CN209517628U - A kind of rigidity is without glass photoelectricity printed board - Google Patents
A kind of rigidity is without glass photoelectricity printed board Download PDFInfo
- Publication number
- CN209517628U CN209517628U CN201821967506.XU CN201821967506U CN209517628U CN 209517628 U CN209517628 U CN 209517628U CN 201821967506 U CN201821967506 U CN 201821967506U CN 209517628 U CN209517628 U CN 209517628U
- Authority
- CN
- China
- Prior art keywords
- piece
- glass
- printed board
- copper
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 239000011521 glass Substances 0.000 title claims abstract description 53
- 230000005622 photoelectricity Effects 0.000 title claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000011229 interlayer Substances 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 230000005611 electricity Effects 0.000 description 7
- 239000004744 fabric Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012767 functional filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Abstract
The utility model relates to a kind of rigidity can meet the low reflection processing request of no glass photovoltaic without the printed board of glass photoelectricity, including being stacked the first PI piece, N without glass film and the 2nd PI piece, two pieces of PI single sides cover copper, two pieces of PI pieces and without glass film preboring hole machined formed gas port, interlayer gas bubbles left can be reduced in pressing, laminating technology difficulty is reduced, yields is promoted.
Description
Technical field
The utility model relates to PCB manufacturing fields, more particularly to a kind of rigidity without the printed board of glass photoelectricity and its processing
Method.
Background technique
Traditional rigid printed board substrate, is mainly made of reinforcing material, resin and functional filler, generally according to enhancing
The difference of material can be divided into paper base, glass from fiber cloth base, composite base (CM series) and special material base (ceramics, metal core base)
Etc. several major class, wherein using glass from fiber cloth base being most widely used as reinforcing material.
Glass has good endurance, electrical insulating property and dimensional stability from fiber cloth, can provide for substrate good
Mechanical support power is component part most crucial in rigid printed board processing, but in certain special photovoltaic applications fields, glass
Glass cloth can bring photoelectric reflection, cause signal interference, be unable to reach high-precision mass transport requirement.
Press rigid printed board processed using no glass film needs multiple compressed together since no glass film is very thin
Thickness and rigid requirements are just able to satisfy, since individual is soft without glass film material, is easily adhered to each other when pre- folded and interlayer is caused to arrange
Gas is difficult, and when pressing, which is also easy to produce bubble, causes lamination to be layered；And material without glass is relatively soft when will lead to machine drilling
It is also easy to produce burr, influences the reliability of pore size and the connection of hole copper.
Utility model content
Existing rigid printed board substrate contains glass fabric, has stronger reflection and interference to photosignal, can not
Reach the quality requirement of low reflection.For the technical problem, the utility model provides a kind of rigidity without glass photoelectricity printed board, this
Utility model adopts the following technical scheme that a kind of rigidity without glass photoelectricity printed board, including is stacked the first PI piece, N nothing
Glass film and the 2nd PI piece.First PI piece, the 2nd PI piece are coated with metal layer far from the end face of no glass film.First PI
Piece, N up and down, form the gas port for being used for air guide, gas port is set to non-graphic area without glass film and the 2nd PI piece
Domain.First PI piece, N up and down, form the through-hole of metallization, through-hole is set to graph area without glass film and the 2nd PI piece
Domain.The edge without glass film and the 2nd PI piece first PI piece, N up and down, forms location hole.
Preferably, metal layer is layers of copper.After the PI piece that single side covers copper can be using the PI piece sawing sheet of existing double-sided copper-clad
Etching removal wherein one is covered copper face and is made.
Further, layers of copper is provided on the hole wall of through-hole.
Further, N is not less than 13.
A kind of processing method of the rigidity without glass photoelectricity printed board, includes the following steps:
S1: two pieces of single sides are covered into copper PI piece and carry out drilling processing formation gas port, location hole；
S2: two pieces of single sides are covered into copper PI piece and carry out brownification processing；
S3: drilling processing is carried out without glass film by N and forms gas port, location hole；
S4: two pieces of single sides are covered into copper PI piece and are overlapped with no glass film, structure to be laminated is formed, passes through location hole riveted pair
It is pressed together behind position；
S5: drilling for the first time is carried out in the graphics field that single side covers copper PI piece and forms through-hole；
S6: successively carrying out heavy copper for the first time and first time plate electricity, and the copper that sinks for the first time makes the via hole of through-hole, makes its table
Face is covered with layers of copper, and first time plate electricity thickeies the layers of copper of covering and makes the burr on the hole wall of through-hole that hardening be electroplated simultaneously；
S7: carrying out second on through-hole and drill, the aperture of the aperture ratio first time drilling processing of second of drilling processing
Big 0.1mm can remove the burr on hole wall；
S8: second of heavy copper and second of plate electricity are successively carried out, slice detection can be carried out after second of plate electricity, if on hole wall
It is impulse- free robustness, then qualified without cavity；
S9: one bronze medal of plating is carried out, the copper face that covers of through-hole and PI piece is electroplated onto specified thickness；
S10: carrying out acid etching, conductive pattern be made in the copper face that covers of PI piece, subsequent to be processed by PCB common process
?.
The utility model has the following beneficial effects: 1. rigidity can meet the low of no glass photovoltaic without the printed board of glass photoelectricity
Reflect processing request.
2. covering copper PI piece in single side and forming gas port without glass film preboring hole machined, interlayer can be reduced in pressing
Gas bubbles left reduces laminating technology difficulty, promotes yields.
3. secondary drilling burr removal technology is effectively improved hole inner burr, the reliability of hole copper connection is improved.
Detailed description of the invention
The utility model is described in further detail for attached drawing, but the embodiment in attached drawing is not constituted to any of the utility model
Limitation.
Fig. 1 provides rigid without glass photoelectricity printed board schematic for an embodiment of the present invention.
Fig. 2 is top end face schematic diagram of the rigidity without glass photoelectricity printed board that an embodiment of the present invention provides.
Fig. 3 is manufacturing flow chart of the rigidity without glass photoelectricity printed board that an embodiment of the present invention provides.
Specific embodiment
It should be appreciated that specific embodiment described herein is only used to explain the utility model, it is not used to limit this
Utility model.
As shown in figs. 1-2, a kind of rigidity that an embodiment of the present invention provides is without glass photoelectricity printed board, including layer
First PI piece b of folded setting, 13 without glass film c and the 2nd PI piece.First PI piece a, the 2nd PI piece are far from no glass film
End face be coated with copper foil layer a.First PI piece a, without glass film c and the 2nd PI piece up and down, form leading for air guide
Stomata e, gas port are set to non-graphic region.First PI piece, N up and down, form gold without glass film and the 2nd PI piece
The through-hole d of categoryization, through-hole d are set to graphics field.First PI piece b, the edge without glass film c and the 2nd PI piece pass through up and down
It is logical, form location hole f.Preceding first PI piece b and the 2nd PI piece are pressed with a thickness of 0.05mm, no glass film c with a thickness of
1.0mm, copper foil layer with a thickness of 0.5OZ, rigidly without glass photoelectricity printed board with a thickness of 1.1mm~1.2mm after pressing.
As shown in figure 3, a kind of processing method of rigidity without glass photoelectricity printed board, includes the following steps:
S1: two pieces of conventional double-sided copper-clad PI pieces are subjected to sawing sheet and single side etches the PI that single side is made after removing layers of copper and covers copper
Two pieces of single sides are covered copper PI piece and carry out drilling processing formation gas port e, location hole f by piece；
S2: two pieces of single sides are covered into copper PI piece and carry out brownification processing；
S3: drilling processing is carried out without glass film c by 13 and forms gas port e, location hole f；
S4: two pieces of single sides are covered into copper PI piece and are overlapped with no glass film c, structure to be laminated is formed, passes through location hole f riveted
Hot pressing is carried out after contraposition；
S5: drilling for the first time is carried out in the graphics field that single side covers copper PI piece and forms through-hole d；
S6: successively carrying out heavy copper for the first time and first time plate electricity, and the copper that sinks for the first time makes the via hole of through-hole d, makes it
Surface is covered with layers of copper, and first time plate electricity thickeies the layers of copper of covering and makes the burr on the hole wall of through-hole d that hardening be electroplated simultaneously；
S7: carrying out second on through-hole d and drill, the aperture of the aperture ratio first time drilling processing of second of drilling processing
Big 0.1mm can remove the burr on hole wall；
S8: second of heavy copper and second of plate electricity are successively carried out；
S9: carrying out one bronze medal of plating, and the copper face plating of covering of through-hole d and PI piece is thickeied；
S10: carrying out acid etching, conductive pattern be made in the copper face that covers of PI piece, subsequent to be processed by PCB common process
?.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (4)
1. a kind of rigidity is without glass photoelectricity printed board, it is characterised in that:
Including being stacked the first PI piece, N without glass film and the 2nd PI piece；
The first PI piece, the 2nd PI piece are coated with metal layer far from the end face of the no glass film；
The first PI piece, N up and down, form the gas port for being used for air guide without glass film and the 2nd PI piece, described to lead
Stomata is set to non-graphic region；
The first PI piece, N up and down, form the through-hole of metallization, the through-hole is set without glass film and the 2nd PI piece
It is placed in graphics field；
The edge without glass film and the 2nd PI piece the first PI piece, N up and down, forms location hole.
2. rigidity is without glass photoelectricity printed board according to claim 1, it is characterised in that: the metal layer is layers of copper.
3. rigidity is without glass photoelectricity printed board according to claim 1, it is characterised in that: be provided on the hole wall of the through-hole
Layers of copper.
4. rigidity is without glass photoelectricity printed board according to claim 1, it is characterised in that: the N is not less than 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821967506.XU CN209517628U (en) | 2018-11-27 | 2018-11-27 | A kind of rigidity is without glass photoelectricity printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821967506.XU CN209517628U (en) | 2018-11-27 | 2018-11-27 | A kind of rigidity is without glass photoelectricity printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517628U true CN209517628U (en) | 2019-10-18 |
Family
ID=68190495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821967506.XU Withdrawn - After Issue CN209517628U (en) | 2018-11-27 | 2018-11-27 | A kind of rigidity is without glass photoelectricity printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209517628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526138A (en) * | 2018-11-27 | 2019-03-26 | 惠州市金百泽电路科技有限公司 | A kind of rigidity is without the printed board of glass photoelectricity and its processing method |
-
2018
- 2018-11-27 CN CN201821967506.XU patent/CN209517628U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526138A (en) * | 2018-11-27 | 2019-03-26 | 惠州市金百泽电路科技有限公司 | A kind of rigidity is without the printed board of glass photoelectricity and its processing method |
| CN109526138B (en) * | 2018-11-27 | 2024-04-12 | 惠州市金百泽电路科技有限公司 | Rigid glass fiber-free photoelectric printed board and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20191018 Effective date of abandoning: 20240412 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20191018 Effective date of abandoning: 20240412 |