CN104669710A - Copper-clad plate with heat dissipation function and manufacturing method thereof - Google Patents
Copper-clad plate with heat dissipation function and manufacturing method thereof Download PDFInfo
- Publication number
- CN104669710A CN104669710A CN201310630175.6A CN201310630175A CN104669710A CN 104669710 A CN104669710 A CN 104669710A CN 201310630175 A CN201310630175 A CN 201310630175A CN 104669710 A CN104669710 A CN 104669710A
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- CN
- China
- Prior art keywords
- copper
- clad plate
- graphite film
- copper foil
- fiberglass reinforced
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a copper-clad plate with a heat dissipation function and a manufacturing method thereof. The copper-clad plate comprises at least a layer of glass fiber reinforced prepreg, a graphite film and a copper foil, and the copper-clad plate is prepared by pressing the materials by using a resin glue solution. According to the invention, compared with traditional FR-4 and CEM-3, the graphite film with a thermal conductivity far greater than that of copper in the plane direction is added, so that heat on the copper-clad plate can be rapidly conducted out, thereby achieving the function of heat dissipation.
Description
Technical field
The present invention relates to electronic radiation field, particularly relate to a kind of copper-clad plate and the preparation method with heat sinking function.
Background technology
In recent years, along with the fast development of electronic apparatus technology, the intelligent electronic device such as panel computer, touch-screen mobile phone function becomes from strength to strength, and volume is more and more less, more and more lighting, therefore causes the caloric value of electronic equipment to increase and temperature raises, thus affects stability and the speed of equipment operation, battery capacity is also limited because of heat, reduces service life of equipment; Special in chip, along with the increase of its speed of service, its caloric value is that geometry level increases.What early stage heat radiation adopted is active heat radiation, as fan, is eliminated because volume is comparatively large; Present main method adopts heat-conducting glue and thermal grease conduction to conduct heat on outside metal heat sink, but because the thermal conductivity ratio lower (being less than 5 W/mK) of heat-conducting glue, and metal heat sink distance heat generating spot is distant, so can not realize heat sinking function well.
Therefore how effectively the heat of chip to be distributed, become the key problem that electronic radiation field is urgently to be resolved hurrily.
Summary of the invention
The present invention seeks to be increased in the graphite film that in-plane has the thermal conductivity much larger than copper on traditional FR-4 and CEM-3 basis, the heat in copper-clad plate can be derived fast, thus realize heat sinking function.
In order to achieve the above object, the present invention adopts following technical scheme:
The invention discloses a kind of copper-clad plate with heat sinking function, by least one deck graphite film and one deck Copper Foil are formed by jointing material adhering and pressing.
Preferably, in above-mentioned copper-clad plate, described jointing material is fiberglass reinforced prepreg.
Preferably, in above-mentioned copper-clad plate, the glass fabric specification that described fiberglass reinforced prepreg uses is 25-300g/m
2, the content of resin glue is 60-95%.
Preferably, in above-mentioned copper-clad plate, described fiberglass reinforced prepreg is heated after being flooded in resin adhesive liquid by glass fabric again, thus makes resin adhesive liquid semi-solid preparation and be attached to glass fabric.
Preferably, in above-mentioned copper-clad plate, described graphite film thermal conductivity is in the in-plane direction greater than 800W/mK, and thickness is between 5-100 um.
Preferably, in above-mentioned copper-clad plate, described Copper Foil can be rolled copper foil or electrolytic copper foil, and thickness is at 10-1000um.
Preferably, in above-mentioned copper-clad plate, described graphite film is at 2200-3300 by polymeric membrane
oat the temperature of C, graphitization obtains, and aforementioned polymeric membrane is one or more the combination in polyethersulfone ketone, polyhenylene ethenylidene, polyimides, PEI, phenolic resins, polyoxadiazole.
Present invention also offers a kind of method for manufacturing cover clad laminate, it comprises the following steps: step (1), and glass fabric impregnating resin glue is removed unnecessary glue to control spread by pressure roller; Step (2), obtains fiberglass reinforced prepreg by high-temperature baking; Step (3), by fiberglass reinforced prepreg, graphite film, Copper Foil is laid according to the order of Copper Foil/fiberglass reinforced prepreg/graphite film, also can continue to increase random layer fiberglass reinforced prepreg/graphite film, also can increase layer of glass fiber again to strengthen prepreg or increase layer of glass fiber enhancing prepreg/Copper Foil again, then the product laid be sent into laminating machine and carry out lamination, temperature 170
oc, pressure 40KGf/cm
2condition under carry out lamination, heat-insulation pressure keeping obtains described copper-clad plate in 60 minutes.
Copper-clad plate and the preparation method with heat sinking function provided by the invention, comprise at least one deck graphite film, Copper Foil, by tree jointing material, previous materials compacting is formed, the copper-clad plate having a heat sinking function due to described and preparation method are on Copper Foil, increase at least one deck graphite film, make copper-clad plate have heat sinking function.
Accompanying drawing explanation
Of the present invention there is heat sinking function copper-clad plate and preparation method provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation with the copper-clad plate of heat sinking function of one embodiment of the invention.
In figure, 1-Copper Foil, 2-jointing material, 3-graphite film.
Detailed description of the invention
Below the copper-clad plate having a heat sinking function to of the present invention and preparation method are described in further detail.
Below with reference to accompanying drawings the present invention is described in more detail, which show the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise the present invention described here and still realize beneficial effect of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
In order to clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, a large amount of implementation detail must be made to realize the specific objective of developer, such as, according to regarding system or the restriction about business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
For making object of the present invention, feature becomes apparent, and is further described the specific embodiment of the present invention below in conjunction with accompanying drawing.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
With reference to accompanying drawing 1, copper-clad plate of the present invention is multilayer material composite construction, is Copper Foil 1/ glass-fiber-fabric 2/ graphite film 3/ glass-fiber-fabric 2/ graphite film 3/ glass-fiber-fabric 2/ Copper Foil 1 from top to bottom.The glass fabric specification that described fiberglass reinforced prepreg uses is 25-300g/m
2, the content of resin glue is 60-95%.Described fiberglass reinforced prepreg is heated after being flooded in resin adhesive liquid by glass fabric again, thus makes resin adhesive liquid semi-solid preparation and be attached to glass fabric.Described graphite film thermal conductivity is in the in-plane direction greater than 800W/mK, and thickness is between 5-100 um.Described Copper Foil can be rolled copper foil or electrolytic copper foil, and thickness is at 10-1000um.Described graphite film is at 2200-3300 by polymeric membrane
oat the temperature of C, graphitization obtains, and aforementioned polymeric membrane is polyethersulfone ketone, polyhenylene ethenylidene, polyimides, PEI, one or more the combination in phenolic resins ， polyoxadiazole.
The preparation method of copper-clad plate of the present invention, it is as follows that it comprises step:
Step 1, provides glass-fiber-fabric, graphite film, Copper Foil, and resin adhesive liquid.Copper Foil is rolled copper foil, and thickness is 50um, and graphite film is artificial synthetic graphite film, and thickness is at 25um, and thermal conductivity is 1500W/mk, and glass-fiber-fabric is 7628 glass-fiber-fabrics.
Step 2, preparation resin adhesive liquid.
Step 3, removes unnecessary glue to control spread, afterwards at 120-180 by glass-fiber-fabric impregnating resin glue by pressure roller
ofiberglass reinforced prepreg is made in C drying.
Step 4, by glass-fiber-fabric, graphite film, Copper Foil is laid according to the order of one deck Copper Foil/layer of glass fiber fabric/one deck graphite film/layer of glass fiber fabric/one deck graphite film/layer of glass fiber fabric/one deck Copper Foil, sends into laminating machine in temperature 170
oc pressure 40KGf/cm
2condition under carry out lamination, heat-insulation pressure keeping 60 minutes, obtains described copper-clad plate.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from intension of the present invention and scope.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. have a copper-clad plate for heat sinking function, it is characterized in that, described copper-clad plate is by least one deck graphite film and one deck Copper Foil are formed by jointing material adhering and pressing.
2. copper-clad plate according to claim 1, is characterized in that, described jointing material is fiberglass reinforced prepreg.
3. copper-clad plate according to claim 2, is characterized in that, the glass fabric specification that described fiberglass reinforced prepreg uses is 25-300g/m
2, the content of resin glue is 60-95%.
4. copper-clad plate according to claim 3, is characterized in that, described fiberglass reinforced prepreg is heated after being flooded in resin adhesive liquid by glass fabric again, thus makes resin adhesive liquid semi-solid preparation and be attached to glass fabric.
5. copper-clad plate according to claim 1, is characterized in that, described graphite film thermal conductivity is in the in-plane direction greater than 800W/mK, and thickness is between 5-100 um.
6. copper-clad plate according to claim 1, is characterized in that, described Copper Foil can be rolled copper foil or electrolytic copper foil, and thickness is at 10-1000um.
7. copper-clad plate according to claim 1, is characterized in that, described graphite film is at 2200-3300 by polymeric membrane
oat the temperature of C, graphitization obtains, and aforementioned polymeric membrane is polyethersulfone ketone, polyhenylene ethenylidene, polyimides, PEI, one or more the combination in phenolic resins ， polyoxadiazole.
8. a method for manufacturing cover clad laminate, is characterized in that comprising the following steps:
Step (1), removes unnecessary glue to control spread by glass fabric impregnating resin glue by pressure roller;
Step (2), obtains fiberglass reinforced prepreg by high-temperature baking;
Step (3), by fiberglass reinforced prepreg, graphite film, Copper Foil is laid according to the order of Copper Foil/fiberglass reinforced prepreg/graphite film, also can continue to increase random layer fiberglass reinforced prepreg/graphite film, also can increase layer of glass fiber again to strengthen prepreg or increase layer of glass fiber enhancing prepreg/Copper Foil again, then the product laid be sent into laminating machine and carry out lamination, temperature 170
oc, pressure 40KGf/cm
2condition under carry out lamination, heat-insulation pressure keeping obtains copper-clad plate in 60 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630175.6A CN104669710A (en) | 2013-12-02 | 2013-12-02 | Copper-clad plate with heat dissipation function and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630175.6A CN104669710A (en) | 2013-12-02 | 2013-12-02 | Copper-clad plate with heat dissipation function and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104669710A true CN104669710A (en) | 2015-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310630175.6A Pending CN104669710A (en) | 2013-12-02 | 2013-12-02 | Copper-clad plate with heat dissipation function and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN104669710A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108839407A (en) * | 2018-06-04 | 2018-11-20 | 南京大学 | A kind of graphene-based PCB copper-clad plate and preparation method |
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
| CN114670512A (en) * | 2022-04-27 | 2022-06-28 | 中山新高电子材料股份有限公司 | Polytetrafluoroethylene flexible copper-clad plate containing glass fiber cloth and preparation method thereof |
-
2013
- 2013-12-02 CN CN201310630175.6A patent/CN104669710A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
| CN108839407A (en) * | 2018-06-04 | 2018-11-20 | 南京大学 | A kind of graphene-based PCB copper-clad plate and preparation method |
| CN114670512A (en) * | 2022-04-27 | 2022-06-28 | 中山新高电子材料股份有限公司 | Polytetrafluoroethylene flexible copper-clad plate containing glass fiber cloth and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150603 |