CN103298321A - Tungsten-copper alloy and graphite composite cooling fin and production method thereof - Google Patents
Tungsten-copper alloy and graphite composite cooling fin and production method thereof Download PDFInfo
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- CN103298321A CN103298321A CN2013102525103A CN201310252510A CN103298321A CN 103298321 A CN103298321 A CN 103298321A CN 2013102525103 A CN2013102525103 A CN 2013102525103A CN 201310252510 A CN201310252510 A CN 201310252510A CN 103298321 A CN103298321 A CN 103298321A
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Abstract
The invention discloses a tungsten-copper alloy and graphite composite cooling fin which is formed by a graphite sheet, a tungsten-copper alloy sheet and a graphite sheet from top to bottom in sequence. The production method of the tungsten-copper alloy and graphite composite cooling fin includes: expansible graphite is placed in a high temperature furnace, is expanded for 8 hours at high temperature of 1000 DEG C, is cooled naturally and is calendared to be as thick as 2.5mm; and the graphite is extruded to be sheet-shaped graphite cooling fins through a graphite coiled material device, and the graphite cooling fins are adhered to the upper surface and the lower surface of tungsten-copper alloy as thick as 0.5mm and then the cooling fins and the tungsten-copper alloy are integrally calendared. The tungsten-copper alloy and graphite composite cooling fin has high heat conductivity, excellent gas tightness, high temperature resistance and stable property.
Description
Technical field
The present invention relates to a kind of tungsten-copper alloy and graphite heat sink compound and preparation method thereof.
Background technology
Along with developing rapidly of microelectronics integrated technology and high density printed board packaging technology, packaging density improves rapidly, and electronic component, thousands of times of ground of logical circuit volume dwindle, and electronic instrument and equipment develop towards light, thin, short, little direction day by day.Under the high-frequency work frequency, semiconductor working heat environment is mobile rapidly to the high temperature direction, at this moment, heat run-up, increase that electronic devices and components produce, under the environment for use temperature, make electronic devices and components still can high reliability the ground operate as normal, in time heat-sinking capability becomes the critical limitation in its useful life factor that influences.Be to ensure the components and parts operational reliabilitys, need to use the material of excellent combination properties such as high reliability, high thermal conductivity, rapidly, the heat that in time heater element gathered passes and dispel the heat away guarantee electronic equipment operate as normal.
Along with science and technology development, panel computer, smart mobile phone, high-end digital product etc. all come into the market in enormous quantities.The heat sink material that it is traditional and structure can not satisfy the heat radiation requirement far away.
Summary of the invention
Technical problem to be solved: the object of the invention provides a kind of tungsten-copper alloy of good heat dissipation effect and graphite heat sink compound and preparation method thereof.
Technical scheme: a kind of tungsten-copper alloy and graphite heat sink compound is characterized in that: described heat sink compound is made of graphite flake-tungsten-copper alloy sheet-graphite flake from top to bottom successively.
Preparation tungsten-copper alloy and graphite heat sink compound method: get expansible graphite and place high temperature furnace, after high temperature under 1000 ℃ of conditions expanded 8 hours, the calendering of cooling back was handled to thickness 2.5mm naturally; Be squeezed into the graphite radiating sheet of sheet again by the graphite web apparatus, paste to roll behind the described graphite radiating sheet with the tungsten-copper alloy top and bottom of 0.5mm thickness and be integral.
Effect of the present invention is: the present invention is as the advantage of heat sink material, high heat conductance, and excellent air-tightness, good flatness, smooth surface, easily cutting, size is controlled easily, can obtain the size of superprecision.High temperature resistant, stable in properties, surface gold-plating or nickel plating do not influence the performance of product.
Tungsten-copper composite material is to serve as a kind of two phase structure pseudo-alloy of main composition with tungsten, copper, be metal-base composites. because metallic copper and tungsten physical difference are bigger, therefore can not adopt fusion casting to produce, the general powder metallurgy technology that adopts is produced now.The alloy that tungsten and copper are formed.The copper content of alloy commonly used is 10%～50%.Alloy is produced with powder metallurgy process, has good electrical and thermal conductivity, preferably elevated temperature strength and certain plasticity.Under very high temperature, as more than 3000 ℃, the evaporation that is liquefied of the copper in the alloy absorbs heat in a large number, reduces the material surface temperature.So this class material is also referred to as the metal transpiration material.Tungsten-copper alloy has purposes more widely, and wherein most is applied to industries such as space flight, aviation, electronics, electric power, metallurgy, machinery, sports equipment.Secondly also to be used for making contact and the high temperature members such as rocket nozzle larynx lining, tail vane of the high-voltage appliance switch that arc resistant ablates, also require the occasion of electrical and thermal conductivity performance and high temperature use as the electrode of electric machining, die material and other.
The graphite radiating film is a kind of novel heat conduction and heat radiation material, and the effect of its heat conduction and heat radiation is very tangible, can be widely used in smart mobile phone, in the industries such as panel computer.
The graphite radiating membrane structure presents sheet, and heat conduction and heat radiation mainly is along level and vertical direction Homogeneouslly-radiating.Allow heat be communicated to better on the external world or the miscellaneous part.The critical function of graphite radiating film is to create maximum effective surface area, and heating power is transferred and has extraneous cooling media to take away on this surface.Thereby the graphite radiating film of panel computer, smart mobile phone is exactly by being evenly distributed in heat two dimensional surface effectively with transfer of heat.One deck dielectric film is arranged above the raw material carbon film, and there is one deck bond plies the bottom surface, and it is convenient to use when installing, quick, good heat dissipation effect.
Embodiment
A kind of tungsten-copper alloy and graphite heat sink compound is characterized in that: described heat sink compound is made of graphite flake-tungsten-copper alloy sheet-graphite flake from top to bottom successively.
Preparation tungsten-copper alloy and graphite heat sink compound method: get expansible graphite and place high temperature furnace, after high temperature under 1000 ℃ of conditions expanded 8 hours, the calendering of cooling back was handled to thickness 2.5mm naturally; Be squeezed into the graphite radiating sheet of sheet again by the graphite web apparatus, paste to roll behind the described graphite radiating sheet with the tungsten-copper alloy top and bottom of 0.5mm thickness and be integral.
The present invention only limits to these examples absolutely not.The above only is the present invention embodiment preferably, only is used for describing the present invention, can not be interpreted as the restriction to scope of the present invention.Should be pointed out that all any modifications of making within the spirit and principles in the present invention, be equal to replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. a tungsten-copper alloy and graphite heat sink compound, it is characterized in that: described heat sink compound is made of graphite flake-tungsten-copper alloy sheet-graphite flake from top to bottom successively.
2. tungsten-copper alloy and a graphite heat sink compound method for preparing claim 1 is characterized in that: get expansible graphite and place high temperature furnace, after high temperature under 1000 ℃ of conditions expanded 8 hours, roll after the cooling naturally and handle to thickness 2.5mm; Be squeezed into the graphite radiating sheet of sheet again by the graphite web apparatus, paste to roll behind the described graphite radiating sheet with the tungsten-copper alloy top and bottom of 0.5mm thickness and be integral.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013102525103A CN103298321A (en) | 2013-06-24 | 2013-06-24 | Tungsten-copper alloy and graphite composite cooling fin and production method thereof |
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| CN2013102525103A CN103298321A (en) | 2013-06-24 | 2013-06-24 | Tungsten-copper alloy and graphite composite cooling fin and production method thereof |
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| CN103298321A true CN103298321A (en) | 2013-09-11 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101758A (en) * | 2015-09-14 | 2015-11-25 | 昆山奇华印刷科技有限公司 | Natural graphite/copper composite heat sink and fabrication method thereof |
| CN105437641A (en) * | 2015-10-16 | 2016-03-30 | 奇华光电（昆山）股份有限公司 | Artificial graphite/copper composite radiating fin and preparation method therefor |
| CN105584122A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电（昆山）股份有限公司 | Cooling fin made of natural graphite/copper composite material and preparation method of cooling fin |
| US9575523B2 (en) | 2015-01-22 | 2017-02-21 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
| CN117303904A (en) * | 2023-07-04 | 2023-12-29 | 张润枝 | Production process of heat dissipation film |
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| US9575523B2 (en) | 2015-01-22 | 2017-02-21 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
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| CN105437641A (en) * | 2015-10-16 | 2016-03-30 | 奇华光电（昆山）股份有限公司 | Artificial graphite/copper composite radiating fin and preparation method therefor |
| CN105584122A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电（昆山）股份有限公司 | Cooling fin made of natural graphite/copper composite material and preparation method of cooling fin |
| CN117303904A (en) * | 2023-07-04 | 2023-12-29 | 张润枝 | Production process of heat dissipation film |
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Application publication date: 20130911 |