CN105437641A - Artificial graphite/copper composite radiating fin and preparation method therefor - Google Patents
Artificial graphite/copper composite radiating fin and preparation method therefor Download PDFInfo
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- CN105437641A CN105437641A CN201510672288.1A CN201510672288A CN105437641A CN 105437641 A CN105437641 A CN 105437641A CN 201510672288 A CN201510672288 A CN 201510672288A CN 105437641 A CN105437641 A CN 105437641A
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- copper
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- copper foil
- heat sink
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 175
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 108
- 239000010949 copper Substances 0.000 title claims abstract description 108
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000002131 composite material Substances 0.000 title abstract description 6
- 229910021383 artificial graphite Inorganic materials 0.000 title abstract 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 116
- 239000011889 copper foil Substances 0.000 claims abstract description 70
- 238000003490 calendering Methods 0.000 claims abstract description 25
- 239000010439 graphite Substances 0.000 claims abstract description 13
- 238000007788 roughening Methods 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 239000002585 base Substances 0.000 claims description 17
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 238000000280 densification Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000002932 luster Substances 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims description 2
- 240000003936 Plumbago auriculata Species 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 abstract description 10
- 239000002245 particle Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 206010028980 Neoplasm Diseases 0.000 abstract 2
- 238000003825 pressing Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 241000209456 Plumbago Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1045—Intermittent pressing, e.g. by oscillating or reciprocating motion of the pressing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
An artificial graphite/copper composite radiating fin and a preparation method therefor relate to the field of radiation of heat components of electronics and electromagnetic shield. The artificial graphite/copper composite radiating fin comprises a copper foil layer and artificial graphite layers located on the upper and lower sides of the copper foil layer; the copper foil layer comprises a copper substrate and roughened layers located on the upper and lower sides of the copper substrate; a tumor-like copper particle structure is uniformly distributed on the surface of each of the roughened layers; each of the roughened layers is mutually engaged with each artificial graphite layer through the tumor-like copper particle structure; and each artificial graphite layer is formed by roll-pressing fluffy artificial single graphite flakes to be adhered to a release film and paving the film on the copper foil. The preparation method comprises: performing roughening treatment and curing treatment on the cleaned copper foil; roll-pressing the fluffy artificial single graphite flakes to be adhered to the release film, then paving the film on the copper foil, and calendering stepwise so as to obtain the artificial graphite/copper composite radiating fin. The radiating fin provided by the invention has a good heat-conducting performance, an excellent electromagnetic shielding effect and low thermal resistance of the interface between the copper foil and graphite, thereby improving the heat-conducting performance.
Description
Technical field
The present invention relates to heat radiation and the electromagnetic shielding field of the heat generating component of electronic product, particularly relate to a kind of electrographite/copper heat sink compound and preparation method thereof.
Background technology
Current CPU generates heat because of high-speed cruising, and CPU high-speed cruising is processing speed for improving its equipment and researches and develops.Mobile phone, tablet PC, the demand of notebook and TV and display screen use amount increase, the demand of display screen high brightness makes light emitting diode use amount increase, but because light emitting diode uses more, its power consumption increases, this also adds the caloric value of large equipment, battery power consumption increases simultaneously, battery capacity also needs and then to improve, and makes display apparatus generate heat many, as effectively do not controlled heating because consuming energy large, not only high temperature can make CPU running Yin Gaore and when machine goes wrong or loss of function, also can make heat-producing device shortening in service life.Display apparatus function increases now simultaneously, and use part also diversified, quantity is many and volume is less, mobile phone, the equipment such as tablet PC are because of more and more miniaturized, and its free space is not enough, the distance of each part and assembly is nearer, is easy to mutual electromagnetic interference occurs.
Electrographite thickness in the market as radiative material is taken as the leading factor with 25 μm, the electrographite of 40 μm can reach volume production, but thermal conductivity factor is not good, the electrographite of 70 μm can production not high, thickness limits the heat dispersion of electrographite, more caloric requirement solves, and in order to heat is reached from heat generating component " A " some the temperature that other point distributed and then reduced heat generating component, the body temperature of heat generating component " A " is significantly reduced.Therefore the heat conduction carrier of more high thermal conductivity coefficient and larger heat-sinking capability is needed.
Summary of the invention
The present invention provides a kind of electrographite/copper heat sink compound and preparation method thereof in order to solve the problems of the technologies described above, be the heat conduction carrier with excellent heat-conducting effect, also can provide the function of electromagnetic shielding.
A kind of electrographite/copper heat sink compound, it comprises copper foil layer and is positioned at the electrographite layer of copper foil layer upper and lower surface; Described copper foil layer comprises Copper base material and is positioned at the roughened layer of Copper base material upper and lower surface; The surface uniform of described roughened layer is distributed with warty copper grain structure; Described roughened layer by warty copper grain structure and electrographite layer engaged; Described copper foil layer is web-like Copper Foil; To be bulk electrographite monolithic through roll extrusion be attached to described electrographite layer is laid in compacting on Copper Foil after fractal film and forms.
Described Copper base material, roughened layer and warty copper grain structure are integrated.
The thickness of described electrographite/copper heat sink compound is 18 μm ~ 310 μm; The thickness of described copper foil layer is 8 μm ~ 150 μm; The maximum length of described warty copper grain structure is less than 8 μm; The surface area of described roughened layer is 3 ~ 8 times of Copper base material; Described electrographite layer thickness is 5 μm ~ 80 μm.
Described electrographite/copper heat sink compound is an Institutional Layer with electrographite layer/copper foil layer/electrographite layer, can form the structure of maximum 10 Institutional Layer compounds.
A preparation method for electrographite/copper heat sink compound, specifically carries out according to the following steps:
One, pretreatment is carried out to copper foil surface, the pollution of removing copper foil surface and oxide layer;
Two, the Copper Foil obtained is processed to step one and carry out roughening treatment and solidification process, make to form at copper foil surface the roughened layer being evenly distributed with warty copper grain structure;
Three, by bulk electrographite monolithic roll extrusion on fractal film, make electrographite monolithic be attached on fractal film;
The one side with electrographite monolithic of the fractal film four, step 3 obtained is laid on the Copper Foil that obtains through step 2 process; Then, through stage calendering, namely obtain electrographite/copper heat sink compound.
Pretreated method in described step one, is specially: carry out pickling, washing, alkali cleaning, washing and oven dry successively to Copper Foil; What described pickling adopted is concentration be less than 0.5% dilute sulfuric acid; What described alkali cleaning adopted is concentration be 2 ~ 5% the NaOH aqueous solution.
The processing method of described step 2 is specially: roughening treatment: the Copper Foil that step one obtains is electroplated two-sided in electroplate liquid, surface forms one deck warty copper grain structure, then repeatedly upper step is carried out, the maximum length of warty copper grain structure is made to be less than 8 μm, obtain roughened layer, and then be cured process, be the thin copper of 0.1 ~ 0.5 μm in plated surface a layer thickness of roughened layer; The metallic copper of one deck densification is deposited, to improve the adhesion strength of roughened layer and Copper Foil matrix in the gap of warty copper grain structure; After solidification, carry out cleaning and drying and processing, then, rolling is carried out to Copper Foil.
Described step 4 concrete operation method is: the one side with plumbago single slice of fractal film step 3 obtained is layered on the Copper Foil that obtains through step 2 process, leveling, then, carry out first time calendering, pressure is 500 ~ 2000kg, electrographite is filled and is expressed in the gap of warty copper grain structure; Carry out second time calendering, pressure is 3000 ~ 6000kg, makes the density of electrographite layer bring up to 0.4 ~ 0.5g/cm
3; Third time calendering, pressure is 8000 ~ 20000kg, makes the density of electrographite layer bring up to 0.8 ~ 1g/cm
3; 4th calendering, pressure is 40000 ~ 70000kg, makes the density of electrographite layer bring up to 1.2 ~ 1.4g/cm
3, now electrographite layer has changed the state of film forming; 5th calendering, pressure is 90000 ~ 200000kg, makes the density of electrographite layer bring up to 1.6 ~ 1.8g/cm
3, now there is metallic luster on electrographite layer surface.
Described calendering mode is specially roll extrusion.
Advantage of the present invention: the mode that one, a kind of electrographite of the present invention/copper heat sink compound adopts electrographite layer and copper foil layer to be mutually engaged by warty copper grain structure, the thermal conductivity of Z-direction is improved greatly, make the heat conductivility of fin excellent, thermal conductivity factor is up to 1500W/mK, and thermal diffusion coefficient is up to 900mm
2/ s; Due to adding of Copper base material, also there is excellent effectiveness, make each assembly in mini-plant effectively can prevent electromagnetic interference; Two, a kind of electrographite/copper heat sink compound of the present invention, stretch-proof, has very high mechanical property by bent 180 degree; Three, the preparation method of a kind of electrographite/copper heat sink compound of the present invention, first electrographite is attached on fractal film, again by the mode of stage calendering, electrographite and Copper Foil in fin can be better interlocked, and can not warty copper grain structure in defective copper layers of foil, the adhesive force of Copper Foil and electrographite is increased greatly, makes the interface resistance of Copper Foil and electrographite less, improve heat conductivility.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of electrographite/copper heat sink compound of embodiment;
Fig. 2 is the enlarged diagram of the copper foil layer of a kind of electrographite/copper heat sink compound of embodiment;
Wherein, 1-copper foil layer, 11-Copper base material, 12-roughened layer, 13-warty copper grain structure, 2-electrographite layer.
Detailed description of the invention
In order to deepen the understanding of the present invention, be described in further detail the present invention below in conjunction with drawings and Examples, this embodiment, only for explaining the present invention, not forming protection scope of the present invention and limiting.
Embodiment
The preparation method of a kind of electrographite/copper heat sink compound, specifically carry out according to the following steps: 1, the two surface treatment of Copper Foil, Copper Foil must carry out pretreatment before roughening treatment, because Copper Foil contacts with air, hand and other handbarrow in the storage process, handling process of transport, easily be subject to the pollution such as grease and salt, and the surface-active of copper is large, easily form oxide layer on surface, thus with alkaline degreaser (as NaOH etc.) oil removing and pickling (dilute sulfuric acid of less than 0.5%) process; 2, the Copper Foil handled well is electroplated two-sided in electroplate liquid, surface is made to become one deck warty copper particle, repeatedly electroplate roughening treatment simultaneously, the length of warty copper particle is made to be less than 8 μm, roughening treatment is good, then is cured process, in the warty particulate interspaces of roughened layer, namely deposit the metallic copper of one deck densification, in case warty copper particle and Copper Foil Matrix separation, namely improve the adhesion strength of roughened layer and Copper Foil matrix; Alligatoring and the Copper Foil after solidifying will carry out clean solution and drying and processing, make it keep stability in a period of time, now want light during rolling Copper Foil, too not tight, in order to avoid the roughened layer of deface; 3, by bulk electrographite monolithic roll extrusion on fractal film, make electrographite monolithic be attached on fractal film; 4, be layered on Copper Foil by the one side with plumbago single slice of fractal film, leveling, for stage calendering provides the foundation; 5, in order to improve the Copper Foil bonding strength after expanded electrographite and alligatoring, solidification, allowing electrographite enter in the copper particle gap after alligatoring simultaneously, and tamping, thus taking the pattern of stage calendering.During first time calendering, electrographite and electrographite layer isodensity enter copper particle gap, and now pressure is little, is just doing the action extruded, and play a part to fill extruding; Second time calendering brings up to 0.4 ~ 0.5g/cm density
3left and right is still now thick pressure, to precision without special requirement; Third time calendering makes density be increased to 0.8 ~ 1g/cm
3left and right, now electrographite will enter the state of the graphite film of low temperature; 4th time calendering density is increased to 1.2 ~ 1.4g/cm
3left and right, electrographite is now film forming completely, and has thermal conductivity, and thermal conductivity factor significantly improves, and the physical property of graphite also embodies to some extent, and thermal diffusion coefficient tentatively embodies; 5th calendering, makes the density of the electrographite layer of composite wood reach 1.6 ~ 1.8g/cm
3, even higher, the graphite on two sides has the light quality of metal (pool), and thermal conductivity factor reaches peak, and thermal diffusion coefficient is also very stable.Now have high requirement to calendering, the tolerance of thickness is 1 μm, and the cylinder of calendering is Stainless Steel material, and pressure is 200000kg.Effective control because of thickness makes the copper particle of alligatoring without impact, and the density of graphite can reach 1.8g/cm
3left and right.
As depicted in figs. 1 and 2, electrographite/copper heat sink compound that the preparation method of a kind of electrographite/copper heat sink compound of the present embodiment prepares, it comprises copper foil layer 1 and is positioned at the electrographite layer 2 of copper foil layer 1 upper and lower surface; Described copper foil layer 1 comprises Copper base material 11 and is positioned at the roughened layer 12 of Copper base material upper and lower surface; The surface uniform of described roughened layer 12 is distributed with warty copper grain structure 13; Described roughened layer 12 is engaged by warty copper grain structure 13 and electrographite layer 2; Described copper foil layer is web-like Copper Foil; To be bulk electrographite monolithic through roll extrusion be attached to described electrographite layer is laid in compacting on Copper Foil after fractal film and forms; The thickness of described electrographite/copper heat sink compound is 28 μm ~ 2100 μm; The thickness of described copper foil layer 1 is 8 μm ~ 100 μm; The maximum length of described warty copper grain structure 13 is less than 8 μm; The surface area of described roughened layer 12 is 3 ~ 8 times of Copper base material 11; Described electrographite layer 2 thickness is 10 μm ~ 1000 μm.
Warty copper grain structure on the copper foil layer of the present embodiment, surface area can not only be increased, copper and graphite can also be made to adhere to tightr, be separated with Copper base material to prevent warty copper particle, solidification process also will be done in copper surface after alligatoring, Copper base material is after alligatoring and solidification process, its surface irregularity, surface area is very big, and distribution of particles is at random, the stretching resistance that the different such process of knob shape more can increase contact surface except surface is fastening, can make graphite not come off and anti-scratch and bend resistance because of the grip of knob
To be bulk electrographite monolithic through roll extrusion be attached to electrographite layer described in the present embodiment is laid in compacting on Copper Foil after fractal film and forms; Electrographite is compressed between the knob on copper surface, compress into the electrographite in space between knob because extruding the very fine and close of change, until and the snap-in force of copper be greater than snap-in force between electrographite layer and electrographite layer, thus add the adhesive force between electrographite layer and Copper base material.
The pattern of the stage calendering described in the present embodiment from bulked state, is transformed into high-density state according to electrographite layer, because of various different density requirements and thickness requirement, applies, with different rolling pressures, to compress when rolling times.
Electrographite described in the present embodiment/copper heat sink compound can adjust thickness arbitrarily in different demand, adjusts arbitrarily in technique tolerance band, to reach the requirement of different application aspect; Be that a unit number of plies can adjust thickness arbitrarily in different demand with electrographite layer/copper foil layer/electrographite layer, in technique tolerance band, be adjusted to maximum 10 layers, to reach the requirement of different application aspect.
The warty copper grain structure distributed on copper foil layer in the present embodiment enters in electrographite layer in Z-direction, utilize each characteristic identical to thermal conductivity factor of copper, after copper knob enters electrographite layer, not only strengthen the adhesive force difficult drop-off of electrographite and copper, adding more because of copper, Z-direction thermal conduction characteristic by copper compensate for the not good shortcoming of electrographite layer Z-direction thermal conduction characteristic, and the Z-direction heat conduction of whole heat sink compound was improved because of adding of copper.
Electrographite/copper the heat sink compound of the present embodiment, thermal conductivity factor is 1000W/mK ~ 1500W/mK, and thermal diffusion coefficient is 230mm
2/ s ~ 900mm
2/ s; Because of adding of copper material in heat sink compound, can fix with metal bolts in device assembles and be connected with ground terminal, and because of copper conductive characteristic form earth-return circuit, and fin covers on the chip of equipment, directly cover the most disturbed chip, forming the best anti-High-frequency Interference ability of electromagnetic shielding effect is 60 ~ 80db (10MHz ~ 1GHz); Because of adding of Copper base material, the tension failure value in its X-Y direction (horizontal direction) is 100Kgf/mm
2~ 200Kgf/mm
2, be 10 times of current condition of equivalent thickness electrographite sheet; No matter composite sheet thickness is how many, its bent angle is 180 degree, bent number of times is 100 times, and the fracture of electrographite/copper heat sink compound can not be made and cause heat dissipation to reduce, this be single graphite heat radiation fin cannot bear be greater than 90 degree bend and cannot bear repeatedly bend incomparable.
Above-described embodiment should not limit the present invention by any way, and the technical scheme that the mode that all employings are equal to replacement or equivalency transform obtains all drops in protection scope of the present invention.
Claims (8)
1. electrographite/copper heat sink compound, is characterized in that: it comprises copper foil layer and is positioned at the electrographite layer of copper foil layer upper and lower surface; Described copper foil layer comprises Copper base material and is positioned at the roughened layer of Copper base material upper and lower surface; The surface uniform of described roughened layer is distributed with warty copper grain structure; Described roughened layer by warty copper grain structure and electrographite layer engaged; Described copper foil layer is web-like Copper Foil; To be bulk electrographite monolithic through roll extrusion be attached to described electrographite layer is laid in compacting on Copper Foil after fractal film and forms.
2. a kind of electrographite/copper heat sink compound according to claim 1, is characterized in that: described Copper base material, roughened layer and warty copper grain structure are integrated.
3. a kind of electrographite/copper heat sink compound according to claim 1, is characterized in that: the thickness of described electrographite/copper heat sink compound is 18 μm ~ 310 μm; The thickness of described copper foil layer is 8 μm ~ 150 μm; The maximum length of described warty copper grain structure is less than 8 μm; The surface area of described roughened layer is 3 ~ 8 times of Copper base material; Described electrographite layer thickness is 5 μm ~ 80 μm.
4. a kind of electrographite/copper heat sink compound according to claim 1, is characterized in that: described electrographite/copper heat sink compound is an Institutional Layer with electrographite layer/copper foil layer/electrographite layer, can form the structure of maximum 10 Institutional Layer compounds.
5. the preparation method of a kind of electrographite/copper heat sink compound as claimed in claim 1, is characterized in that: preparation method specifically carries out according to the following steps:
One, pretreatment is carried out to copper foil surface, the pollution of removing copper foil surface and oxide layer;
Two, the Copper Foil obtained is processed to step one and carry out roughening treatment and solidification process, make to form at copper foil surface the roughened layer being evenly distributed with warty copper grain structure;
Three, by bulk electrographite monolithic roll extrusion on fractal film, make electrographite monolithic be attached on fractal film;
The one side with electrographite monolithic of the fractal film four, step 3 obtained is laid on the Copper Foil that obtains through step 2 process; Then, through stage calendering, namely obtain electrographite/copper heat sink compound.
6. the preparation method of a kind of electrographite/copper heat sink compound according to claim 5, is characterized in that: the pretreated method in described step one, is specially: carry out pickling, washing, alkali cleaning, washing and oven dry successively to Copper Foil; What described pickling adopted is concentration be less than 0.5% dilute sulfuric acid; What described alkali cleaning adopted is concentration be 2 ~ 5% the NaOH aqueous solution.
7. the preparation method of a kind of electrographite/copper heat sink compound according to claim 5, it is characterized in that: the processing method of described step 2 is specially: roughening treatment: the Copper Foil that step one obtains is electroplated two-sided in electroplate liquid, surface forms one deck warty copper grain structure, then repeatedly upper step is carried out, the maximum length of warty copper grain structure is made to be less than 8 μm, obtaining roughened layer, and then be cured process, is the thin copper of 0.1 ~ 0.5 μm in plated surface a layer thickness of roughened layer; The metallic copper of one deck densification is deposited, to improve the adhesion strength of roughened layer and Copper Foil matrix in the gap of warty copper grain structure; After solidification, carry out cleaning and drying and processing, then, rolling is carried out to Copper Foil.
8. the preparation method of a kind of electrographite/copper heat sink compound according to claim 5, it is characterized in that: described step 4 concrete operation method is: the one side with plumbago single slice of fractal film step 3 obtained is layered on the Copper Foil that obtains through step 2 process, leveling, then, carry out first time calendering, pressure is 500 ~ 2000kg, electrographite is filled and is expressed in the gap of warty copper grain structure; Carry out second time calendering, pressure is 3000 ~ 6000kg, makes the density of electrographite layer bring up to 0.4 ~ 0.5g/cm
3; Third time calendering, pressure is 8000 ~ 20000kg, makes the density of electrographite layer bring up to 0.8 ~ 1g/cm
3; 4th calendering, pressure is 40000 ~ 70000kg, makes the density of electrographite layer bring up to 1.2 ~ 1.4g/cm
3, now electrographite layer has changed the state of film forming; 5th calendering, pressure is 90000 ~ 200000kg, makes the density of electrographite layer bring up to 1.6 ~ 1.8g/cm
3, now there is metallic luster on electrographite layer surface.
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| CN107901524A (en) * | 2017-11-01 | 2018-04-13 | 镇江博昊科技有限公司 | Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film |
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