CN211240297U - Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film - Google Patents
Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film Download PDFInfo
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- CN211240297U CN211240297U CN201922385755.9U CN201922385755U CN211240297U CN 211240297 U CN211240297 U CN 211240297U CN 201922385755 U CN201922385755 U CN 201922385755U CN 211240297 U CN211240297 U CN 211240297U
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Abstract
The utility model discloses a single face copper-clad plate with anti-corrosion wrinkled protection film that glues a little, including PI layer, epoxy layer, copper foil and protecting film layer, the PI layer is attached on one side surface on epoxy layer, the attached opposite side surface on epoxy layer of copper foil, inseparable firm connection between PI layer, epoxy layer and the copper foil, the protecting film layer is including gluing a layer and PET layer a little, glue a layer evenly distributed on a side surface on PET layer a little, the PET layer is connected through the surface on a little viscose layer and PI layer. The utility model discloses in, the PET layer on the protective film layer can play the effect of support to whole single face copper-clad plate, consequently carrying out the sculpture to the copper foil and adding man-hour, can effectively avoid appearing wrinkling, phenomenons such as deformation between closely firm connected's PI layer, epoxy layer and the copper foil, and then has reduced the degree of difficulty in carrying out the sculpture course of working to the single face copper-clad plate, is favorable to going on of the sculpture processing of copper foil.
Description
Technical Field
The utility model relates to a single face copper-clad plate technical field especially relates to a single face copper-clad plate of gluing protection film a little with anti-corrosion is wrinkled.
Background
The single-sided copper-clad plate is a basic material for producing the single-sided PCB circuit board, and a copper foil layer on the single-sided copper-clad plate needs to be etched in the process of manufacturing the single-sided PCB circuit board from the single-sided copper-clad plate. Therefore, we propose a single-sided copper-clad plate with a micro-adhesive protective film for preventing etching wrinkling.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a single-sided copper-clad plate with a micro-adhesive protective film for preventing etching and wrinkling.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a single face copper-clad plate with protection film is glued a little of anti-corrosion wrinkling, includes PI layer, epoxy layer, copper foil and protective film layer, the PI layer is attached on one side surface on epoxy layer, the copper foil is attached on the opposite side surface on epoxy layer, inseparable firm connection between PI layer, epoxy layer and the copper foil, protective film layer includes a little viscose layer and PET layer, a little viscose layer evenly distributed is on a side surface on PET layer, the PET layer is connected through the surface on a little viscose layer and PI layer.
The utility model provides a pair of have single face copper-clad plate of the protection film that glues a little that anti-corrosion corrugates, beneficial effect lies in: in the scheme, when the copper foil is etched, the PET layer on the protective film layer can support the whole single-sided copper-clad plate, so that the phenomena of wrinkling, deformation and the like among the closely and firmly connected PI layer, the epoxy resin layer and the copper foil are effectively avoided, the difficulty in the etching process of the single-sided copper-clad plate is further reduced, and the etching process of the copper foil is facilitated; further after the copper foil is etched, the protective film layer can be separated from the PI layer through the micro adhesive layer due to the fact that the protective film layer comprises the micro adhesive layer, further production and processing of the copper foil after etching are guaranteed, and then the whole single-sided copper-clad plate is beneficial to popularization and application.
Drawings
Fig. 1 is a schematic view of the structure of the single-sided copper-clad plate with the anti-etching and anti-wrinkling micro-adhesive protective film of the present invention.
In the figure: PI layer 1, epoxy resin layer 2, copper foil 3, micro-adhesive layer 4, PET layer 5, protective film layer 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1, a single face copper-clad plate with anti-corrosion crinkle slight-sticking protection film, including PI layer 1, epoxy layer 2, copper foil 3 and protection rete 6, PI layer 1 is attached on one side surface of epoxy layer 2, copper foil 3 is attached on the opposite side surface of epoxy layer 2, closely firm connection between PI layer 1, epoxy layer 2 and the copper foil 3, protection rete 6 includes slight viscose layer 4 and PET layer 5, 4 evenly distributed on one side surface of PET layer 5 on slight viscose layer, PET layer 5 is connected through slight viscose layer 4 and PI layer 1's surface.
In the utility model, when the copper foil 3 of the single-sided copper-clad plate is etched, the PET layer 5 on the protective film layer 6 can support the whole single-sided copper-clad plate, thereby effectively avoiding the phenomena of wrinkling, deformation and the like among the PI layer 1, the epoxy resin layer 2 and the copper foil 3 which are tightly and firmly connected, further reducing the difficulty in the etching process of the single-sided copper-clad plate and being beneficial to the etching process of the copper foil 3; further after the copper foil 3 is etched, the protective film layer 6 can be separated from the PI layer 1 through the micro adhesive layer 4 due to the fact that the protective film layer 6 comprises the micro adhesive layer 4, further production and processing after the copper foil 3 is etched are guaranteed, and then the whole single-sided copper-clad plate is beneficial to popularization and application.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (1)
1. The utility model provides a single face copper-clad plate with anti-corrosion crinkle glues protection film a little, includes PI layer (1), epoxy layer (2), copper foil (3) and protecting film layer (6), its characterized in that, PI layer (1) is attached on one side surface of epoxy layer (2), the opposite side surface of epoxy layer (2) is attached in copper foil (3), inseparable firm connection between PI layer (1), epoxy layer (2) and copper foil (3), protecting film layer (6) are including gluing layer (4) and PET layer (5) a little, gluing layer (4) evenly distributed is on one side surface of PET layer (5) a little, PET layer (5) are connected through gluing layer (4) and the surface on PI layer (1) a little.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922385755.9U CN211240297U (en) | 2019-12-26 | 2019-12-26 | Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film |
Applications Claiming Priority (1)
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CN201922385755.9U CN211240297U (en) | 2019-12-26 | 2019-12-26 | Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film |
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CN211240297U true CN211240297U (en) | 2020-08-11 |
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CN201922385755.9U Active CN211240297U (en) | 2019-12-26 | 2019-12-26 | Single-sided copper-clad plate with anti-etching wrinkling micro-adhesive protective film |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114571532A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技(上海)有限公司 | Die cutting device for manufacturing bending-proof folded copper foil die cutting piece and manufacturing method |
-
2019
- 2019-12-26 CN CN201922385755.9U patent/CN211240297U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114571532A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技(上海)有限公司 | Die cutting device for manufacturing bending-proof folded copper foil die cutting piece and manufacturing method |
CN114571532B (en) * | 2020-11-30 | 2024-04-02 | 上海昊佰智造精密电子股份有限公司 | Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece |
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