CN201501140U - Prepreg with resin beds of asymmetric thicknesses - Google Patents
Prepreg with resin beds of asymmetric thicknesses Download PDFInfo
- Publication number
- CN201501140U CN201501140U CN2009202047990U CN200920204799U CN201501140U CN 201501140 U CN201501140 U CN 201501140U CN 2009202047990 U CN2009202047990 U CN 2009202047990U CN 200920204799 U CN200920204799 U CN 200920204799U CN 201501140 U CN201501140 U CN 201501140U
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- prepreg
- resin
- resin bed
- thickness
- asymmetric
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a prepreg with resin beds with asymmetric thickness, which comprises a reinforcing material layer, a first resin bed and a second resin bed, wherein the first resin bed and the second resin bed are respectively arranged on two opposite surfaces of the reinforcing material layer, and resin contents of the first resin bed and the second resin bed are different. Resin content of the first resin bed and the second resin bed on the two sides of the reinforcing material layer of the prepreg are different, and thickness difference between the resin beds on two sides after pressing ranges from 10umu to 25umu. By utilizing the subtractive process to manufacture, problems of flakes on copper-clad plate substrates and warping of single-side plate and the like can be improved or resolved on the premise of changing or not changing thickness of the conventional prepreg substrates. After the prepreg is applied to the field of printed circuit boards, shortages of substrate flakes, glue filling of thick copper areas, glue filling of high-density interconnected circuit boards, CAF among wires and the like can be improved on a condition of certain dielectric layer thickness, and then printed circuit boards can meet designed requirements of electrical, mechanical and heat resistant reliability.
Description
Technical field
The utility model relates to copper-clad plate and printed wiring board field, relates in particular to a kind of prepreg with asymmetric resin layer thickness.
Background technology
Prepreg (prepreg, B-Stage), be that present industry planted agent belongs to copper-clad plate (Copperclad laminate) and the requisite semi-finished product of multilayer printed wiring board (Multilayer printed circuit board), its main composition is by reinforcing material, comprise glass fabric (Glassfabric), nonwoven (non-woven Glass fabric) or wood pulp paper etc., reach semi-cured state at a certain temperature by the steeping liq resin.The resin content on the general reinforcing material of traditional prepreg two sides equates that substantially (the two sides resin layer thickness differs generally in 5um, maximum does not differ can surpass 10um), the resin layer thickness on reinforcing material two sides is suitable behind copper-clad plate of making or the printed wiring board.
Along with the constantly development of " thin, light, small-sized " change of electronic product, high density interconnect (HDI) multi-layer sheet is constantly pursued slimming, and copper-clad plate and prepreg thereof also must develop towards the slimming direction.Using the prepreg of slim reinforcing material, is main stream approach that industry realizes slimming by individual or many combinations.But along with the problem of some fillibility deficiencies appears in reinforcing material and traditional prepreg when slimming develops, as problems such as base material white point, filler deficiencies, guaranteeing to improve the problems referred to above under the constant situation of base material total thickness, be the difficult problem of industry always.
The utility model content
The purpose of this utility model is, a kind of prepreg with asymmetric resin layer thickness is provided, and it can improve or solve copper-clad plate and some structural issues of printed circuit board, as problems such as base material white point, single sided board warpages;
Another purpose of the present utility model is, a kind of prepreg with asymmetric resin layer thickness is provided, and it need not to increase new technological process in use, and is simple to operate, economy and facility.
For achieving the above object, the prepreg that the utlity model has asymmetric resin layer thickness comprises: layers of reinforcement, and first and second resin bed, described first and second resin bed is located at the relative two sides of layers of reinforcement respectively, and the resin content of this first and second resin bed does not wait.
This layers of reinforcement adopts glass fabric, nonwoven or wood pulp paper material to be made.
The thickness of this first and second resin bed is asymmetric.
The thickness of this first and second resin bed differs 10～25um.
The beneficial effects of the utility model: the utlity model has the prepreg of asymmetric resin layer thickness, the resin bed resin content on its layers of reinforcement two sides does not wait, and the resin layer thickness on its two sides differs 10～25um behind the pressing plate; This prepreg with asymmetric resin layer thickness adopts the subtractive process manufacture craft, can change or not change under the situation of traditional prepreg base material thickness, improve or solution copper-clad plate base material white point, problems such as single sided board warpage, it can be applied to printed wiring board (PCB) field, can under certain medium bed thickness condition, improve the base material white point, thick copper (more than or equal to 2OZ) district filler, high density interconnect (HDI) circuit board filler, ion migration defectives such as (CAF) makes printed wiring board reach the electric of expection between line, machinery, the heat-resisting reliability requirement that waits; In addition, use this prepreg to need not to increase new technological process, economy and facility with asymmetric resin layer thickness.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effect apparent by the specific embodiment of the present utility model is described in detail.
Fig. 1 is the schematic cross-section that the utlity model has prepreg one embodiment of asymmetric resin layer thickness.
The specific embodiment
For further setting forth technological means and the effect thereof that the utility model is taked, be described in detail below in conjunction with preferred embodiment of the present utility model and accompanying drawing thereof.
As shown in Figure 1, schematic cross-section for prepreg one embodiment that the utlity model has asymmetric resin layer thickness, this prepreg with asymmetric resin layer thickness comprises: layers of reinforcement 1, and first and second resin bed 2,3, described first and second resin bed 2,3 is located at the relative two sides of this layers of reinforcement 1 respectively, and the resin content of this first and second resin bed 2,3 does not wait.
Layers of reinforcement 1 of the present utility model adopts traditional prepreg base material such as glass fabric, nonwoven or wood pulp paper to make, it can change or not change under the situation of base material thickness, improves or solve the problem of copper-clad plate base material white point, single sided board warpage.Because the resin content of its first and second resin bed 2,3 is unequal, therefore after plate was pressed, the thickness of this first and second resin bed 2,3 was also unequal.During making, adopt the subtractive process manufacture craft, at first by improving total resin content of producing prepreg, the air pressure that adopts folder axle two sides not wait then, make the laminated resin of reinforcing material scrape off a part, so just caused the differing of resin content on layers of reinforcement 1 two sides, make the prepreg of thickness difference between 10～25um between first and second resin bed 2,3, the requirement that the resin content of this two resin bed differs can realize by the size of adjustable clamp axle air pressure.
In sum, the utlity model has the prepreg of asymmetric resin layer thickness, the resin bed resin content on its layers of reinforcement two sides does not wait, and the resin layer thickness on its two sides differs 10～25um behind the pressing plate; This prepreg with asymmetric resin layer thickness adopts the subtractive process manufacture craft, can change or not change under the situation of traditional prepreg base material thickness, improve or problems such as solution copper-clad plate base material white point, single sided board warpage, it is applied to the printed wiring board field, can improve between base material white point, thick copper (more than or equal to 2OZ) district filler, high density interconnect (HDI) circuit board filler, line defective such as CAF under certain medium bed thickness condition, make PCB reach the reliability requirement such as electric, mechanical, heat-resisting of expection; In addition, use this prepreg to need not to increase new technological process, economy and facility.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection domain of the utility model accompanying Claim.
Claims (4)
1. prepreg with asymmetric resin layer thickness, it is characterized in that, comprise layers of reinforcement, reach first and second resin bed, described first and second resin bed is located at the relative two sides of layers of reinforcement respectively, and the resin content of this first and second resin bed does not wait.
2. the prepreg with asymmetric resin layer thickness as claimed in claim 1 is characterized in that, this layers of reinforcement adopts glass fabric, nonwoven or wood pulp paper material to be made.
3. the prepreg with asymmetric resin layer thickness as claimed in claim 1 is characterized in that the thickness of this first and second resin bed is asymmetric.
4. the prepreg with asymmetric resin layer thickness as claimed in claim 3 is characterized in that the thickness of this first and second resin bed differs 10～25um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202047990U CN201501140U (en) | 2009-09-15 | 2009-09-15 | Prepreg with resin beds of asymmetric thicknesses |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202047990U CN201501140U (en) | 2009-09-15 | 2009-09-15 | Prepreg with resin beds of asymmetric thicknesses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201501140U true CN201501140U (en) | 2010-06-09 |
Family
ID=42452079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202047990U Expired - Lifetime CN201501140U (en) | 2009-09-15 | 2009-09-15 | Prepreg with resin beds of asymmetric thicknesses |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201501140U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665017B (en) * | 2009-09-15 | 2012-05-09 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
| CN103512832A (en) * | 2013-10-09 | 2014-01-15 | 广东生益科技股份有限公司 | Method for detecting flowing condition of glue during laminating boards |
-
2009
- 2009-09-15 CN CN2009202047990U patent/CN201501140U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665017B (en) * | 2009-09-15 | 2012-05-09 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
| CN103512832A (en) * | 2013-10-09 | 2014-01-15 | 广东生益科技股份有限公司 | Method for detecting flowing condition of glue during laminating boards |
| CN103512832B (en) * | 2013-10-09 | 2015-08-19 | 广东生益科技股份有限公司 | The method of glue flow state during detection pressing plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100609 |
|
| CX01 | Expiry of patent term |