CN107548244A - The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based - Google Patents

The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based Download PDF

Info

Publication number
CN107548244A
CN107548244A CN201710761051.XA CN201710761051A CN107548244A CN 107548244 A CN107548244 A CN 107548244A CN 201710761051 A CN201710761051 A CN 201710761051A CN 107548244 A CN107548244 A CN 107548244A
Authority
CN
China
Prior art keywords
copper
base
insulated
sided sandwich
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710761051.XA
Other languages
Chinese (zh)
Other versions
CN107548244B (en
Inventor
李仁荣
李秋梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kinwong Electronic Technology Longchuan Co Ltd
Original Assignee
Kinwong Electronic Technology Longchuan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinwong Electronic Technology Longchuan Co Ltd filed Critical Kinwong Electronic Technology Longchuan Co Ltd
Priority to CN201710761051.XA priority Critical patent/CN107548244B/en
Publication of CN107548244A publication Critical patent/CN107548244A/en
Application granted granted Critical
Publication of CN107548244B publication Critical patent/CN107548244B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The preparation method to be insulated between a kind of two-sided sandwich copper base inside of present invention offer is copper-based, is related to metal-base printed wiring board production field.The preparation method to be insulated between two-sided sandwich copper base inside is copper-based comprises the following steps:S1:It is the copper-based of 0.2mm first to take thickness, and copper-based one side presses 40um dielectric layers and HOZ copper foils.S2:Using realizing that the ready film is etched to copper-based another side, using etching method produce it is copper-based between gap.S3:Silk-screen insulating resin and solidification is pressed in copper-based gap blind slot.S4:The residue of polishing grinding copper-based surfaces is carried out using abrasive band.Inside the two-sided sandwich copper base it is copper-based between the preparation method that insulate solve the problems, such as the two-sided battenboard manufacture craft of tradition can not realize it is internal it is multiple it is copper-based between mutually insulated, meet consumer product design requirement, improve production efficiency and two-sided sandwich copper base makes quality.

Description

The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based
Technical field
The present invention relates to metal-base printed wiring board manufacture technology field, specially a kind of two-sided sandwich copper base internal copper The preparation method to be insulated between base.
Background technology
Metal-base printed wiring board is a kind of special printed wiring board, be widely used in household electrical appliances, automobile, aviation, medical treatment, The various fields such as military affairs.Metal base printed circuit board includes single sided board, single-surface double-layer plate, single-side multi-layer plate, two-sided battenboard etc., The preparation method for mainly illustrating two-sided sandwich copper base herein.
The two-sided sandwich copper base fabrication processing of tradition is copper-based sawing sheet → brill insulated hole → gong insulation tank → mill burr → filling holes with resin/groove → pressing solidifies → cuts excessive glue → brown → pressing two sides dielectric layer and copper foil → X-ray target practices → milling side → bore edge PTH hole → sink copper plate electric → outer-layer circuit → anti-welding → character → surface treatment → shaping → board-washing → FQC → FQA → bag Goods is taken on, it is not interlaced that insulated hole and insulated hole made by gong insulation tank processing procedure and insulation tank type are bored in this flow It is netted, form crisscross network structure containing the gap that multiple mutually insulateds are copper-based and insulated between them for internal Can not be made for product because copper-based first CNC gongs go out it is each it is copper-based between clearance for insulation after copper-based be just scattered as single Block copper can not carry out filling in resin and the making of processing procedure below again.
The content of the invention
(1) technical problem solved
In view of the shortcomings of the prior art, the invention provides the system that a kind of two-sided sandwich copper base inside is insulated between copper-based Make method, solve in the prior art flow mentioned in background technology because copper-based first CNC gongs go out it is each it is copper-based between insulation Copper-based be just scattered can not carry out filling in resin and the problem of the making of processing procedure below again as monolithic copper behind gap.
(2) technical scheme
To realize object above, the present invention is achieved by the following technical programs:Inside a kind of two-sided sandwich copper base The preparation method to be insulated between copper-based comprises the following steps:
S1:It is the copper-based of 0.2mm first to take thickness, and copper-based one side presses 40um dielectric layers and HOZ copper foils.
S2:Using realizing that the ready film is etched to copper-based another side, using etching method produce it is copper-based it Between gap.
S3:Silk-screen insulating resin and solidification is pressed in copper-based gap blind slot.
S4:The residue of polishing grinding copper-based surfaces is carried out using abrasive band, due to meeting during silk-screen resin in copper-based facet etch groove Some resins are remained in copper-based surfaces, so cull need to be fallen with amary tape grinding machine film to ensure the flatness in copper-based face and cleaning Degree.
S5:In copper-based another side pressing 40um dielectric layers and HOZ copper foils, resin and ground one side copper base are stoppered Doing brown increases copper-based face and pressing PP adhesion, then closes 40um PP and HOZ copper foils, pressure in the copper-based face pressure of plug resin Edges of boards unnecessary PP and copper foil are dismissed after conjunction, obtains the copper-based copper-clad plate of two-sided sandwich.
S6:The copper-based copper-clad plate of the two-sided sandwich of dielectric layer and copper foil has been pressed to be drilled on two sides, sink copper plate electric, outer layer line The old process such as road, anti-welding, surface treatment, shaping makes, and can obtain the copper-based printing of two-sided sandwich of internal copper-based mutually insulated Wiring board.
Preferably, the operating process of the S1 steps includes:
A1:Size sawing sheet on request first copper-based to 0.2mm.
A2:Copper-based surface is wiped using adhesive-bonded fabric nog plate, dispels the dirt and debris for being bonded at copper-based surfaces.
A3:It is copper-based to do brown enhancing and pressing PP adhesion, 40um PP and HOZ copper foils are pressed, dismiss the unnecessary PP of edges of boards And copper foil.
Preferably, the operating process of the S2 includes:
B1:First according to product requirement design it is copper-based between the etching gaps film, the copper-based gap width of client's original copy is 0.25mm, film design 0.15mm.
B2:Then the one side copper base for simultaneously having pressed dielectric layer and copper foil is done into the copper-based face brown of dry film pre-treatment microetch Layer, rear two sides patch dry film.
B3:Copper base is dried after pad pasting, and by the copper-based face after drying with designed film aligning Exposure imaging, etching wear it is copper-based expose dielectric layer, copper-based gap bottom width control is on 0.25 ± 0.02mm scopes, top during etching Portion's spacing≤0.4mm.
Preferably, the operating process of the S3 is as follows:The copper-based one side copper base for having etched gap is done into brown increase Copper-based side wall and the adhesion of resin in etching groove, silk-screen insulating resin and solidification is pressed in copper-based etching groove with half tone.
(3) beneficial effect
The invention provides the preparation method that a kind of two-sided sandwich copper base inside is insulated between copper-based.This method it is beneficial Effect is:
1st, presently disclosed method is by elder generation after copper-based first face pressure closes dielectric layer and copper foil, then from copper-based another Face toward dielectric layer etching wear it is copper-based between interstitial site, then etch it is copper-based between gap insulating resin beyond the Great Wall, Dielectric layer and copper foil finally are closed in copper-based plug resin face pressure, forms the copper-based plate of double-sided copper-clad, this slab interior is copper-based to be exactly The independent individual of mutually insulated, realize it is copper-based inside two-sided sandwich copper base between insulation, compared with prior art, this hair It is bright solve the problems, such as the two-sided battenboard manufacture craft of tradition can not realize it is internal it is multiple it is copper-based between mutually insulated, meet client Product design requirement, improves production efficiency and two-sided sandwich copper base makes quality.
Brief description of the drawings
Fig. 1 is flow chart of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made Embodiment, belong to the scope of protection of the invention.
The preparation method to be insulated between a kind of two-sided sandwich copper base inside of offer of the embodiment of the present invention is copper-based, such as Fig. 1 institutes Show, comprise the following steps:
S1:It is the copper-based of 0.2mm first to take thickness, and copper-based one side presses 40um dielectric layers and HOZ copper foils.The behaviour of S1 steps Include as flow:
A1:Size sawing sheet on request first copper-based to 0.2mm, more technological requirement by it is copper-based be fabricated to required for shape and Size.
A2:Copper-based surface is wiped using adhesive-bonded fabric nog plate, dispels the dirt and debris for being bonded at copper-based surfaces, if To there is impurity and dirt to be attached to copper-based surface and can then influence copper-based follow-up process, cause production be molded after Flaw be present, product is unqualified caused by, it is therefore desirable to which careful wipes to copper-based surfaces.
A3:It is copper-based to do brown enhancing and pressing PP adhesion, 40um PP and HOZ copper foils are pressed, dismiss the unnecessary PP of edges of boards And copper foil, when internal layer copper foil surface generation layer of oxide layer is to lift multilayer circuit board in pressing between copper foil and epoxy resin Engaging force, copper foil and medium are then pressed into copper-based surfaces, prepared by PP is by propylene polymerization a kind of thermoplastic resin, With relatively low heat distortion temperature (100 DEG C), low transparency, low-luster, low rigidity, but there is stronger impact strength, The characteristics of PP impact strength increases with the increase of ethylene contents.
S2:Using realizing that the ready film is etched to copper-based another side, using etching method produce it is copper-based it Between gap.S2 operating process includes:
B1:First according to product requirement design it is copper-based between the etching gaps film, the copper-based gap width of client's original copy is 0.25mm, film design 0.15mm.
B2:Then the one side copper base for simultaneously having pressed dielectric layer and copper foil is done into the copper-based face brown of dry film pre-treatment microetch Layer, rear two sides patch dry film, form moisture film, so as to improve the flowing of dry film before dry film is pasted using special laminator in copper foil surface Property, and the bubble that cut, sand holes, pit and fabric depression etc. are detained on position can be driven away, while can also increase dry film with Copper-based adhesiveness.
B3:Copper base is dried after pad pasting, and by the copper-based face after drying with designed film aligning Exposure imaging, etching wear it is copper-based expose dielectric layer, copper-based gap bottom width control is on 0.25 ± 0.02mm scopes, top during etching Portion's spacing≤0.4mm, using etching method, so as to the copper-based gap obtained required for the formation on copper-based face.
S3:Silk-screen insulating resin and solidification is pressed in copper-based gap blind slot.S3 operating process is as follows:Lost copper-based The one side copper base for carving gap does copper-based side wall and the adhesion of resin in brown increase etching groove, with half tone in copper-based etching Silk-screen insulating resin and solidification is pressed in groove.
S4:The residue of polishing grinding copper-based surfaces is carried out using abrasive band, due to meeting during silk-screen resin in copper-based facet etch groove Some resins are remained in copper-based surfaces, so cull need to be fallen with amary tape grinding machine film to ensure the flatness in copper-based face and cleaning Degree.
S5:In copper-based another side pressing 40um dielectric layers and HOZ copper foils, resin and ground one side copper base are stoppered Doing brown increases copper-based face and pressing PP adhesion, then closes 40um PP and HOZ copper foils, pressure in the copper-based face pressure of plug resin Edges of boards unnecessary PP and copper foil are dismissed after conjunction, obtains the copper-based copper-clad plate of two-sided sandwich.
S6:The copper-based copper-clad plate of the two-sided sandwich of dielectric layer and copper foil has been pressed to be drilled on two sides, sink copper plate electric, outer layer line The old process such as road, anti-welding, surface treatment, shaping makes, and can obtain the copper-based printing of two-sided sandwich of internal copper-based mutually insulated Wiring board.
In summary, the preparation method to be insulated between two-sided sandwich copper base inside is copper-based is copper-based first by elder generation After face pressure closes dielectric layer and copper foil, then wear from copper-based another side toward dielectric layer etching it is copper-based between interstitial site, then losing Carve it is copper-based between gap insulating resin beyond the Great Wall, finally close dielectric layer and copper foil in copper-based plug resin face pressure, formed two-sided Cover the copper-based plate of copper, this slab interior is copper-based be exactly mutually insulated independent individual, realize inside two-sided sandwich copper base Insulation between copper-based, solve tradition two-sided battenboard manufacture craft can not realize it is internal it is multiple it is copper-based between mutually insulated Problem, meet consumer product design requirement, improve production efficiency and two-sided sandwich copper base makes quality.
It should be noted that herein, term " comprising ", "comprising" or its any other variant are intended to non-row His property includes, so that process, method, article or equipment including a series of elements not only include those key elements, and And also include the other element being not expressly set out, or also include for this process, method, article or equipment institute inherently Key element.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (4)

  1. A kind of 1. preparation method to be insulated between copper-based inside two-sided sandwich copper base, it is characterised in that:Comprise the following steps:
    S1:It is the copper-based of 0.2mm first to take thickness, and copper-based one side presses 40um dielectric layers and HOZ copper foils.
    S2:Using realizing that the ready film is etched to copper-based another side, using etching method produce it is copper-based between Gap.
    S3:Silk-screen insulating resin and solidification is pressed in copper-based gap blind slot.
    S4:The residue of polishing grinding copper-based surfaces is carried out using abrasive band, due to can be in copper during silk-screen resin in copper-based facet etch groove Primary surface remains some resins, so need to fall cull with amary tape grinding machine film to ensure the flatness in copper-based face and cleanliness factor.
    S5:In copper-based another side pressing 40um dielectric layers and HOZ copper foils, it is stoppered resin and ground one side copper base does palm fibre Changing increases copper-based face and pressing PP adhesion, then 40um PP and HOZ copper foils is closed in the copper-based face pressure of plug resin, after pressing Edges of boards unnecessary PP and copper foil are dismissed, obtains the copper-based copper-clad plate of two-sided sandwich.
    S6:Pressed the copper-based copper-clad plate of the two-sided sandwich of dielectric layer and copper foil to be drilled on two sides, sink copper plate electric, outer-layer circuit, The old process such as anti-welding, surface treatment, shaping make, and can obtain the copper-based printed wiring of two-sided sandwich of internal copper-based mutually insulated Plate.
  2. 2. the preparation method to be insulated between copper-based inside a kind of two-sided sandwich copper base according to claim 1, its feature It is:The operating process of the S1 steps includes:
    A1:Size sawing sheet on request first copper-based to 0.2mm.
    A2:Copper-based surface is wiped using adhesive-bonded fabric nog plate, dispels the dirt and debris for being bonded at copper-based surfaces.
    A3:It is copper-based to do brown enhancing and pressing PP adhesion, 40um PP and HOZ copper foils are pressed, dismiss the unnecessary PP of edges of boards and copper Paper tinsel.
  3. 3. the preparation method to be insulated between copper-based inside a kind of two-sided sandwich copper base according to claim 1, its feature It is:The operating process of the S2 includes:
    B1:First according to product requirement design it is copper-based between the etching gaps film, the copper-based gap width of client's original copy be 0.25mm, phenanthrene Woods designs 0.15mm.
    B2:Then by the one side copper base for simultaneously having pressed dielectric layer and copper foil do the copper-based face brown layer of dry film pre-treatment microetch, Two sides patch dry film afterwards.
    B3:Copper base is dried after pad pasting, and the copper-based face after drying is exposed with designed film aligning Development, etching wear it is copper-based expose dielectric layer, copper-based gap bottom width control is between 0.25 ± 0.02mm scopes, top during etching Away from≤0.4mm.
  4. 4. the preparation method to be insulated between copper-based inside a kind of two-sided sandwich copper base according to claim 1, its feature It is:The operating process of the S3 is as follows:The copper-based one side copper base for having etched gap is done into brown increase etching buried copper The adhesion of base side wall and resin, silk-screen insulating resin and solidification is pressed in copper-based etching groove with half tone.
CN201710761051.XA 2017-08-30 2017-08-30 Manufacturing method for insulation between copper bases in double-sided sandwich copper substrate Active CN107548244B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710761051.XA CN107548244B (en) 2017-08-30 2017-08-30 Manufacturing method for insulation between copper bases in double-sided sandwich copper substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710761051.XA CN107548244B (en) 2017-08-30 2017-08-30 Manufacturing method for insulation between copper bases in double-sided sandwich copper substrate

Publications (2)

Publication Number Publication Date
CN107548244A true CN107548244A (en) 2018-01-05
CN107548244B CN107548244B (en) 2020-02-28

Family

ID=60958398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710761051.XA Active CN107548244B (en) 2017-08-30 2017-08-30 Manufacturing method for insulation between copper bases in double-sided sandwich copper substrate

Country Status (1)

Country Link
CN (1) CN107548244B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108419373A (en) * 2018-05-14 2018-08-17 深圳市深联电路有限公司 A kind of copper-based board manufacturing method for New-energy electric vehicle BMS protections
CN108419372A (en) * 2018-05-14 2018-08-17 深圳市深联电路有限公司 A kind of new-energy automobile power battery test system current-carrying board manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA927011A (en) * 1968-08-16 1973-05-22 The Bunker-Ramo Corporation Coaxial interconnections
BE822462A (en) * 1973-11-21 1975-03-14 PROCESS FOR MAKING PRINTED CIRCUIT BOARDS
CN1462088A (en) * 2001-07-05 2003-12-17 松下电器产业株式会社 Manufacturing method of radio circuit and radio circuit
CN1476290A (en) * 2002-06-27 2004-02-18 日本特殊陶业株式会社 Multi-layer wiring boark, and its mfg. method and substrate material
CN1757111A (en) * 2003-03-11 2006-04-05 古河电气工业株式会社 Printed wiring board, method for manufacturing same, lead frame package and optical module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA927011A (en) * 1968-08-16 1973-05-22 The Bunker-Ramo Corporation Coaxial interconnections
BE822462A (en) * 1973-11-21 1975-03-14 PROCESS FOR MAKING PRINTED CIRCUIT BOARDS
CN1462088A (en) * 2001-07-05 2003-12-17 松下电器产业株式会社 Manufacturing method of radio circuit and radio circuit
CN1476290A (en) * 2002-06-27 2004-02-18 日本特殊陶业株式会社 Multi-layer wiring boark, and its mfg. method and substrate material
CN1757111A (en) * 2003-03-11 2006-04-05 古河电气工业株式会社 Printed wiring board, method for manufacturing same, lead frame package and optical module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108419373A (en) * 2018-05-14 2018-08-17 深圳市深联电路有限公司 A kind of copper-based board manufacturing method for New-energy electric vehicle BMS protections
CN108419372A (en) * 2018-05-14 2018-08-17 深圳市深联电路有限公司 A kind of new-energy automobile power battery test system current-carrying board manufacturing method
CN108419373B (en) * 2018-05-14 2020-08-28 深圳市深联电路有限公司 Copper substrate manufacturing method for BMS protection of new energy electric vehicle

Also Published As

Publication number Publication date
CN107548244B (en) 2020-02-28

Similar Documents

Publication Publication Date Title
CN103648240B (en) A kind of preparation method of symmetric form rigid-flex combined board
CN103458628B (en) Multilayer circuit board and making method thereof
CN107241876B (en) A kind of no core plate single side is sunken cord the processing method of printed circuit board
CN104582325A (en) Rigid-flex printed circuit board and manufacturing method thereof as well as circuit board module
CN104717840B (en) Circuit board manufacturing method and circuit board
CN104394643B (en) Non-layered rigid-flex board and preparation method thereof
CN102281725A (en) Manufacturing method for circuit board
CN102811567A (en) Flexible and rigid combined plate process and uncapping method
CN110881241A (en) High-frequency low-loss glue-layer-free FPC and production process thereof
CN107548244A (en) The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based
CN104349613A (en) PCB (Printed Circuit Board) and manufacturing method thereof
CN107241875A (en) A kind of manufacture method of two-sided printed board of sunkening cord
CN106332438A (en) Rigid and flexible circuit board and manufacturing method thereof
CN103781283A (en) Circuit-board manufacturing method
CN106211638A (en) A kind of processing method of ultra-thin multilayer printed circuit board
CN110740564B (en) Processing method of dense network multilayer printed circuit board
JP2005191549A (en) Module with built-in components manufacturing method and module with built-in components
CN108934130A (en) The manufacturing method of rigid-flexible circuit board
CN101534613B (en) Method for manufacturing circuit board with offset structure
CN103298274A (en) Manufacturing method for capacitor-buried printed-circuit board and capacitor-buried printed-circuit board
WO2018163859A1 (en) Multi-layer substrate, electronic apparatus, and method for producing multi-layer substrate
CN211240255U (en) High-frequency low-loss glue-layer-free FPC
CN104981097B (en) The processing method and golden finger circuit board of golden finger
CN104768318B (en) Rigid-flexible circuit board and preparation method thereof
TW200922429A (en) Structure and manufacturing method of (with embedded component) multilayer circuit board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant