CN204906865U - white single panel - Google Patents
white single panel Download PDFInfo
- Publication number
- CN204906865U CN204906865U CN201520496201.5U CN201520496201U CN204906865U CN 204906865 U CN204906865 U CN 204906865U CN 201520496201 U CN201520496201 U CN 201520496201U CN 204906865 U CN204906865 U CN 204906865U
- Authority
- CN
- China
- Prior art keywords
- layer
- white
- polyimide film
- microns
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 229920001721 polyimide Polymers 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 229920006332 epoxy adhesive Polymers 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000010292 electrical insulation Methods 0.000 abstract description 3
- 229920006335 epoxy glue Polymers 0.000 abstract description 3
- 238000007639 printing Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
Description
技术领域 technical field
本实用新型涉及单面板技术领域，特别涉及一种白色单面板。 The utility model relates to the technical field of single panels, in particular to a white single panel.
背景技术 Background technique
单面印刷电路板是1950年代初期随着电晶体的出现，以美国为中心发展出来的产品，当时主要制作方法以铜箔直接蚀刻方法为主流。1953～1955年，日本利用进口铜箔首次作成纸质酚醛铜箔基板，并大量应用在收音机方面。1956年，日本电路板专业厂商出现后，单面板的制造技术随即急速进展。 Single-sided printed circuit boards were developed in the early 1950s with the emergence of transistors and centered in the United States. At that time, the main production method was the direct etching of copper foil. From 1953 to 1955, Japan used imported copper foil to make paper phenolic copper foil substrates for the first time, and it was widely used in radios. In 1956, after the emergence of professional Japanese circuit board manufacturers, the manufacturing technology of single-sided boards developed rapidly.
单面板就是在最基本的PCB上，零件集中在其中一面，导线则集中在另一面上。单面板的布线图以网路印刷(ScreenPrinting)为主，亦即在铜表面印上阻剂，经蚀刻后再以防焊阻印上记号，最后再以冲孔加工方式完成零件导孔及外形。但是现在的单面板不能直接应用在LED软灯条上，还要对单面板进行丝印白色油墨和烘干等工序，影响到下游LED企业生产LED软灯条的生产效率，影响到企业的综合竞争力。 Single sided board is exactly on the most basic PCB, and parts concentrate on wherein one side, and wire then concentrates on the other side. The wiring diagram of the single-sided board is mainly based on screen printing, that is, printing resist on the copper surface, after etching, marking with solder resistance, and finally completing the guide hole and shape of the part by punching . However, the current single panel cannot be directly applied to the LED flexible light strip, and the single panel needs to be screen-printed with white ink and dried, which affects the production efficiency of downstream LED enterprises in the production of LED flexible light strips, and affects the comprehensive competition of enterprises. force.
实用新型内容 Utility model content
针对上述不足，本实用新型目的在于提供一种结构设计巧妙、合理，可以直接适用于LED软灯条，节省工序，且综合性能好的白色单面板。 In view of the above shortcomings, the purpose of this utility model is to provide a white single panel with ingenious and reasonable structural design, which can be directly applied to LED flexible light strips, saves procedures, and has good comprehensive performance.
本实用新型为实现上述目的，所提供的技术方案是：一种白色单面板，其包括白色油墨层、聚酰亚胺薄膜层、环氧胶层和铜箔层，所述白色油墨层、聚酰亚胺薄膜层、环氧胶层、铜箔层按照从上至下的顺序依次贴合。 In order to achieve the above purpose, the utility model provides a technical solution as follows: a white single panel, which includes a white ink layer, a polyimide film layer, an epoxy adhesive layer and a copper foil layer, the white ink layer, polyimide The imide film layer, epoxy adhesive layer, and copper foil layer are laminated in order from top to bottom.
作为本实用新型的一种改进，所述聚酰亚胺薄膜层的厚度为12.5～50微米。所述白色油墨层的厚度为13～18微米。所述环氧胶层的厚度为15～50微米。所述铜箔层的厚度为12～50微米。 As an improvement of the utility model, the thickness of the polyimide film layer is 12.5-50 microns. The thickness of the white ink layer is 13-18 microns. The thickness of the epoxy adhesive layer is 15-50 microns. The thickness of the copper foil layer is 12-50 microns.
本实用新型的有益效果为：本实用新型结构设计巧妙、合理，覆合有聚酰亚胺薄膜层，具有较佳的耐高温、耐辐射、耐化学腐蚀和电绝缘性能，综合性能好，而且同时覆合有白色油墨层，可以直接应用于LED软灯条产品，有效节能去传统下游LED企业生产LED软灯条时还需要对单面板进行丝印白色油墨和烘干等工序，大大提升生产效率，且易于加工且成本低，实用性强，利于广泛推广应用。 The beneficial effects of the utility model are: the utility model has an ingenious and reasonable structural design, covered with a polyimide film layer, has better high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance, good comprehensive performance, and At the same time, it is covered with a white ink layer, which can be directly applied to LED flexible light strip products, effectively saving energy. When traditional downstream LED companies produce LED flexible light strips, they need to screen-print white ink and dry the single panel, which greatly improves production efficiency. , and is easy to process, low in cost, strong in practicability, and conducive to wide popularization and application.
附图说明 Description of drawings
图1是本实用新型的截面结构示意图。 Fig. 1 is a schematic cross-sectional structure diagram of the utility model.
具体实施方式 Detailed ways
实施例：参见图1，本实用新型实施例提供一种白色单面板，其包括白色油墨层1、聚酰亚胺薄膜层2、环氧胶层3和铜箔层4，所述白色油墨层1、聚酰亚胺薄膜层2、环氧胶层3、铜箔层4按照从上至下的顺序依次贴合。 Embodiment: Referring to Fig. 1, the utility model embodiment provides a kind of white single panel, and it comprises white ink layer 1, polyimide film layer 2, epoxy glue layer 3 and copper foil layer 4, and described white ink layer 1. The polyimide film layer 2, the epoxy adhesive layer 3, and the copper foil layer 4 are laminated sequentially from top to bottom.
本实施例中，所述聚酰亚胺薄膜层2的厚度为12.5～50微米，优选为12.5微米、18微米、或20微米或50微米。所述白色油墨层1的厚度为13～18微米，优选为13微米、15微米或18微米。所述环氧胶层3的厚度为15～50微米，优选为18微米、20微米或50微米。所述铜箔层4的厚度为12～50微米，优选为12微米、15微米、20微米或50微米。 In this embodiment, the polyimide film layer 2 has a thickness of 12.5-50 microns, preferably 12.5 microns, 18 microns, or 20 microns or 50 microns. The thickness of the white ink layer 1 is 13-18 microns, preferably 13 microns, 15 microns or 18 microns. The thickness of the epoxy adhesive layer 3 is 15-50 microns, preferably 18 microns, 20 microns or 50 microns. The thickness of the copper foil layer 4 is 12-50 microns, preferably 12 microns, 15 microns, 20 microns or 50 microns.
使用时，由于覆合有聚酰亚胺薄膜层2，具有较佳的耐高温、耐辐射、耐化学腐蚀和电绝缘性能，综合性能好，而且同时覆合有白色油墨层1，可以直接应用于LED软灯条产品，有效节能去传统下游LED企业生产LED软灯条时还需要对单面板进行丝印白色油墨和烘干等工序，大大提升生产效率，且易于加工且成本低，实用性强。 When in use, because it is covered with polyimide film layer 2, it has better high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance, and has good comprehensive performance, and it is also covered with white ink layer 1, which can be directly applied For LED flexible light strip products, it can effectively save energy. When traditional downstream LED companies produce LED flexible light strips, they still need to screen-print white ink and dry the single panel, which greatly improves production efficiency. It is easy to process, low in cost, and strong in practicability. .
根据上述说明书的揭示和教导，本实用新型所属领域的技术人员还可以对上述实施方式进行变更和修改。因此，本实用新型并不局限于上面揭示和描述的具体实施方式，对本实用新型的一些修改和变更也应当落入本实用新型的权利要求的保护范围内。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对本实用新型构成任何限制，采用与其相同或相似的其它白色单面板，均在本实用新型保护范围内。 According to the disclosure and teaching of the above specification, those skilled in the art to which the present utility model belongs can also change and modify the above embodiment. Therefore, the utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the utility model should also fall within the scope of protection of the claims of the utility model. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present invention. The use of other same or similar white veneer is within the protection scope of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520496201.5U CN204906865U (en) | 2015-07-10 | 2015-07-10 | white single panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520496201.5U CN204906865U (en) | 2015-07-10 | 2015-07-10 | white single panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204906865U true CN204906865U (en) | 2015-12-23 |
Family
ID=54929001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520496201.5U Expired - Fee Related CN204906865U (en) | 2015-07-10 | 2015-07-10 | white single panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204906865U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106827717A (en) * | 2017-01-09 | 2017-06-13 | 三峡大学 | A kind of high dielectric property flexibility coat copper plate and preparation method thereof |
-
2015
- 2015-07-10 CN CN201520496201.5U patent/CN204906865U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106827717A (en) * | 2017-01-09 | 2017-06-13 | 三峡大学 | A kind of high dielectric property flexibility coat copper plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20180710 |