CN209517628U - A kind of rigidity is without glass photoelectricity printed board - Google Patents

A kind of rigidity is without glass photoelectricity printed board Download PDF

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Publication number
CN209517628U
CN209517628U CN201821967506.XU CN201821967506U CN209517628U CN 209517628 U CN209517628 U CN 209517628U CN 201821967506 U CN201821967506 U CN 201821967506U CN 209517628 U CN209517628 U CN 209517628U
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China
Prior art keywords
piece
glass
hole
copper
printed board
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Active
Application number
CN201821967506.XU
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Chinese (zh)
Inventor
唐宏华
陈春
林映生
卫雄
范思维
吴军权
唐殿军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou King Brother Circuit Technology Co Ltd
Shenzhen Jinbaize Electronic Technology Co Ltd
Xian King Brother Circuit Technology Co Ltd
Shenzhen King Brother Electronics Technology Co Ltd
Original Assignee
Huizhou King Brother Circuit Technology Co Ltd
Shenzhen Jinbaize Electronic Technology Co Ltd
Xian King Brother Circuit Technology Co Ltd
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Application filed by Huizhou King Brother Circuit Technology Co Ltd, Shenzhen Jinbaize Electronic Technology Co Ltd, Xian King Brother Circuit Technology Co Ltd filed Critical Huizhou King Brother Circuit Technology Co Ltd
Priority to CN201821967506.XU priority Critical patent/CN209517628U/en
Application granted granted Critical
Publication of CN209517628U publication Critical patent/CN209517628U/en
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Abstract

The utility model relates to a kind of rigidity can meet the low reflection processing request of no glass photovoltaic without the printed board of glass photoelectricity, including being stacked the first PI piece, N without glass film and the 2nd PI piece, two pieces of PI single sides cover copper, two pieces of PI pieces and without glass film preboring hole machined formed gas port, interlayer gas bubbles left can be reduced in pressing, laminating technology difficulty is reduced, yields is promoted.

Description

A kind of rigidity is without glass photoelectricity printed board
Technical field
The utility model relates to PCB manufacturing fields, more particularly to a kind of rigidity without the printed board of glass photoelectricity and its processing Method.
Background technique
Traditional rigid printed board substrate, is mainly made of reinforcing material, resin and functional filler, generally according to enhancing The difference of material can be divided into paper base, glass from fiber cloth base, composite base (CM series) and special material base (ceramics, metal core base) Etc. several major class, wherein using glass from fiber cloth base being most widely used as reinforcing material.
Glass has good endurance, electrical insulating property and dimensional stability from fiber cloth, can provide for substrate good Mechanical support power is component part most crucial in rigid printed board processing, but in certain special photovoltaic applications fields, glass Glass cloth can bring photoelectric reflection, cause signal interference, be unable to reach high-precision mass transport requirement.
Press rigid printed board processed using no glass film needs multiple compressed together since no glass film is very thin Thickness and rigid requirements are just able to satisfy, since individual is soft without glass film material, is easily adhered to each other when pre- folded and interlayer is caused to arrange Gas is difficult, and when pressing, which is also easy to produce bubble, causes lamination to be layered;And material without glass is relatively soft when will lead to machine drilling It is also easy to produce burr, influences the reliability of pore size and the connection of hole copper.
Utility model content
Existing rigid printed board substrate contains glass fabric, has stronger reflection and interference to photosignal, can not Reach the quality requirement of low reflection.For the technical problem, the utility model provides a kind of rigidity without glass photoelectricity printed board, this Utility model adopts the following technical scheme that a kind of rigidity without glass photoelectricity printed board, including is stacked the first PI piece, N nothing Glass film and the 2nd PI piece.First PI piece, the 2nd PI piece are coated with metal layer far from the end face of no glass film.First PI Piece, N up and down, form the gas port for being used for air guide, gas port is set to non-graphic area without glass film and the 2nd PI piece Domain.First PI piece, N up and down, form the through-hole of metallization, through-hole is set to graph area without glass film and the 2nd PI piece Domain.The edge without glass film and the 2nd PI piece first PI piece, N up and down, forms location hole.
Preferably, metal layer is layers of copper.After the PI piece that single side covers copper can be using the PI piece sawing sheet of existing double-sided copper-clad Etching removal wherein one is covered copper face and is made.
Further, layers of copper is provided on the hole wall of through-hole.
Further, N is not less than 13.
A kind of processing method of the rigidity without glass photoelectricity printed board, includes the following steps:
S1: two pieces of single sides are covered into copper PI piece and carry out drilling processing formation gas port, location hole;
S2: two pieces of single sides are covered into copper PI piece and carry out brownification processing;
S3: drilling processing is carried out without glass film by N and forms gas port, location hole;
S4: two pieces of single sides are covered into copper PI piece and are overlapped with no glass film, structure to be laminated is formed, passes through location hole riveted pair It is pressed together behind position;
S5: drilling for the first time is carried out in the graphics field that single side covers copper PI piece and forms through-hole;
S6: successively carrying out heavy copper for the first time and first time plate electricity, and the copper that sinks for the first time makes the via hole of through-hole, makes its table Face is covered with layers of copper, and first time plate electricity thickeies the layers of copper of covering and makes the burr on the hole wall of through-hole that hardening be electroplated simultaneously;
S7: carrying out second on through-hole and drill, the aperture of the aperture ratio first time drilling processing of second of drilling processing Big 0.1mm can remove the burr on hole wall;
S8: second of heavy copper and second of plate electricity are successively carried out, slice detection can be carried out after second of plate electricity, if on hole wall It is impulse- free robustness, then qualified without cavity;
S9: one bronze medal of plating is carried out, the copper face that covers of through-hole and PI piece is electroplated onto specified thickness;
S10: carrying out acid etching, conductive pattern be made in the copper face that covers of PI piece, subsequent to be processed by PCB common process ?.
The utility model has the following beneficial effects: 1. rigidity can meet the low of no glass photovoltaic without the printed board of glass photoelectricity Reflect processing request.
2. covering copper PI piece in single side and forming gas port without glass film preboring hole machined, interlayer can be reduced in pressing Gas bubbles left reduces laminating technology difficulty, promotes yields.
3. secondary drilling burr removal technology is effectively improved hole inner burr, the reliability of hole copper connection is improved.
Detailed description of the invention
The utility model is described in further detail for attached drawing, but the embodiment in attached drawing is not constituted to any of the utility model Limitation.
Fig. 1 provides rigid without glass photoelectricity printed board schematic for an embodiment of the present invention.
Fig. 2 is top end face schematic diagram of the rigidity without glass photoelectricity printed board that an embodiment of the present invention provides.
Fig. 3 is manufacturing flow chart of the rigidity without glass photoelectricity printed board that an embodiment of the present invention provides.
Specific embodiment
It should be appreciated that specific embodiment described herein is only used to explain the utility model, it is not used to limit this Utility model.
As shown in figs. 1-2, a kind of rigidity that an embodiment of the present invention provides is without glass photoelectricity printed board, including layer First PI piece b of folded setting, 13 without glass film c and the 2nd PI piece.First PI piece a, the 2nd PI piece are far from no glass film End face be coated with copper foil layer a.First PI piece a, without glass film c and the 2nd PI piece up and down, form leading for air guide Stomata e, gas port are set to non-graphic region.First PI piece, N up and down, form gold without glass film and the 2nd PI piece The through-hole d of categoryization, through-hole d are set to graphics field.First PI piece b, the edge without glass film c and the 2nd PI piece pass through up and down It is logical, form location hole f.Preceding first PI piece b and the 2nd PI piece are pressed with a thickness of 0.05mm, no glass film c with a thickness of 1.0mm, copper foil layer with a thickness of 0.5OZ, rigidly without glass photoelectricity printed board with a thickness of 1.1mm~1.2mm after pressing.
As shown in figure 3, a kind of processing method of rigidity without glass photoelectricity printed board, includes the following steps:
S1: two pieces of conventional double-sided copper-clad PI pieces are subjected to sawing sheet and single side etches the PI that single side is made after removing layers of copper and covers copper Two pieces of single sides are covered copper PI piece and carry out drilling processing formation gas port e, location hole f by piece;
S2: two pieces of single sides are covered into copper PI piece and carry out brownification processing;
S3: drilling processing is carried out without glass film c by 13 and forms gas port e, location hole f;
S4: two pieces of single sides are covered into copper PI piece and are overlapped with no glass film c, structure to be laminated is formed, passes through location hole f riveted Hot pressing is carried out after contraposition;
S5: drilling for the first time is carried out in the graphics field that single side covers copper PI piece and forms through-hole d;
S6: successively carrying out heavy copper for the first time and first time plate electricity, and the copper that sinks for the first time makes the via hole of through-hole d, makes it Surface is covered with layers of copper, and first time plate electricity thickeies the layers of copper of covering and makes the burr on the hole wall of through-hole d that hardening be electroplated simultaneously;
S7: carrying out second on through-hole d and drill, the aperture of the aperture ratio first time drilling processing of second of drilling processing Big 0.1mm can remove the burr on hole wall;
S8: second of heavy copper and second of plate electricity are successively carried out;
S9: carrying out one bronze medal of plating, and the copper face plating of covering of through-hole d and PI piece is thickeied;
S10: carrying out acid etching, conductive pattern be made in the copper face that covers of PI piece, subsequent to be processed by PCB common process ?.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.

Claims (4)

1. a kind of rigidity is without glass photoelectricity printed board, it is characterised in that:
Including being stacked the first PI piece, N without glass film and the 2nd PI piece;
The first PI piece, the 2nd PI piece are coated with metal layer far from the end face of the no glass film;
The first PI piece, N up and down, form the gas port for being used for air guide without glass film and the 2nd PI piece, described to lead Stomata is set to non-graphic region;
The first PI piece, N up and down, form the through-hole of metallization, the through-hole is set without glass film and the 2nd PI piece It is placed in graphics field;
The edge without glass film and the 2nd PI piece the first PI piece, N up and down, forms location hole.
2. rigidity is without glass photoelectricity printed board according to claim 1, it is characterised in that: the metal layer is layers of copper.
3. rigidity is without glass photoelectricity printed board according to claim 1, it is characterised in that: be provided on the hole wall of the through-hole Layers of copper.
4. rigidity is without glass photoelectricity printed board according to claim 1, it is characterised in that: the N is not less than 13.
CN201821967506.XU 2018-11-27 2018-11-27 A kind of rigidity is without glass photoelectricity printed board Active CN209517628U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821967506.XU CN209517628U (en) 2018-11-27 2018-11-27 A kind of rigidity is without glass photoelectricity printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821967506.XU CN209517628U (en) 2018-11-27 2018-11-27 A kind of rigidity is without glass photoelectricity printed board

Publications (1)

Publication Number Publication Date
CN209517628U true CN209517628U (en) 2019-10-18

Family

ID=68190495

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821967506.XU Active CN209517628U (en) 2018-11-27 2018-11-27 A kind of rigidity is without glass photoelectricity printed board

Country Status (1)

Country Link
CN (1) CN209517628U (en)

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