CN104754874A - Guide plate attachment method used for ultrathin FPC - Google Patents
Guide plate attachment method used for ultrathin FPC Download PDFInfo
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- CN104754874A CN104754874A CN201410775585.4A CN201410775585A CN104754874A CN 104754874 A CN104754874 A CN 104754874A CN 201410775585 A CN201410775585 A CN 201410775585A CN 104754874 A CN104754874 A CN 104754874A
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- fpc
- guide plate
- guided plate
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- plate
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Abstract
The invention provides a guide plate attachment method used for an ultrathin FPC, and belongs to a manufacturing process of the ultrathin FPC. Particularly for the sheet-to-sheet type ultrathin FPC process, base materials are cut and then drilled according to requirements, and an FPC substrate is manufactured; the length of a cutting outer frame of a guide plate is 1 cm to 10 cm larger than the length of the FPC substrate, and the width of the cutting outer frame of the guide plate is 1 cm to 2 cm larger than the width of the FPC substrate; the guide plate is milled, wherein the length of an inner frame of the guide plate is 1 cm to 2 cm larger than the length of the FPC substrate, and the width of the inner frame of the guide plate is 1 cm to 2 cm larger than the width of the FPC substrate; epoxy bonding adhesives with the thickness of 1 cm to 2 cm are pasted on the periphery of the guide plate; the substrate and the frames of the guide plate are overlapped, wherein the alignment accuracy is 0.5 mm; the substrate and the guide plate are pressed, and the frames become a part of the substrate through pressing, barking and solidifying. The guide plate is directly pasted on the substrate, the frames can be a part of the base materials, expansion, contraction and folds which are caused to the plate surface when the guide plate is repeatedly detached and pasted are reduced, the manufacturing time in the manufacturing process is shortened, and the method is suitable for FPC thin plates of any thickness.
Description
Technical field
A kind of guided plate applying method for ultra-thin FPC of the present invention belongs to ultra-thin FPC manufacture craft, especially for sheet to the ultra-thin FPC technique of chip.
Background technology
Flexible PCB is that the one made for base material with polyimides or polyester film has height reliability, excellent flexible printed circuit, is called for short soft board or FPC, has the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.
The method of single sided board is sawing sheet → boring → subsides dry film → contraposition → exposure → development → etching → demoulding → surface treatment → paste epiphragma → compacting → solidification → surface treatment → heavy nickel gold → lettering symbol → shearing → electrical measurement → die-cut → inspection → packaging → shipment at end.
The method of double sided board is sawing sheet → boring → PTH → plating → pre-treatment → subsides dry film → contraposition → exposure → development → graphic plating → demoulding → pre-treatment → subsides dry film → contraposition exposure → development → etching → demoulding → surface treatment → paste epiphragma → compacting → solidification → heavy nickel gold → lettering symbol → shearing → electrical measurement → die-cut → inspection → packaging → shipment at end.
When at the chip FPC plate of thickness of slab lower than 3mil, when crossing horizontal line (microetch, development, etching, stripping, brown, alligatoring etc.), generally can adopt and first pasting guided plate, after horizontal processing mode.Guided plate generally adopts the FR4 material of 1.0mm, and structure is divided into horizontal type (as Fig. 1) and frame-type (as Fig. 2), and adhesive glue adopts the green adhesive tape of PET.There is following shortcoming in this laminating guided plate: back and forth cross horizontal line, for several times tear subsides guided plate open, easily cause punching shear and fold, plate face is easily torn rotten simultaneously; The green adhesive tape adhesion of PET is not very strong, and easy board falling, causes horizontal line clamp; Spend in subsides guided plate oversize with the time of tearing open on guided plate, and waste of manpower; When making thickness of slab and being less than the FPC of 1.5mil, frame-type guided plate can only be used, and need stickup 2 green adhesive tapes of PET.
Summary of the invention
The object of the invention is to avoid the deficiencies in the prior art, and a kind of a kind of guided plate applying method for ultra-thin FPC be directly pasted onto by guided plate on substrate is provided.
The object of the invention is to be reached by following measures, a kind of guided plate applying method for ultra-thin FPC is:
1, FCCL base material conventional on market is selected: hole after base material sawing sheet, make FPC substrate;
2, select on market and commonly use FR4 as guided plate raw material: this FR4 thickness is 0.1-0.5mm;
3, FR4 guided plate is cut by guided plate: cut out plate housing 1-2cm longer than FPC substrate size, wide 1-2cm wider than FPC substrate size;
3, guided plate milling plate: guided plate inside casing 1-2cm less of FPC substrate size, the wide 1-2cm narrower than FPC substrate size of guided plate inside casing;
4, rubberizing: the epoxy bonds glue sticking wide 1-2cm in guided plate surrounding;
5, lamination: by substrate and guided plate framework superimposed, aligning accuracy 0.5mm;
6, pressing: by substrate and guided plate pressing, this pressing mode is that fast pressure or vacuum are pressed soon, then by plate baking-curing good for pressing, makes framework become a part for substrate.
Guided plate is directly pasted onto on substrate by the present invention, makes framework become a part for base material, reduces to tear open for several times and pastes the plate face harmomegathus and fold that guided plate causes, reduce the Production Time in manufacturing process, be applicable to the FPC thin plate of any thickness.
Accompanying drawing explanation
Accompanying drawing 1 is horizontal type guided plate schematic diagram.
Accompanying drawing 2 is frame-type guided plate schematic diagrames.
Accompanying drawing 3 is embodiments of the invention schematic diagrames.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
In figure: 1 be horizontal type guided plate, 2 be glue, 3 be FPC plate, 4 be frame-type guided plate, 5 for embroidery formula guided plate.
As shown in Figure 3, be embroidery formula FR4 guided plate, the concrete implementation step of the present invention is as follows:
select common single-side coated copper plate on market, wherein single-side coated copper plate copper thickness is 12um, and single-side coated copper plate dielectric layer is 12um polyimides.
will
middle single-side coated copper plate blanking cuts into the plate material of 250mm × 200mm.
select 0.1mmFR4(glass-epoxy common on market), cut into 260mm × 210mm plate material, this plate material milling become inside casing to be the framework of 240mm × 190mm.
will
middle frame edge pastes the wide adhesive tape of 5mm, and this adhesive tape is epoxy glue or acrylic glue.
will
with
carry out lamination, press soon, baking-curing, wherein lamination aligning accuracy is 5mm, and fast pressure is pressed or common fast pressure soon for vacuum, and baking temperature is 150 DEG C, and baking time is 90min.
by post framework thin plate alligatoring, paste dry film, exposure, development, etching, stripping, then folded diaphragm.
diaphragm pressing, this place adopts the fast press of vacuum, phase air bag face, face, FR4 face.
Claims (1)
1., for a guided plate applying method of ultra-thin FPC, it is characterized in that:
1.. select FCCL base material conventional on market: hole after base material sawing sheet, make FPC substrate;
2.. select on market and commonly use FR4 as guided plate raw material: described guided plate thickness is 0.1-0.5mm; Cut FR4 guided plate, the housing of guided plate is cut to 1-2cm longer than FPC substrate size, wide 1-2cm wider than FPC substrate size;
3.. guided plate milling plate: guided plate inside casing 1-2cm less of FPC substrate size, the wide 1-2cm narrower than FPC substrate size of guided plate inside casing;
4., rubberizing: the epoxy bonds glue sticking wide 1-2cm in guided plate surrounding;
5., lamination: by substrate and guided plate framework superimposed, aligning accuracy 0.5mm;
6., pressing: by substrate and guided plate pressing, this pressing mode is that fast pressure or vacuum are pressed soon, then by plate baking-curing good for pressing, makes framework become a part for substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775585.4A CN104754874A (en) | 2014-12-17 | 2014-12-17 | Guide plate attachment method used for ultrathin FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775585.4A CN104754874A (en) | 2014-12-17 | 2014-12-17 | Guide plate attachment method used for ultrathin FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104754874A true CN104754874A (en) | 2015-07-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410775585.4A Pending CN104754874A (en) | 2014-12-17 | 2014-12-17 | Guide plate attachment method used for ultrathin FPC |
Country Status (1)
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| CN (1) | CN104754874A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517359A (en) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | Manufacturing process for increasing utilization rate of copper substrate |
| CN109275272A (en) * | 2018-11-27 | 2019-01-25 | 景旺电子科技(龙川)有限公司 | A kind of thin pcb board processing method |
| CN113260174A (en) * | 2021-04-12 | 2021-08-13 | 深圳市景旺电子股份有限公司 | Pattern electroplating method of FPC board |
| CN114280077A (en) * | 2021-12-22 | 2022-04-05 | 江西荣晖电子有限公司 | FPC circuit board production process and device based on image processing technology |
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| CN201657504U (en) * | 2009-12-29 | 2010-11-24 | 深南电路有限公司 | Plate fixing frame |
| CN201726603U (en) * | 2010-07-16 | 2011-01-26 | 厦门弘信电子科技有限公司 | Guide plate for releasing film through developing and etching |
| CN201898666U (en) * | 2010-12-20 | 2011-07-13 | 珠海海迅软性多层板有限公司 | Horizontal line leveling guide frame for flexible printed circuit board |
| CN201937961U (en) * | 2010-12-27 | 2011-08-17 | 深圳市翔宇电路有限公司 | Developing and scrubbing auxiliary device for super thin plate |
| CN202475934U (en) * | 2012-02-16 | 2012-10-03 | 日彩电子科技(深圳)有限公司 | Inner layer thin plate structure |
| JP2013058620A (en) * | 2011-09-08 | 2013-03-28 | Hitachi Chemical Co Ltd | Manufacturing method of electronic component and fixing jig |
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2014
- 2014-12-17 CN CN201410775585.4A patent/CN104754874A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201657504U (en) * | 2009-12-29 | 2010-11-24 | 深南电路有限公司 | Plate fixing frame |
| CN201726603U (en) * | 2010-07-16 | 2011-01-26 | 厦门弘信电子科技有限公司 | Guide plate for releasing film through developing and etching |
| CN201898666U (en) * | 2010-12-20 | 2011-07-13 | 珠海海迅软性多层板有限公司 | Horizontal line leveling guide frame for flexible printed circuit board |
| CN201937961U (en) * | 2010-12-27 | 2011-08-17 | 深圳市翔宇电路有限公司 | Developing and scrubbing auxiliary device for super thin plate |
| JP2013058620A (en) * | 2011-09-08 | 2013-03-28 | Hitachi Chemical Co Ltd | Manufacturing method of electronic component and fixing jig |
| CN202475934U (en) * | 2012-02-16 | 2012-10-03 | 日彩电子科技(深圳)有限公司 | Inner layer thin plate structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517359A (en) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | Manufacturing process for increasing utilization rate of copper substrate |
| CN105517359B (en) * | 2016-01-25 | 2018-08-07 | 东莞联桥电子有限公司 | A kind of fabrication processing promoting copper base utilization rate |
| CN109275272A (en) * | 2018-11-27 | 2019-01-25 | 景旺电子科技(龙川)有限公司 | A kind of thin pcb board processing method |
| CN113260174A (en) * | 2021-04-12 | 2021-08-13 | 深圳市景旺电子股份有限公司 | Pattern electroplating method of FPC board |
| CN114280077A (en) * | 2021-12-22 | 2022-04-05 | 江西荣晖电子有限公司 | FPC circuit board production process and device based on image processing technology |
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Application publication date: 20150701 |
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