JPH03112656A - Manufacture of one side copper-spread laminated board and manufacture of one side printed-wiring board employing laminated board thereof - Google Patents

Abstract

PURPOSE:To enable a process rationalization and obtain a remarkable cost reduction effect by putting symmetrically each other a constitutional body in which copper foil is superimposed on one side being placed with a predetermined sheet of prepregs and mold-release treated metallic foil is superimposed on the other side, and another constitutional body via a predeter mined sheet of prepregs and disposing mirror plates on the whole upper and lower position and heat-press molding them thereafter. CONSTITUTION:A constitutional body being superimposed with mold-release treated metallic foil 5, two sheets of prepregs 3, and further copper foil 2 are arranged on a prepreg 6. Another constitutional body is arranged symmetrically below the prepreg 6 and then the whole thereof is held by two mirrors 1. For the metallic foil 5, aluminum is most suitable in view of cutting workability and economical point. It is preferable to be in the range of 10 - 100 mum in the thickness of the metallic foil 5 and in the case of 10 mum or less, since the rigidity of the product is less, it is liable to cause rolling in the delivery rolls or dropping and the like during the circuit working period, on the other hand, in the case of 100 mum, the cutting workability becomes worse. In the releasing property between the prepregs 3 and the metallic foil 5 on one side board, it is preferred to be 10 -200 g/cm. The release property is possible such that a release agent is applied uniformly on the metallic foil 5 and the release property can be controlled by the amount of application.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention relates to a method for producing a single-sided copper-clad laminate used in the production of printed wiring boards, and a method for producing a single-sided printed wiring board using the laminate.
This invention relates to a method for manufacturing a board.

[Conventional technology]

In recent years, OA has become popular for industrial printed wiring boards.

BACKGROUND ART As electronic devices such as computers and NC control machines become smaller and lighter, higher density and higher reliability are required. Furthermore, due to the same circumstances, printed wiring boards for consumer use are also made thinner to accommodate the miniaturization and weight reduction of cameras, videos, and the like.

However, the paper-based phenolic resin steel laminated board conventionally used for consumer printed circuit boards #8i has poor mechanical and electrical properties, and cannot be used for thin products with a board thickness of 0.1 to Q, 4 mm+. Therefore, J5 uses a glass-based epoxy-sided copper-clad laminate board instead of the paper-based phenolic resin. The method shown in FIGS. 2 and 3 is generally performed. Second
In the example shown in the figure, two prepregs 3 made by impregnating and drying a glass cloth base material with epoxy resin to a semi-hardened state are stacked, a steel foil 2 is stacked on one side, a release film 4 is stacked on the other side, and then this The structure is sandwiched between two mirror plates 1, and the upper and lower sides thereof are heated and pressed by a press hot plate through a cutter. On both sides of the mold film 4 or metal foil 5
Add 32 layers of prepreg 3 to both sides of the prepreg 3.
This structure is sandwiched between two mirror plates 1, and the upper and lower sides thereof are heated and pressure-molded with a press hot plate via a cushion.

[Problem to be solved by the invention]

Generally, a single-sided printed wiring board is manufactured using a single-sided board in the following process. Step 1: Etching the copper foil surface of the single-sided board to form a circuit. Step 1: Etching the surface circuit with solder resist using the inkuri method. Drilling holes for parts using a drill, etc., and shaping the outline. Conditions are necessary to be able to perform various processes such as n, but when processing thin single-sided plates of 0.1 to Q, 4a + m, it is necessary to prevent warping and twisting during the process,
In order to maintain rigidity, it is necessary to attach and reinforce a laminate plate of approximately 0.8ffi1 or more using taping or the like.

For the purpose of streamlining the etching process.

When simultaneously etching both sides of two single-sided plates bonded together 1 For example, as shown in Figure 6, a composite body with a release film 4 in the center and copper foil 2 placed on both sides via prepreg 3 is used. There is an example of etching the surface of the foil. However, the release film does not have rigidity at the center, and the yield is very low due to problems such as getting caught in the feed roll in the middle of the process, falling, and scratches during drilling. Also, use rigid gold instead of release film! When four foils are arranged, simultaneous etching of both sides is possible, but the printed wiring board process becomes complicated and the cost of auxiliary materials increases due to this 1f411 measure.

An object of the present invention is to provide a method for manufacturing a single-sided board that solves the conventional problems in manufacturing a single-sided printed wiring board, and a method for manufacturing a single-sided printed wiring board using the single-sided board.

[Means to solve the problem]

The present invention comprises a structure in which a predetermined number of prepregs made by impregnating and drying a base material with a thermosetting resin or a thermoplastic resin are stacked, copper foil is layered on one side, and metal foil subjected to III type treatment is layered on the other side. A method for manufacturing a single-sided copper-clad laminate, characterized in that another structure is symmetrically stretched through a predetermined number of prepregs, mirror plates are placed above and below the whole, and the whole is heated and press-formed. be.

The present invention will be explained using figures. In FIG. 1, metal ff15. which has been subjected to mold release treatment on prepreg B. Further, a structure including two sheets of prepreg 6 and further one layer of copper foil 2 is arranged. Another above-mentioned structure is arranged symmetrically under the prepreg 6,
The whole is sandwiched between two mirror plates 1.

According to the present invention, one single-sided board is manufactured as a two-piece composite as shown in FIG. 1, and furthermore, when it is sent in this state to the process of assembling a single-sided printed wiring board, excellent characteristics can be exhibited. .

The single-sided copper foil 2 is used after roughening the prepreg or applying adhesive to improve adhesion. In addition, it is also possible to use gold foil other than steel foil. Iron, aluminum, copper, etc. can be used as the metal foil 5, but aluminum is the most preferable in terms of cutting workability and durability. The thickness of the gold M recess 5 is preferably in the range of 10 to 100 μm; if it is less than 10 μm, the product will not be rigid (it will easily get caught in the feed roll during circuit processing, fall, etc.)
On the other hand, if it is 100 μm or more, the cutting workability becomes poor. Also, the peelability between the prepreg 6 of the single-sided plate and the metal 765 is preferably 10 to 200 g/Cl1l. olOg/c
If the weight is less than m, 0200 g/- is easy to peel off when processing circuits on both sides at the same time with all 812 sheets on one side.
If Cff1 or higher, metal PP is removed from the product after 5 circuit processing.
It is difficult to exclude 15. This removability.

Kim JIj! This is possible by uniformly applying a mold release agent to the recess 5, and the releasability can be completely controlled by changing the amount of application.

The mold release agent is not particularly limited as long as it does not change in quality due to temperature and pressure during production of the single-sided board and does not impede the printability of the base material surface of the single-sided board.

Furthermore, the releasability may be improved by using a metal foil 5 whose entire surface is finished smooth.

An example of manufacturing a single-sided printed wiring board from a single-sided board composite obtained by the present invention is to process the circuit by etching the inner mesh foil surface of this composite at the same time, and then process the prepreg 6 in the center.
The prepreg is removed by peeling off the aluminum foils 5 on both sides that have been subjected to mold release treatment, and the resulting single-sided plate with aluminum foil is subjected to subsequent processes such as a solder resist inkuri process, a drilling process using a drill, and an external shape process. Process the process. The aluminum recess 5 is removed to make it a single-sided printed wiring board.

[Effect]

The effect of the prepreg 6 in the present invention is significant.

If there is no prepreg 6 and the two gold Mffi are in direct contact with each other, they will easily slide against each other when heated and pressurized, and the desired single-sided t
It's hard to get 1.

Further, the cured product of the prepreg 6 after being heated and pressurized can be used as a patch plate in the hole-drilling process during the production of printed wiring boards, and can also be effectively used as an auxiliary material.

〔Example〕

Next, examples of the present invention will be described.

Epoxy silane treated glass cloth (Nittobo, WEI
A prepreg was obtained by impregnating I(SE) with an epoxy resin by a conventional method. Its characteristics are shown in Table 1〇As shown in Figure 1, the thickness of 35 μm ('Jtt calendar steel plate 2, two prepregs 3 and 50 μm thick aluminum foil 5 with mold release agent on both sides)
Another identical structure was placed symmetrically opposite to the structure in which the above structure was placed, with a flip-preg 6 interposed therebetween. Mirror plates are placed above and below this overall composition.

Furthermore, cushion paper is stacked on both rows and placed in a laminated press, at a pressure of 20 to 80 kg/an' and a temperature of 160 to 18.
A composite body consisting of two single-sided plates with aluminum foil was produced by laminating the bottom at 0° C. for 30 to 90 minutes at a stacking rate of 20 to 30 sheets/stage.

The peel strength between the aluminum foil 5 and the prepreg 3 of the composite obtained as described above is 125 to 135 g/co+
I got it.

Next, the composite of the single-sided copper-clad laminate of the present invention was used to manufacture a single-sided printed wiring board. Circuit processing (etching) is performed on @1w32 on both sides of the shaking table body at the same time, so that the prepreg 3 and the aluminum recess 5 do not peel off.

The number of sheets processed per unit time is twice that of the example shown in FIG. In addition, since the thickness of the aluminum depression was set to 50 μm, problems such as folding and sagging caused the aluminum to get caught in the feed roll during the process and fall, even in the solder resist printing process, hole process, and outline processing process, which are the subsequent processes. I didn't.

Table 1 [Effects of the Invention] According to the present invention, 2. The pasting process for manufacturing single-sided printed wiring board T-A from single-sided copper-clad laminates can process twice as many sheets per unit time as compared to the normal single-sided board method. It became. Moreover, even in the subsequent process, the complicated laminate board is used to prevent folding and sagging that occur due to the thinness of the board, getting caught in the feed roll during the process, falling, and drilling holes. There is no need to perform temporary fixing work. Therefore, it becomes possible to streamline the manufacturing process of single-sided printed wiring boards.

A remarkable cost reduction effect was obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view illustrating the production of a single-sided board according to the present invention. FIGS. 2 and 3 are cross-sectional views illustrating conventional single-sided plate manufacturing. 1...f#A board, 2...
Copper foil. 3...Prepreg, 4...H
type film. 5... Aluminum foil, 6... Prepreg. =1 mirror plate 1 2 copper foil 3 prepreg 1 4 release film 1 Fig. 2 1 -4 (or opening ====co 5) Fig. 3

Claims (2)

[Claims] 1. A predetermined number of sheets of prepreg made by impregnating and drying a thermosetting resin or thermoplastic resin as a base material are layered, copper or other metal foil is layered on one side, and aluminum foil or other metal foil that has been subjected to mold release treatment is layered on the other side. A composite body is formed by symmetrically stacking the stacked structure and another structure via a predetermined number of prepregs, placing mirror plates above and below the entire structure, and performing heating and pressure molding. A method for manufacturing single-sided copper-clad laminates. 2. After circuit-processing both sides of the single-sided copper-clad laminate composite obtained by the manufacturing method according to Claim 1 at the same time, the prepreg is removed by peeling between the central prepreg and the release-treated aluminum foil on both sides. A method for producing a single-sided printed wiring board, which comprises performing drilling and other processing, and finally removing the aluminum foil.