CN103687293A - Stacked circuit board and manufacturing technology thereof - Google Patents
Stacked circuit board and manufacturing technology thereof Download PDFInfo
- Publication number
- CN103687293A CN103687293A CN201210323641.1A CN201210323641A CN103687293A CN 103687293 A CN103687293 A CN 103687293A CN 201210323641 A CN201210323641 A CN 201210323641A CN 103687293 A CN103687293 A CN 103687293A
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- substrate
- flexible soft
- soft board
- copper foil
- board
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a stacked circuit board and a manufacturing technology thereof, and belongs to the field of integrated circuits. The stacked circuit board comprises a base board and a flexible soft board; the base board is a hard board; a copper foil is arranged on the surface of the base board; the base board conducts wiring and circuit formation manufacturing; the flexible soft board is a copper foil with polyimide or a copper foil with resin or a polymer liquid crystal copper foil; the flexible soft board conducts wiring and circuit formation manufacturing; the base board is pressed on the flexible soft board. According to the invention, the position of the flexible soft plate can be distributed on the base board as required; a partial high density circuit board can be achieved as required, and the integral thickness of a product is lowered.
Description
Technical field
A kind of supercircuit plate of the present invention and manufacture craft thereof belong to integrated circuit fields, particularly extremely inhomogeneous for wiring density, and adopt stack to carry out part and add, then a kind of supercircuit plate and the manufacture craft thereof that are electrically connected.
Background technology
Modern electronic product is integrated towards function, volume miniaturization, this just require printed circuit board (PCB) (PCB) as the critical component in electronic product also towards integrated, fine and closely wovenization future development, along with the integrated development of printed circuit board (PCB) (PCB), this has just proposed more and more higher requirement to the figure processing as signal transmission in printed circuit board (PCB) (PCB).
Existing printed circuit board (PCB) (PCB), by wiring and circuit moulding, can adopt subtractive process semi-additive process or modified model semi-additive process.The substrate of printed circuit board (PCB) (PCB) has hardboard, and the material that hardboard adopts has epoxy resin (FR-4) Copper Foil bismaleimide-triazine resin resin (BT) Copper Foil.Printed circuit board (PCB) (PCB) has flexible soft board, and the base material of employing refers to be with polyimide copper foil, resin Copper Foil or polymer liquid crystal copper foil base material LCP.
Summary of the invention
The object of the invention is to avoid weak point of the prior art, a kind of a kind of supercircuit plate and manufacture craft thereof of local high-density circuit board is provided.
The object of the invention is to realize by following measures, a kind of supercircuit plate, comprises substrate, flexible soft board, and substrate is hardboard, on the surface of substrate, has Copper Foil, and substrate connects up and circuit moulding is made; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, and flexible soft board connects up and circuit moulding is made,
Solderless substrate on flexible soft board.
The present invention, at the upper and lower flexible soft board of pressing that carries out of substrate, forms upper and lower two flexible soft boards and is pressed together on substrate.
The present invention, at the upper and lower solderless substrate of flexible soft board, forms upper and lower two substrates and is pressed together on flexible soft board.
The present invention is at the flexible soft board of pressing of upper and lower while of substrate, and the position of flexible soft board can distribute as required; And then with another substrate pressing, form multiple-layer stacked structure.
The position of flexible soft board of the present invention can be distributed on substrate as required.
The present invention carries out pressing by flexible soft board and substrate middle-high density district, holes and hole clean, and metalized is carried out in hole, realizes electrical connection, obtains a kind of supercircuit plate, realizes the combination of substrate and flexible soft board.
A kind of supercircuit plate manufacture craft of the present invention, supercircuit plate comprises substrate, flexible soft board, and substrate is hardboard, and the material that hardboard adopts has epoxy resin (FR-4) Copper Foil bismaleimide-triazine resin resin (BT) Copper Foil; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil,
Substrate connects up and circuit moulding is made;
Flexible soft board connects up and circuit moulding is made;
Flexible soft board and substrate are carried out to pressing;
Hole and hole clean;
The metalized in hole.
Wiring and circuit moulding, can adopt subtractive process semi-additive process or modified model semi-additive process;
Substrate can be single sided board double sided board or multi-layer sheet;
Flexible soft board can be single sided board double sided board or multi-layer sheet;
Flexible soft board and substrate middle-high density district are carried out to pressing, and other not pressings of district in substrate, manufacture local high-density circuit board, simultaneously because flexible soft board is ultra-thin, thereby reach the integral thickness that reduces product;
The present invention, at the upper and lower flexible soft board of pressing that carries out of substrate, forms upper and lower two flexible soft boards and is pressed together on substrate.
The present invention, at the upper and lower solderless substrate of flexible soft board, forms upper and lower two substrates and is pressed together on flexible soft board.
The present invention is at the flexible soft board of pressing of upper and lower while of substrate, and the position of flexible soft board can distribute as required; And then with another substrate pressing, form multiple-layer stacked structure.
The present invention can realize local high-density circuit board as required, reduces the integral thickness of product.
Accompanying drawing explanation
Accompanying drawing 1 is substrate schematic diagram of the present invention.
Accompanying drawing 2 is double-faced flexible soft board schematic diagrames of the present invention.
Accompanying drawing 3 is single-sided flexible soft board schematic diagrames of the present invention.
Accompanying drawing 4 is supercircuit plate schematic diagrames of the present invention.
Accompanying drawing 5 is supercircuit plate schematic diagrames of the present invention.
Accompanying drawing 6 is supercircuit plate schematic diagrames of the present invention.
Concrete execution mode
Illustrate by reference to the accompanying drawings manufacture craft of the present invention.
In figure: substrate 1, flexible soft board 2, Copper Foil 3, access hole 4, blind hole 5.
As shown in Figure 1, substrate is hardboard, on the surface of substrate, has Copper Foil, and substrate connects up and circuit moulding is made; Wiring and circuit moulding, can adopt subtractive process semi-additive process or modified model semi-additive process.
As shown in accompanying drawing 2, accompanying drawing 3, flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, and flexible soft board connects up and circuit moulding is made, and wiring and circuit moulding, can adopt subtractive process semi-additive process or modified model semi-additive process.Flexible soft board can be single sided board double sided board or multi-layer sheet.
As shown in Figure 4, a kind of supercircuit plate, comprises substrate, flexible soft board, and substrate is hardboard, on the surface of substrate, has Copper Foil, and substrate connects up and circuit moulding is made; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, and flexible soft board connects up and circuit moulding is made, and carries out pressing double-faced flexible soft board on substrate, carries out pressing single-sided flexible soft board below substrate.
As shown in accompanying drawing 5, accompanying drawing 6, a kind of supercircuit plate, comprises substrate, flexible soft board, and substrate is hardboard, on the surface of substrate, has Copper Foil, and substrate connects up and circuit moulding is made; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, flexible soft board connects up and circuit moulding is made, on substrate, carry out pressing double-faced flexible soft board, below substrate, carry out pressing single-sided flexible soft board, hole and hole clean, metalized is carried out in hole, realize electrical connection, obtain a kind of supercircuit plate, realize the combination of substrate and flexible soft board.
A kind of supercircuit plate manufacture craft of the present invention, supercircuit plate comprises substrate, flexible soft board, and substrate is hardboard, and the material that hardboard adopts has epoxy resin (FR-4) Copper Foil bismaleimide-triazine resin resin (BT) Copper Foil; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, and substrate connects up and circuit moulding is made; Adopt subtractive process.Flexible soft board connects up and circuit moulding is made; Semi-additive process.Flexible soft board and substrate are carried out to pressing; Hole and hole clean; The metalized in hole.
Claims (7)
1. a supercircuit plate, comprises substrate, flexible soft board, and substrate is hardboard, on the surface of substrate, has Copper Foil, and substrate connects up and circuit moulding is made; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, and flexible soft board connects up and circuit moulding is made, and it is characterized in that: solderless substrate on flexible soft board.
2. a kind of supercircuit plate according to claim 1, is characterized in that: at the upper and lower flexible soft board of pressing that carries out of substrate.
3. a kind of supercircuit plate according to claim 1, is characterized in that: at the upper and lower solderless substrate of flexible soft board.
4. a kind of supercircuit plate according to claim 1, is characterized in that: at the flexible soft board of pressing of upper and lower while of substrate, and then with another substrate pressing.
5. a supercircuit plate manufacture craft, supercircuit plate comprises substrate, flexible soft board, and substrate is hardboard, and the material that hardboard adopts has epoxy resin (FR-4) Copper Foil bismaleimide-triazine resin resin (BT) Copper Foil; Flexible soft board is band polyimide copper foil or resin Copper Foil or polymer liquid crystal Copper Foil, and substrate connects up and circuit moulding is made; Flexible soft board connects up and circuit moulding is made; It is characterized in that: flexible soft board and substrate are carried out to pressing.
6. a kind of supercircuit plate manufacture craft according to claim 5, is characterized in that: holes and hole clean, and the metalized in hole.
7. a kind of supercircuit plate manufacture craft according to claim 5, is characterized in that: at the flexible soft board of pressing of upper and lower while of substrate, and then with another substrate pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210323641.1A CN103687293A (en) | 2012-09-05 | 2012-09-05 | Stacked circuit board and manufacturing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210323641.1A CN103687293A (en) | 2012-09-05 | 2012-09-05 | Stacked circuit board and manufacturing technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103687293A true CN103687293A (en) | 2014-03-26 |
Family
ID=50323180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210323641.1A Pending CN103687293A (en) | 2012-09-05 | 2012-09-05 | Stacked circuit board and manufacturing technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103687293A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017000361A1 (en) * | 2015-06-30 | 2017-01-05 | 安捷利（番禺）电子实业有限公司 | Three-dimensional inductance coil and method for preparing three-dimensional inductance coil using printed circuit method |
| CN107846789A (en) * | 2017-11-24 | 2018-03-27 | 郑州云海信息技术有限公司 | A kind of design method for solving PCB layout density |
| CN109637368A (en) * | 2019-01-07 | 2019-04-16 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135465A (en) * | 2006-11-27 | 2008-06-12 | Funai Electric Co Ltd | Flexible wiring board and liquid crystal display with flexible wiring board |
| CN102510665A (en) * | 2011-10-20 | 2012-06-20 | 深圳市五株电路板有限公司 | Method for processing circuit board |
| CN202841708U (en) * | 2012-08-16 | 2013-03-27 | 安捷利电子科技（苏州）有限公司 | Superimposed circuit board |
-
2012
- 2012-09-05 CN CN201210323641.1A patent/CN103687293A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135465A (en) * | 2006-11-27 | 2008-06-12 | Funai Electric Co Ltd | Flexible wiring board and liquid crystal display with flexible wiring board |
| CN102510665A (en) * | 2011-10-20 | 2012-06-20 | 深圳市五株电路板有限公司 | Method for processing circuit board |
| CN202841708U (en) * | 2012-08-16 | 2013-03-27 | 安捷利电子科技（苏州）有限公司 | Superimposed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017000361A1 (en) * | 2015-06-30 | 2017-01-05 | 安捷利（番禺）电子实业有限公司 | Three-dimensional inductance coil and method for preparing three-dimensional inductance coil using printed circuit method |
| CN107846789A (en) * | 2017-11-24 | 2018-03-27 | 郑州云海信息技术有限公司 | A kind of design method for solving PCB layout density |
| CN109637368A (en) * | 2019-01-07 | 2019-04-16 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
| CN109637368B (en) * | 2019-01-07 | 2023-12-26 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
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Application publication date: 20140326 |