CN205847725U - A kind of improvement is uncapped the damaged Rigid Flex of flow process copper - Google Patents
A kind of improvement is uncapped the damaged Rigid Flex of flow process copper Download PDFInfo
- Publication number
- CN205847725U CN205847725U CN201620336555.8U CN201620336555U CN205847725U CN 205847725 U CN205847725 U CN 205847725U CN 201620336555 U CN201620336555 U CN 201620336555U CN 205847725 U CN205847725 U CN 205847725U
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- CN
- China
- Prior art keywords
- hardboard
- layer
- skylight
- prepreg
- copper foil
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- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 23
- 239000010949 copper Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 43
- 239000011162 core material Substances 0.000 claims abstract description 37
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 230000002159 abnormal effect Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 230000008719 thickening Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
This utility model relates to a kind of improvement and uncaps the damaged Rigid Flex of flow process copper, belongs to Rigid Flex technical field.It sets gradually the most from top to bottom, particularly as follows: top layer Copper Foil, the second prepreg, core material hardboard layer, the first prepreg, core material soft board layer, the first prepreg, core material hardboard layer, the second prepreg and top layer Copper Foil；After tablet machine pressing, obtain product improve the Rigid Flex that flow process copper of uncapping is damaged.The Rigid Flex that this utility model provides, when pressing, the window that drags for the direct prepreg of outer copper foil is smaller in size than required soft board size, edge after outer copper foil is directly windowed with thickening layer or hardboard layer after can solving pressing contacts the defect abnormal so that copper breakage, improving product quality yield, reduces and scraps and the product heavy industry of production line.
Description
Technical field
This utility model relates to a kind of improvement and uncaps the damaged Rigid Flex of flow process copper, is specifically related in the pressing application of multilamellar core material (soft board and hardboard thickness of slab exist bigger high low head), belongs to Rigid Flex technical field.
Background technology
Along with consumption electronic product is lightening, integrated, the development trend of multifunction, the processing technology of printed circuit board (PCB) is required more and more higher by it.Complying with this trend, soft or hard combines printed substrate can be increasingly becoming the pith of printed circuit board (PCB).Rigid Flex is as the term suggests being on one or more rigidity printed substrate, include overall one or more flexible printed wiring board essential of composition, reduce when it makes electronic product assemble and use adapter, possess advantages such as adding reliability, signal transmits faster, finished size is less.
Current most Rigid Flex production method is all before pressing, by forming machine, corresponding for soft board upper and lower cover plate to be dragged for turn on window in advance first to get rid of, cover upper Copper Foil again and carry out pressing, it is characterized in before pressing upper and lower cover plates corresponding for soft board is dragged for turn on window in advance first got rid of by forming machine, so the prepreg (the bonding film of PP) between the soft board of correspondence with hardboard layer or Copper Foil etc. also needs to first pass through forming machine before pressing and drags for turn on window in advance and first get rid of.Bending requirement due to Rigid Flex to be considered, the gummosis part of the bonding film of PP can not flow to soft board part, otherwise there will be the situation that bending is bad, cannot assemble, therefore PP bonding film windowing size is all bigger about 0.125-0.25mm than soft board size.
There is following defect in above method: folds on the position that structure, Copper Foil and core material contact as shown in Figure 1, and Copper Foil is easily dragged for window back edge by core material and crushes damage, i.e. copper is damaged, is entering liquid medicine through wet process Copper Foil depletion region, is causing quality abnormal.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned weak point, it is provided that a kind of improvement is uncapped the damaged Rigid Flex of flow process copper.
The technical scheme provided according to this utility model, a kind of improvement is uncapped the damaged Rigid Flex of flow process copper, including core material soft board layer, core material hardboard layer, the first prepreg, the second prepreg and top layer Copper Foil；
Set gradually the most from top to bottom, particularly as follows: top layer Copper Foil, the second prepreg, core material hardboard layer, the first prepreg, core material soft board layer, the first prepreg, core material hardboard layer, the second prepreg and top layer Copper Foil；After tablet machine pressing, obtain product improve the Rigid Flex that flow process copper of uncapping is damaged；
Soft board skylight is set on described core material soft board layer, core material hardboard layer arranges hardboard skylight, the first prepreg arranges the first skylight, the second prepreg arranges the second skylight.
Described core material soft board layer includes that flexible board substrate and flexible plate copper foil, described flexible board substrate are respectively provided with one layer of flexible plate copper foil up and down；Soft board skylight is had on described flexible plate copper foil.
Described core material hardboard layer includes that hardboard base material and hardboard Copper Foil, described hardboard base material are respectively provided with one layer of hardboard Copper Foil up and down；Hardboard skylight is all had on hardboard base material and hardboard Copper Foil；The width in described hardboard skylight is the most identical.
The width in described hardboard skylight is identical with the width in soft board skylight.
The width in described first skylight is more than the width in soft board skylight.The big 0.125-0.25mm of width in the width ratio soft board skylight in described first skylight.
The width in described second skylight is less than the width in hardboard skylight.The little 0.1-0.2mm of width in the width ratio hardboard skylight in the second skylight.
The beneficial effects of the utility model: the Rigid Flex that this utility model provides, when pressing, the window that drags for the direct prepreg of outer copper foil is smaller in size than required soft board size, edge after outer copper foil is directly windowed with thickening layer or hardboard layer after can solving pressing contacts the defect abnormal so that copper breakage, improving product quality yield, reduces and scraps and the product heavy industry of production line.
Accompanying drawing explanation
Fig. 1 is existing folded structure schematic diagram.
Fig. 2 is core material soft board layer schematic diagram.
Fig. 3 is core material hardboard layer schematic diagram.
Fig. 4 is the first prepreg schematic diagram.
Fig. 5 is the second prepreg schematic diagram.
Fig. 6 is this utility model Rigid Flex schematic diagram.
Description of reference numerals: 1, core material soft board layer；1-1, flexible board substrate；1-2, flexible plate copper foil；2, core material hardboard layer；2-1, hardboard base material；2-2, hardboard Copper Foil；3, the first prepreg；4, the second prepreg；5, top layer Copper Foil；6-1, soft board skylight；6-2, hardboard skylight；6-3, the first skylight；6-4, the second skylight.
Detailed description of the invention
As shown in Figure 6: a kind of improvement is uncapped the damaged Rigid Flex of flow process copper, including core material soft board layer 1, core material hardboard layer the 2, first prepreg the 3, second prepreg 4 and top layer Copper Foil 5；
Set gradually the most from top to bottom, particularly as follows: top layer Copper Foil the 5, second prepreg 4, core material hardboard layer the 2, first prepreg 3, core material soft board layer the 1, first prepreg 3, core material hardboard layer the 2, second prepreg 4 and top layer Copper Foil 5；After tablet machine pressing, obtain product improve the Rigid Flex that flow process copper of uncapping is damaged；
Soft board skylight 6-1 is set on described core material soft board layer 1, core material hardboard layer 2 arranges hardboard skylight 6-2, the first prepreg 3 arranges the first skylight 6-3, the second prepreg 4 arranges the second skylight 6-4.
Described core material soft board layer 1 includes flexible board substrate 1-1 and flexible plate copper foil 1-2, and described flexible board substrate 1-1 is respectively provided with one layer of flexible plate copper foil 1-2 up and down；Soft board skylight 6-1 is had on described flexible plate copper foil 1-2.
Described core material hardboard layer 2 includes that hardboard base material 2-1 and hardboard Copper Foil 2-2, described hardboard base material 2-1 are respectively provided with one layer of hardboard Copper Foil 2-2 up and down；Hardboard skylight 6-2 is all had on hardboard base material 2-1 and hardboard Copper Foil 2-2；The width of described hardboard skylight 6-2 is the most identical.
As in figure 2 it is shown, size A of described soft board skylight 6-1 is 20mm；As it is shown on figure 3, correspondence soft board skylight, the position 6-1 of described hardboard skylight 6-2, it is similarly size A, 20mm；As shown in Figure 4, the size of the first skylight 6-3 is A1=A+0.25mm；As it is shown in figure 5, the size of the second skylight 6-4 is A2=A-0.125mm.
After pressing as shown in Figure 6, the window size of dragging for of the second prepreg 4 directly contacted with top layer Copper Foil 5 during pressing simply need to be less than soft board size 0.1-0.2mm of customer requirement, the problem that edge after top layer Copper Foil 5 is directly windowed with thickening layer or hardboard layer after can solving pressing contacts, thus it is abnormal to improve copper breakage, improving product quality yield, reduces and scraps and the product heavy industry of production line.
Claims (8)
1. improvement is uncapped the damaged Rigid Flex of flow process copper, it is characterized in that: include core material soft board layer (1), core material hardboard layer (2), the first prepreg (3), the second prepreg (4) and top layer Copper Foil (5)；
Set gradually the most from top to bottom, particularly as follows: top layer Copper Foil (5), the second prepreg (4), core material hardboard layer (2), the first prepreg (3), core material soft board layer (1), the first prepreg (3), core material hardboard layer (2), the second prepreg (4) and top layer Copper Foil (5)；After tablet machine pressing, obtain product improve the Rigid Flex that flow process copper of uncapping is damaged；
On described core material soft board layer (1), soft board skylight (6-1) is set, hardboard skylight (6-2) is set on core material hardboard layer (2), first skylight (6-3) is set on the first prepreg (3), the second prepreg (4) arranges the second skylight (6-4).
2. improve the Rigid Flex that flow process copper of uncapping is damaged as claimed in claim 1, it is characterized in that: described core material soft board layer (1) includes flexible board substrate (1-1) and flexible plate copper foil (1-2), described flexible board substrate (1-1) is respectively provided with one layer of flexible plate copper foil (1-2) up and down；Soft board skylight (6-1) is had on described flexible plate copper foil (1-2).
3. improve the Rigid Flex that flow process copper of uncapping is damaged as claimed in claim 1, it is characterized in that: described core material hardboard layer (2) includes that hardboard base material (2-1) and hardboard Copper Foil (2-2), described hardboard base material (2-1) are respectively provided with one layer of hardboard Copper Foil (2-2) up and down；Hardboard skylight (6-2) is all had on hardboard base material (2-1) and hardboard Copper Foil (2-2)；The width of described hardboard skylight (6-2) is the most identical.
4. as described in one of claim 1-3, improve the Rigid Flex that flow process copper of uncapping is damaged, it is characterized in that: the width of described hardboard skylight (6-2) is identical with the width of soft board skylight (6-1).
5. as described in one of claim 1-3, improve the Rigid Flex that flow process copper of uncapping is damaged, it is characterized in that: the width of described first skylight (6-3) is more than the width in soft board skylight (6-1).
6. as described in one of claim 1-3, improve the Rigid Flex that flow process copper of uncapping is damaged, it is characterized in that: the width of described second skylight (6-4) is less than the width in hardboard skylight (6-2).
7. improve the Rigid Flex that flow process copper of uncapping is damaged as claimed in claim 6, it is characterized in that: the little 0.1-0.2mm of width in the width ratio hardboard skylight (6-2) of described second skylight (6-4).
8. improve the Rigid Flex that flow process copper of uncapping is damaged as claimed in claim 5, it is characterized in that: the big 0.125-0.25mm of width in the width ratio soft board skylight (6-1) of described first skylight (6-3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620336555.8U CN205847725U (en) | 2016-04-20 | 2016-04-20 | A kind of improvement is uncapped the damaged Rigid Flex of flow process copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620336555.8U CN205847725U (en) | 2016-04-20 | 2016-04-20 | A kind of improvement is uncapped the damaged Rigid Flex of flow process copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205847725U true CN205847725U (en) | 2016-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620336555.8U Expired - Fee Related CN205847725U (en) | 2016-04-20 | 2016-04-20 | A kind of improvement is uncapped the damaged Rigid Flex of flow process copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205847725U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613677A (en) * | 2017-10-17 | 2018-01-19 | 肇庆高新区国专科技有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN108712816A (en) * | 2018-05-31 | 2018-10-26 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
| CN108770185A (en) * | 2018-05-31 | 2018-11-06 | 高德（无锡）电子有限公司 | Prevent the processing technology of Rigid Flex soft board bending fracture |
| CN109600916A (en) * | 2017-09-30 | 2019-04-09 | 惠州威健电路板实业有限公司 | Flexible and hard combined circuit board and its manufacture craft |
| WO2019071853A1 (en) * | 2017-10-11 | 2019-04-18 | 广州兴森快捷电路科技有限公司 | Manufacturing method for rigid-flex combined circuit board |
| CN110650598A (en) * | 2019-10-31 | 2020-01-03 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board for improving bubbling |
| CN110769619A (en) * | 2019-10-31 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board |
| CN113056121A (en) * | 2021-03-16 | 2021-06-29 | 上海美维电子有限公司 | Uncovering method of rigid-flex board |
| CN114745844A (en) * | 2022-03-28 | 2022-07-12 | 诚亿电子（嘉兴）有限公司 | Semi-soft hard combined plate of double-sided circuit in bending area and manufacturing method thereof |
-
2016
- 2016-04-20 CN CN201620336555.8U patent/CN205847725U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600916A (en) * | 2017-09-30 | 2019-04-09 | 惠州威健电路板实业有限公司 | Flexible and hard combined circuit board and its manufacture craft |
| WO2019071853A1 (en) * | 2017-10-11 | 2019-04-18 | 广州兴森快捷电路科技有限公司 | Manufacturing method for rigid-flex combined circuit board |
| CN107613677A (en) * | 2017-10-17 | 2018-01-19 | 肇庆高新区国专科技有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN108712816A (en) * | 2018-05-31 | 2018-10-26 | 高德（无锡）电子有限公司 | Prevent the Rigid Flex of soft board bending fracture |
| CN108770185A (en) * | 2018-05-31 | 2018-11-06 | 高德（无锡）电子有限公司 | Prevent the processing technology of Rigid Flex soft board bending fracture |
| CN110650598A (en) * | 2019-10-31 | 2020-01-03 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board for improving bubbling |
| CN110769619A (en) * | 2019-10-31 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board |
| CN113056121A (en) * | 2021-03-16 | 2021-06-29 | 上海美维电子有限公司 | Uncovering method of rigid-flex board |
| CN113056121B (en) * | 2021-03-16 | 2022-03-18 | 上海美维电子有限公司 | Uncovering method of rigid-flex board |
| CN114745844A (en) * | 2022-03-28 | 2022-07-12 | 诚亿电子（嘉兴）有限公司 | Semi-soft hard combined plate of double-sided circuit in bending area and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 |