CN101695217A - Method for producing printed board combining rigidness and flexibleness - Google Patents
Method for producing printed board combining rigidness and flexibleness Download PDFInfo
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- CN101695217A CN101695217A CN200910192873A CN200910192873A CN101695217A CN 101695217 A CN101695217 A CN 101695217A CN 200910192873 A CN200910192873 A CN 200910192873A CN 200910192873 A CN200910192873 A CN 200910192873A CN 101695217 A CN101695217 A CN 101695217A
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- printed board
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- flexibleness
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000005520 cutting process Methods 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 230000008719 thickening Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for producing a printed board combining rigidness and flexibleness, comprising the following steps: cutting a flexible board and transferring an inner-layer circuit pattern onto the flexible board; cutting a covering film, implement windowing on the covering film, and pressing the covering film onto the flexible board; cutting a rigid board and transferring the inner-layer circuit pattern onto the rigid board; implementing a primary V type cutting at an outline position needing to baring the flexible board area; cutting a prepreg, implementing windowing on the prepreg and removing the prepreg needing to baring the flexible board area; placing the prepreg between the inner surfaces of the flexible board and the rigid board for implementing pressing so as to form a printed board; implementing subsequent processing at the outer layer of the rigid board of the printed board; implementing a secondary V type cutting at the outer layer of the rigid board, and leading the position of the secondary V type cutting to correspond to the position of the primary V type cutting; removing the rigid board of the primary V type cutting and the secondary V type cutting area; and exposing the flexible board of the area. The method improves the production quality of the printed board combining rigidness and flexibleness.
Description
Technical field
The present invention relates to printed panel and make production technical field, relate in particular to a kind of method for producing printed board combining rigidness and flexibleness.
Background technology
Printed board combining rigidness and flexibleness is meant the printed wiring board that includes one or more rigid regions and one or more flexible region in a printed board; This printed wiring board is actually at first rigidity printed wiring plate portion and flexible printed wiring board part is made respectively, forms into columns, is produced on together when hot pressing is superimposed to lamination then.The application of printed board combining rigidness and flexibleness in consumer electronics products such as mobile phone, digital camera is very universal, its can reduce electronic product package size, weight, avoid Miswire, realize the three-dimensional assembling under the different assembled conditions, and have light, thin, short, little characteristics.
With reference to the process chart in early stage shown in the figure 1; Adopt once with the coarctate laminating of all ectonexines early stage in producing design, at first will partly window to guarantee can to expose following flex plate after the pressing to the printed board combining rigidness and flexibleness hardboard; In the pressing process, to increase coating property step S71 and S72 in material (as the PTFE) reference diagram preferably to the part of windowing, guarantee that soft board coverlay and soft board are in conjunction with good after the pressing; Use the low prepreg of resin flow during lamination, avoid that glue flow to the soft board zone in lamination process.
Rigid plate is windowed Width will be with to expose soft board length identical, and shim size is wanted the part of can the complete filling rigid plate windowing.
In sum, difficult point and the defective that early stage, explained hereafter existed is as follows:
1, the deposited shape material PTFE spacer thickness of Shi Yonging is difficult to select, and pad is thick can to influence hardboard zone pressing quality, the thin pressing quality that can influence coverlay of pad, and the PTFE material is more expensive relatively in addition.
2, the PTFE pad that uses after the pressing can't be protected the flex plate that need expose out; because in follow-up wet process; various liquid medicine can be seeped into the flex plate zone by pad and rigid plate groove edge; cause liquid medicine to attack flex plate; so generally speaking; behind lamination, to remove pad, use the method for red adhesive tape or peelable blue glue that flex plate is protected.
3, a laminating pressing coverlay difficulty is big, particularly finer and closely woven circuit, and coverlay can not well be filled between the circuit, can cause that in the follow-up operation that mounts coverlay bubbles.
Summary of the invention
At above-mentioned the problems of the prior art, the object of the present invention is to provide a kind of printed board combining rigidness and flexibleness manufacture method, this kind method does not need to use the PTFE pad again, can improve the product quality of printed board combining rigidness and flexibleness.
A kind of method for producing printed board combining rigidness and flexibleness of the present invention may further comprise the steps:
A, flex plate are opened material, by etching inner line figure are transferred on the described flex plate; Coverlay is opened material, and coverlay is windowed not needing the coverlay in exposed flex plate zone to remove, and coverlay is pressed on the described flex plate then;
B, rigid plate are opened material, by etching inner line figure are transferred on the described rigid plate; The corresponding outline position that needs exposed flex plate zone is carried out first time V-type and is cut on rigid plate, controls the degree of depth that this first time, V-type was cut above the thickness of this rigid plate;
C, prepreg are opened material, and its prepreg of windowing the exposed flex plate zone of needs is removed; Described prepreg placed carry out pressing between flex plate and the rigid plate inner surface and form printed board;
D, carry out following process at the rigid plate skin of described printed board;
E, carry out second time V-type at the rigid plate skin and cut, the V-type position of cutting and the V-type for the first time position of cutting is corresponding for the second time, and for the second time the V-type degree of depth of cutting above the thickness of this rigid plate;
F, remove that V-type is for the first time cut and flex plate that V-type is cut the zone for the second time rigid plate should the zone exposes to the open air out.
Particularly, among the described step B for the first time the V-type degree of depth of cutting be 60% to 70% of rigid plate thickness.In the described step e for the second time the V-type degree of depth of cutting be 40% to 50% of rigid plate thickness.Also comprise step F 1 after the step e before the described step F: described printed board is carried out carrying out sharp processing again behind the flying probe.Following process among the described step D comprises: the skin in described printed board holes, heavy copper thickening, outer-layer circuit figure transfer, etching, welding resistance, surface treatment, print character.The position that the described first time, V-type was cut with respect to the object line on the rigid plate to external compensation 0.2mm.
A kind of method that rigid plate in the printed board combining rigidness and flexibleness is windowed provided by the present invention, the rigid plate in the flex plate zone that the mode of cutting by twice V-arrangement will be exposed is removed, solved the difficulty of selecting pad, avoid the product quality problems that may cause, improved the quality of production of printed board combining rigidness and flexibleness.
Description of drawings
Fig. 1 is the flow process figure of former a kind of method for producing printed board combining rigidness and flexibleness;
Fig. 2 is the flow process figure of a kind of method for producing printed board combining rigidness and flexibleness of the present invention;
Fig. 3 is the flow chart of a kind of method for producing printed board combining rigidness and flexibleness of the present invention;
Fig. 4 is the position view of object line and V-CUT line;
Fig. 5 is the coverlay position view of windowing;
Fig. 6 is a V-CUT degree of depth schematic diagram;
Fig. 7 is the prepreg schematic diagram of windowing.
Embodiment
The method that the object of the present invention is to provide a kind of printed board combining rigidness and flexibleness rigid plate to window, use existing equipment, by improving production procedure, overcome the difficult point that existed in the former production process, more effectively produce the printed board combining rigidness and flexibleness that conforms to quality requirements.
Before the rigid element of rigid-flexible combined printed wiring and flex section were carried out lamination, the preprocessing of its rigid element and flex section was carried out respectively.
With reference to figure 2, Fig. 2 is the flow process figure of a kind of method for producing printed board combining rigidness and flexibleness of the present invention; At first according to the circuit production process of prior art, S1: flex plate, rigid plate, coverlay, low Resin Flow prepreg are opened material; S21: then inner line figure is carried out on each layer line road of flex plate and shift S22: on flex plate, etch circuit; S31: then coverlay is windowed, its outline line of windowing inwardly compensates 2mm (as Fig. 5) with the object line contrast that need expose the flex plate zone, and the solid line 11 among the figure is an object line, the outline line that dotted line 13 is windowed for coverlay; Then coverlay and flex plate are carried out pressing (also i.e. pressing for the first time), the independent pressing of coverlay can be considered the flex plate own characteristic, optimizes technological parameter.
S41: carry out inner line figure at the rigid plate internal layer and shift, etch circuit at the rigid plate internal layer, S42: carry out first time V-type then and cut (V-CUT), V-CUT is the one side that rigid plate is pressed together on the inside for the first time, the degree of depth preferably controls to the 60%-70% (as Fig. 6) of rigid plate thickness, notes rigid plate to be cut wearing in this process; Concrete V-type is cut the position will be with respect to object line to external compensation 0.2mm (as Fig. 4), and the solid line 11 among the figure is an object line, and dotted line 12 is the V-CUT line.
S51: prepreg is windowed, the exposed prepreg in flex plate zone outside of needs is removed, the anti-rigid plate in zone here is bonded on the flex plate, and windowing inwardly compensates 2.0mm (as Fig. 7), the shear line that dotted line 14 is windowed for prepreg among the figure with respect to object line; Compensation mainly is to avoid in the process of pressing, and the glue of prepreg flow to soft board, but compensation again can not be too big, otherwise glue flows again less than rigid plate and flex plate junction, causes the transitional region hickie.
Carry out step S3 now: pressing for the second time, with the pressing that rivets together of rigid plate, the flex plate that presses coverlay, prepreg, adopt silicagel pad during pressing up and down.S4: hole at the rigid plate skin after the pressing, use the plasma mode to carry out de-smear; Heavy copper thickening, outer-layer circuit figure transfer, etching, welding resistance, surface treatment, print character; These steps are all handled according to existing printed circuit board (PCB) production technology.
S5: the skin in rigid plate carries out the V-CUT second time, and the position is corresponding with the position of the V-CUT first time; The control V-CUT degree of depth is the 40%-50% of rigid plate thickness, and this process will be paid special attention to the degree of depth, and the degree of depth can shallow a little point, shallow want manually to remove after the profile needs with exactlying and exposes rigid plate waste material above outside the flex plate; But the dark excessively words of the V-CUT degree of depth can arrive the circuit V-CUT on the flex plate, cause open circuit; Carry out flying probe, sharp processing behind the S61:V-CUT, S62: remove the flex plate that the rigid plate in V-CUT zone should the zone and expose to the open air out; S63: last inspection eventually, S64: pack shipment.
With reference to figure 6 as can be seen rigid plate through for the first time V-CUT and the process of V-CUT processing and fabricating for the second time; The manufacture method of the present invention of Fig. 2 is compared with the former manufacture method shown in Fig. 1, has increased the V-CUT step of twice pair of rigid plate of step S42 and S5, has omitted the step S71 and the S72 that select PTEE material pad; The rigid plate in the flex plate zone that will expose by the mode of twice V-CUT is removed, and has solved the difficulty of selecting pad, and some quality problems that may cause.
In sum, with reference to figure 3, a kind of method for producing printed board combining rigidness and flexibleness provided by the invention can reduce following steps:
S01, flex plate are opened material, by etching inner line figure are transferred on the flex plate; Coverlay is opened material, and coverlay is windowed not needing the coverlay in exposed flex plate zone to remove, and then coverlay is pressed on the flex plate;
S02, rigid plate are opened material, by etching inner line figure are transferred on the described rigid plate; The object line that draws on the rigid plate in the exposed flex plate zone of needs carries out first time V-type at the rigid plate inner surface and cuts along the object line position, control the degree of depth that this first time, V-type was cut above the thickness of this rigid plate;
S03, prepreg are opened material, and its prepreg of windowing the exposed flex plate zone of needs is removed; Prepreg placed carry out pressing between flex plate and the rigid plate inner surface and form printed board;
S04, carry out subsequent treatment, comprising: boring, heavy copper thickening, figure transfer, etching, welding resistance, surface treatment, print character at the rigid plate skin of printed board;
S05, carry out second time V-type at the rigid plate skin and cut, the V-type position of cutting and the V-type for the first time position of cutting is corresponding for the second time, and for the second time the V-type degree of depth of cutting with the first time V-type degree of depth sum had better not be less than the thickness of rigid plate;
S06, flying probe is carried out in printed board, sharp processing again removes that V-type is for the first time cut and flex plate that V-type is cut the zone for the second time rigid plate should the zone exposes to the open air out.
S01 in the above-mentioned steps and S02 can carry out simultaneously, and the prepreg among the S03 is windowed and also can be carried out simultaneously, does not have sequencing.
The method of a kind of printed board combining rigidness and flexibleness rigid plate windowed regions provided by the present invention, promptly the rigid plate in the flex plate zone that will expose by the mode of twice V-CUT is removed, solved following problem: 1. for needing exposed flex plate zone in the course of processing, to select the matters of pad, 2. avoided the peelable glue of printing to influence the boring quality because of out-of-flatness, also need when printing peelable glue simultaneously protect hardboard, the big quality of protection difficulty can't guarantee; 3. Yin Shua peelable glue is subjected to heavy copper liquid medicine and attacks and come off easily and lose the protection of coverlay and influence the postorder course of processing.
Above-described embodiment of the present invention does not constitute the qualification to protection range of the present invention.Any modification of being done within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included within the claim protection range of the present invention.
Claims (6)
1. method for producing printed board combining rigidness and flexibleness is characterized in that may further comprise the steps:
A, flex plate are opened material, by etching inner line figure are transferred on the described flex plate; Coverlay is opened material, and coverlay is windowed not needing the coverlay in exposed flex plate zone to remove, and coverlay is pressed on the described flex plate then;
B, rigid plate are opened material, by etching inner line figure are transferred on the described rigid plate; The corresponding outline position that needs exposed flex plate zone is carried out first time V-type and is cut on rigid plate, controls the degree of depth that this first time, V-type was cut above the thickness of this rigid plate;
C, prepreg are opened material, and its prepreg of windowing the exposed flex plate zone of needs is removed; Described prepreg placed carry out pressing between flex plate and the rigid plate inner surface and form printed board;
D, carry out following process at the rigid plate skin of described printed board;
E, carry out second time V-type at the rigid plate skin and cut, the V-type position of cutting and the V-type for the first time position of cutting is corresponding for the second time, and for the second time the V-type degree of depth of cutting above the thickness of this rigid plate;
F, remove that V-type is for the first time cut and flex plate that V-type is cut the zone for the second time rigid plate should the zone exposes to the open air out.
2. method for producing printed board combining rigidness and flexibleness as claimed in claim 1 is characterized in that: among the described step B for the first time the V-type degree of depth of cutting be 60% to 70% of rigid plate thickness.
3. method for producing printed board combining rigidness and flexibleness as claimed in claim 2 is characterized in that: in the described step e for the second time the V-type degree of depth of cutting be 40% to 50% of rigid plate thickness.
4. method for producing printed board combining rigidness and flexibleness as claimed in claim 3 is characterized in that: also comprise step F 1 after the step e before the described step F: described printed board is carried out carrying out sharp processing again behind the flying probe.
5. method for producing printed board combining rigidness and flexibleness as claimed in claim 4 is characterized in that: the following process among the described step D comprises: hole at described printed board skin, sink copper thickening, outer-layer circuit figure transfer, etching, welding resistance, surface treatment, print character.
6. method for producing printed board combining rigidness and flexibleness as claimed in claim 5 is characterized in that: the position that the described first time, V-type was cut with respect to the object line on the rigid plate to external compensation 0.2mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101928736A CN101695217B (en) | 2009-09-30 | 2009-09-30 | Method for producing printed board combining rigidness and flexibleness |
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| CN2009101928736A CN101695217B (en) | 2009-09-30 | 2009-09-30 | Method for producing printed board combining rigidness and flexibleness |
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| CN101695217A true CN101695217A (en) | 2010-04-14 |
| CN101695217B CN101695217B (en) | 2011-07-27 |
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| CN103068185A (en) * | 2012-12-21 | 2013-04-24 | 深圳市中兴新宇软电路有限公司 | Manufacturing method of printed circuit board soft-hard combination substrate flexible area |
| CN103096641A (en) * | 2011-10-28 | 2013-05-08 | 富葵精密组件(深圳)有限公司 | Manufacture method of contiguous circuit board |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN103237413A (en) * | 2013-04-17 | 2013-08-07 | 景旺电子（深圳）有限公司 | Method for protecting inner-layer flexible board area of flex-rigid board |
| CN103369863A (en) * | 2013-08-02 | 2013-10-23 | 高德（无锡）电子有限公司 | Production process of softness and hardness combined printed circuit board with soft board at outer layer |
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Denomination of invention: A production method of rigid flexible printed circuit board Effective date of registration: 20231109 Granted publication date: 20110727 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN KING BROTHER ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980064991 |