CN210351782U - PTFE high frequency thoughtlessly presses PCB circuit board - Google Patents
PTFE high frequency thoughtlessly presses PCB circuit board Download PDFInfo
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- CN210351782U CN210351782U CN201920984811.8U CN201920984811U CN210351782U CN 210351782 U CN210351782 U CN 210351782U CN 201920984811 U CN201920984811 U CN 201920984811U CN 210351782 U CN210351782 U CN 210351782U
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Abstract
The utility model discloses a PTFE high frequency mixed compression PCB circuit board, which comprises a mother board and a high frequency daughter board, wherein the mother board is provided with a board groove, and the high frequency daughter board is arranged in the board groove; the mother board comprises two polytetrafluoroethylene glass fiber cloth layers and a plurality of FR4 copper-clad plates arranged between the two polytetrafluoroethylene glass fiber cloth layers, the polytetrafluoroethylene glass fiber cloth layers are bonded with the FR4 copper-clad plate through a first semi-cured bonding sheet, and the FR4 copper-clad plate is bonded with the FR4 copper-clad plate through a second semi-cured bonding sheet; the mother board is provided with a circular through hole, and a copper foil layer is plated in the through hole. The mother plate is arranged into two layers of polytetrafluoroethylene glass fiber cloth layers to clamp a plurality of layers of FR4 copper-clad plates, and meanwhile, a circular through hole is arranged on the mother plate; therefore, the multi-layer high-frequency circuit board can be mixed and pressed, so that the high-frequency dielectric ceramic has excellent high-frequency dielectric property, can resist high temperature and radiation, is convenient to align during assembly, and has high qualification rate.
Description
Technical Field
The utility model belongs to the technical field of the circuit board technique and specifically relates to a PTFE high frequency thoughtlessly presses PCB circuit board.
Background
At present, the existing multilayer circuit board has no higher transmission requirement, and the multilayer circuit board with the traditional structure can meet the requirement of stable signal transmission; however, when the whole multilayer circuit board has a high requirement for signal transmission, the multilayer circuit board with the conventional structure cannot meet the requirement for stable signal transmission. And the existing circuit board has low high-frequency dielectric property, cannot resist high temperature and has no radiation resistance.
Therefore, the prior art still needs to be improved and developed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a PTFE high frequency thoughtlessly presses PCB circuit board has excellent high frequency dielectric property, can be high temperature resistant to resistant radiation.
In order to achieve the above purpose, the technical scheme of the utility model is as follows: a PTFE high frequency mixed compression PCB circuit board comprises a mother board and a high frequency daughter board, wherein the mother board is provided with a board groove, and the high frequency daughter board is arranged in the board groove; the mother board comprises two polytetrafluoroethylene glass fiber cloth layers and a plurality of FR4 copper-clad plates arranged between the two polytetrafluoroethylene glass fiber cloth layers, the polytetrafluoroethylene glass fiber cloth layers are bonded with the FR4 copper-clad plate through a first semi-cured bonding sheet, and the FR4 copper-clad plate is bonded with the FR4 copper-clad plate through a second semi-cured bonding sheet; the mother board is provided with a circular through hole, and a copper foil layer is plated in the through hole.
The PTFE high frequency mixes presses PCB circuit board, wherein, the side of motherboard is provided with the convenient triangle-shaped focusing groove that corresponds the equipment.
The PTFE high frequency mixed compression PCB circuit board, wherein, the semi-solidified bonding sheet adopts fire-retardant glass fiber or polycarbonate material to make.
The PTFE high frequency mixes presses PCB circuit board, wherein, the high frequency daughter board passes through the bonding sheet and pastes the bottom at the board groove.
The PTFE high frequency mixed compression PCB circuit board, wherein, the side of board groove is plated with the metal level.
The PTFE high frequency thoughtlessly presses PCB circuit board, wherein, one of two-layer polytetrafluoroethylene glass cloth layer is ceramic powder filling polytetrafluoroethylene glass cloth layer.
Has the advantages that: the mother plate is provided with the circular through hole, and a copper foil layer is plated in the through hole; therefore, the circuit board can realize the mixed compression of a plurality of layers of high-frequency circuit boards, so that the circuit board has excellent high-frequency dielectric property, can resist high temperature and radiation, is convenient to align during assembly and has high qualification rate.
Drawings
Fig. 1 is a cross-sectional view of the present invention.
Fig. 2 is a plan view of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention will be described in further detail below with reference to the accompanying drawings and examples.
As shown in fig. 1-2, the utility model discloses a PTFE high-frequency mixed-compression PCB circuit board, which comprises a mother board 1 and a high-frequency daughter board 2, wherein the mother board 1 is provided with a board slot 10, and the high-frequency daughter board 2 is arranged in the board slot 10; the motherboard 1 comprises two polytetrafluoroethylene glass fiber cloth layers 3 and a plurality of FR4 copper-clad plates 4 arranged between the two polytetrafluoroethylene glass fiber cloth layers 3, wherein the polytetrafluoroethylene glass fiber cloth layers 3 and the FR4 copper-clad plate 4 are bonded through a first semi-cured bonding sheet 5, and the FR4 copper-clad plate 4 and the FR4 copper-clad plate 4 are bonded through a second semi-cured bonding sheet 6; the motherboard 1 is provided with a circular through hole 11, and a copper foil layer 12 is plated in the through hole 11.
After the structure of the oil adding device is adopted, the utility model discloses a glass cloth layer of two-layer polytetrafluoroethylene is cliied a plurality of layers FR4 copper-clad plate, so can realize that multilayer high frequency circuit board thoughtlessly presses for high frequency circuit board has multilayer circuit board's function, simultaneously owing to adopt the glass cloth layer of polytetrafluoroethylene glass as the one deck of mother board, so has good high frequency dielectric property, and FR4 copper-clad plate makes the mother board can be high temperature resistant, resistant radiation.
According to the PTFE high-frequency mixed-compression PCB, the triangular focusing grooves 13 which are convenient to assemble correspondingly are formed in the side face of the motherboard 1, so that during assembly, all layers of the motherboard are aligned with each other through the focusing grooves, rapid assembly can be achieved, and the assembly qualification rate is high; the interlayer alignment precision of the circuit layers of the multilayer circuit board is good.
The PTFE high-frequency mixed-compression PCB circuit board is characterized in that the semi-solidified bonding sheets 5 and 6 are made of flame-retardant glass fibers or polycarbonate materials; so can strengthen the utility model discloses a radiating effect of prepreg bonding sheet, and then make the radiating effect of circuit board stronger, can be high temperature resistant.
PTFE high frequency thoughtlessly presses PCB circuit board, wherein, high frequency daughter board 2 pastes in the bottom of chase through the bonding sheet, so the utility model discloses excellent high frequency dielectric property has.
The PTFE high frequency mixed-compression PCB circuit board is characterized in that a metal layer is plated on the side surface of the board groove 10.
The PTFE high frequency thoughtlessly presses PCB circuit board, wherein, one of two-layer polytetrafluoroethylene glass cloth layer 3 fills polytetrafluoroethylene glass cloth layer 30 for ceramic powder, so can improve high frequency dielectric property and high temperature resistance.
The mother plate is provided with the circular through hole, and a copper foil layer is plated in the through hole; therefore, the circuit board can realize the mixed compression of a plurality of layers of high-frequency circuit boards, so that the circuit board has excellent high-frequency dielectric property, can resist high temperature and radiation, is convenient to align during assembly and has high qualification rate.
The above is a preferred embodiment of the present invention, and certainly not to limit the scope of the present invention, it should be noted that, for those skilled in the art, modifications or equivalent substitutions of the technical solutions of the present invention without creative efforts may not depart from the protection scope of the technical solutions of the present invention.
Claims (6)
1. A PTFE high frequency mixed compression PCB circuit board is characterized by comprising a mother board and a high frequency daughter board, wherein the mother board is provided with a board groove, and the high frequency daughter board is arranged in the board groove; the mother board comprises two polytetrafluoroethylene glass fiber cloth layers and a plurality of FR4 copper-clad plates arranged between the two polytetrafluoroethylene glass fiber cloth layers, the polytetrafluoroethylene glass fiber cloth layers are bonded with the FR4 copper-clad plate through a first semi-cured bonding sheet, and the FR4 copper-clad plate is bonded with the FR4 copper-clad plate through a second semi-cured bonding sheet; the mother board is provided with a circular through hole, and a copper foil layer is plated in the through hole.
2. The PTFE high frequency mixed compression PCB circuit board of claim 1, wherein the side of the motherboard is provided with a triangular focusing groove which facilitates corresponding assembly.
3. The PTFE high frequency co-extruded PCB circuit board of claim 1, wherein the prepreg is made of flame retardant glass fiber or polycarbonate material.
4. The PTFE high frequency hybrid PCB circuit board of claim 1, wherein the high frequency sub-board is adhered to the bottom of the board slot by an adhesive sheet.
5. The PTFE high frequency hybrid PCB circuit board of claim 1, wherein the side of the board slot is plated with a metal layer.
6. The PTFE high frequency co-extruded PCB circuit board of claim 1, wherein one of the two PTFE fiberglass cloth layers is a ceramic powder filled PTFE fiberglass cloth layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920984811.8U CN210351782U (en) | 2019-06-27 | 2019-06-27 | PTFE high frequency thoughtlessly presses PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920984811.8U CN210351782U (en) | 2019-06-27 | 2019-06-27 | PTFE high frequency thoughtlessly presses PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351782U true CN210351782U (en) | 2020-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920984811.8U Active CN210351782U (en) | 2019-06-27 | 2019-06-27 | PTFE high frequency thoughtlessly presses PCB circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN210351782U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
| CN113179594A (en) * | 2021-03-15 | 2021-07-27 | 华宇华源电子科技（深圳）有限公司 | Local high-frequency circuit board manufacturing method |
-
2019
- 2019-06-27 CN CN201920984811.8U patent/CN210351782U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
| CN113179594A (en) * | 2021-03-15 | 2021-07-27 | 华宇华源电子科技（深圳）有限公司 | Local high-frequency circuit board manufacturing method |
| CN113179594B (en) * | 2021-03-15 | 2023-01-03 | 华宇华源电子科技（深圳）有限公司 | Local high-frequency circuit board manufacturing method |
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