CN105722314B - A kind of Rigid Flex that anti-cover board is broken and its dozen slice process of uncapping - Google Patents

A kind of Rigid Flex that anti-cover board is broken and its dozen slice process of uncapping Download PDF

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Publication number
CN105722314B
CN105722314B CN201610248974.0A CN201610248974A CN105722314B CN 105722314 B CN105722314 B CN 105722314B CN 201610248974 A CN201610248974 A CN 201610248974A CN 105722314 B CN105722314 B CN 105722314B
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layer
copper foil
prepreg
core material
hardboard
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CN201610248974.0A
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CN105722314A (en
Inventor
华福德
张志敏
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Gaode Jiangsu Electronic Technology Co ltd
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Gul Wuxi Technologies Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a kind of Rigid Flex of anti-cover board fracture and its dozen slice process of uncapping, and belong to Rigid Flex technical field.It sets gradually are as follows: surface layer copper foil, the first prepreg, core material hardboard layer, the second prepreg, core material soft board layer, the second prepreg, core material hardboard layer, the first prepreg and surface layer copper foil；The Rigid Flex of the anti-cover board fracture of product is obtained after tablet press machine presses.Any one Coupon by being directed to four corners at random is sampled the radium-shine cutting of analysis, obtains depth parameter, finally carries out radium-shine cutting and uncap to complete entire technique.The present invention can improve the defect of cover board fracture when process of uncapping after Rigid Flex beats slice, by Coupon design on printed wiring board break edge, outer dimension is small, it does not take up space, it can be adjusted accordingly according to the printed wiring board of different type, size, the number of plies, convenient for the production management of printed wiring board processing factory, working efficiency is promoted, unnecessary scrap of the product is reduced.

Description

A kind of Rigid Flex that anti-cover board is broken and its dozen slice process of uncapping
Technical field
The present invention relates to a kind of Rigid Flex of anti-cover board fracture and its dozen slice process of uncapping, and in particular to a kind of soft The processing technology of the printed wire Rigid Flex of board size larger (X or Y-direction size are greater than 5cm or more), belongs to soft or hard knot Plywood technical field.
Background technique
With lightening, integrated, multifunction the development trend of consumption electronic product, to the soft or hard combination of printed circuit The manufacture craft of plate requires higher and higher.Comply with the production of the applications such as this trend, such as switching, writing pencil, mobile POS, industry control Product can be more and more.The Rigid Flex that this this product uses has a feature, is exactly soft board size larger (X or Y-direction Size is greater than 5cm or more), this soft board size X or Y-direction size are greater than to the Rigid Flex of 5cm or more in the present invention The soft hard board plywood of referred to as big soft board application.Soft hard board plywood printed wiring board with the application of big soft board, has and allows Printed wiring board plate thickness is thinner, the number of plies is more, signal transmission faster, the advantages that finished size is smaller.
In processing procedure production process of uncapping after current existing Rigid Flex, due to needing to confirm the quality and trust of product Property, so micro- slice analysis is unavoidably carried out to it, it is corresponding because soft board size is larger when fishing type machine plays slice sampling The size of the cover plate it is also bigger, be very easy to the phenomenon that cover board fracture occur, it is specific as shown in Figure 1.Therefore it provides a kind of anti-lid The Rigid Flex of plate fracture, which is uncapped, beats slice process just at urgent problem to be solved.
Summary of the invention
It is an object of the present invention to overcome the above deficiencies, provides process of uncapping after a kind of improvement Rigid Flex and beats and cuts The technique of cover board method for breaking when piece also can be reduced scrap of the product while promoting working efficiency.
According to technical solution provided by the invention, a kind of Rigid Flex of anti-cover board fracture, including core material soft board Layer, core material hardboard layer, the first prepreg, the second prepreg and surface layer copper foil；
Set gradually from top to bottom in sequence, specifically: surface layer copper foil, the first prepreg, core material hardboard layer, Second prepreg, core material soft board layer, the second prepreg, core material hardboard layer, the first prepreg and surface layer copper Foil；The Rigid Flex of the anti-cover board fracture of product is obtained after tablet press machine presses；
Several Coupon are equipped on the core material hardboard layer and surface layer copper foil.
The core material soft board layer includes flexible board substrate and flexible plate copper foil, and the flexible board substrate is respectively set one layer up and down Flexible plate copper foil；Soft board skylight is provided on the flexible plate copper foil.
The core material hardboard layer includes hardboard substrate and hardboard copper foil, and the hardboard substrate is respectively set one layer up and down Hardboard copper foil；It is respectively equipped with a Coupon on four corners of the hardboard copper foil, is also provided with hardboard skylight on hardboard copper foil.
First prepreg is equipped with skylight.
The surface layer copper foil is equipped with copper foil skylight, is respectively equipped with a Coupon on four corners.
The Rigid Flex of the anti-cover board fracture, which is uncapped, beats slice process, step are as follows:
(1) core material soft board layer makes: flexible board substrate is middle layer, is covered each by one layer of flexible plate copper foil, soft board up and down Soft board skylight is provided on copper foil；
(2) core material hardboard layer makes: hardboard substrate is middle layer, is covered each by one layer of hardboard copper foil up and down；It is described It is respectively equipped with a Coupon on four corners of hardboard copper foil, is also provided with hardboard skylight on hardboard copper foil；
(3) production of prepreg and surface layer copper foil: the first prepreg of preparation and the second prepreg；Described the first half Skylight is also provided in cured sheets；On surface layer, a Coupon is opened in four corners of copper foil respectively；
(4) it presses: according to surface layer copper foil from top to bottom, the first prepreg, core material hardboard layer, the second semi-solid preparation Piece, core material soft board layer, the second prepreg, core material hardboard layer, the first prepreg and surface layer copper foil sequence into Row pressing；
(5) analyze: any one Coupon for four corners is sampled the radium-shine cutting of analysis at random, obtains depth Parameter；
(6) radium-shine cutting: the radium-shine cutting of gained depth parameter progress is analyzed using step (5) and is uncapped, so that radium-shine cutting Depth will not be cut to core material soft board layer, will not pull core material hardboard layer.
The length or width of the Rigid Flex is greater than 5cm.
Above-mentioned Coupon is calibrated bolck.
Beneficial effects of the present invention: the present invention can improve cover board when process of uncapping after Rigid Flex beats slice and be broken, By Coupon design on printed wiring board break edge, outer dimension is small, does not take up space, can be according to different type, size, the number of plies Printed wiring board adjust accordingly, be convenient for the production management of printed wiring board processing factory, promoted working efficiency, reduce it is unnecessary Scrap of the product.
Detailed description of the invention
Fig. 1 is cover board fracture schematic diagram.
Fig. 2 is core material soft board layer schematic diagram of the present invention.
Fig. 3 is core material hardboard layer schematic diagram of the present invention.
Fig. 4 is Rigid Flex schematic diagram of the present invention.
Fig. 5 is design data figure of the present invention and pictorial diagram.
Description of symbols: 1, core material soft board layer；1-1, flexible board substrate；1-2, flexible plate copper foil；1-3, soft board skylight； 2, core material hardboard layer；2-1, hardboard substrate；2-2, hardboard copper foil；2-3, hardboard skylight；3, the first prepreg；3-1, day Window；4, the second prepreg；5, surface layer copper foil；5-1, copper foil skylight；6, Coupon(calibrated bolck).
Specific embodiment
Coupon in following embodiment is calibrated bolck.
A kind of Rigid Flex of anti-cover board fracture of embodiment 1
It is as in Figure 2-4: including core material soft board layer 1, core material hardboard layer 2, the first prepreg 3, the second half Cured sheets 4 and surface layer copper foil 5；
It sets gradually from top to bottom in sequence, specifically: surface layer copper foil 5, the first prepreg 3, core material hardboard Layer the 2, second prepreg 4, core material soft board layer 1, the second prepreg 4, core material hardboard layer 2, the first prepreg 3 With surface layer copper foil 5；The Rigid Flex of the anti-cover board fracture of product is obtained after tablet press machine presses；
Several Coupon 6 are equipped on the core material hardboard layer 2 and surface layer copper foil 5.
The core material soft board layer 1 includes flexible board substrate 1-1 and flexible plate copper foil 1-2, the flexible board substrate 1-1 or more point It She Zhi not one layer of flexible plate copper foil 1-2；Soft board skylight 1-3 is provided on the flexible plate copper foil 1-2.
The core material hardboard layer 2 includes hardboard substrate 2-1 and hardboard copper foil 2-2, the hardboard substrate 2-1 or more point It She Zhi not one layer of hardboard copper foil 2-2；A Coupon 6, hardboard copper are respectively equipped on four corners of the hardboard copper foil 2-2 Hardboard skylight 2-3 is also provided on foil 2-2.
First prepreg 3 is equipped with skylight 3-1.
The surface layer copper foil 5 is equipped with copper foil skylight 5-1, is respectively equipped with a Coupon 6 on four corners.
The Rigid Flex of the anti-cover board of embodiment 2 fracture, which is uncapped, beats slice process
As illustrated in figures 4-5, specific steps are as follows:
(1) core material soft board layer makes: flexible board substrate 1-1 is middle layer, is covered each by one layer of flexible plate copper foil 1- up and down Soft board skylight 1-3 is provided on 2, flexible plate copper foil 1-2；
(2) core material hardboard layer makes: hardboard substrate 2-1 is middle layer, is covered each by one layer of hardboard copper foil 2- up and down 2；It is respectively equipped with a Coupon 6 on four corners of the hardboard copper foil 2-2, is also provided with hardboard skylight on hardboard copper foil 2-2 2-3；
(3) production of prepreg and surface layer copper foil: the first prepreg 3 of preparation and the second prepreg 4；Described first Skylight 3-1 is also provided on prepreg 3；On surface layer, a Coupon 6 is opened in four corners of copper foil 3 respectively；
(4) it presses: according to surface layer copper foil 5 from top to bottom, the first prepreg 3, core material hardboard layer 2, the second half solid Change piece 4, core material soft board layer 1, the second prepreg 4, core material hardboard layer 2, the first prepreg 3 and surface layer copper foil 5 Sequence pressed；
(5) analyze: any one Coupon 6 for four corners is sampled the radium-shine cutting of analysis at random, obtains deep Spend parameter；
(6) radium-shine cutting: the radium-shine cutting of gained depth parameter progress is analyzed using step (5) and is uncapped, so that radium-shine cutting Depth will not be cut to core material soft board layer 1, will not pull core material hardboard layer 2.
The length or width of the Rigid Flex is greater than 5cm.

Claims (3)

1. a kind of Rigid Flex of anti-cover board fracture, which is uncapped, beats slice process, it is characterized in that step are as follows:
(1) core material soft board layer makes: flexible board substrate (1-1) is middle layer, is covered each by one layer of flexible plate copper foil (1- up and down 2), soft board skylight (1-3) is provided on flexible plate copper foil (1-2)；
(2) core material hardboard layer makes: hardboard substrate (2-1) is middle layer, is covered each by one layer of hardboard copper foil (2- up and down 2)；It is respectively equipped with a calibrated bolck (6) on four corners of the hardboard copper foil (2-2), is also provided on hardboard copper foil (2-2) hard Plate skylight (2-3)；
(3) production of prepreg and surface layer copper foil: preparation the first prepreg (3) and the second prepreg (4)；Described first Skylight (3-1) is also provided on prepreg (3)；On surface layer, a calibrated bolck (6) is opened in four corners of copper foil (3) respectively；
(4) it presses: according to surface layer copper foil (5) from top to bottom, the first prepreg (3), core material hardboard layer (2), the second half Cured sheets (4), core material soft board layer (1), the second prepreg (4), core material hardboard layer (2), the first prepreg (3) It is pressed with the sequence of surface layer copper foil (5)；
(5) analyze: any one calibrated bolck (6) for four corners is sampled the radium-shine cutting of analysis at random, obtains depth Parameter；
(6) radium-shine cutting: the radium-shine cutting of gained depth parameter progress is analyzed using step (5) and is uncapped, so that radium-shine depth of cut It will not be cut to core material soft board layer (1), core material hardboard layer (2) will not be pulled.
2. the Rigid Flex of anti-cover board fracture, which is uncapped, as described in claim 1 beats slice process, it is characterized in that: the soft or hard knot The length or width of plywood is greater than 5cm.
3. the Rigid Flex of anti-cover board fracture, which is uncapped, as described in claim 1 beats slice process, it is characterized in that: described the first half Cured sheets (3) are equipped with skylight (3-1).
CN201610248974.0A 2016-04-20 2016-04-20 A kind of Rigid Flex that anti-cover board is broken and its dozen slice process of uncapping Active CN105722314B (en)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109688734B (en) * 2018-12-06 2021-07-13 高德（无锡）电子有限公司 Processing technology for preventing soft and hard combined plate from being bent and torn
CN113993301B (en) * 2021-10-27 2024-06-14 高德(江苏)电子科技股份有限公司 Processing technology of multilayer soft board of soft and hard combined board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099745A (en) * 1998-06-05 2000-08-08 Parlex Corporation Rigid/flex printed circuit board and manufacturing method therefor
CN103068185A (en) * 2012-12-21 2013-04-24 深圳市中兴新宇软电路有限公司 Manufacturing method of printed circuit board soft-hard combination substrate flexible area
CN203057679U (en) * 2012-12-28 2013-07-10 信利电子有限公司 A circuit board combining a soft layer and hard layers
CN205726646U (en) * 2016-04-20 2016-11-23 高德（无锡）电子有限公司 A kind of Rigid Flex of anti-cover plate fracture

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102215642B (en) * 2010-04-01 2013-11-27 富葵精密组件(深圳)有限公司 Manufacturing method for rigid flexible printed circuit board (R-F PCB)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099745A (en) * 1998-06-05 2000-08-08 Parlex Corporation Rigid/flex printed circuit board and manufacturing method therefor
CN103068185A (en) * 2012-12-21 2013-04-24 深圳市中兴新宇软电路有限公司 Manufacturing method of printed circuit board soft-hard combination substrate flexible area
CN203057679U (en) * 2012-12-28 2013-07-10 信利电子有限公司 A circuit board combining a soft layer and hard layers
CN205726646U (en) * 2016-04-20 2016-11-23 高德（无锡）电子有限公司 A kind of Rigid Flex of anti-cover plate fracture

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Effective date of registration: 20230830

Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101

Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd.

Address before: No.32 Chunhui East Road, Xishan Economic Development Zone, Xishan District, Wuxi City, Jiangsu Province

Patentee before: Gultech (Wuxi) Electronics Co.,Ltd.

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