JP2000022406A - Planar transmission line - Google Patents

Planar transmission line

Info

Publication number
JP2000022406A
JP2000022406A JP10182684A JP18268498A JP2000022406A JP 2000022406 A JP2000022406 A JP 2000022406A JP 10182684 A JP10182684 A JP 10182684A JP 18268498 A JP18268498 A JP 18268498A JP 2000022406 A JP2000022406 A JP 2000022406A
Authority
JP
Japan
Prior art keywords
conductor
dielectric substrate
ground plane
transmission line
strip conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10182684A
Other languages
Japanese (ja)
Inventor
Akishi Numata
晃志 沼田
Original Assignee
Denso Corp
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, 株式会社デンソー filed Critical Denso Corp
Priority to JP10182684A priority Critical patent/JP2000022406A/en
Publication of JP2000022406A publication Critical patent/JP2000022406A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a planar transmission line from which an electromagnetic wave is less emitted and that is hardly susceptible to external interference. SOLUTION: A ground planar conductor 2 is formed on the entire rear side of a dielectric substrate 3 whose plate thickness is t1. A strip conductor 4 and ground planar conductors 5, 6 holding the conductor 4 inbetween are formed on a front side of the dielectric substrate 3. A dielectric substrate 8 with a plate thickness of t2 consisting of a prepreg layer is adhered onto the dielectric substrate 3, and a ground plane conductor 9 is formed on the entire surface of the dielectric substrate 8. The ground planar conductors 2, 9 and the ground planar conductors 5, 6 are interconnected through via-contacts (via-holes and contact holes) 10 that are made through the dielectric substrates 3, 8 and connect to ground. The strip conductor 4 is parted from the ground planar conductors 5, 6 at an interval (d).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【発明の属する技術分野】本発明は平面形伝送線路に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar transmission line.
【0002】[0002]
【従来の技術】一般に、電磁波を伝送(導波)する線路
を伝送線路(導波路)という。伝送線路には、断面寸法
の縦横比が同程度である立体形伝送線路(例えば、同軸
ケーブル,導波管,誘電体線路など)と、縦方向に比べ
て横方向の断面寸法が大きな平面形伝送線路とがある。
2. Description of the Related Art Generally, a line for transmitting (guiding) an electromagnetic wave is called a transmission line (waveguide). The transmission line includes a three-dimensional transmission line (for example, a coaxial cable, a waveguide, a dielectric line, etc.) having a similar cross-sectional aspect ratio, and a flat-type transmission line having a larger cross-sectional dimension than the vertical direction. There is a transmission line.
【0003】平面形伝送線路には、マイクロストリップ
線路,ストリップ線路(トリプレート線路),コプレー
ナ線路などがある。マイクロストリップ線路は、誘電体
基板の裏面全面に接地平面導体(接地平面導体板)が積
層され、当該誘電体基板の表面に厚さの極めて薄いスト
リップ状の導体(一般に、「ストリップ導体」と呼ばれ
る)が積層されて構成されている。
[0003] Planar transmission lines include microstrip lines, strip lines (triplate lines), and coplanar lines. In a microstrip line, a ground plane conductor (ground plane conductor plate) is laminated on the entire back surface of a dielectric substrate, and an extremely thin strip-shaped conductor (generally called a “strip conductor”) is formed on the surface of the dielectric substrate. ) Are stacked.
【0004】ストリップ線路は、ストリップ導体が上下
の接地平面導体に挟まれて構成され、具体的には、第1
の誘電体基板の裏面全面に第1の接地平面導体が積層さ
れ、当該誘電体基板の表面にストリップ導体が積層さ
れ、第1の誘電体基板上に第2の誘電体基板が貼付さ
れ、当該第2の誘電体基板の表面全面に第2の接地平面
導体が積層されて構成されている。
[0004] A strip line is constituted by a strip conductor sandwiched between upper and lower ground plane conductors.
A first ground plane conductor is laminated on the entire back surface of the dielectric substrate, a strip conductor is laminated on the surface of the dielectric substrate, and a second dielectric substrate is attached on the first dielectric substrate. A second ground plane conductor is laminated on the entire surface of the second dielectric substrate.
【0005】コプレーナ線路は、誘電体基板の同一面上
に、ストリップ導体と、当該ストリップ導体を両側から
挟み込む接地平面導体とが積層されて構成されている。
[0005] The coplanar line is constituted by laminating a strip conductor and a ground plane conductor sandwiching the strip conductor from both sides on the same surface of the dielectric substrate.
【0006】[0006]
【発明が解決しようとする課題】平面形伝送線路は、立
体形伝送線路に比べ、小型,軽量,簡単な構造,製造の
容易さ,低コストなどの優れた特長を備えており、近年
のマイクロ波・ミリ波半導体デバイスの進歩および集積
化の要求に伴い、その特長を生かして発振器や増幅器な
どの能動回路にも広く応用されている。
The flat transmission line has excellent features such as small size, light weight, simple structure, easy manufacturing, and low cost compared with the three-dimensional transmission line. With the advancement of wave / millimeter wave semiconductor devices and the demand for integration, their features have been widely applied to active circuits such as oscillators and amplifiers.
【0007】しかし、平面形伝送線路には、電磁波の放
射が多く、外部からの干渉を受けやすいという欠点があ
る。特に、平面形伝送線路を携帯電話機のような高密度
基板を用いる電子機器に適用した場合、電磁波の放射や
外部からの干渉により、当該電子機器の性能を向上させ
るのは難しい。
However, the flat transmission line has a drawback that it emits a large amount of electromagnetic waves and is susceptible to external interference. In particular, when the flat transmission line is applied to an electronic device using a high-density substrate such as a mobile phone, it is difficult to improve the performance of the electronic device due to radiation of electromagnetic waves or external interference.
【0008】本発明は上記問題点を解決するためになさ
れたものであって、その目的は、電磁波の放射が少な
く、外部からの干渉を受け難い平面形伝送線路を提供す
ることにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a planar transmission line which emits less electromagnetic waves and is less susceptible to external interference.
【0009】[0009]
【課題を解決するための手段】かかる目的を達成するた
めになされた請求項1に記載の発明は、電磁波が伝送さ
れるストリップ導体と、当該ストリップ導体に対して一
定間隔だけ離間して上下方向からそれぞれ挟む第1およ
び第2の接地平面導体と、前記ストリップ導体に対して
一定間隔だけ離間して左右方向からそれぞれ挟む第3お
よび第4の接地平面導体とを備えている。
Means for Solving the Problems In order to achieve the above object, the invention according to claim 1 comprises a strip conductor through which an electromagnetic wave is transmitted, and a strip conductor which is spaced apart from the strip conductor by a certain distance in a vertical direction. , And third and fourth ground plane conductors that are respectively spaced from the strip conductor by a predetermined distance and are horizontally sandwiched from the strip conductor.
【0010】従って、本発明においては、ストリップ導
体接地平面導体によって上下左右方向から一定間隔だけ
離間して挟まれることで電磁シールドが施されているた
め、ストリップ導体中を伝送される電磁波の伝送方向
(ストリップ導体の長手方向)と直角な断面内におい
て、電磁波が外部に漏れるのを防止することができる。
また、外部からの電磁波がストリップ導体中を伝送され
る電磁波に影響を与えるのを防止することができる。つ
まり、第1および第2の接地平面導体は、ストリップ導
体から上下方向に放射される電磁波およびストリップ導
体に対して上下方向から入射される電磁波を遮断する。
また、第3および第4の接地平面導体は、ストリップ導
体から左右方向に放射される電磁波およびストリップ導
体に対して左右方向から入射される電磁波を遮断する。
すなわち、本発明の平面形伝送線路は、ストリップ線路
とコプレーナ線路とを併用したものにほかならず、両線
路の相乗効果により優れた電磁シールド性能を備える。
そのため、本発明の平面形伝送線路を携帯電話機のよう
な高密度基板を用いる電子機器に適用すれば、電磁波の
放射が少なく、外部からの干渉を受けにくいため、当該
電子機器の性能を向上させることができる。
Therefore, in the present invention, since the electromagnetic shield is provided by being sandwiched by the strip conductor ground plane conductor at a certain interval from the top, bottom, left and right directions, the transmission direction of the electromagnetic wave transmitted through the strip conductor is provided. Electromagnetic waves can be prevented from leaking outside in a cross section perpendicular to the (longitudinal direction of the strip conductor).
Further, it is possible to prevent external electromagnetic waves from affecting the electromagnetic waves transmitted through the strip conductor. That is, the first and second ground plane conductors block electromagnetic waves radiated from the strip conductor in the vertical direction and electromagnetic waves incident on the strip conductor from the vertical direction.
The third and fourth ground plane conductors block electromagnetic waves radiated from the strip conductor in the left-right direction and electromagnetic waves incident on the strip conductor from the left-right direction.
That is, the planar transmission line of the present invention is nothing but a combination of a strip line and a coplanar line, and has excellent electromagnetic shielding performance due to a synergistic effect of both lines.
Therefore, if the planar transmission line of the present invention is applied to an electronic device using a high-density substrate such as a mobile phone, the radiation of electromagnetic waves is small and the device is less susceptible to external interference, so that the performance of the electronic device is improved. be able to.
【0011】ところで、請求項2に記載の発明のよう
に、請求項1に記載の平面形伝送線路において、前記第
1の接地平面導体が一方の面に形成され、前記ストリッ
プ導体と前記第3および第4の接地平面導体とが他方の
面に形成された第1の誘電体基板を備えると共に、前記
第2の接地平面導体が一方の面に形成され、他方の面が
前記第1の誘電体基板と対向して配置された第2の誘電
体基板を備えるようにしてもよい。
According to a second aspect of the present invention, in the planar transmission line according to the first aspect, the first ground plane conductor is formed on one surface, and the strip conductor and the third ground plane conductor are formed on one surface. And a first dielectric substrate having a fourth ground plane conductor formed on the other surface, the second ground plane conductor being formed on one surface, and the other surface being formed on the first dielectric substrate. A second dielectric substrate may be provided facing the body substrate.
【0012】従って、本発明によれば、一般的な多層プ
リント基板または多層セラミック基板を用いて請求項1
に記載の発明を容易に具体化することができる。また、
請求項3に記載の発明のように、請求項2に記載の平面
形伝送線路において、前記第1,第2,第3,第4の接
地平面導体をそれぞれ接続するビアコンタクトを備え、
当該ビアコンタクトが前記第1および第2の誘電体基板
を貫通して形成されるようにしてもよい。
Therefore, according to the present invention, a general multi-layer printed circuit board or a multi-layer ceramic substrate is used.
Can be easily embodied. Also,
According to a third aspect of the present invention, in the planar transmission line according to the second aspect, via contacts are provided for connecting the first, second, third, and fourth ground plane conductors, respectively.
The via contact may be formed to penetrate the first and second dielectric substrates.
【0013】従って、本発明によれば、ビアコンタクト
を設けることにより、各平面接地導体の全ての部分が接
地電位になり、電磁シールド効果をより確実に得ること
ができる。
Therefore, according to the present invention, by providing the via contact, all the portions of each planar ground conductor become the ground potential, and the electromagnetic shielding effect can be more reliably obtained.
【0014】[0014]
【発明の実施の形態】以下、本発明を具体化した一実施
形態を図面と共に説明する。図1は、本実施形態の平面
形伝送線路(平面形導波路)1の概略構成を示す要部断
面斜視図である。図2および図3は平面形伝送線路1の
概略構成を示す要部断面図であり、図2は図1における
矢印A−A方向から切断して見た断面図、図3は図1に
おける矢印B−B方向から切断して見た断面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional perspective view of a main part showing a schematic configuration of a planar transmission line (planar waveguide) 1 of the present embodiment. 2 and 3 are cross-sectional views of a main part showing a schematic configuration of the planar transmission line 1. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is an arrow in FIG. FIG. 4 is a cross-sectional view taken along line BB.
【0015】平面形伝送線路1は、第1の接地平面導体
2、第1の誘電体基板3、ストリップ導体4、第3およ
び第4の接地平面導体5,6、第2の誘電体基板8、第
2の接地平面導体9が積層されて構成されている。すな
わち、板厚t1の誘電体基板3の裏面全面に接地平面導
体2が形成されている。また、誘電体基板3の表面に
は、ストリップ導体4と、当該ストリップ導体4を両側
から挟み込む各接地平面導体5,6とが形成されてい
る。そして、誘電体基板3上に、プリプレグ層から成る
板厚t2の誘電体基板8が貼付されている。また、誘電
体基板8の表面全面に接地平面導体9が形成されてい
る。また、各接地平面導体2,9および各接地平面導体
5,6は、各誘電体基板3,8を貫通して形成されたビ
アコンタクト(ビアホール,コンタクトホール)10を
介して互いに接続されると共に接地されている。
The planar transmission line 1 includes a first ground plane conductor 2, a first dielectric substrate 3, a strip conductor 4, third and fourth ground plane conductors 5, 6, and a second dielectric substrate 8. , A second ground plane conductor 9 are laminated. That is, the ground plane conductor 2 is formed on the entire back surface of the dielectric substrate 3 having the thickness t1. On the surface of the dielectric substrate 3, a strip conductor 4 and ground plane conductors 5 and 6 sandwiching the strip conductor 4 from both sides are formed. Then, on the dielectric substrate 3, a dielectric substrate 8 made of a prepreg layer and having a thickness of t2 is attached. A ground plane conductor 9 is formed on the entire surface of the dielectric substrate 8. The ground plane conductors 2 and 9 and the ground plane conductors 5 and 6 are connected to each other via via contacts (via holes and contact holes) 10 formed through the respective dielectric substrates 3 and 8, and Grounded.
【0016】尚、ストリップ導体4と各接地平面導体
5,6とはそれぞれ間隔dだけ離間している。また、各
平面接地導体2,9,5,6の配線抵抗により任意の部
分間に電位差が生じないように、ビアコンタクト10は
できるだけ多数設けることが望ましい。ビアコンタクト
10を設けることにより、各平面接地導体2,9,5,
6の全ての部分が接地電位になり、後述する電磁シール
ド効果をより確実に得ることができる。
The strip conductor 4 and the ground plane conductors 5 and 6 are separated from each other by a distance d. Also, it is desirable to provide as many via contacts 10 as possible so that a potential difference does not occur between arbitrary portions due to the wiring resistance of each of the planar ground conductors 2, 9, 5, and 6. By providing the via contact 10, each planar ground conductor 2, 9, 5, 5,
All parts of the circuit 6 have the ground potential, and the electromagnetic shielding effect described later can be obtained more reliably.
【0017】誘電体基板3は低損失高誘電率材料から成
り、例えば、ガラス繊維に各種樹脂を含浸させた基板
(ガラス・ポリイミド樹脂基板、ガラス・エポキシ樹脂
基板、ガラス・トリアジン樹脂基板、ガラス・フッ素樹
脂基板など)、紙に各種樹脂を含浸させた基板(紙・フ
ェノール樹脂基板、紙・ポリエステル樹など)、ガラス
布補強紙に各種樹脂を含浸させた基板、ガラス布補強ポ
リエステル繊維に各種樹脂を含浸させた基板、ポリスチ
ロール樹脂基板、アルミナ基板、溶融石英基板、サファ
イア基板などがある。
The dielectric substrate 3 is made of a material having a low loss and a high dielectric constant. For example, a substrate in which various resins are impregnated into glass fibers (a glass / polyimide resin substrate, a glass / epoxy resin substrate, a glass / triazine resin substrate, a glass / triazine resin substrate, Fluororesin substrate), paper impregnated with various resins (paper / phenolic resin substrate, paper / polyester resin, etc.), glass cloth reinforced paper impregnated with various resins, glass cloth reinforced polyester fiber with various resins , A polystyrene resin substrate, an alumina substrate, a fused quartz substrate, a sapphire substrate, and the like.
【0018】各導体2,4,5,6,9は銅やアルミニ
ウムなどの導電材料箔から成り、各誘電体基板3,8に
貼付されている。誘電体基板8を形成するプリプレグ層
は、充填繊維にマトリック樹脂が含浸されて形成され、
例えば、ガラス繊維やアラミド繊維にポリイミド樹脂や
エポキシ樹脂を含浸させたものなどがある。
Each of the conductors 2, 4, 5, 6, and 9 is made of a conductive material foil such as copper or aluminum, and is attached to each of the dielectric substrates 3 and 8. The prepreg layer forming the dielectric substrate 8 is formed by impregnating the filling fiber with a matrix resin,
For example, there is a glass fiber or an aramid fiber impregnated with a polyimide resin or an epoxy resin.
【0019】このように構成された平面形伝送線路1
は、一般的な多層プリント基板の製造技術を利用して簡
単に製造することができる。すなわち、両面に導電材料
箔が貼付された誘電体基板3(両面プリント基板)の一
方の面の導電材料箔を接地平面導体2とし、他方の面の
導電材料箔を通常のフォトエッチング技術を利用してパ
ターニングすることにより、ストリップ導体4および各
接地平面導体5,6を形成する。次に、誘電体基板3に
おける各導体4〜6が形成された面の上に、誘電体基板
8と成るプリプレグ層と、接地平面導体9と成る導電材
料箔とをこの順番で重ね合わせる。そして、ホットプレ
スすることにより、各誘電体基板3,8を接着する。続
いて、各誘電体基板3,8に貫通孔を形成し、当該貫通
孔の内壁面にめっき層を形成することにより、めっきス
ルーホールから成るビアコンタクト10を形成する。
The planar transmission line 1 constructed as described above
Can be easily manufactured using a general multilayer printed circuit board manufacturing technique. That is, the conductive material foil on one surface of the dielectric substrate 3 (double-sided printed circuit board) having the conductive material foil adhered on both surfaces is used as the ground plane conductor 2, and the conductive material foil on the other surface is used by a normal photo-etching technique. Then, the strip conductor 4 and the ground plane conductors 5 and 6 are formed by patterning. Next, a prepreg layer serving as the dielectric substrate 8 and a conductive material foil serving as the ground plane conductor 9 are laminated in this order on the surface of the dielectric substrate 3 on which the conductors 4 to 6 are formed. Then, the dielectric substrates 3 and 8 are bonded by hot pressing. Subsequently, a through-hole is formed in each of the dielectric substrates 3 and 8, and a plating layer is formed on the inner wall surface of the through-hole, thereby forming a via contact 10 including a plated-through hole.
【0020】このように、本実施形態の平面形伝送線路
1は、ストリップ導体4が、各接地平面導体2,9によ
って上下方向から挟まれると共に、各接地平面導体5,
6によって左右方向から挟まれて構成されている。尚、
ストリップ導体4と接地平面導体2とは、誘電体基板3
の板厚t1分だけ離間している。また、ストリップ導体
4と接地平面導体9とは、誘電体基板8の板厚t2だけ
離間している。そして、ストリップ導体4と各接地平面
導体5,6とは間隔dだけ離間している。
As described above, in the planar transmission line 1 of the present embodiment, the strip conductor 4 is sandwiched between the ground plane conductors 2 and 9 from above and below, and
6 sandwiched from the left and right directions. still,
The strip conductor 4 and the ground plane conductor 2 are
Are separated by the plate thickness t1. Further, the strip conductor 4 and the ground plane conductor 9 are separated by the thickness t2 of the dielectric substrate 8. The strip conductor 4 and each of the ground plane conductors 5 and 6 are separated by a distance d.
【0021】従って、ストリップ導体4が接地平面導体
9,2,5,6によって上下左右方向から一定間隔だけ
離間して挟まれることで電磁シールドが施されているた
め、ストリップ導体4中を伝送される電磁波の伝送方向
(ストリップ導体4の長手方向)と直角な断面内におい
て、電磁波が外部に漏れるのを防止することができる。
また、外部からの電磁波がストリップ導体4中を伝送さ
れる電磁波に影響を与えるのを防止することができる。
つまり、各接地平面導体2,9は、ストリップ導体4か
ら上下方向に放射される電磁波およびストリップ導体4
に対して上下方向から入射される電磁波を遮断する。ま
た、各接地平面導体5,6は、ストリップ導体4から左
右方向に放射される電磁波およびストリップ導体4に対
して左右方向から入射される電磁波を遮断する。
Therefore, since the strip conductor 4 is sandwiched between the ground plane conductors 9, 2, 5, and 6 at a certain interval from the top, bottom, left, and right directions to provide an electromagnetic shield, transmission is performed through the strip conductor 4. The electromagnetic wave can be prevented from leaking to the outside in a section perpendicular to the transmission direction of the electromagnetic wave (the longitudinal direction of the strip conductor 4).
Further, it is possible to prevent external electromagnetic waves from affecting the electromagnetic waves transmitted through the strip conductor 4.
That is, each of the ground plane conductors 2 and 9 is connected to the electromagnetic wave radiated in the vertical direction from the strip conductor 4 and the
To block electromagnetic waves incident from above and below. Each of the ground plane conductors 5 and 6 blocks an electromagnetic wave radiated from the strip conductor 4 in the left-right direction and an electromagnetic wave incident on the strip conductor 4 from the left-right direction.
【0022】すなわち、平面形伝送線路1は、ストリッ
プ線路とコプレーナ線路とを併用したものにほかなら
ず、両線路の相乗効果により優れた電磁シールド性能を
備えている。そのため、平面形伝送線路1を携帯電話機
のような高密度基板を用いる電子機器に適用すれば、電
磁波の放射が少なく、外部からの干渉を受けにくいた
め、当該電子機器の性能を向上させることができる。
That is, the planar transmission line 1 is nothing but a combination of a strip line and a coplanar line, and has excellent electromagnetic shielding performance due to a synergistic effect of both lines. Therefore, if the flat transmission line 1 is applied to an electronic device using a high-density substrate, such as a mobile phone, the radiation of electromagnetic waves is small and the device is less susceptible to external interference, so that the performance of the electronic device can be improved. it can.
【0023】尚、本発明は上記実施形態に限定されるも
のではなく、以下のように変更してもよく、その場合で
も、上記実施形態と同様の作用および効果を得ることが
できる。 (1)ビアコンタクト10は、めっきスルーホールに限
らず、他の接続方法(ワイヤ接続,はとめ金具接続,銀
ペースト充填など)を利用して具体化してもよい。
The present invention is not limited to the above embodiment, but may be modified as follows. Even in such a case, the same operation and effect as those of the above embodiment can be obtained. (1) The via contact 10 is not limited to the plated through hole, and may be embodied using other connection methods (wire connection, fitting connection, silver paste filling, etc.).
【0024】(2)上記実施形態は多層プリント基板を
用いて具体化したものであるが、多層セラミック基板を
用いて具体化してもよい。その場合、各誘電体基板2,
8は、アルミナ,ムライト,ステアタイト,ベリリア,
ホルステライトなどの低損失高誘電率材料のグリーンシ
ートを用いて形成され、積層後に焼成される。
(2) Although the above embodiment is embodied using a multilayer printed circuit board, it may be embodied using a multilayer ceramic substrate. In that case, each dielectric substrate 2,
8 is alumina, mullite, steatite, beryllia,
It is formed using a green sheet of a low-loss high-dielectric-constant material such as holsterite and fired after lamination.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明を具体化した一実施形態の断面構造を示
す要部断面斜視図。
FIG. 1 is a cross-sectional perspective view of a main part showing a cross-sectional structure according to an embodiment of the invention.
【図2】一実施形態の断面構造を示す要部断面図。FIG. 2 is an essential part cross-sectional view showing a cross-sectional structure of one embodiment.
【図3】一実施形態の断面構造を示す要部断面図。FIG. 3 is an essential part cross-sectional view showing a cross-sectional structure of one embodiment.
【符号の説明】[Explanation of symbols]
1…平面形伝送線路 2…第1の接地平面導体 3
…第1の誘電体基板 4…ストリップ導体 5…第3の接地平面導体 6…第4の接地平面導体 8…第2の誘電体基板 9…第2の接地平面導体 10…ビアコンタクト
DESCRIPTION OF SYMBOLS 1 ... Planar transmission line 2 ... 1st ground plane conductor 3
... first dielectric substrate 4 ... strip conductor 5 ... third ground plane conductor 6 ... fourth ground plane conductor 8 ... second dielectric substrate 9 ... second ground plane conductor 10 ... via contact

Claims (3)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 電磁波が伝送されるストリップ導体と、 当該ストリップ導体に対して一定間隔だけ離間して上下
    方向からそれぞれ挟む第1および第2の接地平面導体
    と、 前記ストリップ導体に対して一定間隔だけ離間して左右
    方向からそれぞれ挟む第3および第4の接地平面導体と
    を備えたことを特徴とする平面形伝送線路。
    1. A strip conductor through which an electromagnetic wave is transmitted, first and second ground plane conductors which are spaced apart from the strip conductor by a fixed distance and sandwiched from above and below, respectively; A flat transmission line comprising: third and fourth ground plane conductors that are separated from each other only in the left and right directions.
  2. 【請求項2】 請求項1に記載の平面形伝送線路におい
    て、 前記第1の接地平面導体が一方の面に形成され、前記ス
    トリップ導体と前記第3および第4の接地平面導体とが
    他方の面に形成された第1の誘電体基板と、 前記第2の接地平面導体が一方の面に形成され、他方の
    面が前記第1の誘電体基板と対向して配置された第2の
    誘電体基板とを備えたことを特徴とする平面形伝送線
    路。
    2. The planar transmission line according to claim 1, wherein the first ground plane conductor is formed on one surface, and the strip conductor and the third and fourth ground plane conductors are formed on the other side. A first dielectric substrate formed on a surface of the first dielectric substrate, and a second ground plane conductor formed on one surface of the second dielectric substrate, the other surface of which is disposed to face the first dielectric substrate. A planar transmission line comprising a body substrate.
  3. 【請求項3】 請求項2に記載の平面形伝送線路におい
    て、 前記第1,第2,第3,第4の接地平面導体をそれぞれ
    接続するビアコンタクトを備え、当該ビアコンタクトが
    前記第1および第2の誘電体基板を貫通して形成された
    ことを特徴とする平面形伝送線路。
    3. The planar transmission line according to claim 2, further comprising a via contact for connecting the first, second, third, and fourth ground plane conductors, wherein the via contact includes the first and second ground plane conductors. A planar transmission line formed through a second dielectric substrate.
JP10182684A 1998-06-29 1998-06-29 Planar transmission line Pending JP2000022406A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10182684A JP2000022406A (en) 1998-06-29 1998-06-29 Planar transmission line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10182684A JP2000022406A (en) 1998-06-29 1998-06-29 Planar transmission line

Publications (1)

Publication Number Publication Date
JP2000022406A true JP2000022406A (en) 2000-01-21

Family

ID=16122637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10182684A Pending JP2000022406A (en) 1998-06-29 1998-06-29 Planar transmission line

Country Status (1)

Country Link
JP (1) JP2000022406A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026690A1 (en) * 2006-09-01 2008-03-06 Nec Corporation High frequency transmission line
JP2008193320A (en) * 2007-02-02 2008-08-21 Mitsubishi Electric Corp Low-pass filter
JP2011527171A (en) * 2008-07-07 2011-10-20 キルダル アンテナ コンサルティング アクティエボラーグ Waveguides and transmission lines in the gap between parallel conducting surfaces.
JP2012094639A (en) * 2010-10-26 2012-05-17 Kyocera Corp Circuit board, package for housing electronic component, and electronic device
JP2015231105A (en) * 2014-06-04 2015-12-21 三菱電機株式会社 Strip line

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026690A1 (en) * 2006-09-01 2008-03-06 Nec Corporation High frequency transmission line
US8154364B2 (en) 2006-09-01 2012-04-10 Nec Corporation High-frequency transmission line having ground surface patterns with a plurality of notches therein
JP5207065B2 (en) * 2006-09-01 2013-06-12 日本電気株式会社 High frequency transmission line
JP2008193320A (en) * 2007-02-02 2008-08-21 Mitsubishi Electric Corp Low-pass filter
JP2011527171A (en) * 2008-07-07 2011-10-20 キルダル アンテナ コンサルティング アクティエボラーグ Waveguides and transmission lines in the gap between parallel conducting surfaces.
US8803638B2 (en) 2008-07-07 2014-08-12 Kildal Antenna Consulting Ab Waveguides and transmission lines in gaps between parallel conducting surfaces
JP2012094639A (en) * 2010-10-26 2012-05-17 Kyocera Corp Circuit board, package for housing electronic component, and electronic device
JP2015231105A (en) * 2014-06-04 2015-12-21 三菱電機株式会社 Strip line

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