CN102009513A - Insulating reinforced plate and making method thereof - Google Patents

Insulating reinforced plate and making method thereof Download PDF

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Publication number
CN102009513A
CN102009513A CN2010102333330A CN201010233333A CN102009513A CN 102009513 A CN102009513 A CN 102009513A CN 2010102333330 A CN2010102333330 A CN 2010102333330A CN 201010233333 A CN201010233333 A CN 201010233333A CN 102009513 A CN102009513 A CN 102009513A
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Prior art keywords
insulation
sheet material
prepreg
strengthens
cure
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CN2010102333330A
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CN102009513B (en
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方东炜
张君宝
吴小连
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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Abstract

The invention relates to an insulating reinforced plate and a making method thereof. The method comprises the steps of: 1, providing a plurality of prepregs, matching the prepregs according to the required thickness, and coating release films on two sides; 2, heating and pressurizing the prepregs with two sides coated with the release films through a press; and 3, melting the prepregs at high temperature and starting generating a cure reaction, and stopping heating before the material is cured completely so that the prepregs reach the pre-curing stage and become the insulating reinforced plate with low curing degree at this time. The invention ensures that the prepregs formed by laminating according to the required thickness are pre-cured with a certain degree to prepare the insulating reinforced plate with low curing degree through a low-curing process, and the insulating reinforced plate in the state can participate in the cure reaction in a subsequent pressing process without obvious resin flowing.

Description

Preparation method and this insulation that insulation strengthens sheet material strengthen sheet material
Technical field
The present invention relates to copper-clad plate (CCL), reach printed circuit board (PCB) (PCB) field, relate in particular to solid state and strengthen sheet material and preparation method thereof between the insulation of the low state of cure of prepreg and curing copper-clad plate (or insulation board).
Background technology
Along with the constantly development of " thin, light, small-sized " change of electronic product, high density interconnect (HDI) multi-layer sheet is constantly pursued slimming, makes printed wiring board constantly to high multi-layered high-density circuit distribution arrangement development.Impedance design in the multi-layer sheet has determined multiple-plate thickness of dielectric layers, and dielectric layer is realized by the prepreg collocation between central layer.It is reinforcing material (glass cloth, glass paper, aramid fiber cloth/paper etc.) that multi-layer sheet is made the prepreg that uses, and reaches semi-cured state at a certain temperature by the steeping liq resin.When the thickness of insulating layer that needs when design is thicker, need to use many bonding sheets compactings to form, at this moment can cause occurring in the pressing process shortcomings such as gummosis is big, interformational sliding, thickness evenness difference.
In order to solve the structure problem of many prepregs, industry has two kinds of replacement methods, the first is directly replaced the part prepreg (as replacing wherein 2 of 4 prepregs with insulation board, reduce prepreg quantity), though this method solves problems such as gummosis is big, but exist the interface in conjunction with bad problem, can't satisfy the requirement of reliability; Second it be to use the whole plate etching of copper-clad plate to replace, and this method can better be taken into account and solve the problem that gummosis combines with the interface, but have the cost height, efficient is low and shortcoming such as not environmental protection.
Along with the whole world to the raising of the fieriness of the raising of environmental requirement, industry competition and electronic product to performance requirement, improve the pcb board of this class formation production efficiency, reduce cost, enhance product performance significant.
Summary of the invention
The objective of the invention is to, provide a kind of the insulation to strengthen the preparation method of sheet material, its making flow process is simple, meets low energy consumption, low cost, oligosaprobic low-carbon economy notion.
Another object of the present invention is to, provide a kind of insulation to strengthen sheet material, its solid state is between prepreg and curing copper-clad plate (or insulation board), can be applied to multi-layer sheet production, not only can solve problems such as the pressing plate gummosis is big, interface binding power is good, and meets low cost, low energy consumption, oligosaprobic low-carbon economy notion.
For achieving the above object, the invention provides a kind of the insulation and strengthen the preparation method of sheet material, it comprises the steps:
Step 1, provide several prepregs, and prepreg is arranged in pairs or groups according to desired thickness, two-sided coated with mould release membrance;
Step 2, with the two-sided prepreg that pastes mould release membrance by press heating pressurization;
Step 3, treat that prepreg through high-temperature fusion attitude and begin to take place curing reaction, stopped heating before material solidifies fully, this moment, prepreg reached pre-cure phase, and the insulation that becomes low state of cure strengthens sheet material.
In the described step 2, prepreg is heated pressurization by vacuum press.
In the described step 3, treat that controlling heating rate after the prepreg material temperature reaches 80 ℃ is 180～320psi at 1.0～2.5 ℃/min, pressure, promptly stops heating when the prepreg material temperature reaches 130～190 ℃.
The insulation of described low state of cure strengthens sheet material and comprises the test by DMA, is scanned up to such resin solidification temperature, and the insulation that storage modulus can be on the rise after decline becomes to putting down strengthens sheet material.
The insulation enhancing sheet material of described low state of cure is included on the insulation enhancing sheet material and is covered with Copper Foil, uses required solidification temperature of this resinous type and pressure condition pressing, solidifies the insulation enhancing sheet material of back Copper Foil PS value＞0.2N/mm fully.
The insulation of described low state of cure strengthens sheet material and comprises use required solidification temperature of this resinous type and pressure condition pressing, and gummosis strengthens sheet material less than the insulation of 2mm.
The insulation of described low state of cure strengthens sheet material and comprises the test by DSC, and the insulation of Δ Tg＞10 ℃ strengthens sheet material.
Further, the present invention also provides a kind of insulation to strengthen sheet material, and it comprises prepreg that several Zhang Houdu are formed by stacking, and is covered in the mould release membrance on this prepreg two sides respectively, and described mould release membrance passes through the high-temperature fusion attitude with prepreg and also reaches pre-cure phase.
Described two sides pastes the prepreg of mould release membrance by press heating pressurization, treat that controlling heating rate after the prepreg material temperature reaches 80 ℃ is 180～320psi at 1.0～2.5 ℃/min, pressure, promptly stop heating when the prepreg material temperature reaches 130～190 ℃, this moment, prepreg reached pre-cure phase.
Beneficial effect of the present invention: preparation method and this insulation that insulation provided by the present invention strengthens sheet material strengthen sheet material, it is by low manufacture craft of solidifying, make prepreg that thickness as requested is formed by stacking strengthen sheet material through the insulation that to a certain degree precuring makes low state of cure, the insulation this state under strengthens sheet material can the participation curing reaction in follow-up pressing process but do not have obvious resin flows; Using the insulation of this low state of cure to strengthen sheet material replaces the etching copper-clad plate commonly used of present industry and is used for multi-layer sheet production, can solve problems such as many multiple-plate pressing plate gummosis of prepreg structure are big, interformational sliding, thickness evenness difference, distinctive curing reaction once more makes storeroom overall performance unanimity, the interface is in conjunction with good, guarantee the product reliability quality, the while can also reduce production costs, economize on resources and reduce disposal of pollutants.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 insulate for the present invention and strengthens the preparation method schematic flow sheet of sheet material;
Fig. 2 strengthens the DMA scintigram of sheet material for insulation among the present invention.
The specific embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
As shown in Figure 1, the invention provides a kind of the insulation and strengthen the preparation method of sheet material, it comprises the steps:
Step 1, provide several prepregs, and prepreg is arranged in pairs or groups according to desired thickness, two-sided coated with mould release membrance.
Step 2, with the two-sided prepreg that pastes mould release membrance by press heating pressurization.In this step 2, can heat pressurization to prepreg by vacuum press.
Step 3, treat that prepreg through high-temperature fusion attitude and begin to take place curing reaction, stopped heating before material solidifies fully, this moment, prepreg reached pre-cure phase, and the insulation that becomes low state of cure strengthens sheet material.As a kind of specific embodiment of the present invention, in this step, treat that controlling heating rate after the prepreg material temperature reaches 80 ℃ is 180～320psi at 1.0～2.5 ℃/min, pressure, when reaching 130～190 ℃, the prepreg material temperature promptly stops heating, this moment, prepreg reached pre-cure phase, and the insulation that becomes low state of cure strengthens sheet material.Wherein, the decision method that should hang down the insulation enhancing sheet material of state of cure comprises: method one: test by DMA, be scanned up to such resin solidification temperature, storage modulus can be on the rise after decline becomes to putting down, as shown in Figure 2, A/B/C/D represents that the insulation of different precuring times strengthens the sheet material sample, precuring time A＞B＞C＞D, and E is for solidifying the copper-clad plate sample fully.Method two: on insulation enhancing sheet material, be covered with Copper Foil, use required solidification temperature of this resinous type and pressure condition pressing, solidify back Copper Foil PS value＞0.2N/mm fully.Method three: use required solidification temperature of this resinous type and pressure condition pressing, gummosis is less than 2mm.Method four: by DSC test, Δ Tg＞10 ℃.All insulation that meet above-mentioned one or more conditions strengthen insulation that sheet material all can be used as low state of cure of the present invention and strengthen sheet material and be applied to multiple-plate production, using the insulation of this low state of cure to strengthen sheet material replaces the etching copper-clad plate commonly used of present industry and is used for multi-layer sheet production, it is big to solve many multiple-plate pressing plate gummosis of prepreg structure, interformational sliding, problems such as thickness evenness difference, distinctive curing reaction once more makes storeroom overall performance unanimity, the interface is in conjunction with good, guarantee the product reliability quality, can also reduce production costs simultaneously, economize on resources and reduce disposal of pollutants.
Following as insulate a kind of specific embodiment of the preparation method that strengthens sheet material of the present invention:
Prepreg is arranged in pairs or groups according to desired thickness, two-sided coated with mould release membrance, make prepreg process high-temperature fusion attitude and begin to take place curing reaction by press heating pressurization, before solidifying fully, material stops heating, the insulation that becomes low state of cure strengthens sheet material, in follow-up lamination process, curing reaction can take place further, but resin flows is not obvious.For example: the material pre-hardening thickness compression technology of epoxy resin+DICY system can be:
T/℃ 140 160 190
t/min 5 10 15--40
P/psi 100 150 280
t/min 10 5 15--40
Further, the present invention also provides a kind of insulation to strengthen sheet material, and it comprises prepreg that several Zhang Houdu are formed by stacking, and is covered in the mould release membrance on this prepreg two sides respectively, and described mould release membrance passes through the high-temperature fusion attitude with prepreg and also reaches pre-cure phase.In this invention, the two sides pastes the prepreg of mould release membrance by press heating pressurization, treat that controlling heating rate after the prepreg material temperature reaches 80 ℃ is 180～320psi at 1.0～2.5 ℃/min, pressure, when reaching 130～190 ℃, the prepreg material temperature promptly stops heating, this moment, prepreg reached pre-cure phase, and the insulation that can obtain low state of cure of the present invention strengthens sheet material.
In sum, preparation method and this insulation that insulation provided by the present invention strengthens sheet material strengthen sheet material, it is by low manufacture craft of solidifying, make prepreg that thickness as requested is formed by stacking strengthen sheet material through the insulation that to a certain degree precuring makes low state of cure, the insulation this state under strengthens sheet material can the participation curing reaction in follow-up pressing process but do not have obvious resin flows; Using the insulation of this low state of cure to strengthen sheet material replaces the etching copper-clad plate commonly used of present industry and is used for multi-layer sheet production, can solve problems such as many multiple-plate pressing plate gummosis of prepreg structure are big, interformational sliding, thickness evenness difference, distinctive curing reaction once more makes storeroom overall performance unanimity, the interface is in conjunction with good, guarantee the product reliability quality, the while can also reduce production costs, economize on resources and reduce disposal of pollutants.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of accompanying Claim of the present invention.

Claims (9)

1. the preparation method of enhancing sheet material that insulate is characterized in that, comprises the steps:
Step 1, provide several prepregs, and prepreg is arranged in pairs or groups according to desired thickness, two-sided coated with mould release membrance;
Step 2, with the two-sided prepreg that pastes mould release membrance by press heating pressurization;
Step 3, treat that prepreg through high-temperature fusion attitude and begin to take place curing reaction, stopped heating before material solidifies fully, this moment, prepreg reached pre-cure phase, and the insulation that becomes low state of cure strengthens sheet material.
2. insulation as claimed in claim 1 strengthens the preparation method of sheet material, it is characterized in that, in the described step 2, by vacuum press prepreg is heated pressurization.
3. insulation as claimed in claim 1 strengthens the preparation method of sheet material, it is characterized in that, in the described step 3, treat that controlling heating rate after the prepreg material temperature reaches 80 ℃ is 180～320psi at 1.0～2.5 ℃/min, pressure, promptly stops heating when the prepreg material temperature reaches 130～190 ℃.
4. insulation as claimed in claim 1 strengthens the preparation method of sheet material, it is characterized in that, the insulation of described low state of cure strengthens sheet material and comprises the test by DMA, is scanned up to such resin solidification temperature, and the insulation that storage modulus can be on the rise after decline becomes to putting down strengthens sheet material.
5. insulation as claimed in claim 1 strengthens the preparation method of sheet material, it is characterized in that, the insulation enhancing sheet material of described low state of cure is included on the insulation enhancing sheet material and is covered with Copper Foil, use required solidification temperature of this resinous type and pressure condition pressing, the insulation of solidifying back Copper Foil PS value＞0.2N/mm fully strengthens sheet material.
6. insulation as claimed in claim 1 strengthens the preparation method of sheet material, it is characterized in that, the insulation of described low state of cure strengthens sheet material and comprises use required solidification temperature of this resinous type and pressure condition pressing, and gummosis strengthens sheet material less than the insulation of 2mm.
7. insulation as claimed in claim 1 strengthens the preparation method of sheet material, it is characterized in that, the insulation of described low state of cure strengthens sheet material and comprises the test by DSC, and the insulation of Δ Tg＞10 ℃ strengthens sheet material.
8. an insulation strengthens sheet material, it is characterized in that, comprises prepreg that several Zhang Houdu are formed by stacking, and is covered in the mould release membrance on this prepreg two sides respectively, and described mould release membrance passes through the high-temperature fusion attitude with prepreg and also reaches pre-cure phase.
9. insulation as claimed in claim 8 strengthens sheet material, it is characterized in that, described two sides pastes the prepreg of mould release membrance by press heating pressurization, treat that controlling heating rate after the prepreg material temperature reaches 80 ℃ is 180～320psi at 1.0～2.5 ℃/min, pressure, promptly stop heating when the prepreg material temperature reaches 130～190 ℃, this moment, prepreg reached pre-cure phase.
CN 201010233333 2010-07-21 2010-07-21 Insulating reinforced plate and making method thereof Active CN102009513B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102909912A (en) * 2012-10-25 2013-02-06 广东生益科技股份有限公司 Insulating plate and preparation method thereof
CN103419436A (en) * 2013-07-17 2013-12-04 广东生益科技股份有限公司 Double plate and preparation method thereof
CN110116541A (en) * 2019-05-13 2019-08-13 广德龙泰电子科技有限公司 A kind of middle TG reheating deformation solidification copper-clad laminate production technology
CN110901197A (en) * 2019-12-06 2020-03-24 南亚新材料科技股份有限公司 Application method of PTFE bonding sheet and PTFE plate prepared by using same
CN114103307A (en) * 2021-12-06 2022-03-01 中国电子科技集团公司第四十六研究所 Low-warpage thermosetting resin copper-clad plate and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1520250A (en) * 2003-02-06 2004-08-11 Lg电子株式会社 Method for mutually connecting multolayer printed circuit board
CN101221833A (en) * 2007-12-20 2008-07-16 株洲南车时代电气股份有限公司 Composite insulating material and its processing method
US20090236038A1 (en) * 2008-03-18 2009-09-24 Samsung Electro-Mechanics Co., Ltd Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same
WO2010050472A1 (en) * 2008-10-29 2010-05-06 住友ベークライト株式会社 Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1520250A (en) * 2003-02-06 2004-08-11 Lg电子株式会社 Method for mutually connecting multolayer printed circuit board
CN101221833A (en) * 2007-12-20 2008-07-16 株洲南车时代电气股份有限公司 Composite insulating material and its processing method
US20090236038A1 (en) * 2008-03-18 2009-09-24 Samsung Electro-Mechanics Co., Ltd Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same
WO2010050472A1 (en) * 2008-10-29 2010-05-06 住友ベークライト株式会社 Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102909912A (en) * 2012-10-25 2013-02-06 广东生益科技股份有限公司 Insulating plate and preparation method thereof
CN103419436A (en) * 2013-07-17 2013-12-04 广东生益科技股份有限公司 Double plate and preparation method thereof
CN103419436B (en) * 2013-07-17 2016-08-10 广东生益科技股份有限公司 A kind of double plate and preparation method thereof
CN110116541A (en) * 2019-05-13 2019-08-13 广德龙泰电子科技有限公司 A kind of middle TG reheating deformation solidification copper-clad laminate production technology
CN110901197A (en) * 2019-12-06 2020-03-24 南亚新材料科技股份有限公司 Application method of PTFE bonding sheet and PTFE plate prepared by using same
CN114103307A (en) * 2021-12-06 2022-03-01 中国电子科技集团公司第四十六研究所 Low-warpage thermosetting resin copper-clad plate and preparation method thereof

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