CN201501140U - Prepreg with asymmetric resin layer thickness - Google Patents

Abstract

The utility model relates to a prepreg with asymmetric resin layer thickness, it includes: the reinforced resin composite material comprises a reinforced material layer, a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer are respectively arranged on two opposite surfaces of the reinforced material layer, and the resin contents of the first resin layer and the second resin layer are different. The utility model discloses the resin content of the resin layer of the prepreg with asymmetric resin layer thickness of its reinforcing material layer both sides varies, and the resin layer thickness of its both sides differs by 10 ~ 25um behind the clamp plate; the manufacturing process adopts a subtractive method, can improve or solve the problems of white spots of a copper-clad plate substrate, single-sided board warping and the like under the condition of changing or not changing the thickness of the traditional prepreg substrate, is applied to the field of printed circuit boards, and can improve the defects of white spots of the substrate, thick copper area underfill, high-density interconnection circuit board underfill, line-to-line CAF and the like under the condition of a certain dielectric layer thickness, so that the printed circuit board meets the expected reliability requirements of electrical, mechanical, heat resistance and the like.

Description

Prepregs with asymmetric resin layer thickness

technical field

The utility model relates to the field of copper-clad boards and printed circuit boards, in particular to a prepreg with an asymmetric resin layer thickness.

Background technique

Prepreg (B-Stage) is an indispensable semi-finished product for copper clad laminate (Copperclad laminate) and multilayer printed circuit board (Multilayer printed circuit board) in the industry. Its main composition is reinforced materials, including glass fiber Cloth (Glassfabric), non-woven (non-woven Glass fabric) or wood pulp paper, etc., are semi-cured at a certain temperature by impregnating liquid resin. In traditional prepregs, the resin content on both sides of the reinforcing material is basically equal (the thickness difference between the resin layers on both sides is generally within 5um, and the maximum difference will not exceed 10um). .

With the continuous development of "thin, light, and miniaturized" electronic products, high-density interconnect (HDI) multilayer boards continue to pursue thinning, and copper-clad laminates and their prepregs must also develop in the direction of thinning. The use of prepregs with thin reinforcement materials, through a single sheet or a combination of multiple sheets, is the mainstream method in the industry to achieve thinning. However, with the development of reinforced materials and traditional prepregs to thinner, some problems of insufficient filling, such as white spots on the base material, insufficient filling, etc., have been improved to improve the above problems while ensuring that the total thickness of the base material remains unchanged. It's a problem for the industry.

Utility model content

The purpose of this utility model is to provide a prepreg with an asymmetric resin layer thickness, which can improve or solve some structural problems of copper clad laminates and printed circuit boards, such as base material white spots, single-sided board warping and other problems;

Another object of the present invention is to provide a prepreg with an asymmetric resin layer thickness, which does not need to add a new process during use, and is easy to operate and economical.

In order to achieve the above object, the utility model has a prepreg with an asymmetric resin layer thickness comprising: a reinforcing material layer, and first and second resin layers, the first and second resin layers are respectively arranged on opposite sides of the reinforcing material layer, the second The resin contents of the first and second resin layers are different.

The reinforcing material layer is made of glass fiber cloth, non-woven cloth, or wood pulp paper.

The thicknesses of the first and second resin layers are asymmetric.

The difference in thickness between the first and second resin layers is 10-25um.

Beneficial effects of the utility model: the utility model has a prepreg with an asymmetric resin layer thickness, and the resin content of the resin layer on both sides of the reinforcing material layer is not equal, and the thickness of the resin layer on the two sides of the plate is different by 10-25um after pressing the plate; the asymmetric resin The thickness of the prepreg adopts the subtractive manufacturing process, which can improve or solve the problems of white spots on the base material of the copper clad laminate and warping of the single panel without changing or not changing the thickness of the traditional prepreg base material. It can be applied to printed circuits In the field of board (PCB), it can improve white spots of substrates, thick copper (greater than or equal to 2OZ) area filling, high-density interconnection (HDI) circuit board filling, and line-to-line ion migration (CAF) under certain dielectric layer thickness conditions. ) and other defects, so that the printed circuit board meets the expected electrical, mechanical, heat resistance and other reliability requirements; in addition, the use of this prepreg with asymmetric resin layer thickness does not need to add new processes, which is economical and easy.

In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the accompanying drawings are for reference and illustration only, and are not intended to limit the present utility model.

Description of drawings

The technical solution and other beneficial effects of the utility model will be apparent through the detailed description of the specific implementation of the utility model in conjunction with the accompanying drawings.

FIG. 1 is a schematic cross-sectional view of an embodiment of a prepreg with an asymmetric resin layer thickness according to the present invention.

Detailed ways

In order to further illustrate the technical means adopted by the utility model and its effects, a detailed description will be given below in conjunction with preferred embodiments of the utility model and accompanying drawings.

As shown in Figure 1, it is a schematic cross-sectional view of an embodiment of a prepreg with an asymmetric resin layer thickness according to the present invention. The prepreg with an asymmetric resin layer thickness includes: a reinforcing material layer 1, and first and second resin layers 2, 3. The first and second resin layers 2 and 3 are respectively arranged on opposite sides of the reinforcing material layer 1, and the resin contents of the first and second resin layers 2 and 3 are different.

The reinforcing material layer 1 of the utility model is made of traditional prepreg substrates such as glass fiber cloth, non-woven fabric, or wood pulp paper, which can improve or solve the problem of copper-clad laminate substrates without changing the thickness of the substrate. Problems of white spots and single-sided warping. Since the resin contents of the first and second resin layers 2 and 3 are not equal, the thicknesses of the first and second resin layers 2 and 3 are also not equal after pressing. During the production, the subtractive method is adopted. Firstly, the total resin content of the prepreg is increased, and then the air pressure on both sides of the clamping shaft is not equal, so that part of the resin on one side of the reinforcing material layer is scraped off, thus resulting in two sides of the reinforcing material layer 1. The difference in resin content between the first and second resin layers 2 and 3 is to prepare a prepreg with a thickness difference between 10 and 25um. The requirement for the difference in resin content of the two resin layers can be adjusted by adjusting the air pressure of the clamping shaft to fulfill.

In summary, the utility model has a prepreg with an asymmetric resin layer thickness, the resin content of the resin layer on both sides of the reinforcing material layer is not equal, and the thickness of the resin layer on the two sides after pressing the plate is 10-25um; the thickness of the asymmetric resin layer is The prepreg adopts the subtractive method manufacturing process, which can improve or solve the problems of white spots on the base material of the copper clad laminate and warpage of the single panel without changing or not changing the thickness of the traditional prepreg base material. It is used in the field of printed circuit boards. Under the condition of a certain dielectric layer thickness, it can improve defects such as base material white spots, thick copper (greater than or equal to 2OZ) area glue filling, high-density interconnect (HDI) circuit board glue filling, and line-to-line CAF, so that the PCB can achieve the expected electrical , machinery, heat resistance and other reliability requirements; in addition, the use of this prepreg does not need to add new processes, which is economical and easy.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical scheme and technical concept of the present utility model, and all these changes and deformations should belong to the appendix of the utility model. The scope of the claims.

Claims (4)

1. A prepreg with an asymmetric resin layer thickness is characterized in that it comprises a reinforcing material layer and the first and second resin layers, and the first and second resin layers are respectively arranged on opposite sides of the reinforcing material layer, the second The resin contents of the first and second resin layers are different. 2. The prepreg with an asymmetric resin layer thickness according to claim 1, wherein the reinforcing material layer is made of glass fiber cloth, non-woven fabric, or wood pulp paper. 3. The prepreg with asymmetric resin layer thickness as claimed in claim 1, wherein the thickness of the first and second resin layers is asymmetric. 4 . The prepreg with an asymmetric resin layer thickness as claimed in claim 3 , wherein the thickness difference between the first and second resin layers is 10-25 um.

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