first conductive via of the fifth conductive circuit layer and the sixth conductive circuit layer, the first connecting film comprising a first connecting film body and a plurality of sixth electrical connectors disposed in the first press film body The third conductive circuit layer and the fifth conductive circuit layer are electrically connected to each other through the plurality of sixth electrical connectors, and the first outer substrate and the first connecting film body are formed with the flexible circuit board exposed The opening corresponding to the zone is such that the flexible circuit board is exposed.

A method for manufacturing a hard and soft combined circuit board, comprising the steps of: forming a soft and hard bonded circuit substrate by using the method of manufacturing the soft and hard bonded circuit substrate; providing a first outer substrate and a first connecting film, wherein the first outer substrate comprises a fifth conductive circuit layer, a fourth insulating layer and a sixth conductive circuit layer are sequentially disposed, and a plurality of first conductive holes electrically conducting the fifth conductive circuit layer and the sixth conductive circuit layer are formed in the fourth insulating layer, a plurality of sixth electrical connectors penetrating through the first connecting film are formed in the first connecting film; pressing the first outer substrate, the first connecting film, and the soft and hard circuit substrate, the plurality of sixth electrical connectors The third conductive circuit layer and the fifth of the first outer substrate The conductive circuit layers are electrically connected to each other; and a first slit penetrating the first outer substrate and the first connecting film is formed along a boundary line between the exposed region and the nip region, and the portion of the first outer substrate surrounded by the first slit is removed And the first connecting film, thereby obtaining a soft and hard combined circuit board.

The soft and hard combined circuit board provided by the technical solution and the manufacturing method thereof are formed by using a printed metal conductive paste in the manufacturing process, and the conductive hole can be improved by the method of forming the conductive hole by electroplating in the prior art. Hardly combine the reliability of the board and reduce the manufacturing cost of the hard and soft board. In addition, since the plug hole is formed by printing in the connecting film or the substrate in the technical solution, the method of layer-by-layer lamination and layer-by-layer conduction can be reduced in the process of manufacturing the soft and hard board. The number of presses is combined to improve the efficiency of the hard and soft board production.

100‧‧‧Soft and hard combined circuit board

100a‧‧‧Soft and hard combined circuit board

100b‧‧‧Multilayer circuit board

107‧‧‧hard areas

108‧‧‧Soft area

110‧‧‧Soft circuit board

1101‧‧‧Exposure Zone

1102‧‧‧First nip

1103‧‧‧Second nip

111‧‧‧First insulation

1111‧‧‧ first surface

1112‧‧‧ second surface

112‧‧‧First conductive circuit layer

113‧‧‧Second conductive circuit layer

114‧‧‧Second insulation

1141‧‧‧ first hole

115‧‧‧ third insulation

1151‧‧‧ second hole

116‧‧‧First electromagnetic shielding layer

117‧‧‧Second electromagnetic mask

118‧‧‧First cover film

119‧‧‧second cover film

120‧‧‧First press film

120a‧‧‧First pressed film body

121‧‧‧first opening

122‧‧‧First through hole

123‧‧‧First electrical connector

127‧‧‧First molding area

128‧‧‧Second forming area

125‧‧‧The first peelable protective layer

130‧‧‧Second pressure film

130a‧‧‧Second pressed film body

131‧‧‧second opening

1321‧‧‧Second through hole

1322‧‧‧ third through hole

1331‧‧‧Second electrical connector

1332‧‧‧ Third electrical connector

140‧‧‧ Third press film

140a‧‧‧ Third laminated film body

141‧‧‧ third opening

1421‧‧‧4th through hole

1422‧‧‧5th through hole

1431‧‧‧4th electrical connector

1432‧‧‧5th electrical connector

150‧‧‧First copper foil

160‧‧‧second copper foil

151‧‧‧ Third conductive circuit layer

161‧‧‧fourth conductive layer

171‧‧‧First connecting film

1711‧‧‧First connection film body

173‧‧‧ sixth through hole

174‧‧‧6th electrical connector

172‧‧‧Second connection film

1721‧‧‧Second connection film body

175‧‧‧ seventh through hole

176‧‧‧ seventh electrical connector

181‧‧‧First outer substrate

181a‧‧‧Copper substrate

183‧‧‧fourth insulation layer

184‧‧‧ fifth conductive circuit layer

184a‧‧‧ third copper foil layer

185‧‧‧ sixth conductive circuit layer

185a‧‧‧fourth copper foil layer

1811‧‧‧First conductive hole

1811a‧‧‧First blind hole

1811b‧‧‧First conductive material

182‧‧‧Second outer substrate

186‧‧‧ fifth insulation layer

187‧‧‧ seventh conductive circuit layer

188‧‧‧ eighth conductive circuit layer

1812‧‧‧Second conductive hole

191‧‧‧ first incision

192‧‧‧second incision

1010‧‧‧First solder mask

1011‧‧‧Second solder mask

1 is a schematic cross-sectional view of a flexible circuit board provided by an embodiment of the present technical solution.

2 is a schematic cross-sectional view of a first press film provided by an embodiment of the present technical solution.

FIG. 3 is a schematic cross-sectional view of a second press film provided by an embodiment of the present technical solution.

4 is a schematic cross-sectional view of a third press film provided by an embodiment of the present technical solution.

FIG. 5 to FIG. 7 are schematic diagrams showing steps of a first press-fit film manufacturing process provided by an embodiment of the present technical solution.

FIG. 8 is a schematic cross-sectional view showing a first copper foil and a second copper foil provided by the present technical solution.

9 is a schematic cross-sectional view showing a press-fit flexible circuit board, a first press-fit substrate, a second press-fit film, a third press-fit film, a first copper foil, and a second copper foil.

FIG. 10 is a schematic cross-sectional view showing a soft and hard circuit board substrate formed by the technical solution.

11 is a schematic cross-sectional view of a first connecting film provided by the present technical solution.

12 is a schematic cross-sectional view of a second connecting film provided by the present technical solution.

13 is a schematic cross-sectional view of a first outer substrate provided by the present technical solution.

14 is a schematic cross-sectional view of a second outer substrate provided by the present technical solution.

FIG. 15 to FIG. 17 are schematic diagrams showing steps of a first outer substrate manufacturing process provided by an embodiment of the present technical solution.

18 is a schematic cross-sectional view showing a multilayer circuit substrate obtained by pressing a first outer substrate, a first connecting film, a hard and soft circuit board substrate, a second connecting film, and a second outer substrate.

Fig. 19 is a schematic cross-sectional view showing the first slit and the second slit formed in the multilayer circuit substrate of Fig. 18.

Fig. 20 is a schematic cross-sectional view showing the cross-sectional view of the material in the first slit and the second slit of Fig. 19, showing a soft-hardened circuit board.

Figure 21 is a schematic cross-sectional view showing the outer solder resist layer formed in the soft-hard bonded circuit board of Figure 20.

The method for fabricating a soft-hard combination circuit board provided by the first embodiment of the present technical solution includes the following steps:

In the first step, referring to FIG. 1, a flexible circuit board 110 is provided.

The flexible circuit board 110 is a circuit board on which conductive lines are formed. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In the present embodiment, the flexible circuit board 110 is taken as an example of a double-sided circuit board. The flexible circuit board 110 includes a first cover film 118, a first electromagnetic mask layer 116, a second insulating layer 114, and a first guide stacked in sequence. The electric circuit layer 112, the first insulating layer 111, the second conductive wiring layer 113, the third insulating layer 115, the second electromagnetic shielding layer 117, and the second covering film 119. The first insulating layer 111 includes an opposite first surface 1111 and a second surface 1112. The first conductive wiring layer 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive wiring layer 113 is formed on the first insulating layer 111. The second surface 1112.

The flexible circuit board 110 is substantially rectangular and includes an exposed area 1101 and a first nip 1102 and a second nip 1103 connected to opposite sides of the exposed area 1101. The exposed area 1101 is also rectangular, which is used to form a soft region of the hard and soft bonded circuit board. The first nip 1102 and the second nip 1103 are for fixed connection to the rigid circuit board. In the embodiment, in the plane in which the flexible circuit board 110 is located, the extending direction from the first nip 1102 to the second nip 1103 is defined as a length direction, and the direction perpendicular to the extending direction is defined as a width direction. The first conductive wiring layer 112 and the second conductive wiring layer 113 both extend along the length direction, and both extend from the first nip 1102 through the exposed region 1101 to the second nip region 1103.

In the second insulating layer 114 in the first nip 1102 and the second nip 1103, a plurality of first holes 1141 are formed such that a portion of the first conductive wiring layer 112 is exposed from the first holes 1141. In the third insulating layer 115 in the first nip 1102 and the second nip 1103, a plurality of second holes 1151 are formed such that a portion of the second conductive wiring layer 113 is exposed from the second holes 1151.

The first electromagnetic mask layer 116, the second electromagnetic mask layer 117, the first cover film 118, and the second cover film 119 are located in the entire exposed area 1101, and are also located in a portion of the first nip 1102 adjacent to the exposed area 1101 and A portion of the second nip 1103 adjacent to the exposed region 1101. Both the first electromagnetic mask layer 116 and the second electromagnetic mask layer 117 can be formed by printing a conductive silver paste. The first cover film 118 is formed on the first electromagnetic mask layer 116 The exposed surface, that is, the surface of the first electromagnetic shielding layer 116 away from the second insulating layer 114 and the side of the first electromagnetic shielding layer 116, for covering and protecting the first electromagnetic shielding layer 116, the second covering The film 119 is formed on a surface of the second electromagnetic mask layer 117 away from the third insulating layer 115 and a side of the second electromagnetic mask layer 117 for covering and protecting the second electromagnetic mask layer 117.

In the second step, please refer to FIG. 2 to FIG. 8 to provide a first press film 120, a second press film 130, a third press film 140, a first copper foil 150 and a second copper foil 160. Referring to FIG. 2, the thickness of the first press film 120 is substantially equal to the thickness of the flexible circuit board 110. A first opening 121 corresponding to the flexible circuit board 110 is formed in the first press film 120. Correspondingly, the cross-sectional area and shape of the first opening 121 are consistent with the flexible circuit board 110. The first press film 120 includes a first molding region 127 and a second molding region 128 connected to both ends of the first opening 121 along the length direction. The first press film 120 includes a first press film body 120a and a plurality of first electrical connectors 123. A plurality of first through holes 122 are formed in the first press-fit film body 120a. A first electrical connection body 123 is formed in each of the first through holes 122. The first electrical connection body 123 in each of the first through holes 122 is disposed coaxially with the first through hole 122 and penetrates the first through hole 122. Both ends of the first electrical connector 123 extend through the first through holes 122 respectively. In this embodiment, the first electrical connector 123 is formed by curing a metal conductive paste, preferably formed by curing a copper conductive paste.

Referring to FIG. 3, the second press film 130 may be a low-flow semi-cured film. A second opening 131 corresponding to the exposed region 1101 of the flexible circuit board 110 is formed in the second press film 130. The second press film 130 includes a second press film body 130a, a plurality of second electrical connectors 1331, and a plurality of third electrical connectors 1332. A plurality of second through holes 1321 and a plurality of third through holes 1322 are formed in the second embossed film main body 130a. among them The second through hole 1321 is located closer to the second opening 131 than the third through hole 1322 , and the second through hole 1321 is located between the second opening 131 and the plurality of third through holes 1322 . A second electrical connection body 1331 is formed in each of the second through holes 1321. The second electrical connection body 1331 in each of the second through holes 1321 is coaxially disposed with the second through holes 1321 and penetrates the second through holes 1321. Both ends of the second electrical connector 1331 extend through the second through holes 1321. The second electrical connector 1331 corresponds to the first hole 1141 of the second insulating layer 114. A third electrical connection body 1332 is formed in each of the third through holes 1322. The third electrical connection body 1332 in each of the third through holes 1322 is disposed coaxially with the third through hole 1322 and penetrates the third through hole 1322. Both ends of the third electrical connector 1332 extend out of the third through hole 1322, respectively. The second electrical connector 1331 has a one-to-one correspondence with the first hole 1141. The third electrical connector 1332 corresponds to the first electrical connector 123 of the first press film 120. In this embodiment, the second electrical connector 1331 and the third electrical connector 1332 are both made of a metal conductive paste. A copper conductive paste is preferred.

Referring to FIG. 4, the structure of the third press film 140 is substantially the same as that of the second press film 130. The third press film 140 may also be a low-flowing semi-cured film. Specifically, a third opening 141 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed in the third laminated film 140. The third press film 140 includes a third press film body 140a, a plurality of fourth electrical connectors 1431, and a plurality of fifth electrical connectors 1432. A plurality of fourth through holes 1421 and a plurality of fifth through holes 1422 are formed in the third pressed film 140 of the third pressed film body 140a. The fourth through hole 1421 is located closer to the third opening 141 than the fifth through hole 1422 , and the fourth through hole 1421 is located between the third opening 141 and the plurality of fifth through holes 1422 . A fourth electrical connection body 1431 is formed in each of the fourth through holes 1421. The fourth electrical connector 1431 in each of the fourth through holes 1421 is disposed coaxially with the fourth through hole 1421 and penetrates the fourth through hole 1421. Both ends of the fourth electrical connector 1431 extend through the fourth through hole 1421, respectively. The fourth electrical connector 1431 and the third insulating layer 115 The second holes 1151 are in one-to-one correspondence. A fifth electrical connector 1432 is formed in each of the fifth through holes 1422. The fifth electrical connector 1432 in each of the fifth through holes 1422 is coaxially disposed with the fifth through hole 1422 and penetrates through the fifth through hole 1422. Both ends of the fifth electrical connector 1432 extend through the fifth through hole 1422, respectively. Each of the fifth electrical connectors 1432 corresponds to a first electrical connector 123 of the first press film 120. In this embodiment, the fourth electrical connector 1431 and the fifth electrical connector 1432 are made of a metal conductive paste. A copper conductive paste is preferred.

The first copper foil 150 and the second copper foil 160 are preferably continuous rolled copper foils, but may be continuous electrolytic copper foils as shown in FIG.

The lengths of the first press film 120, the second press film 130, the third press film 140, the first copper foil 150, and the second copper foil 160 are all greater than the length of the flexible circuit board 110. In this embodiment, the first press film 120, the second press film 130, the third press film 140, the first copper foil 150, and the second copper foil 160 have the same length.

Referring to FIG. 5 to FIG. 7, the first press-fit film 120 can be made by the following method: First, a first press-fit film body 120a as shown in FIG. 5 is provided, and the first press-fit film body 120a is formed therein. The first opening 121 corresponds to the flexible circuit board 110.

Next, as shown in FIG. 6, a first peelable protective adhesive layer 125 is formed on opposite surfaces of the first press-fit film body 120a, and the first peelable protective adhesive layer 125 covers the first opening 121. The first peelable protective adhesive layer 125 may be a peelable polyethylene terephthalate film.

Thirdly, a plurality of first through holes penetrating the first peelable protective adhesive layer 125 and the first press-fit film body 120a are formed in the first press-fit film body 120a by laser ablation. 122, and printing a conductive paste in the first through hole 122, and the conductive paste is cured to form the first electrical connection body 123. Since the first peelable protective adhesive layer 125 has a thickness, the first electrical connector 123 protrudes from the opposite surfaces of the first press-fitted film body 120a.

Finally, the first peelable protective layer 125 of the opposite surfaces of the first press-fit film body 120a is removed to obtain the first press-fit film 120.

The second press film 130 and the third press film 140 are formed in substantially the same manner as the second press film 130, except that the second press film 130 has an exposed area with the flexible circuit board 110. The first opening 131 corresponding to the shape of the 1101, the third pressing film 140 has a third opening 141 corresponding to the shape of the exposed area 1101 of the flexible circuit board 110.

In the third step, referring to FIG. 9, the flexible circuit board 110, the first press film 120, the second press film 130, the third press film 140, the first copper foil 150, and the second copper foil 160 are aligned. And press into a whole.

When the alignment is performed, the first copper foil 150, the second pressed film 130, the first pressed film 120, the third pressed film 140, and the second copper foil 160 are sequentially stacked, and the flexible circuit board 110 is placed on the second press. Between the film 130 and the third press film 140, and located in the first opening 121 of the first press film 120. The second opening 131 of the second pressed film 130 and the third opening 141 of the third laminated film 140 respectively correspond to the exposed area 1101 of the flexible circuit board 110, and the second pressed film 130 is located at the first of the flexible circuit board 110. The pressing area 1102 and the second pressing area 1103 and one side surface of the first press film 120, the third pressing film 140 is located at the first pressing area 1102 and the second pressing area 1103 of the flexible circuit board 110 and The other side surface of the film 120 is pressed.

In this embodiment, the first to fifth electrical connectors are all made of a conductive paste, and are added. During the thermocompression process, deformation can occur. The second electrical connector 1331 of the second laminated film 130 passes through the first hole 1141 of the flexible circuit board 110, is in contact with the first conductive circuit layer 112, and is electrically connected. The second electrical connector 1331 is pressed. A first conductive via hole electrically conducting the first conductive wiring layer 112 and the first copper foil 150 is formed. The third electrical connector 1332 of the second press film 130 is in contact with and electrically conductive with the first electrical connector 123 of the first press film. The fourth electrical connector 1431 of the third laminated film 140 passes through the second hole 1151 of the flexible circuit board 110, is in contact with the second conductive circuit layer 113, and is electrically connected. The fourth electrical connector 1431 forms an electrical continuity. The second conductive circuit layer 113 and the second conductive blind hole of the second copper foil 160. The fifth electrical connector 1432 of the third press film 140 is in contact with and electrically conductive with the first electrical connector 123 of the first press film 120. Therefore, one end of each of the first electrical connectors 123 is connected to the third electrical connector 1332, and the other end is connected to the fifth electrical connector 1432. Each of the first electrical connectors 123 and the third electrical connectors 1332 and the second electrical connectors 1432 connected thereto are formed with a third conductive blind via that electrically conducts the first copper foil 150 and the second copper foil 160.

After pressing, the first press film 120, the second press film 130, and the third press film 140 are cured to form a hard portion, and the exposed region 1101 of the flexible circuit board 110 forms a soft portion.

In a fourth step, referring to FIG. 10, a portion of the first copper foil 150 is selectively removed to form at least a portion of the first copper foil 150 to form a third conductive wiring layer 151 on the surface of the second laminated film 130, and a second portion is selectively removed. The copper foil 160 is formed to form at least a portion of the second copper foil 160 on the fourth conductive wiring layer 161 on the surface of the third embossed film 140, thereby obtaining a soft-hard bonded circuit substrate 100a. The third conductive circuit layer 151 and the fourth conductive circuit layer 161 may be formed by an image transfer process and an etching process.

In this embodiment, only the first molding area 127 and the second molding of the first press-fit film 120 will be The portion 128, the first nip 1102 and the portion of the first copper foil 150 corresponding to the second nip 1103 are selectively etched to obtain a third conductive wiring layer 151, that is, pressed against the surface of the second emboss film 130. The first copper foil 150 is selectively etched to obtain a third conductive wiring layer 151. Only the second copper foil 160 corresponding to the first molding region 127, the second molding region 128, the first nip region 1102, and the second nip region 1103 of the first press-fit film 120 is selectively etched to obtain a fourth Conductive wiring layer 161. The second copper foil 160 to be pressed against the surface of the third press film 140 is selectively etched to obtain a fourth conductive wiring layer 161. A portion of the first copper foil 150 and a portion of the second copper foil 160 covering the exposed region 1101 are not etched. It can be understood that, in this step, the residual first copper foil 150 and the second copper foil 160 corresponding to the exposed region 1101 can also be completely removed.

In this embodiment, a portion of the first copper foil 150 and a portion of the second copper foil 160 covering the exposed region 1101 are not etched, and the flexible circuit board 110 shielded by the flexible circuit board can be protected when the soft and hard circuit board is subsequently fabricated.

In the soft and hard-bonding circuit substrate 100a, the exposed region 1101 of the flexible circuit board 110 and the first copper foil 150 and the second copper foil 160 on the surface thereof constitute a soft board region of the soft and hard bonded circuit substrate 100a, and the remaining portions constitute a soft and hard region. In combination with the hard plate region of the circuit substrate 100a, the thickness of the soft plate region is smaller than the thickness of the hard plate region, and the material is soft, and can be bent and deformed with respect to the hard plate region, thereby forming the soft and hard bonded circuit substrate 100a.

Referring to FIG. 10, a second embodiment of the present invention provides a soft and hard bonded circuit substrate 100a manufactured by the above manufacturing method, which comprises a flexible circuit board 110 pressed together as described above, and a first press fit. The film 120, the second press film 130, the third press film 140, the third conductive circuit layer 151, and the fourth conductive circuit layer 161.

The flexible circuit board 110 includes a first cover film 118, a first electromagnetic mask layer 116, a second insulating layer 114, a first conductive wiring layer 112, a first insulating layer 111, and a first layer. The second conductive circuit layer 113, the third insulating layer 115, the second electromagnetic mask layer 117, and the second cover film 119. The first insulating layer 111 includes an opposite first surface 1111 and a second surface 1112. The first conductive wiring layer 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive wiring layer 113 is formed on the first insulating layer 111. The second surface 1112.

The flexible circuit board 110 is substantially rectangular and includes an exposed area 1101 and a first nip 1102 and a second nip 1103 connected to opposite sides of the exposed area 1101. The exposed area 1101 is also rectangular, which is used to form a soft region of the hard and soft bonded circuit board. The first nip 1102 and the second nip 1103 are for fixed connection to the rigid circuit board. In the embodiment, in the plane in which the flexible circuit board 110 is located, the extending direction from the first nip 1102 to the second nip 1103 is defined as a length direction, and the direction perpendicular to the extending direction is defined as a width direction. The conductive lines in the first conductive wiring layer 112 and the second conductive wiring layer 113 extend in the length direction and extend from the first bonding region 1102 through the exposed region 1101 to the second pressing region 1103.

In the second insulating layer 114 in the first nip 1102 and the second nip 1103, a plurality of first holes 1141 are formed such that a portion of the first conductive wiring layer 112 is exposed from the first holes 1141. In the third insulating layer 115 in the first nip 1102 and the second nip 1103, a plurality of second holes 1151 are formed such that a portion of the second conductive wiring layer 113 is exposed from the second holes 1151.

The first electromagnetic mask layer 116, the second electromagnetic mask layer 117, the first cover film 118 and the second cover film 119 are attached to a portion of the first nip 1102 located in the entire exposed area 1101 and adjacent to the exposed area 1101. And a portion of the second nip 1103 adjacent to the exposed region 1101. Both the first electromagnetic mask layer 116 and the second electromagnetic mask layer 117 can be formed by printing a conductive silver paste. The first cover film 118 is used to cover and protect the first electromagnetic mask layer 116, and the second cover film 119 is used to cover and protect the second electromagnetic mask layer 117.

The second press film 130 can be a low flow semi-cured film. A second opening 131 corresponding to the exposed region 1101 of the flexible circuit board 110 is formed in the second press film 130. The second press film 130 includes a second press film body 130a, a plurality of second electrical connectors 1331, and a plurality of third electrical connectors 1332. A plurality of second through holes 1321 and a plurality of third through holes 1322 are formed in the second embossed film main body 130a. The second through hole 1321 is located closer to the second opening 131 than the third through hole 1322 , and the second through hole 1321 is located between the second opening 131 and the plurality of third through holes 1322 . A second electrical connection body 1331 is formed in each of the second through holes 1321. The second electrical connection body 1331 in each of the second through holes 1321 is coaxially disposed with the second through holes 1321 and penetrates the second through holes 1321. Both ends of the second electrical connector 1331 extend through the second through holes 1321. The second electrical connector 1331 corresponds to the first hole 1141 of the second insulating layer 114. A third electrical connection body 1332 is formed in each of the third through holes 1322. The third electrical connection body 1332 in each of the third through holes 1322 is disposed coaxially with the third through hole 1322 and penetrates the third through hole 1322. Both ends of the third electrical connector 1332 extend out of the third through hole 1322, respectively. The second electrical connector 1331 has a one-to-one correspondence with the first hole 1141. The third electrical connector 1332 corresponds to the first electrical connector 123 of the first press film 120. In this embodiment, the second electrical connector 1331 and the third electrical connector 1332 are both made of a metal conductive paste. A copper conductive paste is preferred.

Referring to FIG. 4, the structure of the third press film 140 is substantially the same as that of the second press film 130. The third press film 140 may also be a low-flowing semi-cured film. Specifically, a third opening 141 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed in the third laminated film 140. The third press film 140 includes a third press film body 140a, a plurality of fourth electrical connectors 1431, and a plurality of fifth electrical connectors 1432. A plurality of fourth through holes 1421 and a plurality of fifth through holes 1422 are formed in the third pressed film 140 of the third pressed film body 140a. The fourth through hole 1421 is opened at a lower position than the fifth through hole 1422 is closer to the third opening 141, and the fourth through hole 1421 is located between the third opening 141 and the plurality of fifth through holes 1422. A fourth electrical connection body 1431 is formed in each of the fourth through holes 1421. The fourth electrical connector 1431 in each of the fourth through holes 1421 is disposed coaxially with the fourth through hole 1421 and penetrates the fourth through hole 1421. Both ends of the fourth electrical connector 1431 extend through the fourth through hole 1421, respectively. The fourth electrical connector 1431 is in one-to-one correspondence with the second hole 1151 of the third insulating layer 115. A fifth electrical connector 1432 is formed in each of the fifth through holes 1422. The fifth electrical connector 1432 in each of the fifth through holes 1422 is coaxially disposed with the fifth through hole 1422 and penetrates through the fifth through hole 1422. Both ends of the fifth electrical connector 1432 extend through the fifth through hole 1422, respectively. Each of the fifth electrical connectors 1432 corresponds to a first electrical connector 123 of the first press film 120. In this embodiment, the fourth electrical connector 1431 and the fifth electrical connector 1432 are made of a metal conductive paste. A copper conductive paste is preferred.

The third conductive line 151 is formed on a surface of the second press film 130 away from the first press film 120. The fourth conductive wiring layer 161 is formed on a surface of the third embossed film 140 away from the first embossed film 120. Both sides of the exposed region 1101 are covered by the first copper foil 150 and the second copper foil 160, respectively.

The second electrical connector 1331 of the second laminated film 130 passes through the first hole 1141 of the flexible circuit board 110, and is electrically connected to the first conductive circuit layer 112. The second electrical connector 1331 forms a conductive first conductive layer. 112 and a first conductive via hole 1104 of the third conductive circuit layer 151. The fourth electrical connector 1431 of the third laminated film 140 passes through the second hole 1151 of the flexible circuit board 110 and is electrically connected to the second conductive circuit layer 113. The fourth electrical connector 1431 forms a conductive second conductive. The second conductive via 1105 of the circuit layer 113 and the fourth conductive circuit layer 161. One end of each of the first electrical connectors 123 is connected to the third electrical connector 1332, and the other end is connected to the fifth electrical connector 1432. Each of the first electrical connecting bodies 123 and the third electrical connecting body 1332 and the fifth electrical connecting body 1432 connected thereto are formed with a third conductive blind hole 1106 electrically conducting the third conductive circuit layer 151 and the fourth conductive circuit layer 161. .

The third embodiment of the present technical solution provides a method for manufacturing a soft and hard combined circuit board, and the manufacturing method includes the following steps:

In the first step, referring to FIG. 10, the soft and hard bonded circuit substrate 100a is provided. The hard and soft combined circuit substrate 100a can be fabricated by using the manufacturing method provided by the first embodiment of the present technical solution.

In the second step, referring to FIG. 11 to FIG. 14, a first connecting film 171, a second connecting film 172, a first outer substrate 181 and a second outer substrate 182 are provided.

The first connecting film 171 and the second connecting film 172 are produced in a similar manner to the first bonding film 120 in the first embodiment, except that the first connecting film 171 and the second connecting film 172 have no opening in the middle. .

The first connecting film 171 includes a first connecting film body 1711 and a plurality of sixth electrical connectors 174. A plurality of sixth through holes 173 are formed in the first connecting film body 1711, and a sixth electrical connecting body 174 is formed in each of the sixth through holes 173. The position where the sixth through hole 173 is opened corresponds to the conductive line in the third conductive circuit layer 151, and the sixth electrical connection body 174 is used to electrically conduct with the third conductive circuit layer 151.

The second connecting film 172 includes a second connecting film body 1721 and a plurality of seventh electrical connectors 176. The first connecting film body 1711 is formed with a plurality of seventh through holes 175. A seventh electrical connector 176 is formed in each of the seventh through holes 175. The seventh through hole 175 is opened at a position corresponding to the conductive line in the fourth conductive circuit layer 161, and the seventh electrical connection body 176 is used to electrically conduct with the fourth conductive circuit layer 161.

The first outer substrate 181 includes a fourth insulating layer 183, a fifth conductive wiring layer 184, and a sixth conductive wiring layer 185. The fifth conductive wiring layer 184 is formed on one surface of the fourth insulating layer 183, and the sixth conductive wiring layer 185 is formed on the other opposite surface of the fourth insulating layer 183. The fourth insulating layer 183 is located between the fifth conductive wiring layer 184 and the sixth conductive wiring layer 185. In the first outer substrate 181, a plurality of first conductive vias 1811 are formed, and the fifth conductive trace layer 184 is electrically connected to the sixth conductive via layer 185 through the plurality of first conductive vias 1811. The conductive line in the portion of the fifth conductive wiring layer 184 should correspond to the position where the sixth through hole 173 in the first connecting film 171 is opened.

The second outer substrate 182 includes a fifth insulating layer 186, a seventh conductive wiring layer 187, and an eighth conductive wiring layer 188. The seventh conductive wiring layer 187 is formed on one surface of the fifth insulating layer 186, and the eighth conductive wiring layer 188 is formed on the other opposite surface of the fifth insulating layer 186. The fifth insulating layer 186 is located between the seventh conductive circuit layer 187 and the eighth conductive circuit layer 188. In the second outer substrate 182, a plurality of second conductive vias 1812 are formed, and the seventh conductive trace layer 187 is electrically connected to the eighth conductive via layer 188 through the plurality of second conductive vias 1812. The conductive lines in the portion of the seventh conductive wiring layer 187 should correspond to the positions at which the seventh via holes 175 in the second connecting film 172 are opened.

Referring to FIGS. 15-17, the first outer substrate 181 can be obtained by the following method: First, as shown in FIG. 15, a copper clad substrate 181a is provided. The copper clad substrate 181a is a double-sided copper clad substrate including a third copper foil layer 184a, the fourth insulating layer 183, and a fourth copper foil layer 185a. The fourth insulating layer 183 is located between the third copper foil layer 184a and the fourth copper foil layer 185a.

Next, a second peelable protective adhesive layer 189 is formed on the surface of the third copper foil layer 184a away from the fourth insulating layer 183. The second peelable protective layer 189 may be a peelable poly Ethylene terephthalate film. In this step, a second peelable protective layer 189 may also be formed on the surface of the fourth copper foil layer 185a away from the fourth insulating layer 183 to protect the fourth copper foil layer 185a.

Thirdly, a first blind hole 1811a penetrating only the second peelable protective layer 189, the third copper foil layer 184a and the fourth insulating layer 183 is formed in the copper clad substrate 181a by laser ablation, and is first A first conductive material 1811b is formed in the blind via 1811a, thereby obtaining a first conductive via 1811, as shown in FIG. In this embodiment, a first blind hole 1811a is formed from the second peelable protective adhesive layer 189 to the fourth insulating layer 183 by using a combination of carbon dioxide laser and ultraviolet laser. The first conductive material 1811b can be formed by printing a conductive paste and curing. Preferably, the first conductive material 1811b is made of a conductive copper paste. The second peelable protective adhesive layer 189 can prevent the conductive paste from being formed on the surfaces of the third copper foil layer 184a and the fourth copper foil layer 185a when the first conductive material 1811b is formed by printing.

Again, as shown in FIG. 17, the second peelable protective layer 189 is removed. The first peelable protective layer 189 can be removed by direct peeling.

Finally, a portion of the third copper foil layer 184a is selectively removed to form the third copper foil layer 184a into the fifth conductive wiring layer 184, and a portion of the fourth copper foil layer 185a is selectively removed to form the fourth copper foil layer 185a into the sixth conductive layer. Circuit layer 185.

In this embodiment, a portion of the third copper foil layer 184a may be selectively removed by an image transfer process and an etching process to form a fifth conductive wiring layer 184, and a portion of the fourth copper foil layer 185a may be selectively removed to form a sixth conductive wiring layer 185.

In addition, the first conductive via 1811 may also be a conductive via, which may be formed by forming a via hole in the copper clad substrate 181a and then filling the via hole with a conductive material.

The second outer substrate 182 can be fabricated in the same manner as the first outer substrate 181.

The third step, referring to FIG. 18, sequentially stacks and presses the first outer substrate 181, the first connecting film 171, the soft and hard bonded circuit substrate 100a, the second connecting film 172, and the second outer substrate 182 in one step to obtain a multilayer circuit. Substrate 100b.

Since the first connecting film 171, the second connecting film 172, the sixth electrical connecting body 174 in the first connecting film 171, and the seventh electrical connecting body 176 in the second connecting film 172 are all deformable when heated and pressurized. Thus, after pressing, the third conductive wiring layer 151 is electrically conducted to the fifth conductive wiring layer 184 through the sixth electrical connection body 174 in the first connection film 171. The film material in the first connecting film 171 becomes an insulating layer between the third conductive wiring layer 151 and the fifth conductive wiring layer 184. The fourth conductive wiring layer 161 is electrically connected to the seventh conductive wiring layer 187 through the seventh electrical connection body 176 of the second connection film 172. The film material in the second connecting film 172 becomes an insulating layer between the fourth conductive wiring layer 161 and the seventh conductive wiring layer 187. The fourth step, referring to FIG. 19 to FIG. 20, is formed along the boundary between the exposed region 1101 of the flexible circuit board 110 and the first nip region 1102 and the second nip region 1103, and is formed through the first outer substrate 181. a first slit 191 of the first copper foil 150 corresponding to the first connecting film 171 and the exposed area 1101, and a second slit of the second copper foil 160 corresponding to the second outer substrate 182, the second connecting film 172 and the exposed area 1101 192. The first copper foil 150 corresponding to the portion of the first outer substrate 181 and the first connecting film 171 and the exposed region 1101 in the first slit 191 is removed, and the portion located in the second slit 192 is second. The second copper foil 160 corresponding to the outer substrate 182 and the second connecting film 172 and the exposed region 1101 is removed, thereby exposing the exposed region 1101 of the flexible circuit board 110, and the soft and hard circuit board 100 is obtained.

The first slit 191 and the second slit 192 may be formed by ultraviolet laser deep cut, and the formed first slit 191 and second slit 192 are not penetrated to the flexible circuit board 110.

In this embodiment, the fifth conductive circuit layer 184 and the sixth conductive circuit layer 185 have openings corresponding to the exposed regions 1101. The portion of the first connecting film 171 corresponding to the exposed regions 1101 is not provided with the sixth electrical connector 174. Therefore, the first slit 191 can be formed by cutting. The seventh conductive circuit layer 187 and the eighth conductive circuit layer 188 have openings corresponding to the exposed regions 1101, and the portion of the second connecting film 172 corresponding to the exposed regions 1101 is not provided with the seventh electrical connecting body 176, so that it can be conveniently The cutting forms a second slit 192.

In this embodiment, the first slit 191 and the second slit 192 each include two trimming edges as shown in FIG.

The first molding area 127, the first pressing area 1102, and the first connecting film 171, the second connecting film 172, the first outer substrate 181, and the second outer substrate 182 corresponding to the two portions form a soft and hard circuit board. A rigid region 107 of 100, the hard portion of the second molding region 128 corresponding to the second nip region 1103 of the flexible circuit board 110 forms another hard region 107 of the hard and soft bonding circuit board 100. The exposed region 1101 of the flexible circuit board 110 connected between the two hard regions 107 forms a soft region 108 of the hard and soft bonded circuit board 100.

It can be understood that when the third conductive circuit layer 151 and the fourth conductive circuit layer 161 are not disposed on both sides of the exposed region 1101, the third conductive circuit layer 151 and the fourth conductive circuit layer 161 need not be removed in this step. The first connecting film 171, the second connecting film 172, the first outer substrate 181, and the second outer substrate 182 corresponding to the exposed area 1101 may be removed.

In the fifth step, referring to FIG. 21, a solder resist layer is formed on the outer conductive layer and the outer insulating layer surface of the two hard regions of the hard-and-soft bonded circuit board 100.

In this embodiment, a first solder resist layer 1010 is formed on a surface of the sixth conductive wiring layer 185 and a surface of the exposed fourth insulating layer 183 from the sixth conductive wiring layer 185, and the first solder resist layer 1010 has an opening such that A portion of the sixth conductive wiring layer 185 is exposed from the opening. A second solder resist layer 1011 is formed on a surface of the eighth conductive circuit layer 188 and a surface of the fifth insulating layer 186 exposed from the eighth conductive circuit layer 188, and the second solder resist layer 1011 also has an opening, and a portion of the eighth conductive line Layer 188 is exposed from the opening.

It can be understood that the first solder resist layer 1010 and the second solder resist layer 1011 can also be formed after the third step.

It can be understood that, in the third step, in the third step, more layers of the outer circuit substrate and the connecting film are pressed on opposite sides of the hard and soft combined circuit substrate 100a. A connecting film is disposed between two adjacent outer circuit boards, and more layers of soft and hard circuit boards can be fabricated.

It can be understood that, in order to prevent the material of the second press film 130 and the third press film 140 from flowing to the first cover film 118 and the second cover film 119 located in the exposed area 1101 during the pressing process, in the subsequent process It is not easy to remove, and a peelable protective film can be formed on the surfaces of the first cover film 118 and the second cover film 119 located in the exposed region 1101. And in a fourth step, a portion of the first outer substrate 181 and the first connecting film 171 located in the first slit 191 are removed, and a portion of the second outer substrate 182 and the second portion located in the second slit 192 are removed. When the connecting film 172 is removed, it is removed together.

It can be understood that the soft and hard circuit board provided by the technical solution may include only a flexible circuit board and a rigid circuit structure laminated on one side of the flexible circuit board. In progress In the process of making a hard and soft board, it is also possible to perform lamination only on one side of the flexible board.

Referring to FIG. 21, a fourth embodiment of the present invention further provides a soft and hard bonded circuit board 100 obtained by the above manufacturing method, which comprises a soft region 108 and two hard regions 107 connected to both ends of the soft region 108. In this embodiment, the hard and soft bonding circuit board 100 includes the soft and hard bonding circuit substrate 100a, the first connecting film 171, the second connecting film 172, and the first outer substrate 181 which are pressed together as described above. The second outer substrate 182.

The third conductive wiring layer 151 is electrically connected to the fifth conductive wiring layer 184 of the first outer substrate 181 through the sixth electrical connection body 174 of the first connection film 171. The sixth electrical connector 174 becomes a conductive blind hole. The fourth conductive wiring layer 161 is electrically connected to the seventh conductive wiring layer 187 through the seventh electrical connection body 176 of the second connection film 172. The seventh electrical connector 176 becomes a conductive blind hole.

It can be understood that the third conductive circuit layer 151 can have a plurality of first connecting films 171 and a plurality of first outer substrates 181, and the first connecting film 171 and the plurality of first outer substrates 181 are alternately arranged, each adjacent two layers. There is only one multilayer first outer substrate 181 between the first connecting films 171. There is only one first connecting film 171 between the adjacent two first outer substrates 181, one of the first connecting films 171 is adjacent to the third conductive circuit layer 151, and the sixth electrical connecting body 174 is electrically connected thereto Adjacent conductive circuit layers.

The fourth conductive circuit layer 161 may have a plurality of second connecting films 172 and a plurality of second outer substrates 182. The second connecting film 172 and the plurality of second outer substrates 182 are alternately arranged, and each adjacent two layers of the second connecting film 172 There is only one multilayer second outer substrate 182 between them. There is only one second connection between two adjacent second outer substrates 182 The film 172, one of the second connecting films 172 is adjacent to the fourth conductive wiring layer 161, and the seventh electrical connecting body 176 electrically conducts the conductive wiring layer adjacent thereto.

The soft and hard combined circuit board and the manufacturing method thereof provided by the technical solution form a conductive hole by using a printed metal conductive paste in the manufacturing process, and the soft and hard combined circuit can be improved in comparison with the method of forming a conductive hole by electroplating. Board reliability, and reduce the cost of manufacturing hard and hard board. In addition, since the plug hole is formed by printing in the connecting film or the substrate in the prior art, the layer-by-layer lamination and layer-by-layer conduction can reduce the hard and soft bonding circuit board manufacturing process. The number of presses is combined to improve the efficiency of the hard and soft board production.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100a‧‧‧Soft and hard combined circuit board

110‧‧‧Soft circuit board

112‧‧‧First conductive circuit layer

113‧‧‧Second conductive circuit layer

120‧‧‧First press film

123‧‧‧First electrical connector

130‧‧‧Second pressure film

1331‧‧‧Second electrical connector

1332‧‧‧ Third electrical connector

140‧‧‧ Third press film

1431‧‧‧4th electrical connector

1432‧‧‧5th electrical connector

151‧‧‧ Third conductive circuit layer

161‧‧‧fourth conductive layer

Claims (24)

A soft and hard combined circuit substrate comprising a flexible circuit board, a first press film, a second press film, a third press film, a third conductive circuit layer and a fourth conductive circuit layer, wherein the flexible circuit board comprises an exposed area And a nip area connected to the exposed area, the first press film comprises a first press film body and a plurality of first electrical connectors disposed in the first press film body, the first pressure The film body has a first opening corresponding to the flexible circuit board, the flexible circuit board is received in the first opening, and the second pressing film and the third pressing film are respectively pressed against the relative surface of the first pressing film On both sides, and also on opposite sides of the nip, the fourth conductive circuit layer is formed on the surface of the second press film away from the first press film, and the fifth conductive circuit layer is formed on the third press film away from the first Pressing the surface of the film, the second press film comprises a second press film body, a plurality of second electrical connectors and a plurality of third electrical connectors, the second film body having a corresponding portion of the exposed regions Two openings, the plurality of second electrical connections The plurality of third electrical connectors are disposed in the second embossed film body and are in contact with the fourth conductive circuit layer, and the plurality of second electrical connectors are further in contact with the nip and electrically Optionally, the plurality of third electrical connectors are further in one-to-one contact with the plurality of first electrical connectors, and the third laminated film comprises a third film body, a plurality of fourth electrical connectors, and a plurality of a fifth electrical connector having a third opening corresponding to the exposed area, wherein the plurality of fourth electrical connectors and the plurality of fifth electrical connectors are disposed in the third film body and are both electrically conductive The circuit layers are in contact with each other, and the plurality of fourth electrical connectors are further in contact with and electrically connected to the nip. The plurality of fifth electrical connectors are further in contact with the plurality of first electrical connectors. The first electrical connector, the second electrical connector, the third electrical connector, and the fourth electrical connector are each formed by printing a conductive paste and curing the conductive paste. The flexible hard-bonding circuit substrate of claim 1, wherein the flexible circuit board comprises a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer, and a second a third insulating layer, the second insulating layer is formed with a plurality of first openings corresponding to the plurality of second electrical connectors, each of the second electrical connectors passing through a corresponding first opening and the first The conductive circuit layer is in contact with and electrically connected, and the third insulating layer is formed with a plurality of second openings corresponding to the plurality of fourth electrical connectors, each of the fourth electrical connectors passing through a corresponding first The two openings are in contact with and electrically connected to the second conductive circuit layer. The soft-hard bonded circuit substrate of claim 2, wherein the flexible circuit board further comprises a first electromagnetic mask layer and a second electromagnetic mask layer, the first electromagnetic mask layer and the second electromagnetic mask The layer is located in the exposed area, the first electromagnetic mask layer is formed on a surface of the second insulating layer, and the second electromagnetic mask layer is formed on a surface of the third insulating layer. The soft-hard-bonding circuit substrate of claim 3, wherein the flexible circuit board further comprises a first cover film and a second cover film, wherein the first cover film and the second cover film are located in the exposed area, The first cover film is formed on the surface of the first electromagnetic mask layer, and the second cover film is formed on the surface of the second electromagnetic mask layer. The soft-hard bonded circuit substrate according to claim 2, wherein the flexible circuit board includes two nip regions, and the exposed region is located between the two nip regions, in the first conductive circuit layer And the conductive lines in the second conductive circuit layer extend from one of the nips through the exposed area to the other nip. The soft-hard bonded circuit substrate according to claim 1, wherein one side surface of the exposed portion of the flexible circuit board is covered with a copper foil, and the other side surface of the exposed portion of the flexible circuit board is also covered with a copper foil. . The flexible bonded circuit substrate according to claim 1, wherein the first electrical connector, the second electrical connector, the third electrical connector, and the fourth electrical connector are made of a conductive paste. A manufacturing method of a soft and hard combined circuit substrate, comprising the steps of: providing a flexible circuit board, the flexible circuit board comprising an exposed area and a nip area connected to the exposed area; Providing a first press film, a second press film, a third press film, a first copper foil and a second copper foil, the first press film comprising a first press film body and being disposed at the first press a plurality of first electrical connectors in the film body, the first press film body has a first opening corresponding to the flexible circuit board, and the second press film comprises a second press film body, a plurality of a second electrical connector and a plurality of third electrical connectors, the second film body has a second opening corresponding to the exposed area, and the plurality of second electrical connectors and the plurality of third electrical connectors are disposed on the second a second press-fit film body, the plurality of second electrical connectors corresponding to the nip, the plurality of third electrical connectors being in one-to-one contact with the plurality of first electrical connectors, the third The laminated film comprises a third film body, a plurality of fourth electrical connectors and a plurality of fifth electrical connectors, the third film body having a third opening corresponding to the exposed area, the plurality of fourth electrical connectors, The fifth electrical connectors are all disposed in the third film body, and the plurality of fourth electrical connections Corresponding to the nip, the plurality of fifth electrical connectors further correspond to the plurality of first electrical connectors, the first electrical connector, the second electrical connector, and the third electrical connector And the fourth electrical connector is formed by printing the conductive paste and curing the conductive paste; pressing the flexible circuit board, the first press film, the second press film, the third press film, the first copper foil and the second a copper foil, the flexible circuit board is fitted into the first opening of the first press film, and the second press film and the third press film are respectively pressed on opposite sides of the first press film, and Also located on opposite sides of the nip, the first copper foil is formed on the surface of the second press film away from the first press film, and the second copper foil is formed on the surface of the third press film away from the first press film. The first copper foil and the second copper foil are electrically connected to each other through a first electrical connector, a third electrical connector and a fifth electrical connector that are in communication with the first electrical connector, and the second electrical connector Electrically connecting the nip of the flexible circuit board with the first copper foil, and the fourth electrical connector is electrically connected a nip area of the road plate and the second copper foil; and selectively removing a portion of the first copper foil to form a third conductive circuit layer, selectively removing a portion of the second copper foil to form a fourth conductive circuit layer, the third conductive circuit layer And the fourth conductive circuit layer passes the first An electrical connector, the third electrical connector and the fifth electrical connector corresponding to the first electrical connector are in electrical communication, and the second electrical connector electrically connects the nip area of the flexible circuit board with the three conductive lines And a fourth electrical connector electrically connecting the nip of the flexible circuit board to the fourth conductive circuit layer. The method of fabricating a soft-hard bonded circuit substrate according to claim 8, wherein the flexible circuit board comprises a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer, and a second a third insulating layer, the second insulating layer is formed with a plurality of first openings corresponding to the plurality of second electrical connectors, each of the second electrical connectors passing through a corresponding first opening and the first The conductive circuit layer is in contact with and electrically connected, and the third insulating layer is formed with a plurality of second openings corresponding to the plurality of fourth electrical connectors, each of the fourth electrical connectors passing through a corresponding first The two openings are in contact with and electrically connected to the second conductive circuit layer. The manufacturing method of the soft and hard bonded circuit substrate of claim 9, wherein the hard and soft circuit board further comprises a first electromagnetic mask layer and a second electromagnetic mask layer, the first electromagnetic mask layer and the first Two electromagnetic shielding layers are disposed in the exposed area, the first electromagnetic shielding layer is formed on the second insulating layer, and the second electromagnetic shielding layer is formed on the third insulating layer. The method for manufacturing a soft-hard bonded circuit substrate according to claim 8, wherein the flexible circuit board, the first press-fit film, the second press-fit film, the third press-fit film, the first copper foil, and In the second copper foil, part of the first copper foil is attached to one side of the exposed area of the flexible circuit board, and part of the second copper foil is attached to the other side of the exposed area, and the first copper foil is selectively removed to obtain the third conductive In the circuit layer, when the second copper foil is selectively removed to obtain the fourth conductive wiring layer, the first copper foil and the second copper foil attached to the exposed region are not removed. A soft and hard bonded circuit board comprising: a soft and hard bonded circuit substrate as claimed in claim 1, a first connecting film and a first outer substrate, wherein the first connecting film is pressed against the first outer layer Between the substrate and the third conductive circuit layer of the flexible circuit board, the first outer substrate includes a fifth conductive circuit layer, a fourth insulating layer and a sixth conductive circuit layer disposed in sequence. Forming, in the fourth insulating layer, a plurality of first conductive holes electrically conducting the fifth conductive circuit layer and the sixth conductive circuit layer, wherein the first connecting film comprises a first connecting film body and disposed on the first pressing film a plurality of sixth electrical connectors in the body, the third conductive circuit layer and the fifth conductive circuit layer are electrically connected to each other through the plurality of sixth electrical connectors, the first outer substrate and the first connecting film An opening corresponding to the exposed area of the flexible circuit board is formed in the body to expose the flexible circuit board. A soft and hard combined circuit board comprising: a soft and hard bonded circuit substrate as claimed in claim 1, a first outer substrate, a second outer substrate, a first connecting film and a second connecting film, the first The connecting film is press-fitted between the first outer substrate and the third conductive circuit layer of the flexible circuit board, and the second connecting film is pressed against the second outer substrate and the soft and hard circuit substrate Between the fourth conductive circuit layers, the first outer substrate includes a fifth conductive circuit layer, a fourth insulating layer and a sixth conductive circuit layer, and a plurality of electrically conductive fifth conductive lines are formed in the fourth insulating layer. a first conductive film of the layer and the sixth conductive circuit layer, the first connecting film comprises a first connecting film body and the plurality of sixth electrical connectors disposed in the first connecting film body, the third conductive The circuit layer and the fifth conductive circuit layer are electrically connected to each other through the sixth electrical connection body, and the second outer substrate comprises a seventh conductive circuit layer, a fifth insulating layer and an eighth conductive circuit layer, which are sequentially disposed, and the fifth insulation Layer shape Forming a plurality of first conductive holes electrically conducting the fifth conductive circuit layer and the sixth conductive circuit layer, wherein the second connecting film comprises a second connecting film body and a plurality of seventh electricity disposed in the second connecting film body The connecting body, the fourth conductive circuit layer and the seventh conductive circuit layer are electrically connected to each other through the seventh electrical connecting body, the first connecting film body, the first outer film substrate, the second connecting film body and the second outer layer An opening corresponding to the exposed region of the flexible circuit board is formed in the substrate such that both sides of the exposed portion of the flexible circuit board are respectively exposed. A soft and hard combined circuit board comprising a soft and hard bonded circuit substrate as claimed in claim 1, a plurality of first outer substrates, a plurality of second outer substrates, a plurality of first connecting films, and a plurality of laminated substrates a second connecting film, the first outer substrate and the first connecting film are pressed against one side of the third conductive circuit layer of the soft and hard circuit board substrate, the first outer substrate includes a fourth insulating layer, and a fifth a conductive layer and a sixth conductive layer; a plurality of first conductive holes electrically conducting the fifth conductive layer and the sixth conductive layer are formed in the fourth insulating layer, and the first connecting film is formed with a plurality of through holes The sixth electrical connector of the first connecting film, the plurality of first connecting films and the plurality of first outer substrates are alternately arranged, and there is only one first connecting film between the adjacent two first outer substrates, The first connecting film is adjacent to the third conductive circuit layer, the sixth electrical connector electrically conducts the adjacent conductive circuit layer, and the second outer substrate and the second connecting film are pressed against the soft and hard circuit board a side of the fourth conductive circuit layer of the substrate, the second outer substrate includes a fifth insulating layer, a seventh conductive circuit layer and an eighth conductive circuit layer, and a plurality of electrically conductive seventh conductive circuit layers are formed in the fifth insulating layer And eighth conductive line a second conductive hole, the second connecting film is formed with a plurality of the seventh electrical connecting body penetrating the second connecting film, and the plurality of second connecting films and the plurality of second outer substrates are alternately arranged adjacent to each other There is only one second connecting film between the two second outer substrates, one of the second connecting films is adjacent to the fourth conductive circuit layer, and the seventh electrical connecting body electrically conducts the conductive layer adjacent thereto. The soft-hardened circuit board according to any one of claims 13 to 14, wherein the material of the sixth electrical connector and the seventh electrical connector is a conductive paste. The soft-hardened circuit board according to any one of claims 12 to 14, wherein the flexible circuit board comprises a second insulating layer, a first conductive circuit layer, a first insulating layer, and a second conductive circuit layer which are sequentially disposed. And a third insulating layer, the second insulating layer is formed with a plurality of first openings corresponding to the plurality of second electrical connectors, each of the second electrical connectors passing through a corresponding first opening and The first conductive circuit layer is in contact with and electrically connected, and the third insulating layer is formed with a plurality of second openings corresponding to the plurality of fourth electrical connectors, and each of the fourth electrical connectors passes through a corresponding one. The second opening is in contact with and electrically connected to the second conductive circuit layer. The soft and hard circuit board of claim 16, wherein the hard and soft circuit board further includes An electromagnetic shielding layer and a second electromagnetic shielding layer, the first electromagnetic shielding layer and the second electromagnetic shielding layer are located in the exposed area, and the first electromagnetic shielding layer is formed on the second insulating layer, The second electromagnetic shielding layer is formed on the third insulating layer. The soft-hardened circuit board of any one of claims 12 to 14, wherein the flexible circuit board includes two nips, the exposed area being located between the two nips, the The conductive lines in one of the conductive circuit layers and in the second conductive circuit layer extend from one of the nips through the exposed area to the other nip. The soft-hardened circuit board of any one of claims 12 to 14, wherein the second conductive hole is filled with a conductive paste. A method for fabricating a hard and soft combined circuit board, comprising the steps of: forming a soft and hard bonded circuit substrate by using a method of manufacturing a soft and hard bonded circuit substrate according to claim 8; providing a first outer substrate and a first connecting film, The first outer substrate includes a fifth conductive circuit layer, a fourth insulating layer and a sixth conductive circuit layer, which are sequentially disposed, and a plurality of electrically conductive fifth conductive circuit layers and a sixth conductive circuit layer are formed in the fourth insulating layer. a conductive hole, a plurality of sixth electrical connectors penetrating through the first connecting film are formed in the first connecting film; and the first outer substrate, the first connecting film and the soft and hard circuit substrate are pressed together, The sixth electrical connection body electrically connects the third conductive circuit layer and the fifth conductive circuit layer of the first outer substrate; and the first outer substrate and the first connecting film are formed along the boundary line between the exposed area and the nip The first slit removes the portion of the first outer substrate and the first connecting film surrounded by the first slit, thereby obtaining a soft and hard bonded circuit board. A method for manufacturing a hard and soft combined circuit board, comprising the steps of: providing a soft and hard combined circuit substrate according to claim 1; providing a first outer substrate, a first connecting film, a second outer substrate, and a second connecting film; The first outer substrate includes a fourth insulating layer, a fifth conductive circuit layer and a sixth conductive circuit layer. The fourth insulating layer is formed with a plurality of second conductive holes electrically conducting the fifth conductive circuit layer and the sixth conductive circuit layer. Forming, in the first connecting film, a plurality of sixth electrical connectors penetrating through the first connecting film, the second outer layer substrate comprising a fifth insulating layer, a seventh conductive circuit layer and an eighth conductive circuit layer, fifth a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer are formed in the insulating layer, and the second connecting film is formed with a plurality of seventh electrical connecting bodies penetrating the second connecting film; a first outer substrate, a first connecting film, a hard and soft circuit board substrate, a second connecting film and a second outer substrate, wherein the sixth electrical connecting body electrically connects the third conductive circuit layer and the first outer substrate to each other The seventh electrical connector electrically conducts the fourth conductive circuit layer and the second outer substrate; and the first slit formed through the first connecting film of the first outer substrate along the boundary line of the exposed region is to be first Surrounded by a slit Connecting a first outer substrate and the film is removed, rigid-flex circuit board obtained. A method for manufacturing a soft and hard combined circuit board, comprising the steps of: providing a soft and hard combined circuit substrate according to claim 1; providing a plurality of first outer substrate, a plurality of first connecting films, a plurality of second outer substrates, and a plurality of a second connecting film, each of the first outer substrate comprises a fourth insulating layer, a fifth conductive circuit layer and a sixth conductive circuit layer, wherein the fourth insulating layer is formed with a plurality of electrically conductive fifth conductive circuit layers and a second conductive hole of the six conductive circuit layer, each of the first connecting films is formed with a plurality of sixth electrical connectors penetrating through the first connecting film, each of the second outer substrates comprising a fifth insulating layer, a seventh conductive circuit layer and an eighth conductive circuit layer, wherein a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer are formed in the fifth insulating layer, and each of the second connecting films is formed a plurality of seventh electrical connectors penetrating through the second connecting film; pressing a plurality of first outer substrate, a plurality of first connecting films, a hard and soft circuit board substrate, and a plurality of a second connecting film and a plurality of second outer substrates, a plurality of first outer substrates and a plurality of first connecting films are pressed against one side of the third conductive circuit layer, and the plurality of first outer substrates and the plurality of first connecting films are alternated Providing that there is only one first connecting film between the adjacent two first outer substrates, the first connecting film is adjacent to the third conductive circuit layer, and the sixth electrical connecting body electrically conducts the conductive line adjacent thereto The second outer substrate and the second connecting film are pressed against one side of the fourth conductive circuit layer of the flexible circuit board substrate, and the second outer substrate includes a fifth insulating layer and a seventh conductive circuit layer. An eighth conductive circuit layer, a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer are formed in the fifth insulating layer, and the second connecting film is formed with a plurality of through the second connecting film The seventh electrical connector, the plurality of second connecting films and the plurality of second outer substrates are alternately arranged, and there is only one second connecting film between the adjacent two second outer substrates, and the second connecting film and the second connecting film Fourth conductivity Adjacent to the road layer, the seventh electrical connector electrically conducts the adjacent conductive circuit layer; and along the boundary line of the exposed region, the first slit forming the first connecting film penetrating the first outer substrate is to be The first outer substrate surrounding the first slit and the first connecting film are removed to obtain a soft and hard bonded circuit board. The method for fabricating a soft-hardened circuit board according to any one of claims 20 to 22, wherein the method for fabricating the first outer substrate comprises the steps of: providing a double-sided copper-clad substrate, the copper-clad substrate comprising a first copper foil a layer, a fourth insulating layer and a second copper foil layer; forming a second peelable protective adhesive layer on a surface of the first copper foil layer away from the fourth insulating layer; forming a second peelable protective adhesive only in the copper clad substrate a plurality of first blind vias of the first copper foil layer and the fourth insulating layer, and filling each of the first blind vias with a conductive paste to form a plurality of first conductive vias; removing the first peelable protective adhesive layer; Selectively removing a portion of the first copper foil layer to form a fifth conductive wiring layer, selectively removing a portion of the second The copper foil layer forms a sixth conductive wiring layer. The method for fabricating a soft-hardened circuit board according to any one of claims 20 to 22, wherein the method for fabricating the first outer substrate comprises the steps of: providing a double-sided copper-clad substrate, the copper-clad substrate comprising a first copper foil a second peelable protective adhesive layer on the opposite surfaces of the copper foil substrate; a second peelable protective adhesive layer and a copper foil substrate formed in the copper clad substrate a plurality of through holes, and filling a conductive paste in each of the through holes to form a plurality of first conductive holes; removing the first peelable protective adhesive layer; and selectively removing a portion of the first copper foil layer to form a fifth conductive circuit layer, selecting The second copper foil layer is partially removed to form a sixth conductive wiring layer.