CN106061107A - Rigidity and flexibility combination circuit board possessing electromagnetic shielding film and manufacturing method thereof - Google Patents
Rigidity and flexibility combination circuit board possessing electromagnetic shielding film and manufacturing method thereof Download PDFInfo
- Publication number
- CN106061107A CN106061107A CN201610644368.0A CN201610644368A CN106061107A CN 106061107 A CN106061107 A CN 106061107A CN 201610644368 A CN201610644368 A CN 201610644368A CN 106061107 A CN106061107 A CN 106061107A
- Authority
- CN
- China
- Prior art keywords
- rigid
- electromagnetic shielding
- shielding film
- flexible
- daughter board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a rigidity and flexibility combination circuit board possessing an electromagnetic shielding film and a manufacturing method thereof. The rigidity and flexibility combination circuit board possessing the electromagnetic shielding film comprises a rigid area and a flexible area. The rigid area comprises a first rigid daughter board, a bonding sheet, a flexible daughter board, the bonding sheet and a second rigid daughter board which are successively stacked. The flexible area comprises the electromagnetic shielding film, a covering film, a flexible daughter board, the covering film and the electromagnetic shielding film which are successively stacked. The electromagnetic shielding film comprises a first release film, an insulating layer and a conductive mucilage glue layer which are successively arranged in a laminated mode. According to the rigidity and flexibility combination circuit board possessing the electromagnetic shielding film, during a rigidity and flexibility combination plate manufacturing process, a lid is taken off and the flexible area is exposed, and then an auxiliary gasket which is designed specially is used so that the electromagnetic shielding film can be reliably pasted to a surface of the flexible area under effects of pressure and heat during a pressing process.
Description
Technical field
The present invention relates to printed wiring technical field, particularly relate to a kind of rigid-flexible combined circuit board having electromagnetic shielding film
And preparation method thereof.
Background technology
Along with PCB (Printed Circuit Board, printed circuit board) installation little to volume, lightweight, three-dimensional and
The direction of high connecting reliability is developed, and rigid printed circuit boards and flexible printed-circuit board start to send out to rigid-flex combined board direction
Exhibition, and along with electronic product has the highest requirement to the complete transmission of communication signal, electromagnetic shielding film is attached to flexible region
The rigid-flex combined board of upper and lower surface, while can meeting three-dimensional installation requirement, it is also possible to effectively prevent electromagnetic interference, protects
The integrity of card product signal transmission.
Existing common technique, for first completing rigid-flex combined board at PCB maker, uses producer to do in order to avoid electromagnetism
Disturbing can be at flexible region upper and lower surface one layer of aluminium foil of patch or Copper Foil.It is poor that Special electromagnetic screened film shield effectiveness compared by aluminium foil or Copper Foil,
And owing to bending property is poor, rigid-flex board installation process can bend flexible region and cause aluminium foil or Copper Foil to fracture and affect electromagnetic screen
Cover effect, the inefficiency for using producer of the operation of patch aluminium foil or Copper Foil simultaneously, it is impossible to realize batch production.
Summary of the invention
Based on this, it is an object of the invention to provide a kind of rigid-flexible combined circuit board having electromagnetic shielding film.
Concrete technical scheme is as follows:
A kind of rigid-flexible combined circuit board having electromagnetic shielding film, including rigid region and flexure region, described rigid region
Including the first rigid daughter board stacked gradually, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board, described flexible region
Territory includes electromagnetic shielding film, coverlay, described flexible daughter board, coverlay and the electromagnetic shielding film stacked gradually；
Described electromagnetic shielding film includes the first mould release membrance, insulating barrier and the conductive viscose layer being cascading, described
Conductive viscose layer adheres to described coverlay.
Wherein in an embodiment, the material of described insulating barrier is epoxy resin or polyurethane resin.
Wherein in an embodiment, the material of described conductive viscose layer is copper slurry or silver slurry.
Wherein in an embodiment, described first rigid daughter board and described second rigid daughter board be single layer rigid plate or
Multilamellar rigid plate；Described flexible daughter board is single layer flexible plate or Multilayer Flexible Board.
Wherein in an embodiment, the thickness of described electromagnetic shielding film is 25-35 μm.
It is a further object of the present invention to provide the preparation method of the rigid-flexible combined circuit board of above-mentioned tool electromagnetic shielding film.
Concrete technical scheme is as follows:
The preparation method of the rigid-flexible combined circuit board of above-mentioned tool electromagnetic shielding film, comprises the steps:
S1, obtain the first rigid daughter board, flexible daughter board, bonding sheet, the second rigid daughter board, electromagnetic shielding according to a conventional method
Film, coverlay and pad；
S2, described flexible daughter board flexure region paste coverlay；On described bonding sheet corresponding with described flexure region
Region carry out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigidity
The order of plate stacks gradually rear pressing, and flexure region is exposed in the operation that carries out the wiring board after pressing uncapping；
S3, electromagnetic shielding film is adhered to described flexure region, on described electromagnetic shielding film, then covers one layer of pad,
Then second time pressing is carried out；
S4, carry out rear operation making, obtain the rigid-flexible combined circuit board of described tool electromagnetic shielding film.
Wherein in an embodiment, the matching size of the size of described pad and described flexure region closes, described pad
Thickness 0.1-0.2mm bigger than the thickness difference of described rigid region Yu described flexure region.
Wherein in an embodiment, the parameter of described second time pressing is: pressing pressure is 20-40kg/cm2, pressing
Temperature is 170-190 DEG C, and pressing time is 180-300s.
Wherein in an embodiment, drying-plate operation, the ginseng of described drying-plate operation after described second time pressing, are also carried out
Number is: 110-130 DEG C is dried 1-2h.
Advantages of the present invention is as follows:
Compared with prior art, a kind of rigid-flexible combined circuit board having electromagnetic shielding film of the present invention, is by just
Flex combined board manufacturing process completes take off after lid exposes flexible region, use custom-designed auxiliary spacer (size and described flexibility
Region Matching, thickness is slightly larger than the thickness difference of rigid region with flexure region) make electromagnetic shielding film energy in bonding processes fine
Be under pressure and heat and be reliably attached to surface, flexible region.
Accompanying drawing explanation
Fig. 1 is the structural representation of the rigid-flexible combined circuit board of an embodiment tool electromagnetic shielding film；
Fig. 2 is the structural representation of an embodiment electromagnetic shielding film.
Description of reference numerals:
11, has the rigid-flexible combined circuit board of electromagnetic shielding film；10, the first rigid daughter board；20, bonding sheet；30, flexible son
Plate；40, the second rigid daughter board；50, coverlay；60, electromagnetic shielding film；601, the first mould release membrance；602, insulating barrier；603, conduction
Adhesive-layer；604, the second mould release membrance.
Detailed description of the invention
Understandable for enabling objects, features and advantages of the present invention to become apparent from, the specific embodiment party to the present invention below
Formula is described in detail.Elaborate a lot of detail in the following description so that fully understanding the present invention, but this
Bright can implement to be much different from other modes described here, those skilled in the art can be in the present invention
Doing similar improvement in the case of culvert, therefore the present invention is not limited by following public being embodied as.
By the following examples the application is further elaborated.
With reference to Fig. 1, a kind of rigid-flexible combined circuit board 11 having electromagnetic shielding film, including rigid region 112 and flexure region
111, the first rigid daughter board 10 that described rigid region includes stacking gradually, bonding sheet 20, flexible daughter board 30, bonding sheet 20 and
Second rigid daughter board 40, electromagnetic shielding film 60 that described flexure region 111 includes stacking gradually, coverlay 50, described flexible son
Plate 30, coverlay 50 and electromagnetic shielding film 60；
The first mould release membrance 601 that described electromagnetic shielding film includes being cascading, insulating barrier 602, conductive viscose layer
603。
The material of described insulating barrier is epoxy resin or polyurethane resin.
The material of described conductive viscose layer is copper slurry or silver slurry.
Described first rigid daughter board and described second rigid daughter board are single layer rigid plate or multilamellar rigid plate；Described flexibility
Daughter board is single layer flexible plate or Multilayer Flexible Board.
The thickness of described electromagnetic shielding film is 25-35 μm.
The preparation method of the rigid-flexible combined circuit board of above-mentioned tool electromagnetic shielding film, comprises the steps:
S1, according to a conventional method obtain the first rigid daughter board 10, flexible daughter board 30, bonding sheet the 20, second rigid daughter board 40, electricity
Magnetic shield film 60, coverlay 50 and pad；
S2, described flexible daughter board flexure region paste coverlay；On described bonding sheet corresponding with described flexure region
Region carry out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigidity
The order of plate stacks gradually rear pressing, and flexure region is exposed in the operation that carries out the wiring board after pressing uncapping；
The matching size of the size of described pad and described flexure region closes, and the thickness of described pad is than described rigid region
The big 0.1-0.2mm with the thickness difference of described flexure region；
S3, by electromagnetic shielding film, (untapped product, as in figure 2 it is shown, be also stained with one layer outside conductive viscose layer
Two mould release membrances 604) the second mould release membrance remove after adhere to described flexure region, on described electromagnetic shielding film, then cover one
Layer pad, then carries out second time pressing；
The parameter of described second time pressing is: pressing pressure is 20-40kg/cm2, pressing-in temp is 170-190 DEG C, pressing
Time is 180-300s；
Also having carried out drying-plate operation after described second time pressing, the parameter of described drying-plate operation is: 110-130 DEG C is dried 1-
2h；
S4, carry out rear operation making, obtain the rigid-flexible combined circuit board of described tool electromagnetic shielding film.
A kind of rigid-flexible combined circuit board having electromagnetic shielding film of the present embodiment, is by rigid-flex combined board manufacturing process
Completing to take off after lid exposes flexible region, (size is mated with described flexure region, and thickness is slightly larger than to use custom-designed auxiliary spacer
The thickness difference of rigid region and flexure region) make electromagnetic shielding film can well be under pressure in bonding processes and heat and can
It is attached to surface, flexible region by ground.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that, come for those of ordinary skill in the art
Saying, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. the rigid-flexible combined circuit board having electromagnetic shielding film, it is characterised in that include rigid region and flexure region, described
Rigid region includes the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board stacked gradually, institute
State electromagnetic shielding film, coverlay, described flexible daughter board, coverlay and electromagnetic shielding film that flexure region includes stacking gradually；
Described electromagnetic shielding film includes the first mould release membrance, insulating barrier and the conductive viscose layer being cascading, described conduction
Adhesive-layer adheres to described coverlay.
The rigid-flexible combined circuit board of tool electromagnetic shielding film the most according to claim 1, it is characterised in that described insulating barrier
Material is epoxy resin or polyurethane resin.
The rigid-flexible combined circuit board of tool electromagnetic shielding film the most according to claim 1, it is characterised in that described conductive viscose
The material of layer is copper slurry or silver slurry.
4. according to the rigid-flexible combined circuit board of the tool electromagnetic shielding film described in any one of claim 1-3, it is characterised in that described
The thickness of electromagnetic shielding film is 25-35 μm.
5. according to the rigid-flexible combined circuit board of the tool electromagnetic shielding film described in any one of claim 1-3, it is characterised in that described
First rigid daughter board and described second rigid daughter board are single layer rigid plate or multilamellar rigid plate；Described flexible daughter board is that monolayer is scratched
Property plate or Multilayer Flexible Board.
6. the preparation method of the rigid-flexible combined circuit board of the tool electromagnetic shielding film described in any one of claim 1-5, its feature exists
In, comprise the steps:
S1, obtain the first rigid daughter board, flexible daughter board, bonding sheet, the second rigid daughter board, electromagnetic shielding film according to a conventional method, cover
Epiphragma and pad；
S2, described flexible daughter board flexure region paste coverlay；District corresponding with described flexure region on described bonding sheet
Territory carries out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board
Order stacks gradually rear pressing, and flexure region is exposed in the operation that carries out the wiring board after pressing uncapping；
S3, electromagnetic shielding film is adhered to described flexure region, on described electromagnetic shielding film, then cover one layer of pad, then
Carry out second time pressing；
S4, carry out rear operation making, obtain the rigid-flexible combined circuit board of described tool electromagnetic shielding film.
The preparation method of the rigid-flexible combined circuit board of tool electromagnetic shielding film the most according to claim 6, it is characterised in that institute
The matching size of the size and described flexure region of stating pad closes, and the thickness of described pad is than described rigid region and described flexibility
The big 0.1-0.2mm of thickness difference in region.
The preparation method of the rigid-flexible combined circuit board of tool electromagnetic shielding film the most according to claim 6, it is characterised in that institute
The parameter stating second time pressing is: pressing pressure is 20-40kg/cm2, pressing-in temp is 170-190 DEG C, and pressing time is 180-
300s。
The preparation method of the rigid-flexible combined circuit board of tool electromagnetic shielding film the most according to claim 6, it is characterised in that institute
Also having carried out drying-plate operation after stating second time pressing, the parameter of described drying-plate operation is: 110-130 DEG C is dried 1-2h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644368.0A CN106061107B (en) | 2016-08-08 | 2016-08-08 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644368.0A CN106061107B (en) | 2016-08-08 | 2016-08-08 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106061107A true CN106061107A (en) | 2016-10-26 |
| CN106061107B CN106061107B (en) | 2019-10-25 |
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ID=57480950
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610644368.0A Active CN106061107B (en) | 2016-08-08 | 2016-08-08 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11019758B2 (en) | 2017-09-15 | 2021-05-25 | Henan Guoan Electronic Material Co., Ltd. | Electromagnetic shielding film and preparation method therefor |
| CN113056101A (en) * | 2021-03-05 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Secondary processing and pressing method for electromagnetic shielding film |
| CN114390881A (en) * | 2021-12-20 | 2022-04-22 | 北京空间机电研究所 | Electromagnetic shielding method for space camera focal plane flexible circuit board |
| CN114980572A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Rigid-flexible circuit board and processing method |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11019758B2 (en) | 2017-09-15 | 2021-05-25 | Henan Guoan Electronic Material Co., Ltd. | Electromagnetic shielding film and preparation method therefor |
| CN114980572A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Rigid-flexible circuit board and processing method |
| CN113056101A (en) * | 2021-03-05 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Secondary processing and pressing method for electromagnetic shielding film |
| CN114390881A (en) * | 2021-12-20 | 2022-04-22 | 北京空间机电研究所 | Electromagnetic shielding method for space camera focal plane flexible circuit board |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106061107B (en) | 2019-10-25 |
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