CN106535466B - A kind of rigid-flex combined board and preparation method thereof - Google Patents
A kind of rigid-flex combined board and preparation method thereof Download PDFInfo
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- CN106535466B CN106535466B CN201611044843.7A CN201611044843A CN106535466B CN 106535466 B CN106535466 B CN 106535466B CN 201611044843 A CN201611044843 A CN 201611044843A CN 106535466 B CN106535466 B CN 106535466B
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- rigid
- plate
- combined board
- flex
- flex combined
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The present invention discloses a kind of rigid-flex combined board and preparation method thereof.Method comprising steps of A, in the pre- gong blind slot in the rigid plate first area of rigid-flex combined board, simultaneously in the pre- gong windowed regions of rigid plate second area of rigid-flex combined board, wherein rigid plate first area corresponds to region of the flex plate containing finger or pad in rigid-flex combined board, and rigid plate second area corresponds to the region that flex plate in rigid-flex combined board is free of finger and pad；B, the rigid plate of rigid-flex combined board is pressed together with flex plate；C, gong plate is carried out to the blind slot position of the pre- gong of rigid plate, exposes finger or pad after taking off lid.The present invention will take off two kinds of production methods of lid method and fenestration while apply in the product containing finger or pad and without finger or pad, and the present invention can solve the problems, such as to take off that cover area is too small, it is difficult to take off lid；It can solve the problems, such as simultaneously low using single method producing efficiency.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields more particularly to a kind of rigid-flex combined board and preparation method thereof.
Background technique
The production of rigid-flex combined board at present is mostly made using taking off two methods of lid method and fenestration.In product design subdivision
Two classes, I class can be divided into are as follows: finished product is destroyed or force to yield production of the region without finger or pad (exposing above the region of destroying or force to yield exposed without copper)
Product；II class are as follows: there is the product of finger or pad (having copper exposing above the region of destroying or force to yield exposed) in finished product region of destroying or force to yield.Fenestration
It is only used for I class production method, taking off lid rule can be used for I class and II class production.The excellent of both production methods lacks
Point is as follows: fenestration takes off the process of lid due to saving, and producing efficiency is compared with the height for taking off lid method, but fenestration is only limited the use of and produced in I class
Product production；It takes off Gai Faneng and protects flexable-broken area before forming, but if when flexable-broken area size too small (such as area is less than 5mm*5mm),
Using take off lid legal system as when take off lid just become highly difficult.
With the development of rigid-flex combined board, product design also becomes increasingly complex, and production also becomes more and more difficult, works as production
Product design flexable-broken area containing many places and wherein finished product flexable-broken area is containing finger or pad and without finger or pad, if region of destroying or force to yield is too small
And quantity it is more when, using take off lid legal system make the small position of time domain can highly difficult and efficiency it is extremely low.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of rigid-flex combined board and its production sides
Method, it is intended to solve the problems, such as that existing rigid-flex combined board is low using single method producing efficiency, take off that cover area is small, it is difficult to take off lid.
Technical scheme is as follows:
A kind of production method of rigid-flex combined board, wherein comprising steps of
A, in the pre- gong blind slot in the rigid plate first area of rigid-flex combined board, while in the secondth area of the rigid plate of rigid-flex combined board
The pre- gong windowed regions in domain, wherein rigid plate first area corresponds to region of the flex plate containing finger or pad in rigid-flex combined board,
Rigid plate second area corresponds to the region that flex plate in rigid-flex combined board is free of finger and pad；
B, the rigid plate of rigid-flex combined board is pressed together with flex plate；
C, gong plate is carried out to the blind slot position of the pre- gong of rigid plate, exposes finger or pad after taking off lid.
The production method of the rigid-flex combined board, wherein before the step A further include:
Successively sawing sheet, production inner figure and internal layer is carried out to rigid plate to etch.
The production method of the rigid-flex combined board, wherein before the step A further include:
Sawing sheet successively is carried out to flex plate, production inner figure, internal layer etching, pastes epiphragma and plasma treatment.
The production method of the rigid-flex combined board, wherein in the step B, after being pressed together further include:
It is successively drilled to rigid-flex combined board, plasma treatment, heavy copper plate electric, plating thickening, outer graphics, outer layer erosion
It carves, anti-welding and silk-screen character.
The production method of the rigid-flex combined board, wherein in the step C, after the processing of gong plate further include:
Turmeric, patch PI reinforcement, electrical testing and molding laser incising successively are carried out to rigid-flex combined board.
The production method of the rigid-flex combined board, wherein the rigid-flex combined board includes flex plate, is arranged in flex plate
The prepreg on two sides, the rigid plate that prepreg surface is set.
A kind of rigid-flex combined board, wherein be made of described in any item production methods as above.
The utility model has the advantages that the present invention will take off two kinds of production methods of lid method and fenestration while apply containing finger or pad and not
The production of lid method, destroying or force to yield without finger or pad are taken off in product containing finger or pad, i.e., the flexable-broken area use containing finger or pad
Area is made using fenestration, and the present invention can solve the problems, such as to take off that cover area is too small, it is difficult to take off lid；It can solve using single side simultaneously
Legal system makees the problem of low efficiency.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the production method preferred embodiment of rigid-flex combined board of the present invention.
Fig. 2 is the process flow chart of production method in the present invention.
Specific embodiment
The present invention provides a kind of rigid-flex combined board and preparation method thereof, to make the purpose of the present invention, technical solution and effect
Clearer, clear, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of the production method preferred embodiment of rigid-flex combined board of the present invention, such as scheme
It is shown comprising step:
S1, in the pre- gong blind slot in the rigid plate first area of rigid-flex combined board, while in the rigid plate of rigid-flex combined board second
The pre- gong windowed regions in region, wherein rigid plate first area corresponds to area of the flex plate containing finger or pad in rigid-flex combined board
Domain, rigid plate second area correspond to the region that flex plate in rigid-flex combined board is free of finger and pad；
S2, the rigid plate of rigid-flex combined board and flex plate are pressed together；
S3, gong plate is carried out to the blind slot position of the pre- gong of rigid plate, exposes finger or pad after taking off lid.
For compared with the existing technology, production method present invention employs lid method is taken off and fenestration combines is answered
In rigid-flex combined board, and corresponding region of the flex plate containing finger or pad, using the production of lid method is taken off, corresponding flex plate is not
Region containing finger and pad is made of fenestration.In this way, combining the advantages of taking off lid method and fenestration, in turn avoid simultaneously
Exclusive use is taken off the shortcomings that lid method, and the shortcomings that exclusive use fenestration, improves producing efficiency, solve and take off cover area
Problem that is small, taking off lid difficulty.
As shown in Fig. 2, further, before the step S1 further include:
Successively sawing sheet, production inner figure and internal layer is carried out to rigid plate 30 to etch.
It is etched in internal layer and then rigid plate 30 is handled.Specific to flexable-broken area whether containing finger or pad
Region carries out different disposal.Such as the region containing finger or pad, then 30 corresponding position of rigid plate is used and is taken off at lid method
Reason, the region without finger or pad are then handled 30 corresponding position of rigid plate using fenestration.
Further, before the step S1 further include:
Sawing sheet successively is carried out to flex plate 10, production inner figure, internal layer etching, pastes epiphragma and plasma treatment.
Flex plate 10 before pressing, need successively by sawing sheet, production inner figure, internal layer etching, paste epiphragma and
Plasma treatment.
In the step S1, start to handle rigid plate 30, wherein for the region containing finger or pad, then it is right
The use of 30 corresponding position of rigid plate is taken off lid method and is handled, and 30 corresponding position of rigid plate is then adopted in the region without finger or pad
It is handled with fenestration.
Specifically, as shown in Fig. 2, for falling 1,2,3,4,1 ', 2 ', 3 ' and 4 ' regions in Fig. 2 with gong knife gong in advance.Its
In, after gong falls 1,2,3,4 regions, blind slot can be formed.After gong falls 1 ', 2 ', 3 ' and 4 ' regions, can gong go out windowed regions.This
After pressing, the flexable-broken area containing finger or pad will not expose sample, although windowed regions are exposed, which is free of finger
Or pad.
In step s 2, rigid plate 30 and flex plate 10 are pressed, is wherein set between rigid plate 30 and flex plate 10
It is equipped with prepreg 20, that is to say, that the rigid-flex combined board includes flex plate 10, the semi-solid preparation that 10 two sides of flex plate is arranged in
Piece 20, the rigid plate 30 that 20 surface of prepreg is set.
Further, in the step S2, after being pressed together further include:
It is successively drilled to rigid-flex combined board, plasma treatment, heavy copper plate electric, plating thickening, outer graphics, outer layer erosion
It carves, anti-welding and silk-screen character.Outer graphics therein can be used negative film and be made, and outer layer etching then can be using acid erosion
Carving method is realized.
In the step S3, gong plate is carried out to the blind slot position of the pre- gong of rigid plate 30, exposes finger or pad after taking off lid.
As shown in Figure 2, that is to say, that fall 5,6,7,8 position using gong knife gong, such finger or pad can expose.
Further, in the step S3, after the processing of gong plate further include:
Turmeric, patch PI reinforcement, electrical testing and molding laser incising successively are carried out to rigid-flex combined board.
Quality Detection can be carried out after forming laser incising, then pack shipment.It, can be in production process in front
It is different according to the type of different rigid-flex combined boards, production process is increased and decreased a little.
The present invention also provides a kind of rigid-flex combined boards, and production method as described above is used to be made.
In conclusion the present invention will take off two kinds of production methods of lid method and fenestration while apply containing finger or pad and not
The production of lid method, destroying or force to yield without finger or pad are taken off in product containing finger or pad, i.e., the flexable-broken area use containing finger or pad
Area is made using fenestration, and the present invention can solve the problems, such as to take off that cover area is too small, it is difficult to take off lid；It can solve using single side simultaneously
Legal system makees the problem of low efficiency.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (7)
1. a kind of production method of rigid-flex combined board, which is characterized in that comprising steps of
A, in the pre- gong blind slot in the rigid plate first area of rigid-flex combined board, at the same it is pre- in the rigid plate second area of rigid-flex combined board
Gong windowed regions, wherein rigid plate first area corresponds to region of the flex plate containing finger or pad in rigid-flex combined board, rigidity
Plate second area corresponds to the region that flex plate in rigid-flex combined board is free of finger and pad；
B, the rigid plate of rigid-flex combined board is pressed together with flex plate；
C, gong plate is carried out to the blind slot position of the pre- gong of rigid plate, exposes finger or pad after taking off lid；
Two kinds of production methods of lid method and fenestration will be taken off while being applied in the product containing finger or pad and without finger or pad.
2. the production method of rigid-flex combined board according to claim 1, which is characterized in that before the step A further include:
Successively sawing sheet, production inner figure and internal layer is carried out to rigid plate to etch.
3. the production method of rigid-flex combined board according to claim 1, which is characterized in that before the step A further include:
Sawing sheet successively is carried out to flex plate, production inner figure, internal layer etching, pastes epiphragma and plasma treatment.
4. the production method of rigid-flex combined board according to claim 1, which is characterized in that in the step B, at pressing
After reason further include:
Successively drilled to rigid-flex combined board, plasma treatment, heavy copper plate electric, plating thickenings, outer graphics, outer layer etch,
Anti-welding and silk-screen character.
5. the production method of rigid-flex combined board according to claim 1, which is characterized in that in the step C, at gong plate
After reason further include:
Turmeric, patch PI reinforcement, electrical testing and molding laser incising successively are carried out to rigid-flex combined board.
6. the production method of rigid-flex combined board according to claim 1, which is characterized in that the rigid-flex combined board includes scratching
Property plate, the prepreg that flex plate two sides is set, the rigid plate that prepreg surface is set.
7. a kind of rigid-flex combined board, which is characterized in that be made of production method as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611044843.7A CN106535466B (en) | 2016-11-24 | 2016-11-24 | A kind of rigid-flex combined board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611044843.7A CN106535466B (en) | 2016-11-24 | 2016-11-24 | A kind of rigid-flex combined board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN106535466A CN106535466A (en) | 2017-03-22 |
| CN106535466B true CN106535466B (en) | 2019-01-22 |
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| CN201611044843.7A Active CN106535466B (en) | 2016-11-24 | 2016-11-24 | A kind of rigid-flex combined board and preparation method thereof |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN110572957B (en) * | 2019-09-18 | 2022-10-04 | 九江明阳电路科技有限公司 | Method and device for manufacturing multilayer rigid-flex printed circuit board |
| CN110572944A (en) * | 2019-09-26 | 2019-12-13 | 九江明阳电路科技有限公司 | Method and device for manufacturing exposed area of rigid-flex printed circuit board |
| CN111148375A (en) * | 2019-12-24 | 2020-05-12 | 成都航天通信设备有限责任公司 | Machining method for uncapping of flexible region of rigid-flexible printed board |
| CN112752441B (en) * | 2020-11-10 | 2022-07-08 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of rigid-flexible board with inner layer slotted holes |
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| CN201957328U (en) * | 2011-01-12 | 2011-08-31 | 广州兴森快捷电路科技有限公司 | Rigid-flexible multi-layer printed circuit board |
| CN103237413A (en) * | 2013-04-17 | 2013-08-07 | 景旺电子（深圳）有限公司 | Method for protecting inner-layer flexible board area of flex-rigid board |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
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Patent Citations (5)
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| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN201957328U (en) * | 2011-01-12 | 2011-08-31 | 广州兴森快捷电路科技有限公司 | Rigid-flexible multi-layer printed circuit board |
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| CN106535466A (en) | 2017-03-22 |
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