CN106921013B

CN106921013B - Filter and filter circuit

Info

Publication number: CN106921013B
Application number: CN201710266397.2A
Authority: CN
Inventors: 陈超; 张少林; 孙昌盛; 李朋
Original assignee: Shenzhen City Weifu Communication Technology Co Ltd
Current assignee: Shenzhen City Weifu Communication Technology Co Ltd
Priority date: 2017-04-21
Filing date: 2017-04-21
Publication date: 2020-02-28
Anticipated expiration: 2037-04-21
Also published as: CN106921013A

Abstract

The invention provides a filter and a filter circuit, and belongs to the technical field of communication. A filter comprises a shell, a resonance rod and a boss. The resonance rod and the boss are arranged in the cavity formed by the shell. The boss includes boss body, first heat pipe. Resonance bar and this body coupling of boss, first heat pipe run through the boss body, and the one end and the resonance bar of first heat pipe are connected, and the other end and the casing of first heat pipe are connected. The housing and boss are made of a low density material, such as plastic, to reduce the overall weight of the filter. First heat pipe can in time, shift to the casing fast with a large amount of heat energy that the resonance bar produced for the rate of heat dissipation of resonance bar improves the job stabilization nature of resonance bar. The invention also provides a filter circuit comprising the filter.

Description

Filter and filter circuit

Technical Field

The invention relates to the technical field of communication, in particular to a filter and a filter circuit.

Background

With the increasing competition of the communication system industry and the rising cost of human resources, the cost pressure is higher and higher. With the development of microwave technology, the demand of cavity microwave devices such as duplexers, filters, combiners and the like is increasing. Most cavity devices at the present stage are of metal structures, so that the weight is large, and the requirements at the present stage are not easy to meet. Plastic filters of new materials are increasingly gaining attention for their lighter weight and reliable performance relative to metal.

Because the heat conductivity of plastic materials is poorer than that of metals, the heat accumulated in the plastic cavity can not be dissipated in time under the high-power working state of the existing plastic filter, and the local temperature is higher and higher, so that the product fails.

Disclosure of Invention

The invention aims to provide a filter which has light weight and strong heat dissipation capacity.

Another object of the present invention is to provide a filter circuit, which has stable operation capability under high power operation condition.

The embodiment of the invention is realized by the following steps:

a filter comprises a shell, a resonance rod and a boss. Resonance pole, boss all set up in the cavity that the casing formed, and the resonance pole is connected with the boss. The boss includes boss body, first heat pipe. The boss body is connected with the resonance rod, and first heat pipe runs through the boss body, and the one end and the resonance rod of first heat pipe are connected, and the other end is connected with the casing.

Preferably, the first heat conduction pipe is a solid pipe or a hollow pipe.

Preferably, the first heat pipe is a hollow pipe, and one end of the first heat pipe away from the resonance rod is connected with a heat conduction sealing member to prevent liquid from entering the first heat pipe.

Preferably, the boss further comprises a second heat conductive pipe, the first heat conductive pipe being connected with the case by the second heat conductive pipe.

Preferably, the boss further comprises a heat conduction sealing element, and the first heat conduction pipe and the second heat conduction pipe are hollow pipes. The second heat pipe is connected to the housing through a heat conductive seal to prevent liquid from entering the second heat pipe.

Preferably, the housing comprises an inner housing wall and an outer housing wall, the inner housing wall forming the cavity. The first heat conduction pipe penetrates through the inner wall of the shell and contacts with the outer wall of the shell.

Preferably, the inner shell wall and/or the outer shell wall is provided with a heat conducting layer.

Preferably, the thermally conductive layer comprises a metallic thermally conductive layer and/or a non-metallic thermally conductive layer.

Preferably, the boss body surface is provided with a heat conducting layer.

A filter circuit comprising any of the filters described above.

The embodiment of the invention has the beneficial effects that:

the embodiment of the invention provides a filter which is light in weight and has strong heat dissipation capacity. The housing and boss may be formed of a low density material, such as plastic, to reduce the overall weight of the filter. At present, the weight of the filter is obviously reduced by some low-density materials, but the heat conducting performance of the low-density materials such as plastics is poor, so that the heat in the cavity of the filter cannot be transferred in time, and the resonance rod cannot work normally. The first heat conduction pipe is arranged in the boss, and the first heat conduction pipe penetrates through the boss body and is connected with the resonance rod. Because most heat of wave filter is produced by the resonance bar, this design makes first heat pipe can in time, shift to the casing fast with a large amount of heat energy that the resonance bar produced for the radiating rate of resonance bar improves the job stabilization nature of resonance bar. The embodiment of the invention also provides a filter circuit, which adopts the filter to carry out filtering work, has stable working property and more reliable working result.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a filter provided in embodiment 1 of the present invention;

FIG. 2 is a sectional view A-A of FIG. 1 provided in accordance with embodiment 1 of the present invention;

fig. 3 is a schematic structural diagram of a filter provided in embodiment 2 of the present invention;

fig. 4 is a sectional view a-a of fig. 3 provided in embodiment 2 of the present invention.

Icon: 100-a filter; 110-a resonant rod; 130-a housing; 132-shell inner wall; 134-shell outer wall; 136-a cavity; 150-boss; 152-boss body; 154-a first heat pipe; 156-a second heat pipe; 158-thermally conductive seal; 200-a filter; 250-a boss; 252-a boss body; 254-first heat transfer pipe.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", "outer", and the like refer to orientations or positional relationships based on those shown in the drawings or orientations or positional relationships that are conventionally used for placing products of the present invention, and are used for convenience in describing the present invention and simplifying the description, but do not refer to or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

Referring to fig. 1, the present embodiment provides a filter 100, which can be used to effectively filter a frequency point of a specific frequency or frequencies other than the frequency point to obtain a signal of the specific frequency or a signal with the specific frequency removed.

Referring to fig. 2, fig. 2 is a cross-sectional view of a cross-section a-a of the filter 100. The filter 100 includes a resonant rod 110, a housing 130, and a boss 150. The resonant rod 110 is connected to the housing 130 by a boss 150.

The housing 130 includes an inner housing wall 132 and an outer housing wall 134 disposed opposite to each other, the inner housing wall 132 defining a cavity 136. The boss 150 and the resonant rod 110 are both mounted within the cavity 136.

In this embodiment, the shell inner wall 132 and the shell outer wall 134 are both provided with heat conduction layers, and the heat conduction layers may be commonly used metal heat conduction layers or non-metal heat conduction layers, such as metal copper, metal silver, graphite, and the like. In other embodiments of the present invention, a metal heat conducting layer or a non-metal heat conducting layer may be selectively disposed on the shell inner wall 132 or the shell outer wall 134. The thickness of the heat conducting layer can be adjusted according to specific heat dissipation requirements.

The boss 150 includes a boss body 152 and a first heat conductive pipe 154. One end of the resonance rod 110 is connected to the boss body 152, and the other end of the resonance rod 110 is spaced apart from the case 130 by a certain distance. One end of the first heat pipe 154 penetrates the boss body 152 to connect with the resonance rod 110. The other end of the first heat pipe 154 is connected to the housing 130, wherein the other end of the first heat pipe 154 is connected to the housing 130 in a manner including contacting each other.

The boss body 152 may be made of metal, or may be made of light material with low density such as plastic or rubber. In this embodiment, a plastic material is preferably selected to reduce the mass of the filter 100. In other embodiments of the present invention, it is preferable that a heat conducting layer is further disposed on the surface of the boss body 152, and the disposing manner may be electroplating or coating. The heat conductive layer may be a composite layer made of one or more metals selected from copper, silver, iron, and zinc, or a material having a high thermal conductivity and a low mass such as graphene. Since the boss body 152 is in direct contact with the resonance rod 110, the provision of the heat conductive layer facilitates rapid transfer of heat generated by the resonance rod 110 to the case 130.

In this embodiment, the boss body 152 and the resonant rod 110 are formed separately and then connected to each other, but in other embodiments of the present invention, the boss body 152 and the resonant rod 110 may also be formed integrally.

The first heat conductive pipe 154 can be a solid pipe or a hollow pipe, and in this embodiment, the first heat conductive pipe 154 is a hollow pipe and has a first cavity (not shown). The number of the first heat conductive pipes 154 disposed in the boss body 152 may be changed according to specific heat dissipation requirements. For example, the number of the first heat conductive pipes 154 to which each resonance bar 110 is connected in the present embodiment is 1 or 2. The diameter of the first heat pipe 154 can also be adjusted according to the specific heat dissipation requirements. For example, if a general heat dissipation capability is desired, the aperture of the first heat pipe 154 may be enlarged, the wall thickness of the first heat pipe 154 may be reduced, and the air content may be increased because the thermal conductivity of air is lower. If a strong heat dissipation capability is required, the diameter of the first heat conductive pipe 154 can be reduced or even the first heat conductive pipe 154 can be provided as a solid pipe, increasing the wall thickness of the first heat conductive pipe 154. The air content is decreased and the heat conductive material content is increased, thereby increasing the heat conductive capability of the first heat pipe 154, so that the first heat pipe 154 can rapidly transfer the heat generated from the resonance bar 110 to a position far away from the resonance bar 110.

Preferably, the boss 150 further comprises a second heat conductive pipe 156. The first heat conductive pipe 154 is connected to the housing 130 through the second heat conductive pipe 156. The six first heat conductive pipes 154 shown in fig. 2 are each connected to a second heat conductive pipe 156. The second heat conductive pipe 156 may be a solid pipe or a hollow pipe. In this embodiment, the second heat pipe 156 and the first heat pipe 154 are both hollow pipes, and the second heat pipe 156 has a second cavity (not labeled). In this embodiment, the first cavity and the second cavity are communicated with each other, and in other embodiments of the present invention, the first cavity and the second cavity may be in a non-communicated state. The second heat transfer pipe 156 and the first heat transfer pipe 154 may be the same or different in material, shape, and size.

To further prevent liquid from entering from the hollow tube and affecting the normal operation of the resonant rod 110, the second heat pipe 156 is connected to the housing 130 by a heat conductive seal 158. The heat conductive sealing member 158 may be made of a material having a good heat conductivity, such as a metal sheet, a graphite sheet, or a graphene material. In this embodiment, the heat conductive sealing member 158 may be disposed to seal the second cavity of the second heat conductive pipe 156.

When only the outer housing wall 134 is provided with a metallic or non-metallic heat conductive layer, the heat conductive seal 158 is preferably provided on the outer housing wall 134 for faster transfer of the large amount of heat generated by the resonant rod 110. The second heat conductive pipe 156 is connected to a heat conductive seal 158 through the shell inner wall 132. The overlapping area of the heat conductive seal 158 and the shell outer wall 134 can be designed to be large to facilitate rapid heat transfer.

It should be noted that the housing 130 and the boss 150 can be prepared by the following method:

the first heat pipe 154 and the second heat pipe 156 are prepared in advance. The plastic is directly molded on the first heat conductive pipe 154 and the second heat conductive pipe 156 by using a mold, and the cavity 136 is formed. Finally, electroplating is performed to form a metal heat conducting layer on the shell outer wall 134.

In this embodiment, there are 8 resonant rods 110, the cavity 136 is a double-sided structure, and two sides of the cavity 136 are respectively and symmetrically provided with 4 resonant rods 110. Of course, the number of resonant bars 110 can be adjusted accordingly, depending on the particular operational requirements. In this embodiment, the resonant rods 110 disposed on both sides of the cavity 136 are coaxial, but may not be coaxial in other embodiments of the present invention.

The working principle of the filter 100 is:

the filter 100 starts a filtering operation and the resonant rod 110 generates a large amount of heat energy. The first heat pipe 154 rapidly transfers heat to the second heat pipe 156. The second heat pipe 156 transfers heat through the heat conductive seal 158 to the shell inner wall 132, creating a large area of heat dissipation. The shell inner wall 132 transfers heat to the shell outer wall 134, and the heat conducted out of the shell outer wall 134 can form convection in the air, so that the heat can be quickly transferred. The stable and continuous operation capability of the resonance rod 110 is ensured, and the overall weight of the filter 100 is ensured to be small.

The embodiment of the invention also provides a filter circuit, which is mainly used for filtering ripples in the rectified output voltage and mainly comprises a filter 100.

Example 2

Referring to fig. 3, the present embodiment provides a filter 200, which is substantially the same as the filter 100 of embodiment 1, and the difference between them is:

referring to fig. 4, fig. 4 is a cross-sectional view of a cross-section a-a of the filter 200. The filter 200 includes the resonant rod 110, the housing 130, and the boss 250. The resonant bar 110 is connected to the housing 130 by a boss 250.

The boss 250 includes a boss body 252 and a first heat conductive pipe 254. One end of the resonance rod 110 is connected to the boss body 252, and the other end of the resonance rod 110 is spaced apart from the case 130 by a certain distance. One end of the first heat pipe 254 penetrates the boss body 252 to connect with the resonance rod 110. The other end of the first heat pipe 254 is connected to the case 130.

The boss body 252 in this embodiment is preferably made of plastic to reduce the mass of the filter 200. In this embodiment, a heat conductive layer is disposed on the surface of the boss body 252, and the heat conductive layer may be disposed by electroplating or coating. The heat conducting layer is composed of a copper layer and a silver layer. Since the boss body 252 is in direct contact with the resonance rod 110, the provision of the heat conductive layer facilitates rapid transfer of heat generated by the resonance rod 110 to the case 130.

The first heat conductive pipe 254 may be a solid pipe or a hollow pipe. The first heat conductive pipe 254 is a solid pipe in this embodiment. The number of the first heat conductive pipes 254 to which each resonance bar 110 is connected in this embodiment is 2 or 3. The diameter of the first heat conductive pipe 254 can be increased or decreased as appropriate to adjust the heat dissipation capability of the filter 200.

Other embodiments of the present invention may provide the first heat conductive pipe 254 as a hollow pipe. When the first heat pipe 254 is a hollow pipe, a heat conducting seal (not shown) is connected to an end of the first heat pipe 254 away from the resonant rod 110 to further prevent liquid, such as water, from entering the first heat pipe 254 and affecting the normal operation of the resonant rod 110. The first heat pipe 254 is connected to the housing 130 by a heat conductive seal. The thermally conductive seal can seal the cavity of the first thermally conductive pipe 154 from liquid entering the cavity.

In this embodiment, the number of the resonant rods 110 is 4, and the cavity 136 has a single-sided structure, so that the first heat pipe 254 can be directly connected to the housing 130 (the connection manner includes contacting the two members).

The working principle of the filter 200 is:

the filter 200 starts a filtering operation and the resonant bar 110 generates a large amount of heat energy. The first heat pipe 254 rapidly transfers heat to the housing 130, resulting in large area heat dissipation. Meanwhile, the boss body 252 also transfers part of the heat generated by the resonant rod 110 to the housing 130 through the metal heat conduction layer on the surface thereof, so as to form a large-area heat dissipation.

The embodiment of the invention also provides a filter circuit which is mainly used for filtering ripples in the rectified output voltage and mainly comprises a filter 200.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A filter is characterized by comprising a shell, a resonance rod and a boss, wherein the resonance rod and the boss are both arranged in a cavity formed by the shell, and the resonance rod is connected with the boss;

the boss comprises a boss body and a first heat conduction pipe, the boss body is connected with the resonance rod, the first heat conduction pipe penetrates through the boss body, one end of the first heat conduction pipe is connected with the resonance rod, and the other end of the first heat conduction pipe is connected with the shell; the shell comprises a shell inner wall and a shell outer wall, the shell inner wall forms the cavity, and the first heat conduction pipe penetrates through the shell inner wall and is in contact with the shell outer wall; the inner wall of the shell and/or the outer wall of the shell are/is provided with a heat conduction layer; the boss is a plastic boss or a rubber boss.

2. The filter of claim 1, wherein the first heat conductive pipe is a solid pipe or a hollow pipe.

3. A filter according to claim 2, wherein the first heat conducting pipe is the hollow pipe, and a heat conducting seal is attached to an end of the first heat conducting pipe remote from the resonant rod to prevent liquid from entering the first heat conducting pipe.

4. The filter of claim 1, wherein the boss further comprises a second thermally conductive pipe, the first thermally conductive pipe being connected to the housing by the second thermally conductive pipe.

5. The filter of claim 4, wherein the boss further comprises a thermally conductive seal, the first thermally conductive pipe and the second thermally conductive pipe are both hollow tubes, and the second thermally conductive pipe is connected to the housing through the thermally conductive seal to prevent liquid from entering the second thermally conductive pipe.

6. The filter of claim 1, wherein the thermally conductive layer comprises a metallic thermally conductive layer and/or a non-metallic thermally conductive layer.

7. The filter of claim 1, wherein the boss body surface is provided with the thermally conductive layer.

8. A filter circuit comprising a filter according to any one of claims 1 to 7.