CN104582291A - Manufacturing method of high-frequency LTCC circuit module substrate - Google Patents
Manufacturing method of high-frequency LTCC circuit module substrate Download PDFInfo
- Publication number
- CN104582291A CN104582291A CN201410796601.8A CN201410796601A CN104582291A CN 104582291 A CN104582291 A CN 104582291A CN 201410796601 A CN201410796601 A CN 201410796601A CN 104582291 A CN104582291 A CN 104582291A
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- China
- Prior art keywords
- ltcc
- module substrate
- circuit module
- high frequency
- manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
A manufacturing method of a high-frequency LTCC circuit module substrate comprises the following steps: (1) manufacturing an insulating medium layer of the high-frequency LTCC module substrate; (2) manufacturing LTCC composite adhesive sheets; (3) manufacturing the high-frequency LTCC circuit module substrate. The manufacturing method has the advantages as follows: the manufacturing method is suitable for circuit design with different signal frequencies; a metal material with high electrical conductivity is used as a conductor material, so that the quality factor of a circuit system can be favorably improved and the flexibility of the circuit design is improved; requirements on large current, high temperature resistance can be met, and thermal design of electronic equipment is optimized; the high-frequency LTCC circuit module substrate is high in reliability and is applicable to a severe environment, and the service life of the substrate is prolonged; adhesion between the copper foil layers and the insulating medium layer is facilitated, and the adhesive property is good; the peeling strength of the high-frequency LTCC circuit module substrate is improved, and the high-frequency LTCC circuit module substrate is especially applicable to a high heat-resistant environment; the ranges of the thicknesses of the copper foils can be widened; the copper foils with different thicknesses are selected according to different load current, load power as well as intercepting capabilities of the copper layers, so that the thicknesses of the copper layers are utilized to the maximum extent as much as possible.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit module substrate, especially relate to a kind of manufacture method of high frequency LTCC circuit module substrate.
Background technology
The modularization of electronic component has become industry undisputable fact, is especially wherein preferred manner with LTCC.Alternative module substrate has LTCC, HTCC (High Temperature Co Fired Ceramic), traditional PCB as FR4 and PTFE (high-performance poly tetrafluoro alkene) etc.The sintering temperature of HTCC is more than 1500 DEG C, and the refractory metal matched is as poor in electric conductivities such as tungsten, molybdenum/manganese, and sintering shrinkage is not so good as LTCC and is easy to control.A dielectric loss order of magnitude lower than RF4 of LTCC.The loss of PTFE is lower, but insulating properties is all poor.LTCC can control precision better than most of organic material substrate.Integrated comparative can be carried out with the high frequency performance of ltcc substrate, size and cost without any organic material.Increasingly mature along with LTCC LTCC Technology, high frequency LTCC composite material has the characteristic of excellent high frequency, high-speed transfer and broad passband, adapt to big current, high temperature resistant, there is the advantages such as good compatibility, to this, how LTCC low-temperature co-burning ceramic material and high frequency PTFE powder are merged the new material forming a kind of circuit substrate, apply to modern integrated circuits better, improve the properties of product of microwave circuit boards, extremely urgent, very urgent.
Summary of the invention
For overcoming the problems referred to above, the technical solution used in the present invention is as follows:
A manufacture method for high frequency LTCC circuit module substrate, comprising:
(1) insulating medium layer of high frequency LTCC module substrate is made, high frequency polytetrafluoroethylene PTFE powder and LTCC common burning porcelain powder is adopted to mix by a certain percentage, form the dielectric material of substrate through ball mill high energy ball milling a period of time, then substrate media material is placed in mould and forms substrate insulating medium layer through high-temperature laminating;
(2) make LTCC composite material bonding sheet, choose LTCC ceramic powders and put into PTFE resin and carry out pre-preg through cement dipping machine, then obtain LTCC composite material adhesive sheet after high temperature sintering;
(3) make high frequency LTCC circuit module substrate, choose copper foil layer, insulating medium layer, LTCC composite material bonding sheet, be separately positioned on by Copper Foil above and below insulating medium layer, LTCC composite material bonding sheet interval, centre also bonds, compressing finally by hot environment processing with pressure.
2. the manufacture method of a kind of high frequency LTCC circuit module substrate according to claim 1, it is characterized in that: in described step (1), ball mill Ball-milling Time is 48 hours, the dielectric material that PTFE powder and LTCC common burning porcelain powder are mixed is placed in mould and forms substrate insulating medium layer through 280 ~ 300 DEG C of temperature pressings.
Choose LTCC ceramic powders that thickness is less than 0.025mm in described step (2) to put into PTFE resin and carry out pre-preg through cement dipping machine, then obtained described LTCC composite material bonding sheet after 260 ~ 270 DEG C of high temperature sinterings.
Copper foil layer selects thickness to be the copper foil layer of 35um-280um in described step (3).
In in described step (3), hot environment is 350 ± 10 DEG C.
Advantage of the present invention is: use PTFE powder to mix with LTCC powder, through the latter made substrate insulating dielectric materials of ball mill ball milling, according to the difference of batching, dielectric constant can in very large range change, be applicable to the circuit design of unlike signal frequency, with the use of the metal material of high conductivity as conductor material, be conducive to the quality factor improving Circuits System, add the flexibility of circuit design, big current and high-temperature stability requirement can be adapted to simultaneously, and possess the heat conductivity more excellent than common PCB circuit substrate, greatly optimize the heat dissipation design of electronic equipment, reliability is high, can be applicable to adverse circumstances, extend its useful life, use LTCC composite material bonding sheet, be conducive to the bonding between copper foil layer and insulating medium layer, adhesive property is excellent, improves the peel strength of substrate, is particularly applied to high heat-resisting environment, solves the problem of Copper Foil cohesive force difference, use the Copper Foil of 35um-280um, the scope of application of copper thickness can be expanded, client can select the Copper Foil of different-thickness according to the difference of the ability of damming of the loaded current of circuit design, bearing power and layers of copper, accomplish that the utilization of copper layer thickness maximizes as far as possible.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Embodiment
As shown in Figure 1, a kind of manufacture method of high frequency LTCC circuit module substrate, comprise step, make the insulating medium layer of high frequency LTCC module substrate, require to select mix proportion scheme according to dielectric constant, adopt PTFE powder to mix with LTCC powder, control by thickness of dielectric layers requirement, within 48 hours, form dielectric material through ball mill ball milling, then dielectric material is placed in mould and forms insulating medium layer through 280 ~ 300 DEG C of high-temperature laminatings; Step 2, makes LTCC composite material bonding sheet, chooses LTCC ceramic powders that thickness is less than 0.025mm and puts into PTFE resin and carry out pre-preg through cement dipping machine, then under 260 ~ 270 DEG C of high temperature, obtain LTCC composite material bonding sheet after sintering; Step 3, make high frequency LTCC circuit module substrate, choosing thickness is 35um-280um copper foil layer, insulating medium layer, LTCC composite material bonding sheet, be separately positioned on by Copper Foil above and below insulating medium layer, LTCC composite material bonding sheet interval, centre also bonds, compressing finally by 350 ± 10 DEG C of hot environment processing with pressure.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (5)
1. a manufacture method for high frequency LTCC circuit module substrate, is characterized in that, comprising:
(1) insulating medium layer of high frequency LTCC module substrate is made, high frequency polytetrafluoroethylene PTFE powder and LTCC common burning porcelain powder is adopted to mix by a certain percentage, form the dielectric material of substrate through ball mill high energy ball milling a period of time, then substrate media material is placed in mould and forms substrate insulating medium layer through high-temperature laminating;
(2) make LTCC composite material bonding sheet, choose LTCC ceramic powders and put into PTFE resin and carry out pre-preg through cement dipping machine, then obtain LTCC composite material adhesive sheet after high temperature sintering;
(3) make high frequency LTCC circuit module substrate, choose copper foil layer, insulating medium layer, LTCC composite material bonding sheet, be separately positioned on by Copper Foil above and below insulating medium layer, LTCC composite material bonding sheet interval, centre also bonds, compressing finally by hot environment processing with pressure.
2. the manufacture method of a kind of high frequency LTCC circuit module substrate according to claim 1, it is characterized in that: in described step (1), ball mill Ball-milling Time is 48 hours, the dielectric material that PTFE powder and LTCC common burning porcelain powder are mixed is placed in mould and forms substrate insulating medium layer through 280 ~ 300 DEG C of temperature pressings.
3. the manufacture method of a kind of high frequency LTCC circuit module substrate according to claim 1, it is characterized in that: choose LTCC ceramic powders that thickness is less than 0.025mm in described step (2) and put into PTFE resin and carry out pre-preg through cement dipping machine, then obtained described LTCC composite material bonding sheet after 260 ~ 270 DEG C of high temperature sinterings.
4. the manufacture method of a kind of high frequency LTCC circuit module substrate according to claim 1, is characterized in that: copper foil layer selects thickness to be the copper foil layer of 35um-280um in described step (3).
5. the manufacture method of a kind of high frequency LTCC circuit module substrate according to claim 1, is characterized in that: in described step (3), hot environment is 350 ± 10 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410796601.8A CN104582291A (en) | 2014-12-22 | 2014-12-22 | Manufacturing method of high-frequency LTCC circuit module substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410796601.8A CN104582291A (en) | 2014-12-22 | 2014-12-22 | Manufacturing method of high-frequency LTCC circuit module substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104582291A true CN104582291A (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410796601.8A Pending CN104582291A (en) | 2014-12-22 | 2014-12-22 | Manufacturing method of high-frequency LTCC circuit module substrate |
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| CN (1) | CN104582291A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105007690A (en) * | 2015-07-14 | 2015-10-28 | 泰州市博泰电子有限公司 | Method for manufacturing arc-shaped high-frequency ceramic module substrate |
| CN107197598A (en) * | 2017-07-24 | 2017-09-22 | 泰州市博泰电子有限公司 | A kind of preparation method of low PIM high performance microwaves high frequency composite ceramic substrate |
| CN107197592A (en) * | 2017-07-24 | 2017-09-22 | 泰州市博泰电子有限公司 | A kind of low PIM high performance microwaves high frequency composite ceramic substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000357849A (en) * | 1999-05-17 | 2000-12-26 | Siemens Ag | Manufacture of ltcc circuit supporter capable of automatic coupling and the circuit supporter |
| CN101125653A (en) * | 2007-09-17 | 2008-02-20 | 中国科学院理化技术研究所 | Method for synthesizing homogeneous nano silicon carbide powder by burning |
| CN102281717A (en) * | 2011-08-06 | 2011-12-14 | 倪新军 | Manufacture method for base plate of high frequency circuit module |
-
2014
- 2014-12-22 CN CN201410796601.8A patent/CN104582291A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000357849A (en) * | 1999-05-17 | 2000-12-26 | Siemens Ag | Manufacture of ltcc circuit supporter capable of automatic coupling and the circuit supporter |
| CN101125653A (en) * | 2007-09-17 | 2008-02-20 | 中国科学院理化技术研究所 | Method for synthesizing homogeneous nano silicon carbide powder by burning |
| CN102281717A (en) * | 2011-08-06 | 2011-12-14 | 倪新军 | Manufacture method for base plate of high frequency circuit module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105007690A (en) * | 2015-07-14 | 2015-10-28 | 泰州市博泰电子有限公司 | Method for manufacturing arc-shaped high-frequency ceramic module substrate |
| CN107197598A (en) * | 2017-07-24 | 2017-09-22 | 泰州市博泰电子有限公司 | A kind of preparation method of low PIM high performance microwaves high frequency composite ceramic substrate |
| CN107197592A (en) * | 2017-07-24 | 2017-09-22 | 泰州市博泰电子有限公司 | A kind of low PIM high performance microwaves high frequency composite ceramic substrate |
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Application publication date: 20150429 |