CN106061107B - Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film - Google Patents
Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film Download PDFInfo
- Publication number
- CN106061107B CN106061107B CN201610644368.0A CN201610644368A CN106061107B CN 106061107 B CN106061107 B CN 106061107B CN 201610644368 A CN201610644368 A CN 201610644368A CN 106061107 B CN106061107 B CN 106061107B
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- Prior art keywords
- rigid
- electromagnetic shielding
- daughter board
- shielding film
- flexible
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Abstract
The present invention relates to a kind of rigid-flex circuit boards and preparation method thereof for having electromagnetic shielding film, the rigid-flex circuit board of the tool electromagnetic shielding film, including rigid region and flexure region, the rigid region includes the first rigid daughter board stacked gradually, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board, and the flexure region includes the electromagnetic shielding film stacked gradually, cover film, the flexible daughter board, cover film and electromagnetic shielding film；The electromagnetic shielding film includes the first release film, insulating layer and conductive viscose layer being cascading.The rigid-flex circuit board of tool electromagnetic shielding film of the invention be after exposing flexible region by completing to take off lid in rigid-flex combined board manufacturing process make electromagnetic shielding film during the pressing process using the auxiliary spacer specially designed and can be under pressure well with heat and be reliably attached to flexible region surface.
Description
Technical field
The present invention relates to printed wiring technical fields, more particularly to a kind of rigid-flex circuit board for having electromagnetic shielding film
And preparation method thereof.
Background technique
With PCB (Printed Circuit Board, printed circuit board) to it is small in size, light-weight, three-dimensional installation and
The direction of high connecting reliability is developed, and rigid printed circuit boards and flexible printed-circuit board start to send out to rigid-flex combined board direction
Exhibition, and as complete transmission of the electronic product to communication signal has increasingly higher demands, electromagnetic shielding film is attached to flexible region
While can satisfy three-dimensional installation requirement, electromagnetic interference is also can be effectively prevented in the rigid-flex combined board of upper and lower surface, is protected
Demonstrate,prove the integrality of product signal transmission.
Existing common technique is first to complete rigid-flex combined board in PCB manufactory, using producer in order to avoid electromagnetism is dry
One layer of aluminium foil or copper foil can be pasted in flexible region upper and lower surface by disturbing.Aluminium foil or copper foil are poor compared to Special electromagnetic screened film shield effectiveness,
And since bending is poor, can bend flexible region in rigid-flex board installation process causes aluminium foil or copper foil to fracture and influences electromagnetic screen
Effect is covered, while the operation for pasting aluminium foil or copper foil cannot achieve batch production to using inefficiency for producer.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of rigid-flex circuit boards for having electromagnetic shielding film.
Specific technical solution is as follows:
A kind of rigid-flex circuit board having electromagnetic shielding film, including rigid region and flexure region, the rigid region
Including the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board stacked gradually, the flexible region
Domain includes the electromagnetic shielding film stacked gradually, cover film, the flexible daughter board, cover film and electromagnetic shielding film；
The electromagnetic shielding film includes the first release film, insulating layer and conductive viscose layer being cascading, described
Conductive viscose layer is adhered to the cover film.
The material of the insulating layer is epoxy resin or polyurethane resin in one of the embodiments,.
The material of the conductive viscose layer is copper slurry or silver paste in one of the embodiments,.
In one of the embodiments, first rigid daughter board and second rigid daughter board be single layer rigid plate or
Multilayer rigid plate；The flexible daughter board is single layer flexible plate or Multilayer Flexible Board.
In one of the embodiments, the electromagnetic shielding film with a thickness of 25-35 μm.
It is a further object of the present invention to provide the preparation methods of the rigid-flex circuit board of above-mentioned tool electromagnetic shielding film.
Specific technical solution is as follows:
The preparation method of the rigid-flex circuit board of above-mentioned tool electromagnetic shielding film, includes the following steps:
S1, the first rigid daughter board, flexible daughter board, bonding sheet, the second rigid daughter board, electromagnetic shielding are obtained according to a conventional method
Film, cover film and gasket；
S2, the flexure region stickup cover film in the flexible daughter board；It is corresponding with the flexure region on the bonding sheet
Region carry out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigidity
The sequence of plate presses after stacking gradually, and the wiring board after pressing is carried out operation exposing flexure region of uncapping；
S3, electromagnetic shielding film is adhered to the flexure region, one layer of gasket is then covered on the electromagnetic shielding film,
Then it carries out pressing for second；
Process production is after S4, progress to get the rigid-flex circuit board for having electromagnetic shielding film.
The size of the gasket is matched with the size of the flexure region in one of the embodiments, the gasket
Thickness it is 0.1-0.2mm bigger than the thickness difference of the rigid region and the flexure region.
The parameter of second of pressing in one of the embodiments, are as follows: pressing pressure 20-40kg/cm2, pressing
Temperature is 170-190 DEG C, pressing time 180-300s.
Drying-plate operation, the ginseng of the drying-plate operation have also been carried out after second of pressing in one of the embodiments,
Number are as follows: 110-130 DEG C of baking 1-2h.
Advantages of the present invention is as follows:
Compared with prior art, the rigid-flex circuit board of a kind of tool electromagnetic shielding film of the invention, is by rigid
It is completed in flex combined board manufacturing process after taking off lid exposing flexible region, uses auxiliary spacer (size and the flexibility specially designed
Region Matching, thickness are slightly larger than the thickness difference of rigid region and flexure region) make electromagnetic shielding film during the pressing process can be fine
Be under pressure and be reliably attached to flexible region surface with heat.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the rigid-flex circuit board that an embodiment has electromagnetic shielding film；
Fig. 2 is the structural schematic diagram of an embodiment electromagnetic shielding film.
Description of symbols:
11, has the rigid-flex circuit board of electromagnetic shielding film；10, the first rigid daughter board；20, bonding sheet；30, temper is scratched
Plate；40, the second rigid daughter board；50, cover film；60, electromagnetic shielding film；601, the first release film；602, insulating layer；603, conductive
Adhesive-layer；604, the second release film.
Specific embodiment
To keep objects, features and advantages of the present invention more obvious and easy to understand, below to specific embodiment party of the invention
Formula is described in detail.In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but this hair
Bright to can be implemented in many other ways than those described herein, those skilled in the art can be without prejudice in the present invention
Similar improvement is done in the case where culvert, therefore the present invention is not limited to the specific embodiments disclosed below.
The application is further elaborated by the following examples.
With reference to Fig. 1, a kind of rigid-flex circuit board 11 having electromagnetic shielding film, including rigid region 112 and flexure region
111, the rigid region include the first rigid daughter board 10 stacked gradually, bonding sheet 20, flexible daughter board 30, bonding sheet 20 and
Second rigid daughter board 40, the flexure region 111 include the electromagnetic shielding film 60 stacked gradually, cover film 50, described scratch temper
Plate 30, cover film 50 and electromagnetic shielding film 60；
The electromagnetic shielding film includes the first release film 601, insulating layer 602, the conductive viscose layer being cascading
603。
The material of the insulating layer is epoxy resin or polyurethane resin.
The material of the conductive viscose layer is copper slurry or silver paste.
First rigid daughter board and second rigid daughter board are single layer rigid plate or multilayer rigid plate；The flexibility
Daughter board is single layer flexible plate or Multilayer Flexible Board.
The electromagnetic shielding film with a thickness of 25-35 μm.
The preparation method of the rigid-flex circuit board of above-mentioned tool electromagnetic shielding film, includes the following steps:
S1, the first rigid daughter board 10, flexible daughter board 30, bonding sheet 20, the second rigid daughter board 40, electricity are obtained according to a conventional method
Magnetic shield film 60, cover film 50 and gasket；
S2, the flexure region stickup cover film in the flexible daughter board；It is corresponding with the flexure region on the bonding sheet
Region carry out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigidity
The sequence of plate presses after stacking gradually, and the wiring board after pressing is carried out operation exposing flexure region of uncapping；
The size of the gasket is matched with the size of the flexure region, and the thickness of the gasket is than the rigid region
With the big 0.1-0.2mm of thickness difference of the flexure region；
S3, by electromagnetic shielding film (not used product, as shown in Fig. 2, being also stained with one layer on the outside of conductive viscose layer
Two release films 604) the second release film removal after be adhered to the flexure region, then cover one on the electromagnetic shielding film
Layer gasket, then carries out pressing for second；
The parameter of second of pressing are as follows: pressing pressure 20-40kg/cm2, pressing-in temp is 170-190 DEG C, pressing
Time is 180-300s；
Drying-plate operation, the parameter of the drying-plate operation are as follows: 110-130 DEG C of baking 1- have also been carried out after second of pressing
2h；
Process production is after S4, progress to get the rigid-flex circuit board for having electromagnetic shielding film.
A kind of rigid-flex circuit board for having electromagnetic shielding film of the present embodiment, is by rigid-flex combined board manufacturing process
After lid exposing flexible region is taken off in completion, using the auxiliary spacer specially designed, (size is matched with the flexure region, and thickness is slightly larger than
The thickness difference of rigid region and flexure region) make electromagnetic shielding film during the pressing process and can be under pressure well with heat and can
Flexible region surface is attached to by ground.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (3)
1. a kind of preparation method for the rigid-flex circuit board for having electromagnetic shielding film, which is characterized in that the rigid-flexible combined circuit
Plate includes two rigid regions and a flexure region, and the flexure region is located between two rigid regions；It is described rigid
Property region includes the first rigid daughter board stacked gradually, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board, described
Flexure region includes the electromagnetic shielding film stacked gradually, cover film, the flexible daughter board, cover film and electromagnetic shielding film；Institute
Stating electromagnetic shielding film includes the first release film, insulating layer and conductive viscose layer being cascading, the conductive viscose layer
Be adhered to the cover film, the electromagnetic shielding film with a thickness of 25-35 μm；The material of the insulating layer is epoxy resin or gathers
Ammoniacum resin；The material of the conductive viscose layer is copper slurry or silver paste；The preparation method includes the following steps:
S1, the first rigid daughter board is obtained according to a conventional method, flexible daughter board, bonding sheet, the second rigid daughter board, electromagnetic shielding film, is covered
Epiphragma and gasket；
S2, the flexure region stickup cover film in the flexible daughter board；Area corresponding with the flexure region on the bonding sheet
Domain carries out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board
Sequence presses after stacking gradually, and the wiring board after pressing is carried out operation exposing flexure region of uncapping；
S3, electromagnetic shielding film is adhered to the flexure region, one layer of gasket is then covered on the electromagnetic shielding film, then
Second is carried out to press；The size of the gasket is matched with the size of the flexure region, described in the thickness ratio of the gasket
The big 0.1-0.2mm of thickness difference of rigid region and the flexure region；The parameter of second pressing are as follows: pressing pressure is
20-40kg/cm2, pressing-in temp is 170-190 DEG C, pressing time 180-300s；It is also dried after second of pressing
Plate operation, the parameter of the drying-plate operation are as follows: 110-130 DEG C of baking 1-2h；
Process production is after S4, progress to get the rigid-flex circuit board for having electromagnetic shielding film.
2. a kind of rigid-flex circuit board for having electromagnetic shielding film, which is characterized in that preparation method according to claim 1
It is prepared.
3. rigid-flex circuit board according to claim 2, which is characterized in that the flexible daughter board of the rigid region and institute
The flexible daughter board for stating flexure region is same flexible daughter board, and the flexible daughter board runs through the rigid region and the flexible region
Domain；First rigid daughter board and second rigid daughter board are single layer rigid plate or multilayer rigid plate；The flexible daughter board
For single layer flexible plate or Multilayer Flexible Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644368.0A CN106061107B (en) | 2016-08-08 | 2016-08-08 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644368.0A CN106061107B (en) | 2016-08-08 | 2016-08-08 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
Publications (2)
| Publication Number | Publication Date |
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| CN106061107A CN106061107A (en) | 2016-10-26 |
| CN106061107B true CN106061107B (en) | 2019-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610644368.0A Active CN106061107B (en) | 2016-08-08 | 2016-08-08 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592783A (en) | 2017-09-15 | 2018-01-16 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN114980572A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Rigid-flexible circuit board and processing method |
| CN113056101A (en) * | 2021-03-05 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Secondary processing and pressing method for electromagnetic shielding film |
| CN115666010B (en) * | 2022-11-21 | 2023-03-21 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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| CN103313530A (en) * | 2012-03-08 | 2013-09-18 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of rigid-flex circuit board |
| CN103635007A (en) * | 2012-08-24 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacturing method thereof |
| CN104507258A (en) * | 2014-12-15 | 2015-04-08 | 台山市精诚达电路有限公司 | Soft and rigid combination board and cover film windowing and grounding method thereof |
| CN206118157U (en) * | 2016-08-08 | 2017-04-19 | 广州杰赛科技股份有限公司 | Utensil electromagnetic shielding film's rigid -flex circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102740612B (en) * | 2011-04-13 | 2014-11-05 | 富葵精密组件(深圳)有限公司 | Method for manufacturing rigid-flexible printed circuit board |
| CN103635005B (en) * | 2012-08-23 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing methods |
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2016
- 2016-08-08 CN CN201610644368.0A patent/CN106061107B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313530A (en) * | 2012-03-08 | 2013-09-18 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of rigid-flex circuit board |
| CN103635007A (en) * | 2012-08-24 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacturing method thereof |
| CN104507258A (en) * | 2014-12-15 | 2015-04-08 | 台山市精诚达电路有限公司 | Soft and rigid combination board and cover film windowing and grounding method thereof |
| CN206118157U (en) * | 2016-08-08 | 2017-04-19 | 广州杰赛科技股份有限公司 | Utensil electromagnetic shielding film's rigid -flex circuit board |
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| CN106061107A (en) | 2016-10-26 |
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