CN114571532B - Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece - Google Patents

Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece Download PDF

Info

Publication number
CN114571532B
CN114571532B CN202011372137.1A CN202011372137A CN114571532B CN 114571532 B CN114571532 B CN 114571532B CN 202011372137 A CN202011372137 A CN 202011372137A CN 114571532 B CN114571532 B CN 114571532B
Authority
CN
China
Prior art keywords
die
copper foil
cutting
sided adhesive
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011372137.1A
Other languages
Chinese (zh)
Other versions
CN114571532A (en
Inventor
蒋建国
杜月华
周姿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Haobai Zhizao Precision Electronics Co ltd
Original Assignee
Shanghai Haobai Zhizao Precision Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Haobai Zhizao Precision Electronics Co ltd filed Critical Shanghai Haobai Zhizao Precision Electronics Co ltd
Priority to CN202011372137.1A priority Critical patent/CN114571532B/en
Publication of CN114571532A publication Critical patent/CN114571532A/en
Application granted granted Critical
Publication of CN114571532B publication Critical patent/CN114571532B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27Means for performing other operations combined with cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • B26F1/44Cutters therefor; Dies therefor

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a die cutting device for manufacturing a bending-prevention fold copper foil die cutting piece, which sequentially comprises the following components along the conveying direction of a material belt: the device comprises a laminating unit (1), a die cutting unit (2) and a material receiving unit (3); the preparation method comprises the following steps: (1) first-stage material tape lamination: sequentially attaching a copper foil double-sided adhesive tape (121) and a black single-sided adhesive tape (131) above the first release film (111) by using an attaching unit (1) to form a first-stage material belt; (2) primary material belt die cutting and waste discharge: the primary material belt is subjected to die cutting and waste discharge by utilizing a die cutting unit (2) to form a bending-preventing and folding-preventing copper foil die-cut piece finished product; and (3) rolling a product: and rolling the bending-prevention fold copper foil die-cut piece finished product by using a material collecting unit (3). Compared with the prior art, after the bending test is performed on the bending-prevention fold copper foil die-cut piece, the phenomenon of wrinkling and displacement does not exist, the reject ratio of the product is 0%, and the performance of the whole finished product is not affected.

Description

Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece
Technical Field
The invention relates to the field of die-cutting piece processing, in particular to a die-cutting device and a manufacturing method for manufacturing a bending-prevention fold copper foil die-cutting piece.
Background
The copper foil Mylar is widely applied to the assembly of FPC and PCB circuit boards in the fields of communication, computers and radio. The shielding material has low surface oxygen characteristic and electromagnetic interference resistance, and can be attached to various base materials such as metal, insulating adhesive tape and the like; the polyester film plays a role in reinforcing the tensile strength of the copper foil. The material has the characteristics of high strength, high flexibility, ductility, good conductivity, good heat dissipation, better surface gloss and the like, and becomes an irreplaceable raw material for certain products. In the prior art, the black PET is covered on the copper foil double-sided adhesive tape, and the shielding effect is mainly achieved, so that the copper foil adhesive is not conducted.
However, after the product is processed, the finished copper foil is attached to the PCB for bending, and the surface of the copper foil on the double-sided adhesive tape after bending is wrinkled, and the copper foil is broken when laminated with other parts, so that the copper exposure conduction occurs, the shielding function is seriously affected, and the reject ratio is as high as 20 percent, as shown in fig. 10.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the die cutting device and the manufacturing method for manufacturing the bending-prevention fold copper foil die cutting piece, wherein the bending-prevention fold copper foil die cutting piece is free from wrinkling and displacement after a product is verified by a bending test.
The aim of the invention can be achieved by the following technical scheme:
the inventor finds that the PET has no adhesive component on both sides, namely, the two sides are not glued, the adhesiveness is 0, and the adhesiveness of the double-sided adhesive of the copper foil is about 6.5N/25mm, so that the PET is not firm after being stuck on the copper foil; because the colloid is too low and the PET film is too thin, the phenomenon of wrinkling and displacement can occur after bending, as shown in figure 10, the wrinkled part can be raised, so that PET is damaged and falls off, and the shielding effect of the product is seriously affected; in order to avoid the occurrence of the phenomenon, the invention changes black PET without adhesive components into black single-sided adhesive (polyester film plus adhesive), namely, the component of a layer of adhesive is added on the basis of PET film, the viscosity of the single-sided adhesive is more than or equal to 7.5N/25mm, the viscosity of the double-sided adhesive of copper foil is about 6.5N/25mm, namely, the viscosity of the whole product is increased by at least 7.5N/25mm on the basis of the original, the adhesive-carrying black single-sided adhesive is very firm on the adhesive surface of the copper foil, and the specific scheme is as follows:
die cutting device is used in copper foil die cutting piece preparation of fold of preventing bending, the device includes along material area direction of transmission in proper order:
the laminating unit is used for laminating the first release film, the copper foil double-sided adhesive tape and the black single-sided adhesive tape in sequence to form a first-stage material belt;
the die cutting unit is used for die-cutting the copper foil double faced adhesive tape and the black single faced adhesive tape in the primary material belt into patterns in a die-cut piece product, and forming a bending-prevention fold copper foil die-cut piece finished product;
and the material receiving unit is used for rolling the bending-preventing fold copper foil die-cut piece finished product.
Further, the attaching unit comprises a first release film discharging roller for discharging a first release film, a copper foil double-sided adhesive discharging roller for discharging a copper foil double-sided adhesive and a black single-sided adhesive discharging roller for discharging a black single-sided adhesive;
after passing through the laminating unit, the black single-sided adhesive tape is laminated above the copper foil double-sided adhesive tape, and the first release film is laminated below the copper foil double-sided adhesive tape to form a first-stage material belt.
Further, the black single-sided tape material comprises a polyester film and an adhesive.
Further, the black single-sided adhesive has a tack of at least 7.5N/25mm.
Further, a copper foil double-sided adhesive roll for pressing the copper foil double-sided adhesive roll on the first release film is further arranged above the material belt.
Further, a black single-sided adhesive roll used for rolling the black single-sided adhesive roll on the copper foil double-sided adhesive tape is arranged above the material belt.
Further, the die-cutting unit comprises a die-cutting machine for die-cutting the primary material belt and a waste discharging roller for discharging the die-cut waste. The die-cut waste material only comprises frame waste material after the black single-sided adhesive is die-cut.
Further, a cutting die a is arranged on the die cutting machine, and the punching layer of the cutting die a sequentially comprises black single-sided adhesive tape and copper foil double-sided adhesive tape from top to bottom.
Further, the pattern A die-cut by the cutting die a is matched with the pattern formed by die-cutting the copper foil double faced adhesive tape to form a die-cut piece, and the knife point angle of the cutting die a is 15-20 degrees.
Further, the material receiving unit comprises a material receiving roller for rolling the bending-prevention fold copper foil die-cut piece finished product.
A method for manufacturing a bending-resistant fold copper foil die-cut piece by using the die-cutting device comprises the following steps:
(1) First-stage material belt lamination: sequentially attaching the copper foil double-sided adhesive tape and the black single-sided adhesive tape above the first release film by using an attaching unit to form a first-stage material tape;
(2) First-stage material belt die cutting and waste discharge: the die cutting unit is utilized to form a bending-preventing fold copper foil die-cut piece finished product after the primary material belt is die-cut and waste-discharged;
(3) And (3) rolling a product: and rolling the bending-prevention fold copper foil die-cut part finished product by using a material collecting unit.
Compared with the prior art, the invention has the following advantages:
(1) After the bending test is performed on the prepared bending-prevention fold copper foil die-cut piece, the phenomenon of wrinkling and displacement does not exist, the product reject ratio is 0%, and the performance of the whole finished product is not affected;
(2) By adopting the scheme of the invention, the adverse phenomenon is improved, and a great deal of labor hour and labor are not consumed due to later reworking, so that the cost of a company is saved.
Drawings
FIG. 1 is a schematic view of a die cutting apparatus in an embodiment;
FIG. 2 is a schematic diagram of a die cutter in an embodiment;
FIG. 3 is a schematic diagram of a molding hierarchy in an embodiment;
FIG. 4 is a schematic diagram of a die cutter in an embodiment;
FIG. 5 is a schematic illustration of a die cut piece product of the present invention to be tested;
FIG. 6 is a diagram of a die cut piece product testing apparatus;
FIG. 7 is a schematic view of the layers of the die cut piece product of the present invention to be tested;
FIG. 8 is a schematic view of the prior art die cut piece product in a layered manner to be tested;
FIG. 9 is a schematic diagram of the test results of the die cut piece product of the present invention;
FIG. 10 is a schematic diagram of a prior art die cut piece product test effect;
the reference numerals in the figures indicate: laminating unit 1, first release film blowing roller 11, first release film 111, double faced adhesive tape blowing roller 12, copper foil double faced adhesive tape pressing roller 120, copper foil double faced adhesive tape 121, copper foil black single faced adhesive tape blowing roller 13, black single faced adhesive tape pressing roller 130, black single faced adhesive tape 131, black PET132, PCB 140, die cutting unit 2, die cutting machine 21, waste discharging roller 22, material collecting unit 3, material collecting roller 31 and bending die 4.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples.
Examples
The utility model provides a prevent bending fold copper foil die-cutting piece preparation and use die-cutting device, as in FIG. 1, the device includes along material area direction of transmission in proper order:
the laminating unit 1 is used for laminating the first release film 111, the copper foil double-sided adhesive tape 121 and the black single-sided adhesive tape 131 in sequence to form a first-stage material belt; the laminating unit 1 comprises a first release film discharging roller 11 for discharging the first release film 111, a copper foil double-sided adhesive discharging roller 12 for discharging the copper foil double-sided adhesive 121 and a black single-sided adhesive discharging roller 13 for discharging the black single-sided adhesive 131; after passing through the laminating unit 1, the black single-sided tape 131 is laminated above the copper foil double-sided tape 121, and the first release film 111 is laminated below the copper foil double-sided tape 121 to form a first-stage material tape. The black single-sided tape 131 includes a polyester film and an adhesive. The black single-sided tape 131 has a tack of at least 7.5N/25mm. A copper foil double sided tape pressing roller 120 for rolling the copper foil double sided tape 121 on the first release film 111 is also provided above the tape. A black single-sided tape pressing roller 130 for rolling the black single-sided tape 131 on the copper foil double-sided tape 121 is also arranged above the material belt.
The die cutting unit 2 is used for die-cutting the copper foil double-sided adhesive 121 and the black single-sided adhesive 131 in the primary material belt into patterns in a die-cut piece product and forming a bending-prevention fold copper foil die-cut piece finished product; the die cutting unit 2 includes a die cutter 21 for die-cutting the primary material tape and a waste discharge roller 22 for discharging die-cut waste. The die-cut waste material of this time includes only the frame waste material after the black single-sided tape 131 is die-cut. The die cutting machine 21 is provided with a cutting die a, as shown in fig. 2, and the cutting layer of the cutting die a sequentially comprises a black single-sided adhesive 131 and a copper foil double-sided adhesive 121 from top to bottom, as shown in fig. 3. The pattern A die-cut by the cutter die a is matched with the pattern formed by die-cutting the copper foil double faced adhesive tape 121 to form a die-cut piece, and the cutter angle of the cutter die a is 15-20 degrees, as shown in fig. 4.
And the material receiving unit 3 is used for rolling the bending-preventing fold copper foil die-cut piece finished product. The material receiving unit 3 comprises a material receiving roller 31 for rolling the bending-prevention fold copper foil die-cut piece finished product.
A method for manufacturing a bending-resistant fold copper foil die-cut piece by using the die-cutting device comprises the following steps:
(1) First-stage material belt lamination: sequentially attaching the copper foil double-sided adhesive tape 121 and the black single-sided adhesive tape 131 above the first release film 111 by using an attaching unit 1 to form a first-stage material tape;
(2) First-stage material belt die cutting and waste discharge: the die cutting unit 2 is utilized to form a bending-prevention fold copper foil die-cut piece finished product after the primary material belt is die-cut and waste-discharged;
(3) And (3) rolling a product: and rolling the bending-prevention fold copper foil die-cut piece finished product by using a material collecting unit 3.
After the first release film 111 of the manufactured bending-prevention fold copper foil die-cut piece is removed, as shown in fig. 5-7, the first release film is attached to the PCB board 140, then a bending test is performed in the bending die 4, after the bending test, the phenomenon of wrinkling and displacement is found to be avoided, the reject ratio of the product is 0%, and the performance of the whole finished product is not affected, as shown in fig. 9.
Also, the conventional die-cut product is attached to the PCB 140, and then a bending test is performed in the bending mold 4, as shown in fig. 6 and 8, after the test, the surface of the black PET132 on the copper foil double-sided tape 121 is wrinkled, if the surface is broken when laminated with other components, the copper is exposed to conduct, so that the shielding function is seriously affected, and the reject ratio is as high as 20%, as shown in fig. 10.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the invention in any way, and any person skilled in the art may make modifications or alterations to the disclosed technical content to the equivalent embodiments. However, any simple modification, equivalent variation and variation of the above embodiments according to the technical substance of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims (1)

1. The method for manufacturing the bending-prevention fold copper foil die-cutting piece is implemented by using a die-cutting device based on the bending-prevention fold copper foil die-cutting piece, and is characterized in that the device sequentially comprises the following steps along the conveying direction of a material belt:
the laminating unit (1) is used for laminating the first release film (111), the copper foil double faced adhesive tape (121) and the black single faced adhesive tape (131) in sequence to form a first-stage material belt;
the die-cutting unit (2) is used for die-cutting the copper foil double faced adhesive tape (121) and the black single faced adhesive tape (131) in the primary material tape into patterns in a die-cutting piece product and forming a bending-preventing fold copper foil die-cutting piece finished product;
the material collecting unit (3) is used for collecting the bending-preventing fold copper foil die-cut piece finished product;
the method comprises the following steps:
(1) First-stage material belt lamination: sequentially attaching a copper foil double-sided adhesive tape (121) and a black single-sided adhesive tape (131) above the first release film (111) by using an attaching unit (1) to form a first-stage material belt;
(2) First-stage material belt die cutting and waste discharge: the primary material belt is subjected to die cutting and waste discharge by utilizing a die cutting unit (2) to form a bending-preventing and folding-preventing copper foil die-cut piece finished product;
(3) And (3) rolling a product: winding the bending-prevention fold copper foil die-cut piece finished product by using a material collecting unit (3);
the laminating unit (1) comprises a first release film discharging roller (11) for discharging a first release film (111), a copper foil double-sided adhesive discharging roller (12) for discharging a copper foil double-sided adhesive (121) and a black single-sided adhesive discharging roller (13) for discharging a black single-sided adhesive (131);
after passing through the laminating unit (1), the black single-sided adhesive tape (131) is laminated above the copper foil double-sided adhesive tape (121), and the first release film (111) is laminated below the copper foil double-sided adhesive tape (121) to form a first-stage material tape;
the viscosity of the black single-sided adhesive tape (131) is at least 7.5N/25 mm;
a copper foil double-sided adhesive material pressing roller (120) for pressing the copper foil double-sided adhesive (121) on the first release film (111) in a rolling manner is further arranged above the material belt;
a black single-sided adhesive pressing roller (130) for rolling the black single-sided adhesive (131) on the copper foil double-sided adhesive (121) is also arranged above the material belt;
the die-cutting unit (2) comprises a die-cutting machine (21) for punching the primary material belt and a waste discharge roller (22) for discharging punching waste;
the die cutting machine (21) is provided with a cutting die a, and the cutting layer of the cutting die a sequentially comprises black single-sided adhesive tape (131) and copper foil double-sided adhesive tape (121) from top to bottom;
the pattern A die-cut by the cutting die a is matched with the pattern of a die-cut piece formed by die-cutting the copper foil double faced adhesive tape (121), and the knife point angle of the cutting die a is 15-20 degrees;
the black single-sided tape (131) comprises a polyester film and an adhesive.
CN202011372137.1A 2020-11-30 2020-11-30 Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece Active CN114571532B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011372137.1A CN114571532B (en) 2020-11-30 2020-11-30 Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011372137.1A CN114571532B (en) 2020-11-30 2020-11-30 Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece

Publications (2)

Publication Number Publication Date
CN114571532A CN114571532A (en) 2022-06-03
CN114571532B true CN114571532B (en) 2024-04-02

Family

ID=81768089

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011372137.1A Active CN114571532B (en) 2020-11-30 2020-11-30 Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece

Country Status (1)

Country Link
CN (1) CN114571532B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115260937B (en) * 2022-07-21 2023-12-05 苏州伟铂瑞信电子科技有限公司 Copper foil die cutting processing method with anti-wrinkling function

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124611A (en) * 1998-10-19 2000-04-28 Toshiba Chem Corp Manufacture of multilayer printed wiring board
CN1791310A (en) * 2001-05-24 2006-06-21 住友电木株式会社 Method for manufacturing a laminated board
CN201491395U (en) * 2009-06-18 2010-05-26 苏州工业园区久泰精密电子有限公司 FPC die-cutting production system
FR2975864A1 (en) * 2011-05-27 2012-11-30 Eads Europ Aeronautic Defence SEMI-PRODUCT IN THE FORM OF A CONDUCTIVE BAND INTEGRABLE IN A COMPOSITE MATERIAL AND METHOD OF MANUFACTURING SUCH A BAND
CN104191854A (en) * 2014-09-02 2014-12-10 苏州斯迪克新材料科技股份有限公司 Technology for avoiding wrinkling occurring in aluminum foil intaglio printing
CN204206598U (en) * 2014-10-28 2015-03-11 东莞市毅联电子科技有限公司 A kind of one side composite plate
JP5739575B1 (en) * 2014-10-21 2015-06-24 加川 清二 Method for producing microporous metal foil
CN105017986A (en) * 2015-07-28 2015-11-04 浙江欧仁新材料有限公司 Scratch-resistant ultrathin printable single-sided adhesive, and preparation method and application thereof
CN205011691U (en) * 2015-09-25 2016-02-03 常州昊天塑胶科技有限公司 PET single face sticky tape
CN207927017U (en) * 2018-03-20 2018-09-28 深圳市鑫盈通达电子科技有限公司 single-layer flexible circuit board structure
CN109955311A (en) * 2019-04-22 2019-07-02 四川恒诚信电子科技有限公司 A kind of copper foil cutter
CN110103526A (en) * 2019-05-07 2019-08-09 安徽润辉高分子材料科技有限公司 A kind of polymer moisture-proof compound material and preparation method thereof
CN211195264U (en) * 2019-08-29 2020-08-07 昊佰电子科技(上海)有限公司 A electrically conductive cloth coiled material tool of laminating for automation equipment
CN211240297U (en) * 2019-12-26 2020-08-11 珠海宏正科技有限公司 Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film
CN111740209A (en) * 2020-06-17 2020-10-02 深圳市信维通信股份有限公司 Preparation method of FPC die-cutting antenna
CN211763596U (en) * 2019-11-25 2020-10-27 昊佰电子科技(上海)有限公司 Die cutting piece processing system of accurate laminating is taken to shipment
CN211806567U (en) * 2019-11-29 2020-10-30 昊佰电子科技(上海)有限公司 Die cutting system of standard double faced adhesive tape die cutting test piece

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060225591A1 (en) * 2005-04-07 2006-10-12 Tian-Sheng Liu Automatic die-cutting stamping machine of platen flat double-set type
EP3130432B1 (en) * 2014-04-10 2019-05-15 Kagawa, Seiji Method and device for manufacturing microporous metal foil

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124611A (en) * 1998-10-19 2000-04-28 Toshiba Chem Corp Manufacture of multilayer printed wiring board
CN1791310A (en) * 2001-05-24 2006-06-21 住友电木株式会社 Method for manufacturing a laminated board
CN201491395U (en) * 2009-06-18 2010-05-26 苏州工业园区久泰精密电子有限公司 FPC die-cutting production system
FR2975864A1 (en) * 2011-05-27 2012-11-30 Eads Europ Aeronautic Defence SEMI-PRODUCT IN THE FORM OF A CONDUCTIVE BAND INTEGRABLE IN A COMPOSITE MATERIAL AND METHOD OF MANUFACTURING SUCH A BAND
CN104191854A (en) * 2014-09-02 2014-12-10 苏州斯迪克新材料科技股份有限公司 Technology for avoiding wrinkling occurring in aluminum foil intaglio printing
JP5739575B1 (en) * 2014-10-21 2015-06-24 加川 清二 Method for producing microporous metal foil
CN204206598U (en) * 2014-10-28 2015-03-11 东莞市毅联电子科技有限公司 A kind of one side composite plate
CN105017986A (en) * 2015-07-28 2015-11-04 浙江欧仁新材料有限公司 Scratch-resistant ultrathin printable single-sided adhesive, and preparation method and application thereof
CN205011691U (en) * 2015-09-25 2016-02-03 常州昊天塑胶科技有限公司 PET single face sticky tape
CN207927017U (en) * 2018-03-20 2018-09-28 深圳市鑫盈通达电子科技有限公司 single-layer flexible circuit board structure
CN109955311A (en) * 2019-04-22 2019-07-02 四川恒诚信电子科技有限公司 A kind of copper foil cutter
CN110103526A (en) * 2019-05-07 2019-08-09 安徽润辉高分子材料科技有限公司 A kind of polymer moisture-proof compound material and preparation method thereof
CN211195264U (en) * 2019-08-29 2020-08-07 昊佰电子科技(上海)有限公司 A electrically conductive cloth coiled material tool of laminating for automation equipment
CN211763596U (en) * 2019-11-25 2020-10-27 昊佰电子科技(上海)有限公司 Die cutting piece processing system of accurate laminating is taken to shipment
CN211806567U (en) * 2019-11-29 2020-10-30 昊佰电子科技(上海)有限公司 Die cutting system of standard double faced adhesive tape die cutting test piece
CN211240297U (en) * 2019-12-26 2020-08-11 珠海宏正科技有限公司 Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film
CN111740209A (en) * 2020-06-17 2020-10-02 深圳市信维通信股份有限公司 Preparation method of FPC die-cutting antenna

Also Published As

Publication number Publication date
CN114571532A (en) 2022-06-03

Similar Documents

Publication Publication Date Title
CN108449880B (en) Flexible circuit board cover film laminating method
JP2000269632A (en) Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor
CN114571532B (en) Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece
CN116660314A (en) Copper-clad plate lamination gummosis detection device and gummosis detection method thereof
CN110139485B (en) Method for continuously producing flexible circuit board
WO2005063467A1 (en) Method for producing flexible laminate
JP7001187B1 (en) Electromagnetic wave shield sheet and its manufacturing method, shielded wiring board, and electronic equipment
CN210308194U (en) FPC cross cutting production facility
CN113056101A (en) Secondary processing and pressing method for electromagnetic shielding film
CN113411961B (en) Soft-hard combined circuit board and preparation method thereof
CN114571534B (en) Die cutting device for manufacturing copper exposure-preventing ultrathin copper foil die cutting piece
CN113966089A (en) Processing method of flexible circuit board with thin hollow fingers
CN219627986U (en) Metal foil die-cutting piece
TWI550650B (en) Conductive sheet and electonic parts
WO2023145135A1 (en) Laminated body and metal-clad laminate having laminated body
CN210130011U (en) Equipment for continuously producing flexible circuit board
CN117500171B (en) FPC antenna and production process thereof
CN220104926U (en) Copper-clad plate lamination gummosis detection device
CN211128373U (en) Flexible circuit board
WO2024219160A1 (en) Flexible metal-clad laminate plate and method for producing same
CN102984886A (en) Two-sided flexible printed circuit (FPC) roll-type material-receiving production process
WO2024203977A1 (en) Flexible metal-clad laminate and method for manufacturing same
JP2003183606A (en) Adhesive tape for flexible printed circuit board and method for producing the same
JPH03112656A (en) Manufacture of one side copper-spread laminated board and manufacture of one side printed-wiring board employing laminated board thereof
JPS631514A (en) Manufacture of laminated sheet

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai.

Applicant after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd.

Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai.

Applicant before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant