CN201726603U - Guide plate for releasing film through developing and etching - Google Patents

Guide plate for releasing film through developing and etching Download PDF

Info

Publication number
CN201726603U
CN201726603U CN201020263568XU CN201020263568U CN201726603U CN 201726603 U CN201726603 U CN 201726603U CN 201020263568X U CN201020263568X U CN 201020263568XU CN 201020263568 U CN201020263568 U CN 201020263568U CN 201726603 U CN201726603 U CN 201726603U
Authority
CN
China
Prior art keywords
guide plate
circuit board
flexible circuit
window
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201020263568XU
Other languages
Chinese (zh)
Inventor
曹锦华
陈仁炼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Hongxin Electron Tech Co Ltd
Original Assignee
Xiamen Hongxin Electron Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Hongxin Electron Tech Co Ltd filed Critical Xiamen Hongxin Electron Tech Co Ltd
Priority to CN201020263568XU priority Critical patent/CN201726603U/en
Application granted granted Critical
Publication of CN201726603U publication Critical patent/CN201726603U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model discloses a guide plate for releasing a film through developing and etching. A window for fixing a flexible circuit board to be processed is formed on the guide plate. the guide plate structure is used for fixing the flexible circuit board to be processed by the arranged window, thus providing support for the flexible circuit board, preventing the defects that the flexible circuit board generates wrinkle when passing through a Data Encryption Standard (DES) line, and improving the yield of product circuit manufacture.

Description

A kind of development etching demoulding guide plate of crossing
Technical field
The utility model relates to the flexible circuit board making and uses equipment, is meant a kind of guide plate structure that was used for development etching demoulding operation especially.
Background technology
Along with development of electronic technology, electronic product is past more and more gently, thin, direction develops easily, its employed flexible circuit board is light, thin, highly flexible development, particularly single-sided flexible circuit board of trend thereupon also, and its thinnest employed copper thickness only is 25 μ m.At present, when making single-sided flexible circuit board, development etching demoulding (vehicle economy S line) operation was arranged one, conventional way is that the end with single-sided flexible circuit board to be processed 30 uses transfering belt 40 not to be attached to a side of guide plate 10, cooperate shown in Figure 3, this guide plate 10 has higher mechanical properties, form by a complete substrate manufacture, and its side edge length that contacts with flexible circuit board 30 could drive single-sided flexible circuit board 30 translations like this and cross the DES line greater than the length of flexible circuit board 30 these sides; Yet, this processing mode is not supported on the whole owing to flexible circuit board 30, when crossing the DES line, can produce fold, or seal lower roll rat and to cause circuit to make bad, especially, when and occur when unusual, flexible circuit board 30 more may be wrinkled into one, cause product rejection, thereby reduced make efficiency, strengthen cost.Therefore, this kind guide plate structure is only applicable to process thicker flexible circuit board, for also inapplicable as the relatively thinner flexible circuit board of single-sided flexible circuit board and so on thickness.
Therefore, the design people improves the structure of guide plate, develops a kind of guide plate structure that is applicable to the flexible circuit board of thinner thickness, and this case produces thus.
The utility model content
Main purpose of the present utility model is to provide a kind of development etching demoulding guide plate of crossing, and it is simple in structure, can be flexible circuit board and provides support, and it is bad to prevent to produce when flexible circuit board from crossing the DES line fold etc., improves the yield of product circuit making.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of development etching demoulding guide plate of crossing is formed with the window that is used for fixing flexible circuit board to be processed on this guide plate.
Above-mentioned guide plate is made by the epoxy glass fiber plate.
After adopting such scheme, the utility model is by offering window on guide plate, three sides of flexible circuit board to be processed can be used adhesive tape be fixed on window area, can make flexible circuit board obtain farthest to support so on the one hand, produced fold when avoiding the DES line, and can not influence processed to flexible circuit board, improve make efficiency.
Description of drawings
Fig. 1 is the structural representation of guide plate that the utility model provides;
Fig. 2 is the schematic diagram of the utility model in conjunction with flexible circuit board;
Fig. 3 is the schematic diagram that existing guide plate drives flexible circuit board.
Embodiment
With reference to shown in Figure 1, the utility model provides a kind of development etching demoulding guide plate 2 of crossing, based on its use occasion, require it to have higher mechanical properties and dielectric property, good insulation performance and long-term heat resistance and moisture resistivity, and will have the favorable mechanical processability, adopt the epoxy glass fiber plate in the present embodiment, and will be designed and sized to 300*350mm, thickness is 1.0mm, and the actual size of guide plate 2 and thickness can be determined according to actual conditions certainly, not with this
Embodiment exceeds.
Improvement of the present utility model is: also offer window 21 on the guide plate 2, the size of this window 21 is of a size of suitable to be slightly larger than flexible circuit board to be processed 3, if the size difference is too big, then be unfavorable for flexible circuit board 3 is fixed on window 21 places, and if the size of window 21 is littler than the size of flexible circuit board 3, then can block the marginal portion of flexible circuit board 3, cause and to process etching, therefore in the present embodiment, window 21 is designed and sized to 250mm*300mm (general flexible circuit board is of a size of 250mm*250mm).
During use, cooperate shown in Figure 2, the back side of flexible circuit board 3 is placed on window 21 places of guide plate 2 up, and makes its end near window 21, three sides with flexible circuit board 3 use adhesive tape 4 to be fixed on the edge of window 21 then, like this when crossing the DES line, guide plate 2 drives flexible circuit board 3 translations, because flexible circuit board 3 is supported, can prevent its fold well, thereby improve the making qualification rate of product, enhance productivity.
Above embodiment only is explanation technological thought of the present utility model; can not limit protection range of the present utility model with this; every according to the technological thought that the utility model proposes, any change of being done on the technical scheme basis all falls within the utility model protection range.

Claims (2)

1. cross development etching demoulding guide plate for one kind, it is characterized in that: be formed with the window that is used for fixing flexible circuit board to be processed on this guide plate.
2. a kind of development etching demoulding guide plate of crossing as claimed in claim 1, it is characterized in that: described guide plate is made by the epoxy glass fiber plate.
CN201020263568XU 2010-07-16 2010-07-16 Guide plate for releasing film through developing and etching Expired - Lifetime CN201726603U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020263568XU CN201726603U (en) 2010-07-16 2010-07-16 Guide plate for releasing film through developing and etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020263568XU CN201726603U (en) 2010-07-16 2010-07-16 Guide plate for releasing film through developing and etching

Publications (1)

Publication Number Publication Date
CN201726603U true CN201726603U (en) 2011-01-26

Family

ID=43494985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020263568XU Expired - Lifetime CN201726603U (en) 2010-07-16 2010-07-16 Guide plate for releasing film through developing and etching

Country Status (1)

Country Link
CN (1) CN201726603U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687321A (en) * 2013-12-06 2014-03-26 中国航空工业集团公司第六三一研究所 Machining method for hollow metal graph
CN104754874A (en) * 2014-12-17 2015-07-01 安捷利电子科技(苏州)有限公司 Guide plate attachment method used for ultrathin FPC

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687321A (en) * 2013-12-06 2014-03-26 中国航空工业集团公司第六三一研究所 Machining method for hollow metal graph
CN104754874A (en) * 2014-12-17 2015-07-01 安捷利电子科技(苏州)有限公司 Guide plate attachment method used for ultrathin FPC

Similar Documents

Publication Publication Date Title
CN205847725U (en) A kind of improvement is uncapped the damaged Rigid Flex of flow process copper
CN102637386B (en) Display device
CN204206720U (en) A kind of nano level metal electromagnetic shielding film
CN106793567A (en) A kind of preparation method of rigid and flexibility plate
CN105722317B (en) Rigid-flexible combination printed circuit board and preparation method thereof
CN201726603U (en) Guide plate for releasing film through developing and etching
CN103841767A (en) Transparent printed circuit board and manufacturing method thereof
CN201440756U (en) Sheet browned tin tool
CN107589877A (en) A kind of copper foil base touch sensing
CN101351079A (en) Method for processing step ladder PCB plate
CN206948712U (en) A kind of shield type rigid-flex combined board
TW201524759A (en) Flexible copper clad laminated plate and flexible circuit substrate
CN105196645A (en) Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate
CN105578723B (en) A kind of flexible PCB and mobile terminal
CN202773170U (en) Flexible circuit board with acetate cloth
CN103779516A (en) Fixing sheet and electronic apparatus
CN203896586U (en) Anti-interference open-circuit-preventive FPC
CN206100601U (en) Flexible circuit board is rolled over in bending resistance
CN207589268U (en) rigid-flexible combined circuit board
CN107509383A (en) A kind of Transparent shielding cover for pcb board
CN207897218U (en) Ultra-thin flexible copper-clad plate and flex circuit application
CN205008319U (en) Volume to volume polyimide film's cleaning system
CN206024413U (en) A kind of display window flexible transparent electromagnetic shielding film
CN205491428U (en) Hot pressing laminating flexible circuit board
CN204906865U (en) White single -clad board

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 361100, No. 19, No. 2, No. 1, Xiang Hai Road, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Fujian Province

Patentee after: Xiamen Hongxin Electronic Technology Co., Ltd.

Address before: 361100 Fujian, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Yue Yue Road, No. 23 A-14

Patentee before: Xiamen Hongxin Electron Technology Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20110126