CN105101758A - Natural graphite/copper composite heat sink and fabrication method thereof - Google Patents
Natural graphite/copper composite heat sink and fabrication method thereof Download PDFInfo
- Publication number
- CN105101758A CN105101758A CN201510581993.0A CN201510581993A CN105101758A CN 105101758 A CN105101758 A CN 105101758A CN 201510581993 A CN201510581993 A CN 201510581993A CN 105101758 A CN105101758 A CN 105101758A
- Authority
- CN
- China
- Prior art keywords
- copper
- graphite
- copper foil
- layer
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a natural graphite/copper composite heat sink and a fabrication method thereof, relating to the field of cooling and electromagnetic shielding of a heating component of an electronic product. The natural graphite/copper composite heat sink comprises a copper foil layer and graphite layers, wherein the graphite layers are arranged on the upper surface and the lower surface of the copper foil layer; the copper foil layer comprises a copper substrate and armoring layers arranged on the upper surface and the lower surface of the copper substrate; warty copper particle structures are uniformly distributed on the surfaces of the armoring layers; and the armoring layers are engaged with the graphite layers through the warty copper particle structures. The fabrication method of the natural graphite/copper composite heat sink comprises the following steps of: pre-processing the surface of a copper foil; roughening and curing the copper foil; uniformly stacking puffed worm graphite and laying on the copper foil; and calendering step by step to obtain the natural graphite/copper composite heat sink. The heat sink disclosed by the invention has favorable heat conduction performance and a favorable electromagnetic shielding effect, is resistant to stretch, and can be bent for 180 degrees, the interface resistance between the copper foil and the graphite is lower, and the heat conduction performance is improved.
Description
Technical field
The present invention relates to heat radiation and the electromagnetic shielding field of the heat generating component of electronic product, particularly relate to a kind of native graphite/copper heat sink compound and preparation method thereof.
Background technology
Current CPU generates heat because of high-speed cruising, and CPU high-speed cruising is processing speed for improving its equipment and researches and develops.Mobile phone, flat computer, the demand of notebook and TV and display screen use amount increase, the demand of display screen high brightness makes light-emitting diode use amount increase, but because light-emitting diode uses more, its power consumption increases, this also adds the caloric value of large equipment, battery power consumption increases simultaneously, battery capacity also needs and then to improve, and makes display apparatus generate heat many, as effectively do not controlled heating because consuming energy large, not only high temperature can make CPU running Yin Gaore and when machine goes wrong or loss of function, also can make heat-producing device shortening in useful life.Display apparatus function increases now simultaneously, and use part also diversified, quantity is many and volume is less, mobile phone, the equipment such as flat computer are because of more and more miniaturized, and its free space is not enough, the distance of each part and assembly is nearer, is easy to mutual electromagnetic interference occurs.
In the market as radiative material electrographite thickness take as the leading factor with 25 μm, the electrographite of 40 μm can reach volume production, but conductive coefficient is not good, the electrographite of 70 μm can production not high, the thickness limits heat dispersion of electrographite, more caloric requirement solves, and in order to heat is reached from heat generating component " A " some the temperature that other point distributed and then reduced heat generating component, the body temperature of heat generating component " A " is significantly reduced.Therefore the heat conduction carrier of more high thermal conductivity coefficient and larger heat-sinking capability is needed.
Summary of the invention
The present invention provides a kind of native graphite/copper heat sink compound and preparation method thereof in order to solve the problems of the technologies described above, be the heat conduction carrier with excellent heat-conducting effect, also can provide the function of electromagnetic shielding.
A kind of native graphite/copper heat sink compound, it comprises copper foil layer and is positioned at the graphite linings of copper foil layer upper and lower surface; Described copper foil layer comprises Copper base material and is positioned at the roughened layer of Copper base material upper and lower surface; The surface uniform of described roughened layer is distributed with warty copper grain structure; Described roughened layer by warty copper grain structure and graphite linings engaged.
Described Copper base material, roughened layer and warty copper grain structure are integrated.
The thickness of described native graphite/copper heat sink compound is 28 μm ~ 2100 μm; The thickness of described copper foil layer is 8 μm ~ 100 μm; The maximum length of described warty copper grain structure is less than 8 μm; The surface area of described roughened layer is 3 ~ 8 times of Copper base material; Described graphite linings thickness is 10 μm ~ 1000 μm.
Described native graphite/copper heat sink compound is an Institutional Layer with graphite linings/copper foil layer/graphite linings, can form the structure of maximum 10 Institutional Layer compounds.
Described copper foil layer is web-like Copper Foil; Described graphite linings is suppress after expanded worm graphite is laid in copper foil layer to form.
A preparation method for native graphite/copper heat sink compound, specifically carries out according to the following steps:
One, preliminary treatment is carried out to copper foil surface, the pollution of removing copper foil surface and oxide layer;
Two, the Copper Foil obtained is processed to step one and carry out roughening treatment and solidification process, make to form at copper foil surface the roughened layer being evenly distributed with warty copper grain structure;
Three, expanded worm graphite piled up uniformly and be laid on the Copper Foil that obtains through step 2 process; Then, through stage calendering, namely obtain native graphite/copper heat sink compound.
Pretreated method in described step one, is specially: carry out pickling, washing, alkali cleaning, washing and oven dry successively to Copper Foil; What described pickling adopted is concentration be less than 0.5% dilute sulfuric acid; What described alkali cleaning adopted is concentration be 2 ~ 5% the NaOH aqueous solution.
The processing method of described step 2 is specially: roughening treatment: the Copper Foil that step one obtains is electroplated two-sided in electroplate liquid, surface forms one deck warty copper grain structure, then repeatedly upper step is carried out, the maximum length of warty copper grain structure is made to be less than 8 μm, obtain roughened layer, and then be cured process, be the thin copper of 0.1 ~ 0.5 μm in plated surface a layer thickness of roughened layer; The metallic copper of one deck densification is deposited, to improve the adhesion strength of roughened layer and Copper Foil matrix in the gap of warty copper grain structure; After solidification, carry out cleaning and drying and processing, then, rolling is carried out to Copper Foil.
The preparation method of the expanded worm graphite of described step 3: after expanded graphite granule is warmed to 850 ~ 1040 DEG C, can be puffed to worm graphite, after being then separated through to suspend for 2 ~ 7 times, obtains the expanded worm graphite that purity is more than 99%; Wherein, the volume of worm graphite is 60 ~ 100 times of the volume of graphite granule.
Described step 3 concrete operation method is: be deposited in by expanded worm graphite on the Copper Foil obtained through step 2 process, then flatten, obtain the expanded myrmekite layer of ink of the uniform consistency of thickness of initial density, then, carry out first time calendering, pressure is 500 ~ 2000kg, makes expanded worm graphite-filled and is expressed in the gap of warty copper grain structure; Carry out second time calendering, pressure is 3000 ~ 6000kg, makes the density of expanded myrmekite layer of ink bring up to 0.4 ~ 0.5g/cm
3; Third time calendering, pressure is 8000 ~ 20000kg, makes the density of expanded myrmekite layer of ink bring up to 0.8 ~ 1g/cm
3; 4th calendering, pressure is 40000 ~ 70000kg, makes the density of expanded myrmekite layer of ink bring up to 1.2 ~ 1.4g/cm
3, now expanded myrmekite layer of ink has changed the state of film forming; 5th calendering, pressure is 90000 ~ 200000kg, makes the density of expanded myrmekite layer of ink bring up to 1.6 ~ 1.8g/cm
3, now graphite has metallic luster.
Described calendering mode is specially roll extrusion.
Advantage of the present invention: the mode that one, a kind of native graphite of the present invention/copper heat sink compound adopts graphite linings and copper foil layer to be mutually engaged by warty copper grain structure, the thermal conductivity of Z-direction is improved greatly, make the heat conductivility of fin excellent, conductive coefficient is up to 1200W/mK, and thermal diffusion coefficient is up to 900mm
2/ s; Due to adding of Copper base material, also there is excellent effectiveness, make each assembly in mini-plant effectively can prevent electromagnetic interference; Two, a kind of native graphite/copper heat sink compound of the present invention, stretch-proof, has very high mechanical property by bent 180 degree; Three, the preparation method of a kind of native graphite/copper heat sink compound of the present invention, by the mode of stage calendering, graphite and Copper Foil in fin can be better interlocked, and can not warty copper grain structure in defective copper layers of foil, the adhesive force of Copper Foil and graphite is increased greatly, make the interface resistance of Copper Foil and graphite less, improve heat conductivility.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of native graphite/copper heat sink compound of embodiment;
Fig. 2 is the enlarged diagram of the copper foil layer of a kind of native graphite/copper heat sink compound of embodiment;
Wherein, 1-copper foil layer, 11-Copper base material, 12-roughened layer, 13-warty copper grain structure, 2-graphite linings.
Embodiment
In order to deepen the understanding of the present invention, be described in further detail the present invention below in conjunction with drawings and Examples, this embodiment, only for explaining the present invention, not forming protection scope of the present invention and limiting.
Embodiment
The preparation method of a kind of native graphite/copper heat sink compound, specifically carry out according to the following steps: 1, the two surface treatment of Copper Foil, Copper Foil must carry out preliminary treatment before roughening treatment, because Copper Foil contacts with air, hand and other handbarrow in the storage process, handling process of transport, easily be subject to the pollution such as grease and salt, and the surface activity of copper is large, easily form oxide layer on surface, thus with alkaline degreaser (as NaOH etc.) oil removing and pickling (dilute sulfuric acid of less than 0.5%) process; 2, the Copper Foil handled well is electroplated two-sided in electroplate liquid, surface is made to become one deck warty copper particle, repeatedly electroplate roughening treatment simultaneously, the length of warty copper particle is made to be less than 8 μm, roughening treatment is good, then is cured process, in the warty particulate interspaces of roughened layer, namely deposit the metallic copper of one deck densification, in case warty copper particle and Copper Foil Matrix separation, namely improve the adhesion strength of roughened layer and Copper Foil matrix.Alligatoring and the Copper Foil after solidifying will carry out clean solution and drying and processing, make it keep stability in a period of time, now want light during rolling Copper Foil, too not tight, in order to avoid the roughened layer of deface.The Copper Foil handled well can wait for the certain thickness worm graphite of two-sided tiling by above special installation (namely worm graphite equipment is cut in high rotary-cut) substantially; 3, graphite granule that can be expanded is being warmed to 850 ~ 1040 DEG C, make the expanded worm graphite to more than 60 ~ 100 times of graphite granule, worm graphite after expanded is very light, comparatively pure worm graphite is isolated by outstanding fraction, as highly purified worm graphite will be obtained, having to pass through suspends for 2 ~ 3 times is separated, and even repeatedly suspend separation, with the purity (removing sulphur, sulfide, tiny stone etc. wherein) making worm graphite reach more than 99%; 4, highly purified worm graphite is stacked into the thickness of needs, control accumulation horizon density well simultaneously, again with the leveling of high speed rotary-drum cutting tools, reach and eliminate the uneven problem of ulking thickness, and then obtain the myrmekite layer of ink that just more even cotton-shaped worm graphite relative thickness of density is consistent, for stage calendering provides the foundation; 5, in order to improve the Copper Foil bonding strength after expanded worm graphite and alligatoring, solidification, allowing worm graphite enter in the copper particle gap after alligatoring simultaneously, and tamping, thus taking the pattern of stage calendering.During first time calendering, worm graphite and graphite linings isodensity enter copper particle gap, and now pressure is little, is just doing the action extruded, and play a part to fill extruding; Second time calendering brings up to 0.4 ~ 0.5g/cm density
3left and right is still now thick pressure, to precision without special requirement; Third time calendering makes density be increased to 0.8 ~ 1g/cm
3left and right, now worm graphite will enter the state of the graphite film of low temperature; 4th time calendering density is increased to 1.2 ~ 1.4g/cm
3left and right, the film forming completely of worm graphite now, and there is thermal conductivity, conductive coefficient significantly improves, and the physical property of graphite also embodies to some extent, and thermal diffusion coefficient tentatively embodies; 5th calendering, makes the density of the graphite linings of composite wood reach 1.6 ~ 1.8g/cm
3, even higher, the graphite on two sides has the light quality of metal (pool), and conductive coefficient reaches peak, and thermal diffusion coefficient is also very stable.Now have high requirement to calendering, the tolerance of thickness is 1 μm, and the cylinder of calendering is Stainless Steel material, and pressure is 200000kg.Effective control because of thickness makes the copper particle of alligatoring without impact, and the density of graphite can reach 1.8g/cm
3left and right.
As depicted in figs. 1 and 2, native graphite/copper heat sink compound that the preparation method of a kind of native graphite/copper heat sink compound of the present embodiment prepares, it comprises copper foil layer 1 and is positioned at the graphite linings 2 of copper foil layer 1 upper and lower surface; Described copper foil layer 1 comprises Copper base material 11 and is positioned at the roughened layer 12 of Copper base material upper and lower surface; The surface uniform of described roughened layer 12 is distributed with warty copper grain structure 13; Described roughened layer 12 is engaged by warty copper grain structure 13 and graphite linings 2; The thickness of described native graphite/copper heat sink compound is 28 μm ~ 2100 μm; The thickness of described copper foil layer 1 is 8 μm ~ 100 μm; The maximum length of described warty copper grain structure 13 is less than 8 μm; The surface area of described roughened layer 12 is 3 ~ 8 times of Copper base material 11; Described graphite linings 2 thickness is 10 μm ~ 1000 μm.
Warty copper grain structure on the copper foil layer of the present embodiment, surface area can not only be increased, the attachment of copper and graphite and copper can also be made tightr, be separated with Copper base material to prevent warty copper particle, solidification process also will be done in copper surface after alligatoring, Copper base material is after alligatoring and solidification process, its surface irregularity, surface area is very big, and distribution of particles is at random, the stretching resistance that the different such process of knob shape more can increase contact-making surface except surface is fastening, can make graphite not come off and anti-scratch and bend resistance because of the grip of knob
Graphite linings described in the present embodiment is suppress after expanded worm graphite is laid in copper foil layer to form; Cotton-shaped worm shape graphite after expanded, be laid in Copper base material surface, through roll extrusion several times, cotton-shaped graphite granule is slowly pressed between the knob on copper surface, compress into the graphite in space between knob because extruding the very fine and close of change, until and the snap-in force of copper be greater than snap-in force between graphite linings and graphite linings, thus add the adhesive force between graphite linings and Copper base material.
The pattern of the stage calendering described in the present embodiment from graphite worm state, is transformed into high-density state according to graphite linings, because of various different density requirements and thickness requirement, applies, with different rolling pressures, to compress when rolling times.
Native graphite described in the present embodiment/copper heat sink compound can adjust thickness arbitrarily in different demand, adjusts arbitrarily in technique tolerance band, to reach the requirement of different application aspect; Be that a unit number of plies can adjust thickness arbitrarily in different demand with graphite linings/copper foil layer/graphite linings, in technique tolerance band, be adjusted to maximum 10 layers, to reach the requirement of different application aspect.
The warty copper grain structure distributed on copper foil layer in the present embodiment enters in graphite linings in Z-direction, utilize each characteristic identical to conductive coefficient of copper, after copper knob enters graphite linings, not only strengthen the adhesive force difficult drop-off of graphite and copper, adding more because of copper, Z-direction thermal conduction characteristic by copper compensate for the not good shortcoming of graphite linings Z-direction thermal conduction characteristic, and the Z-direction heat conduction of whole heat sink compound was improved because of adding of copper.
Native graphite/copper the heat sink compound of the present embodiment, conductive coefficient is 500W/mK ~ 1200W/mK, and thermal diffusion coefficient is 230mm
2/ s ~ 900mm
2/ s; Because of adding of copper material in heat sink compound, can fix with metal bolts in device assembles and be connected with ground terminal, and because of copper conductive characteristic form grounded circuit, and fin covers on the chip of equipment, directly cover the most disturbed chip, forming the best anti-High-frequency Interference ability of electromagnetic shielding effect is 60 ~ 80db (10MHz ~ 1GHz); Because of adding of Copper base material, the tension failure value in its X-Y direction (horizontal direction) is 100Kgf/mm
2~ 200Kgf/mm
2, being 100 times of current condition of equivalent thickness graphite flake, is 10 times of current condition of equivalent thickness electrographite sheet; No matter composite sheet thickness is how many, its bent angle is 180 degree, bent number of times is 100 times, and the fracture of native graphite/copper heat sink compound can not be made and cause heat dissipation to reduce, this be single graphite heat radiation fin cannot bear be greater than 90 degree bend and cannot bear repeatedly bend incomparable.
Above-described embodiment should not limit the present invention by any way, and the technical scheme that the mode that all employings are equal to replacement or equivalency transform obtains all drops in protection scope of the present invention.
Claims (10)
1. native graphite/copper heat sink compound, is characterized in that: it comprises copper foil layer and is positioned at the graphite linings of copper foil layer upper and lower surface; Described copper foil layer comprises Copper base material and is positioned at the roughened layer of Copper base material upper and lower surface; The surface uniform of described roughened layer is distributed with warty copper grain structure; Described roughened layer by warty copper grain structure and graphite linings engaged.
2. a kind of native graphite/copper heat sink compound according to claim 1, is characterized in that: described Copper base material, roughened layer and warty copper grain structure are integrated.
3. a kind of native graphite/copper heat sink compound according to claim 1, is characterized in that: the thickness of described native graphite/copper heat sink compound is 28 μm ~ 2100 μm; The thickness of described copper foil layer is 8 μm ~ 100 μm; The maximum length of described warty copper grain structure is less than 8 μm; The surface area of described roughened layer is 3 ~ 8 times of Copper base material; Described graphite linings thickness is 10 μm ~ 1000 μm.
4. a kind of native graphite/copper heat sink compound according to claim 1, is characterized in that: described native graphite/copper heat sink compound is an Institutional Layer with graphite linings/copper foil layer/graphite linings, can form the structure of maximum 10 Institutional Layer compounds.
5. a kind of native graphite/copper heat sink compound according to claim 1, is characterized in that: described copper foil layer is web-like Copper Foil; Described graphite linings is suppress after expanded worm graphite is laid in copper foil layer to form.
6. the preparation method of a kind of native graphite/copper heat sink compound as claimed in claim 1, is characterized in that: preparation method specifically carries out according to the following steps:
One, preliminary treatment is carried out to copper foil surface, the pollution of removing copper foil surface and oxide layer;
Two, the Copper Foil obtained is processed to step one and carry out roughening treatment and solidification process, make to form at copper foil surface the roughened layer being evenly distributed with warty copper grain structure;
Three, expanded worm graphite piled up uniformly and be laid on the Copper Foil that obtains through step 2 process; Then, through stage calendering, namely obtain native graphite/copper heat sink compound.
7. the preparation method of a kind of native graphite/copper heat sink compound according to claim 6, is characterized in that: the pretreated method in described step one, is specially: carry out pickling, washing, alkali cleaning, washing and oven dry successively to Copper Foil; What described pickling adopted is concentration be less than 0.5% dilute sulfuric acid; What described alkali cleaning adopted is concentration be 2 ~ 5% the NaOH aqueous solution.
8. the preparation method of a kind of native graphite/copper heat sink compound according to claim 6, it is characterized in that: the processing method of described step 2 is specially: roughening treatment: the Copper Foil that step one obtains is electroplated two-sided in electroplate liquid, surface forms one deck warty copper grain structure, then repeatedly upper step is carried out, the maximum length of warty copper grain structure is made to be less than 8 μm, obtaining roughened layer, and then be cured process, is the thin copper of 0.1 ~ 0.5 μm in plated surface a layer thickness of roughened layer; The metallic copper of one deck densification is deposited, to improve the adhesion strength of roughened layer and Copper Foil matrix in the gap of warty copper grain structure; After solidification, carry out cleaning and drying and processing, then, rolling is carried out to Copper Foil.
9. the preparation method of a kind of native graphite/copper heat sink compound according to claim 6, it is characterized in that: the preparation method of the expanded worm graphite of described step 3: can after expanded graphite granule is warmed to 850 ~ 1040 DEG C, be puffed to worm graphite, then, after 2 ~ 7 separation that suspend, the expanded worm graphite that purity is more than 99% is obtained; Wherein, the volume of worm graphite is 60 ~ 100 times of the volume of graphite granule.
10. the preparation method of a kind of native graphite/copper heat sink compound according to claim 6, it is characterized in that: described step 3 concrete operation method is: expanded worm graphite is deposited on the Copper Foil obtained through step 2 process, then flatten, obtain the expanded myrmekite layer of ink of the uniform consistency of thickness of initial density, then, carry out first time calendering, pressure is 500 ~ 2000kg, makes expanded worm graphite-filled and is expressed in the gap of warty copper grain structure; Carry out second time calendering, pressure is 3000 ~ 6000kg, makes the density of expanded myrmekite layer of ink bring up to 0.4 ~ 0.5g/cm
3; Third time calendering, pressure is 8000 ~ 20000kg, makes the density of expanded myrmekite layer of ink bring up to 0.8 ~ 1g/cm
3; 4th calendering, pressure is 40000 ~ 70000kg, makes the density of expanded myrmekite layer of ink bring up to 1.2 ~ 1.4g/cm
3, now expanded myrmekite layer of ink has changed the state of film forming; 5th calendering, pressure is 90000 ~ 200000kg, makes the density of expanded myrmekite layer of ink bring up to 1.6 ~ 1.8g/cm
3, now graphite has metallic luster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510581993.0A CN105101758A (en) | 2015-09-14 | 2015-09-14 | Natural graphite/copper composite heat sink and fabrication method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510581993.0A CN105101758A (en) | 2015-09-14 | 2015-09-14 | Natural graphite/copper composite heat sink and fabrication method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101758A true CN105101758A (en) | 2015-11-25 |
Family
ID=54580943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510581993.0A Pending CN105101758A (en) | 2015-09-14 | 2015-09-14 | Natural graphite/copper composite heat sink and fabrication method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101758A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105584122A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电（昆山）股份有限公司 | Cooling fin made of natural graphite/copper composite material and preparation method of cooling fin |
| CN105666983A (en) * | 2016-03-11 | 2016-06-15 | 奇华光电（昆山）股份有限公司 | Artificial graphite and copper composite heat sink and preparation method thereof |
| WO2017045233A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电（昆山）股份有限公司 | Natural graphite/copper composite heatsink |
| CN108074592A (en) * | 2016-11-11 | 2018-05-25 | 海盗船电子股份有限公司 | Thermal diffusion type electronic device |
| CN111356329A (en) * | 2018-12-21 | 2020-06-30 | 惠州昌钲新材料有限公司 | Thin high-conductivity heat-dissipation composite material with low interface thermal resistance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298321A (en) * | 2013-06-24 | 2013-09-11 | 江西量一光电科技有限公司 | Tungsten-copper alloy and graphite composite cooling fin and production method thereof |
| CN203446165U (en) * | 2013-05-28 | 2014-02-19 | 绿晶能源股份有限公司 | Composite radiating fin |
| CN104647830A (en) * | 2015-01-30 | 2015-05-27 | 上海交通大学 | High-heat-conductivity graphite film metal block composite material and preparation method of composite material |
| CN204634261U (en) * | 2015-06-12 | 2015-09-09 | 东莞市思泉实业有限公司 | Multiple field composite graphite fin |
| CN204968326U (en) * | 2015-09-14 | 2016-01-13 | 昆山奇华印刷科技有限公司 | Compound fin of natural graphite copper |
-
2015
- 2015-09-14 CN CN201510581993.0A patent/CN105101758A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203446165U (en) * | 2013-05-28 | 2014-02-19 | 绿晶能源股份有限公司 | Composite radiating fin |
| CN103298321A (en) * | 2013-06-24 | 2013-09-11 | 江西量一光电科技有限公司 | Tungsten-copper alloy and graphite composite cooling fin and production method thereof |
| CN104647830A (en) * | 2015-01-30 | 2015-05-27 | 上海交通大学 | High-heat-conductivity graphite film metal block composite material and preparation method of composite material |
| CN204634261U (en) * | 2015-06-12 | 2015-09-09 | 东莞市思泉实业有限公司 | Multiple field composite graphite fin |
| CN204968326U (en) * | 2015-09-14 | 2016-01-13 | 昆山奇华印刷科技有限公司 | Compound fin of natural graphite copper |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017045233A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电（昆山）股份有限公司 | Natural graphite/copper composite heatsink |
| CN105584122A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电（昆山）股份有限公司 | Cooling fin made of natural graphite/copper composite material and preparation method of cooling fin |
| CN105666983A (en) * | 2016-03-11 | 2016-06-15 | 奇华光电（昆山）股份有限公司 | Artificial graphite and copper composite heat sink and preparation method thereof |
| CN108074592A (en) * | 2016-11-11 | 2018-05-25 | 海盗船电子股份有限公司 | Thermal diffusion type electronic device |
| CN108074592B (en) * | 2016-11-11 | 2020-01-07 | 海盗船电子股份有限公司 | Thermal diffusion type electronic device |
| CN111356329A (en) * | 2018-12-21 | 2020-06-30 | 惠州昌钲新材料有限公司 | Thin high-conductivity heat-dissipation composite material with low interface thermal resistance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105101758A (en) | Natural graphite/copper composite heat sink and fabrication method thereof | |
| Chen et al. | Highly thermally conductive yet electrically insulating polymer/boron nitride nanosheets nanocomposite films for improved thermal management capability | |
| CN105142380A (en) | Natural graphite/aluminium composite radiating fin and preparation method thereof | |
| CN108260366B (en) | Electromagnetic wave absorbing and shielding fusion sheet for superstrong heat dissipation of electronic equipment and manufacturing method thereof | |
| JP6258441B2 (en) | Heat dissipation copper foil and graphene composite | |
| EP1865552B1 (en) | Heat transfer sheet, radiation structure and method for using heat transfer sheet | |
| CN105609476B (en) | A kind of natural graphite/metal layer heat sink compound and preparation method thereof | |
| CN110168670A (en) | Dielectric layer with improved thermal conductivity | |
| CN203446165U (en) | Composite radiating fin | |
| CN104293308A (en) | High heat conduction graphite film and its making technology | |
| CN105437641A (en) | Artificial graphite/copper composite radiating fin and preparation method therefor | |
| CN111069611A (en) | Preparation method of graphite-graphene-metal composite material | |
| Wang et al. | Current advances and future perspectives of MXene-based electromagnetic interference shielding materials | |
| CN105666983A (en) | Artificial graphite and copper composite heat sink and preparation method thereof | |
| KR20140145870A (en) | A heat-radiation complex sheet | |
| WO2017045232A1 (en) | Natural graphite/aluminum composite heat sink | |
| CN202656536U (en) | Structure for adding metal layers in composite case | |
| US20130075074A1 (en) | Thermal Dissipation Device | |
| CN213029050U (en) | Composite heat dissipation film | |
| CN206947325U (en) | A kind of graphite copper foil heat sink compound | |
| CN202439289U (en) | Graphite composite membrane | |
| CN204968326U (en) | Compound fin of natural graphite copper | |
| CN203151931U (en) | Composite material fiber cloth containing heat dissipating effect | |
| CN202213250U (en) | Graphite-based heatconducting flexible copper-clad plate | |
| CN111432595A (en) | Heat dissipation structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Suzhou City, Jiangsu province 215314 City Wanan town Kunshan City Week Road No. 368, room 3 Applicant after: Wonder photoelectric (Kunshan) Limited by Share Ltd Address before: Suzhou City, Jiangsu province 215314 City Wanan town Kunshan City Week Road No. 368, room 3 Applicant before: KUNSHAN QIHUA PRINTING TECHNOLOGY CO., LTD. |
|
| COR | Change of bibliographic data | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151125 |
|
| WD01 | Invention patent application deemed withdrawn after publication |