CN113056101A - Secondary processing and pressing method for electromagnetic shielding film - Google Patents
Secondary processing and pressing method for electromagnetic shielding film Download PDFInfo
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- CN113056101A CN113056101A CN202110246424.6A CN202110246424A CN113056101A CN 113056101 A CN113056101 A CN 113056101A CN 202110246424 A CN202110246424 A CN 202110246424A CN 113056101 A CN113056101 A CN 113056101A
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- electromagnetic shielding
- shielding film
- pcb
- gasket
- secondary processing
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- 238000003825 pressing Methods 0.000 title claims abstract description 48
- 238000003672 processing method Methods 0.000 title claims description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 50
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 239000002390 adhesive tape Substances 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000010408 film Substances 0.000 description 64
- 238000003475 lamination Methods 0.000 description 18
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 6
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 6
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 6
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 3
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention belongs to the technical field of PCB processing, and particularly relates to a secondary processing and laminating method for an electromagnetic shielding film, which comprises the following steps: s1, designing an engineering file, and manufacturing a large PTFE gasket into a small PTFE gasket with a specific appearance; s2, selecting a processing file, and processing the electromagnetic shielding film into a shape consistent with that of the PTFE gasket; s3, pasting the electromagnetic shielding film into the PCB, placing the gasket on the electromagnetic shielding film, and fixing the gasket in a high-temperature resistant adhesive tape sticking mode and the like; s4, designing time and pressure parameters of the rapid press according to the upper drawing, placing auxiliary materials, and then putting the PCB into a press; s5, after the pressing is completed, the gasket is disassembled to continue to process the next PCB; s6, designing an engineering file, and sending the PCB to a laser machine to wash away redundant electromagnetic shielding films; and S7, transferring to the next procedure. The rigid-flex combined plate with the electromagnetic shielding film is subjected to secondary processing, so that the rigid-flex combined plate can basically meet the requirements of customers, and manpower, material resources and time are saved.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a secondary processing and laminating method for an electromagnetic shielding film.
Background
With the continuous and rapid development of science and technology, the soft board area required in part of the client structure of the rigid-flex printed circuit board needs to be pasted with an electromagnetic shielding film, so that the client structure of the rigid-flex printed circuit board plays a role in shielding electromagnetic signals. The common FPC laminated structure is formed by superposing a soft board, a covering film and an electromagnetic shielding film and pressing the soft board, the covering film and the electromagnetic shielding film at high temperature and high pressure similar to a sandwich structure. It should be noted that the cover film portion needs to be windowed to allow the electromagnetic shielding film to contact the circuit.
However, after the pressing, the film falling phenomenon of the electromagnetic shielding film is often caused by human factors, machine performance, materials of the electromagnetic shielding film, pressing time, pressing pressure and environmental factors. After the film falling phenomenon occurs, part of companies often scrap the film and then re-feed the film for re-production.
Disclosure of Invention
In view of the above, the present invention provides a secondary processing and pressing method for an electromagnetic shielding film. According to the invention, the secondary processing of the electromagnetic shielding film is realized by controlling three factors of the quick pressing auxiliary material, the pressure time and the pressure intensity, and the product quality is improved.
The technical scheme of the invention is as follows:
a secondary processing and pressing method for an electromagnetic shielding film is characterized by comprising the following steps:
s1, designing an engineering file, and manufacturing a large PTFE gasket into a small PTFE gasket with a specific appearance; in the invention, a small PTFE gasket for assisting lamination is designed for the electromagnetic shielding film layers subjected to secondary lamination, the basic shapes are various, and different specific shape patterns can be selected according to different processed patterns.
S2, selecting a processing file, and processing the electromagnetic shielding film into a shape consistent with that of the PTFE gasket;
s3, pasting the electromagnetic shielding film into the PCB, placing the gasket on the electromagnetic shielding film, and fixing the gasket in a high-temperature resistant adhesive tape sticking mode and the like;
s4, designing time and pressure parameters of the rapid press according to the upper drawing, placing auxiliary materials, and then putting the PCB into a press;
s5, after the pressing is completed, the gasket is disassembled to continue to process the next PCB;
s6, designing an engineering file, and sending the PCB to a laser machine to wash away redundant electromagnetic shielding films.
And S7, transferring to the next procedure.
Furthermore, in step S1, all sides of the pattern size of the PTFE pad on the engineering document are smaller than those of the windowed document by 0.1-0.2mm, and the thickness range is set to be 0.1-3 mm.
Further, in step S1, the thickness is determined by the thickness of the windowing step between the soft board and the hard board, and is greater than 0.1mm or more than the thickness of the step.
Furthermore, in step S2, the shape of the electromagnetic shielding film is consistent with that of PTFE, and is reduced by 0.1-0.2mm compared with the actual figure, so as to meet the processing requirement.
Further, in step S4, after the processed secondary lamination electromagnetic film is attached to the PCB flexible printed circuit board area, the PTFE gasket is placed, and then the PTFE gasket is fixed by a high temperature resistant adhesive tape, so that lamination can be performed. According to the invention, the gasket is stuffed for pressing, so that a supporting effect can be well achieved, and the PTFE has good plastic formability, so that the pressing requirement can be met.
Further, in step S4, during lamination, the flexible PCB is disposed in the central line region, the rigid PCB is symmetrically disposed at two ends of the flexible PCB, the secondary electromagnetic screen films are disposed on two sides of the flexible PCB, and then the PTFE gasket is disposed above the secondary electromagnetic screen films for lamination.
Further, in step S4, when the front laminate is pressed, a prepreg is laid, and a pad with the same thickness is placed in the groove hollowed by the prepreg.
Further, in step S4, the pressing includes pre-pressing and forming; the parameters of the prepressing are as follows: the pressure is 8-12kg, and the time is 5-20 s; the parameters of the molding press are as follows: the pressure is 20-100kg, and the time is 200-600 s. In the invention, the pressing parameters are determined by equipment and materials.
Further, in step S4, the pressing includes pre-pressing and forming; the parameters of the prepressing are as follows: the pressure is 9-11kg, and the time is 10-20 s; the parameters of the molding press are as follows: the pressure is 35-50kg, and the time is 500-600 s.
Further, in step S4, the design of the pressing auxiliary material is as follows: the release film and the silica gel pad are sequentially and symmetrically arranged on two sides of the PCB.
In the invention, because the secondary quick pressing is adopted, the conventional pressing method cannot meet the processing requirements, is easy to generate abnormity and cannot meet the requirements of customers, and the release film on the electromagnetic shielding film structure cannot be torn off after the pressing, or the film falling phenomenon still exists after the tearing, so that the special design of pressing auxiliary materials is adopted.
The innovation points of the invention are as follows:
1. and a gasket for assisting the pressing of the electromagnetic shielding film is arranged. Through at the inside PTFE gasket that adds of soft board windowing, can play the thickness supporting role, make dielectric layer thickness stable controllable after the pressfitting, and the PTFE gasket satisfies the heat conductivity, and the resistance to pressure requirement, plasticity is strong. The design adjustability of the separated gasket is strong, the pressing requirements of PCBs with various sizes can be met, and the requirements of customers can be met.
2. Provides a secondary processing and pressing method of the electromagnetic shielding film. The realization of the secondary processing of the electromagnetic shielding film can greatly reduce the material cost, the labor cost and the time cost of reworking.
The invention has the beneficial effects that:
1. through at the inside PTFE gasket that adds of soft board windowing, can play the thickness supporting role, make dielectric layer thickness stable controllable after the pressfitting, and the PTFE gasket satisfies the heat conductivity, and the resistance to pressure requirement, plasticity is strong.
2. The realization of the secondary processing of the electromagnetic shielding film can greatly reduce the material cost, the labor cost and the time cost of reworking.
3. The separated gasket provided by the invention has stronger design adjustability, can meet the pressing requirements of PCBs with various sizes, and can meet the requirements of customers.
Drawings
FIG. 1 is a schematic structural view of a PTFE gasket according to an embodiment of the present invention;
FIG. 2 is a schematic view of a press-fit structure according to the present invention;
FIG. 3 is a schematic structural diagram of the pressing accessory of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A secondary processing and pressing method for an electromagnetic shielding film is characterized by comprising the following steps:
s1, designing an engineering file, and manufacturing a large PTFE gasket into a small PTFE gasket with a specific appearance;
s2, selecting a processing file, and processing the electromagnetic shielding film into a shape consistent with that of the PTFE gasket;
s3, pasting the electromagnetic shielding film into the PCB 1, placing the gasket on the electromagnetic shielding film, and fixing the gasket in a high-temperature resistant adhesive tape sticking mode and the like;
s4, designing time and pressure parameters of the rapid press according to the upper drawing, placing auxiliary materials, and then putting the PCB into a press;
s5, after the pressing is completed, the gasket is disassembled to continue to process the next PCB;
s6, designing an engineering file, and sending the PCB to a laser machine to wash away redundant electromagnetic shielding films.
And S7, transferring to the next procedure.
Further, in step S1, all sides of the pattern size of the PTFE gasket on the work document are smaller than those of the windowed document by 0.1mm, and the thickness range is set to 0.1 mm.
Further, in step S1, the thickness is determined by the thickness of the windowing step between the soft board and the hard board, and is greater than 0.1mm or more than the thickness of the step.
Further, in step S2, the shape of the electromagnetic shielding film is consistent with the shape of PTFE, which is reduced by 0.1mm from the actual pattern, and meets the processing requirements.
Further, in step S4, after the processed secondary lamination electromagnetic film is attached to the PCB flexible printed circuit board area, the PTFE gasket is placed, and then the PTFE gasket is fixed by a high temperature resistant adhesive tape, so that lamination can be performed.
Further, in step S4, during lamination, the flexible PCB 11 is disposed in the central line region, the rigid PCB 12 is symmetrically disposed at two ends of the flexible PCB, the secondary electromagnetic shielding films 2 are disposed on two sides of the flexible PCB, and the PTFE gasket 3 is disposed above the secondary electromagnetic shielding films for lamination.
Further, in step S4, when the front laminate is pressed, a prepreg is laid, and a pad with the same thickness is placed in the groove hollowed by the prepreg.
Further, in step S4, the pressing includes pre-pressing and forming; the parameters of the prepressing are as follows: pressure 9kg, time 10 s; the parameters of the molding press are as follows: pressure 35kg, time 500 s.
Further, in step S4, the design of the pressing auxiliary material is as follows: the release film 4 and the silica gel pad 5 are sequentially and symmetrically arranged on two sides of the PCB 1.
Example 2
A secondary processing and pressing method for an electromagnetic shielding film is characterized by comprising the following steps:
s1, designing an engineering file, and manufacturing a large PTFE gasket into a small PTFE gasket with a specific appearance;
s2, selecting a processing file, and processing the electromagnetic shielding film into a shape consistent with that of the PTFE gasket;
s3, pasting the electromagnetic shielding film into the PCB 1, placing the gasket on the electromagnetic shielding film, and fixing the gasket in a high-temperature resistant adhesive tape sticking mode and the like;
s4, designing time and pressure parameters of the rapid press according to the upper drawing, placing auxiliary materials, and then putting the PCB into a press;
s5, after the pressing is completed, the gasket is disassembled to continue to process the next PCB;
s6, designing an engineering file, and sending the PCB to a laser machine to wash away redundant electromagnetic shielding films.
And S7, transferring to the next procedure.
Further, in step S1, the pattern size of the PTFE gasket on the work document is smaller than that of the windowed document by 0.2mm on all sides, and the thickness range is set to 3 mm.
Further, in step S1, the thickness is determined by the thickness of the windowing step between the soft board and the hard board, and is greater than 0.1mm or more than the thickness of the step.
Further, in step S2, the shape of the electromagnetic shielding film is consistent with the shape of PTFE, which is reduced by 0.2mm compared with the actual pattern, and meets the processing requirements.
Further, in step S4, after the processed secondary lamination electromagnetic film is attached to the PCB flexible printed circuit board area, the PTFE gasket is placed, and then the PTFE gasket is fixed by a high temperature resistant adhesive tape, so that lamination can be performed.
Further, in step S4, during lamination, the flexible PCB 11 is disposed in the central line region, the rigid PCB 12 is symmetrically disposed at two ends of the flexible PCB, the secondary electromagnetic shielding films 2 are disposed on two sides of the flexible PCB, and the PTFE gasket 3 is disposed above the secondary electromagnetic shielding films for lamination.
Further, in step S4, when the front laminate is pressed, a prepreg is laid, and a pad with the same thickness is placed in the groove hollowed by the prepreg.
Further, in step S4, the pressing includes pre-pressing and forming; the parameters of the prepressing are as follows: pressure 11kg, time 20 s; the parameters of the molding press are as follows: pressure 50kg, time 600 s.
Further, in step S4, the design of the pressing auxiliary material is as follows: the release film 4 and the silica gel pad 5 are sequentially and symmetrically arranged on two sides of the PCB 1.
Example 3
A secondary processing and pressing method for an electromagnetic shielding film is characterized by comprising the following steps:
s1, designing an engineering file, and manufacturing a large PTFE gasket into a small PTFE gasket with a specific appearance;
s2, selecting a processing file, and processing the electromagnetic shielding film into a shape consistent with that of the PTFE gasket;
s3, pasting the electromagnetic shielding film into the PCB 1, placing the gasket on the electromagnetic shielding film, and fixing the gasket in a high-temperature resistant adhesive tape sticking mode and the like;
s4, designing time and pressure parameters of the rapid press according to the upper drawing, placing auxiliary materials, and then putting the PCB into a press;
s5, after the pressing is completed, the gasket is disassembled to continue to process the next PCB;
s6, designing an engineering file, and sending the PCB to a laser machine to wash away redundant electromagnetic shielding films.
And S7, transferring to the next procedure.
Further, in step S1, the pattern size of the PTFE gasket on the work document is smaller than that of the windowed document by 0.15mm on all sides, and the thickness range is set to 1.6 mm.
Further, in step S1, the thickness is determined by the thickness of the windowing step between the soft board and the hard board, and is greater than 0.1mm or more than the thickness of the step.
Further, in step S2, the shape of the electromagnetic shielding film is consistent with the shape of PTFE, which is reduced by 0.15mm from the actual pattern, and meets the processing requirements.
Further, in step S4, after the processed secondary lamination electromagnetic film is attached to the PCB flexible printed circuit board area, the PTFE gasket is placed, and then the PTFE gasket is fixed by a high temperature resistant adhesive tape, so that lamination can be performed.
Further, in step S4, during lamination, the flexible PCB 11 is disposed in the central line region, the rigid PCB 12 is symmetrically disposed at two ends of the flexible PCB, the secondary electromagnetic shielding films 2 are disposed on two sides of the flexible PCB, and the PTFE gasket 3 is disposed above the secondary electromagnetic shielding films for lamination.
Further, in step S4, when the front laminate is pressed, a prepreg is laid, and a pad with the same thickness is placed in the groove hollowed by the prepreg.
Further, in step S4, the pressing includes pre-pressing and forming; the parameters of the prepressing are as follows: pressure 8kg, time 5 s; the parameters of the molding press are as follows: pressure 20kg, time 200 s.
Further, in step S4, the design of the pressing auxiliary material is as follows: the release film 4 and the silica gel pad 5 are sequentially and symmetrically arranged on two sides of the PCB 1.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A secondary processing and pressing method for an electromagnetic shielding film is characterized by comprising the following steps:
s1, designing an engineering file, and manufacturing a large PTFE gasket into a small PTFE gasket with a specific appearance;
s2, selecting a processing file, and processing the electromagnetic shielding film into a shape consistent with that of the PTFE gasket;
s3, pasting the electromagnetic shielding film into the PCB, placing the gasket on the electromagnetic shielding film, and fixing the gasket in a high-temperature resistant adhesive tape sticking mode and the like;
s4, designing time and pressure parameters of the rapid press according to the upper drawing, placing auxiliary materials, and then putting the PCB into a press;
s5, after the pressing is completed, the gasket is disassembled to continue to process the next PCB;
s6, designing an engineering file, and sending the PCB to a laser machine to wash away redundant electromagnetic shielding films;
and S7, transferring to the next procedure.
2. The secondary processing and laminating method for an electro-magnetic shielding film according to claim 1, wherein in step S1, the pattern size of the PTFE gasket on the engineering document is smaller than that of the windowed document by 0.1-0.2mm on all sides, and the thickness is set to be 0.1-3 mm.
3. The secondary processing and laminating method for an electro-magnetic shielding film according to claim 2, wherein in step S1, the thickness is determined by the thickness of the step of windowing the soft board and the hard board, and the specific thickness is greater than 0.1 mm.
4. The secondary processing and laminating method for an electro-magnetic shielding film according to claim 1, wherein in step S2, the shape of the electro-magnetic shielding film is consistent with the shape of PTFE, which is reduced by 0.1mm compared with the actual pattern, and meets the processing requirements.
5. The secondary processing and laminating method for electromagnetic shielding films according to claim 1, wherein in step S4, after the processed electromagnetic shielding films are attached to the flexible Printed Circuit Board (PCB), PTFE gaskets are placed thereon, and then the PTFE gaskets are fixed by high temperature resistant tapes so as to be laminated.
6. The secondary processing and laminating method for electromagnetic shielding films of claim 5, wherein in step S4, during laminating, the flexible PCB is disposed in the central line region, the rigid PCB is symmetrically disposed at two ends of the flexible PCB, the secondary electromagnetic shielding films are disposed on two sides of the flexible PCB, and then the PTFE gasket is disposed on the secondary electromagnetic shielding films for laminating.
7. The secondary processing and pressing method for an electromagnetic shielding film as claimed in claim 6, wherein in step S4, when the front laminate is pressed, a prepreg is laid, and a gasket with the same thickness is placed in the empty slot of the prepreg.
8. The secondary processing and laminating method for an electromagnetic shielding film according to claim 7, wherein in step S4, the laminating includes pre-pressing and forming; the parameters of the prepressing are as follows: the pressure is 8-12kg, and the time is 5-20 s; the parameters of the molding press are as follows: the pressure is 20-100kg, and the time is 200-600 s.
9. The secondary processing and laminating method for an electromagnetic shielding film according to claim 8, wherein in step S4, the laminating includes pre-pressing and forming; the parameters of the prepressing are as follows: the pressure is 9-11kg, and the time is 10-20 s; the parameters of the molding press are as follows: the pressure is 35-50kg, and the time is 500-600 s.
10. The secondary processing and laminating method for the electromagnetic shielding film according to any one of claims 5 to 9, wherein in step S4, the laminating auxiliary materials are designed as follows: the release film and the silica gel pad are sequentially and symmetrically arranged on two sides of the PCB.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110246424.6A CN113056101A (en) | 2021-03-05 | 2021-03-05 | Secondary processing and pressing method for electromagnetic shielding film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110246424.6A CN113056101A (en) | 2021-03-05 | 2021-03-05 | Secondary processing and pressing method for electromagnetic shielding film |
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| CN113056101A true CN113056101A (en) | 2021-06-29 |
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| CN202110246424.6A Pending CN113056101A (en) | 2021-03-05 | 2021-03-05 | Secondary processing and pressing method for electromagnetic shielding film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN106061107A (en) * | 2016-08-08 | 2016-10-26 | 广州杰赛科技股份有限公司 | Rigidity and flexibility combination circuit board possessing electromagnetic shielding film and manufacturing method thereof |
| JP2018056330A (en) * | 2016-09-29 | 2018-04-05 | 信越ポリマー株式会社 | Electromagnetic wave shield film, method of manufacturing electromagnetic wave shield film and method of manufacturing printed wiring board with electromagnetic wave shield film |
| CN112105158A (en) * | 2020-09-08 | 2020-12-18 | 惠州市金百泽电路科技有限公司 | Manufacturing method of rigid-flex Printed Circuit Board (PCB) utilizing cover film to resist glue |
-
2021
- 2021-03-05 CN CN202110246424.6A patent/CN113056101A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN106061107A (en) * | 2016-08-08 | 2016-10-26 | 广州杰赛科技股份有限公司 | Rigidity and flexibility combination circuit board possessing electromagnetic shielding film and manufacturing method thereof |
| JP2018056330A (en) * | 2016-09-29 | 2018-04-05 | 信越ポリマー株式会社 | Electromagnetic wave shield film, method of manufacturing electromagnetic wave shield film and method of manufacturing printed wiring board with electromagnetic wave shield film |
| CN112105158A (en) * | 2020-09-08 | 2020-12-18 | 惠州市金百泽电路科技有限公司 | Manufacturing method of rigid-flex Printed Circuit Board (PCB) utilizing cover film to resist glue |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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Application publication date: 20210629 |
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