CN102963064A - Metamaterial and preparation method thereof - Google Patents
Metamaterial and preparation method thereof Download PDFInfo
- Publication number
- CN102963064A CN102963064A CN2012104757100A CN201210475710A CN102963064A CN 102963064 A CN102963064 A CN 102963064A CN 2012104757100 A CN2012104757100 A CN 2012104757100A CN 201210475710 A CN201210475710 A CN 201210475710A CN 102963064 A CN102963064 A CN 102963064A
- Authority
- CN
- China
- Prior art keywords
- super material
- substrate
- copper foil
- organic resin
- pure organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention relates to the field of metamaterials. Metamaterial is produced by bonding a plurality of metamaterial base plates etched with an artificial microstructure together via a hot-melt adhesive. The invention further provides a preparation method for the metamaterial, wherein purely organic resin is used for producing the metamaterial, so that the metamaterial is low in density, light in weight and convenient to carry; simultaneously, the metamaterial has the characteristics of being corrosion-resistant, impact-resistant, fireproof, moistureproof, sound-proofing, anti-seismic and the like; and with the adoption of the metamaterial base plates etched with the artificial microstructure, the metamaterial has excellent and stable electromagnetic characteristics.
Description
Technical field
The present invention relates to the medium substrate field, relate in particular to a kind of super material and preparation method thereof.
Background technology
The at present realization of super material microstructure is to make metal wire in the copper-clad plate of thermoset glass polymeric resin matrix to finish.The main medium baseplate material is the employed insulation material of wiring board industry: material FR4, PTFE, polyimides etc.Use FR4, polyimides to be base material, its dielectric loss is larger, affects super material property.And using the PTFE substrate, its cost is very high, causes super material totle drilling cost significantly to rise, and has limited the scale of super material and has used.Thermoplastic macromolecule resin's dielectric material loss of polyolefin one class is low, and near PTFE, and price is very low, is the ideal material of the super material of preparation.But because most polyolefine material polarity is less, surperficial caking property is relatively poor.Use at present the mode of electroplating that copper is covered on the PS surface, but the cost of plating mode is high, waste water and waste liquid is many, has higher pollution, and the adhesion of itself and copper is relatively poor, can't satisfy processing request.
Summary of the invention
Technical problem to be solved by this invention is, the defective that overcomes that super material is overweight in the prior art, loss is excessive etc. provides a kind of super material that adopts pure organic resin substrate, and this super material weight is light, loss is little, brings great convenience for making electromagnetic product.
The present invention solves the problems of the technologies described above the technical scheme that adopts:
A kind of super material is provided, and described super material is formed by stacking by the super material substrate of one deck at least, and described super material substrate comprises that one deck Copper Foil and one deck resin substrate form, and described Copper Foil and described resin substrate are superimposed.
Further, described Copper Foil and described resin substrate are to be combined by melt viscosity.
Further, described resin substrate is pure organic resin sheet material.
Further, described pure organic resin sheet material comprises thermoplastic resin and thermosetting resin.
Further, described thermoplastic resin comprises polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyamide, polyester, Teflon and organosilicon.
Further, described thermosetting resin comprises epoxy resin, phenolic resins polyurethane, phenolic aldehyde and organosilicon.
Further, described super material is comprised of the super material substrate by artificial micro-structural of one deck etching at least.
Further, described super material is comprised of the super material substrate stack of two-layer above etching by artificial micro-structural.
Further, described two-layer above super material substrate is integrated by melt viscosity.
Further, described artificial micro-structural obtains by etching on Copper Foil.
Super material of the present invention has following beneficial effect: the present invention adopts pure organic resin to make super material, so that super density of material is less, weight is lighter, is easy to carry; Simultaneously should super material have the characteristics such as anti-corrosion, anti-wound is hit, prevented fires, protection against the tide, sound insulation, antidetonation; Adopt etching the super material substrate of artificial micro-structural to be arranged so that super material has better, more stable electromagnetic property.
The present invention also provides a kind of individual layer super material preparation method, and described method comprises:
(1) by PUR one deck Copper Foil and the pure organic resin base plate bonding of one deck are formed super material substrate together;
(2) the artificial micro-structural of etching on the Copper Foil of described super material substrate.
Further, described step (1) also comprises the pre-treatment of pure organic resin substrate, and described pre-treatment comprises oil removing, washing and the drying of pure organic resin substrate.
Further, Copper Foil, PUR and pure organic resin substrate form super material substrate by heat pressure adhesive together in the described step (1).
The present invention also provides a kind of multilayer super material preparation method, and described method comprises:
(1) by PUR one deck Copper Foil and the pure organic resin base plate bonding of one deck are formed super material substrate together;
(2) the artificial micro-structural of etching on the Copper Foil of described super material substrate;
(3) a plurality of etchings there is the super material substrate of artificial micro-structural make super material by PUR lamination, hot pressing.
Further, described step (1) also comprises the pre-treatment of pure organic resin substrate, and described pre-treatment comprises oil removing, washing and the drying of pure organic resin substrate.
Further, Copper Foil, PUR and pure organic resin substrate form super material substrate by heat pressure adhesive together in the described step (1).
The super material that preparation method of the present invention obtains has following beneficial effect with respect to prior art: the present invention adopts pure organic resin to make super material, so that super density of material is less, weight is lighter, is easy to carry; Simultaneously should super material have the characteristics such as anti-corrosion, anti-wound is hit, prevented fires, protection against the tide, sound insulation, antidetonation; Adopt etching the super material substrate of artificial micro-structural to be arranged so that super material has better, more stable electromagnetic property.
Description of drawings
Fig. 1 is the structural representation of super material of the present invention;
Fig. 2 is that super material substrate of the present invention is made flow chart;
Fig. 3 is super material substrate structural representation of the present invention;
Fig. 4 is the making flow chart of super material of the present invention.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited to this.
A kind of structural representation of super material as shown in Figure 1, this super material is formed by stacking by the super material substrate of one deck at least, is to be combined by melt viscosity between every layer of super material substrate.As shown in Figure 3, each super material substrate comprises that one deck Copper Foil and one deck resin substrate form, Copper Foil and resin substrate are superimposed, Copper Foil and resin substrate are to be combined by melt viscosity, PUR refers to that normal temperature is the next solid-state, can melting after the heating and under molten condition the sticking family macromolecule resin base material of tool, resin base material can be polyamide, polyurethane, polyethylene etc., this resin substrate is for having thermoplasticity and heat cured pure organic resin sheet material.
This thermoplastic resin can be polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyamide, polyester, Teflon and organosilicon etc.
This thermosetting resin comprises epoxy resin, phenolic resins polyurethane, phenolic aldehyde and organosilicon.
Among the present invention, the Copper Foil etching on the super material substrate has artificial micro-structural, so that super material substrate has good electromagnetic property.
Be illustrated in figure 2 as super material substrate preparation flow schematic diagram, Fig. 4 is the making flow chart of super material of the present invention.
The invention provides the super material preparation method of a kind of individual layer, the method comprises:
(1) by PUR one deck Copper Foil and the pure organic resin base plate bonding of one deck are formed super material substrate together; In the super material preparation method of this individual layer, as shown in Figure 2, this step also can comprise the pre-treatment of pure organic resin substrate, and pre-treatment comprises oil removing, washing and the drying of pure organic resin substrate.Preferential selection of land, in this step, Copper Foil, PUR and pure organic resin substrate form super material substrate by heat pressure adhesive together.
(2) the artificial micro-structural of etching on the Copper Foil of described super material substrate.
The present invention also provides a kind of multilayer super material preparation method, and the method comprises:
(1) by PUR one deck Copper Foil and the pure organic resin base plate bonding of one deck are formed super material substrate together; In the super material preparation method of this multilayer, as shown in Figure 2, this step also can comprise the pre-treatment of pure organic resin substrate, and pre-treatment comprises oil removing, washing and the drying of pure organic resin substrate.Preferential selection of land, in this step, Copper Foil, PUR and pure organic resin substrate form super material substrate by heat pressure adhesive together.
(2) the artificial micro-structural of etching on the Copper Foil of described super material substrate;
(3) a plurality of etchings there is the super material substrate of artificial micro-structural make super material by PUR lamination, hot pressing.In the present embodiment, as shown in Figure 1, this super material adopts 6 layers of super material substrate; But the present invention also is confined to this, and the number of plies of super material can be decided according to concrete actual conditions.
The present invention adopts pure organic resin to make super material, so that super density of material is less, weight is lighter, is easy to carry; Simultaneously should super material have the characteristics such as anti-corrosion, anti-wound is hit, prevented fires, protection against the tide, sound insulation, antidetonation; Adopt etching the super material substrate of artificial micro-structural to be arranged so that super material has better, more stable electromagnetic property.
The above is described embodiments of the invention by reference to the accompanying drawings; but the present invention is not limited to the above-mentioned specific embodiment; the above-mentioned specific embodiment only is schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away from the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (16)
1. super material, described super material is formed by stacking by the super material substrate of one deck at least, it is characterized in that described super material substrate comprises that one deck Copper Foil and one deck resin substrate form, and described Copper Foil and described resin substrate are superimposed.
2. super material according to claim 1 is characterized in that, described Copper Foil and described resin substrate are to be combined by melt viscosity.
3. super material according to claim 1 is characterized in that, described resin substrate is pure organic resin sheet material.
4. super material according to claim 3 is characterized in that, described pure organic resin sheet material comprises thermoplastic resin or thermosetting resin.
5. super material according to claim 4 is characterized in that, described thermoplastic resin comprises polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyamide, polyester, Teflon and organosilicon.
6. super material according to claim 4 is characterized in that, described thermosetting resin comprises epoxy resin, phenolic resins polyurethane, phenolic aldehyde and organosilicon.
7. super material according to claim 1 is characterized in that, described super material is comprised of the super material substrate by artificial micro-structural of one deck etching at least.
8. a kind of super material according to claim 1 is characterized in that, described super material is comprised of the super material substrate stack of two-layer above etching by artificial micro-structural.
9. super material according to claim 1 is characterized in that, described two-layer above super material substrate is integrated by melt viscosity.
10. super material according to claim 7 is characterized in that, described artificial micro-structural obtains by etching on Copper Foil.
11. the super material preparation method of individual layer is characterized in that described method comprises:
(1) by PUR one deck Copper Foil and the pure organic resin base plate bonding of one deck are formed super material substrate together;
(2) the artificial micro-structural of etching on the Copper Foil of described super material substrate.
12. preparation method according to claim 11 is characterized in that, described step (1) also comprises the pre-treatment of pure organic resin substrate, and described pre-treatment comprises oil removing, washing and the drying of pure organic resin substrate.
13. preparation method according to claim 11 is characterized in that, Copper Foil, PUR and pure organic resin substrate form super material substrate by heat pressure adhesive together in the described step (1).
14. the super material preparation method of multilayer is characterized in that described method comprises:
(1) by PUR one deck Copper Foil and the pure organic resin base plate bonding of one deck are formed super material substrate together;
(2) the artificial micro-structural of etching on the Copper Foil of described super material substrate;
(3) a plurality of etchings there is the super material substrate of artificial micro-structural make super material by PUR lamination, hot pressing.
15. preparation method according to claim 14 is characterized in that, described step (1) also comprises the pre-treatment of pure organic resin substrate, and described pre-treatment comprises oil removing, washing and the drying of pure organic resin substrate.
16. preparation method according to claim 14 is characterized in that, Copper Foil, PUR and pure organic resin substrate form super material substrate by heat pressure adhesive together in the described step (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210475710.0A CN102963064B (en) | 2012-02-29 | 2012-11-21 | Metamaterial and preparation method thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210051028.9 | 2012-02-29 | ||
| CN201210051028 | 2012-02-29 | ||
| CN201210475710.0A CN102963064B (en) | 2012-02-29 | 2012-11-21 | Metamaterial and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102963064A true CN102963064A (en) | 2013-03-13 |
| CN102963064B CN102963064B (en) | 2014-04-16 |
Family
ID=47793637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210475710.0A Active CN102963064B (en) | 2012-02-29 | 2012-11-21 | Metamaterial and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102963064B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110562603A (en) * | 2019-09-16 | 2019-12-13 | 昆山新贝斯特电子包装材料有限公司 | high-strength carrier tape and manufacturing method thereof |
| CN113022049A (en) * | 2021-03-26 | 2021-06-25 | 重庆科技学院 | Novel copper-clad plate structure and manufacturing process thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201881601U (en) * | 2010-11-11 | 2011-06-29 | 广东生益科技股份有限公司 | High-dielectric-constant double-sided copper clad laminate |
-
2012
- 2012-11-21 CN CN201210475710.0A patent/CN102963064B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201881601U (en) * | 2010-11-11 | 2011-06-29 | 广东生益科技股份有限公司 | High-dielectric-constant double-sided copper clad laminate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110562603A (en) * | 2019-09-16 | 2019-12-13 | 昆山新贝斯特电子包装材料有限公司 | high-strength carrier tape and manufacturing method thereof |
| CN113022049A (en) * | 2021-03-26 | 2021-06-25 | 重庆科技学院 | Novel copper-clad plate structure and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102963064B (en) | 2014-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202310279U (en) | Graphical printed board at bottom of dual-step ladder groove | |
| CN106232350B (en) | With the metal foil and printed circuit board (PCB) for peeling off resin bed | |
| CN102395249B (en) | Manufacturing method of four-layer copper-based metal plate | |
| CN102595799A (en) | Manufacturing method of high-density interconnected printed circuit board | |
| CN102368890B (en) | Manufacturing method of PCB with embedded assembly | |
| CN103037640B (en) | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate | |
| CN102009514B (en) | Manufacturing method of sandwich plate | |
| JP2016026937A5 (en) | Release film | |
| CN103260350A (en) | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method | |
| CN205946346U (en) | Multilayer battery protection circuit board of high heat dissipating ability | |
| CN102963064B (en) | Metamaterial and preparation method thereof | |
| CN209462709U (en) | A kind of substrate and wiring board with carrier | |
| CN102673050B (en) | A kind of Metamaterial composite plate and processing method | |
| CN102689464B (en) | A kind of Metamaterial composite plate and processing method | |
| JP2008153580A5 (en) | ||
| CN202030694U (en) | High peel strength conductive glue film with through holes | |
| CN104228209A (en) | Metal-resin adhesion structure, circuit board and copper cladding foil layer including metal-resin adhesion structure, and method for making same structure | |
| CN102009513B (en) | Insulating reinforced plate and making method thereof | |
| CN203120285U (en) | Multilayer circuit board | |
| CN102963063B (en) | Metamaterial composite plate and machining method | |
| TW201630482A (en) | Multilayer printed wiring board, multilayer metal clad laminate, and resin coated metal foil | |
| CN203984767U (en) | A kind of high capacity aluminum-based circuit board | |
| CN102963070B (en) | Composite board, metamaterial and preparation methods | |
| CN104669710A (en) | Copper-clad plate with heat dissipation function and manufacturing method thereof | |
| CN102689465B (en) | A kind of Metamaterial composite plate and processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170103 Address after: 518034 A international business center, No. 1061, Xiang Mei Road, Guangdong, Shenzhen, Futian District, China 18B Patentee after: Shenzhen Guangqi Innovative Technology Co., Ltd. Patentee after: Kuang-Chi Institute of Advanced Technology Address before: 518034 A international business center, No. 1061, Xiang Mei Road, Guangdong, Shenzhen, Futian District, China 18B Patentee before: Shenzhen Guangqi Innovative Technology Co., Ltd. |